CN204839566U - Contact pickup microphone and stethoscope - Google Patents
Contact pickup microphone and stethoscope Download PDFInfo
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- CN204839566U CN204839566U CN201520439788.6U CN201520439788U CN204839566U CN 204839566 U CN204839566 U CN 204839566U CN 201520439788 U CN201520439788 U CN 201520439788U CN 204839566 U CN204839566 U CN 204839566U
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- 230000004308 accommodation Effects 0.000 claims abstract description 10
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- 230000008602 contraction Effects 0.000 claims description 10
- 239000012528 membrane Substances 0.000 abstract 6
- 238000007789 sealing Methods 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 description 9
- 238000003825 pressing Methods 0.000 description 8
- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 210000005069 ears Anatomy 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000035807 sensation Effects 0.000 description 2
- 238000002555 auscultation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
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Abstract
The utility model discloses a contact pickup microphone and stethoscope, wherein the stethoscope includes contact pickup microphone and player, the player is received the audio signal of contact pickup microphone and is play, contact pickup microphone includes processing circuit, inflexible support piece, piezoelectric membrane and vibrating diaphragm, the processing circuit electricity is connected the piezoelectric membrane, the last through -hole that sets up of support piece, the piezoelectric membrane will airtight the hiding of through -hole is sealed, the vibrating diaphragm shade in the through -hole, inclosed connection on support piece of border of vibrating diaphragm, form inclosed accommodation space who is full of fluid vibrations medium between piezoelectric membrane, vibrating diaphragm and the support piece, wherein, the piezoelectric membrane hides the inner wall that the part of sealing the through -hole is accommodation space at least, constitutes the vibrating diaphragm part of accommodation space inner wall is greater than the piezoelectric membrane hides the part of sealing the through -hole. The utility model discloses a contact pickup microphone and stethoscope, can be sensitive ground, high -fidelity ground gather the vibration signal of object.
Description
Technical Field
The utility model relates to the stethoscope field especially involves a contact pickup microphone and stethoscope that improves auscultation effect.
Background
The contact type pickup microphone is characterized in that after a target object is contacted, vibration of the target object generates an electric signal, then the electric signal is correspondingly processed through a driving circuit such as an amplifying circuit, a filtering circuit, a digital-to-analog conversion circuit and a compression circuit, and finally the processed electric signal is played and stored through equipment such as audio playing and storage.
The existing contact type pickup microphone has low sensitivity of collecting vibration of a target object, and when the vibration of a measured object is weaker, the condition of missed collection or distortion of collected vibration signals exists.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing a contact pickup microphone and stethoscope of higher sensitivity.
In order to achieve the above object, the present invention first provides a contact type pickup microphone, which includes a signal processing circuit, a rigid supporting member, a piezoelectric film, and a vibrating diaphragm, wherein the signal processing circuit is electrically connected to the piezoelectric film; the supporting piece is provided with a through hole, the piezoelectric film seals and covers the through hole in a closed manner, the vibrating diaphragm covers the through hole, and the edge of the vibrating diaphragm is connected to the supporting piece in a closed manner; and a closed containing space filled with fluid vibration media is formed among the piezoelectric film, the vibrating diaphragm and the supporting piece, wherein at least the part of the piezoelectric film, which covers the through hole, is the inner wall of the containing space, and the part of the vibrating diaphragm, which forms the inner wall of the containing space, is larger than the part of the piezoelectric film, which covers the through hole.
Furthermore, the vibrating diaphragm is arranged to be in a convex shape, and the edge of the vibrating diaphragm is hermetically connected to the supporting piece.
Furthermore, the edge of the diaphragm connected with the support part is in a corrugated shape or a corrugated shape; or the edge of the diaphragm is connected with the support part through a flexible body.
Furthermore, the piezoelectric film and the diaphragm are respectively arranged on the same side of the through hole; or,
the piezoelectric film is arranged at one end of the through hole, and the vibrating diaphragm is arranged at the other end of the through hole.
Further, when the piezoelectric film and the diaphragm are respectively arranged on the same side of the through hole, the diaphragm is convex; or,
the piezoelectric film is arranged at one end of the through hole, and when the vibrating diaphragm is arranged at the other end of the through hole, the vibrating diaphragm is in a convex shape when the areas of the end surfaces at the two ends of the through hole are equal; when the end surface areas of the two ends of the through hole are unequal, the vibrating diaphragm is arranged at one end with a large area of the through hole, and the piezoelectric film is arranged at one end with a small area of the through hole.
Further, the supporting piece is a PCB board, and the through hole is formed in the PCB board;
the signal processing circuit is integrated at a position outside the accommodating space of the PCB.
Further comprises an upper gland and a lower gland,
the upper gland is a first cylinder with one end part shrinking inwards, and the inner side wall of the first cylinder is provided with internal threads; the lower gland is a second cylinder, the outer side wall of the second cylinder is provided with an external thread, and the second cylinder extends into the first cylinder along the end, which is not provided with the inward contraction, of the first cylinder and is in threaded connection with the first cylinder in a matching manner;
the support part is extruded and fixed by the contraction part of the first cylinder and the end part of the second cylinder extending into the first cylinder, wherein the piezoelectric film and the vibrating diaphragm are arranged at one end of the support part far away from the second cylinder, and the vibrating diaphragm covers the piezoelectric film on the support part.
Further, a sound absorption layer is arranged on the part, located in the accommodating space, of the supporting piece.
Further, a charge amplifier is included in the signal processing circuit.
The utility model also provides a stethoscope, which comprises a contact pickup microphone and a player, wherein the player receives and plays the audio signal of the contact pickup microphone; the contact type pickup microphone comprises a signal processing circuit, a rigid supporting piece, a piezoelectric film and a vibrating diaphragm, wherein the signal processing circuit is electrically connected with the piezoelectric film;
the supporting piece is provided with a through hole, the piezoelectric film seals and covers the through hole in a closed manner, the vibrating diaphragm covers the through hole, and the edge of the vibrating diaphragm is connected to the supporting piece in a closed manner; and a closed containing space filled with fluid vibration media is formed among the piezoelectric film, the vibrating diaphragm and the supporting piece, wherein at least the part of the piezoelectric film, which covers the through hole, is the inner wall of the containing space, and the part of the vibrating diaphragm, which forms the inner wall of the containing space, is larger than the part of the piezoelectric film, which covers the through hole.
Furthermore, the vibrating diaphragm is arranged to be in a convex shape, and the edge of the vibrating diaphragm is hermetically connected to the supporting piece.
Furthermore, the edge of the diaphragm connected with the support part is in a corrugated shape or a corrugated shape; or the edge of the diaphragm is connected with the support part through a flexible body. .
Furthermore, the piezoelectric film and the diaphragm are respectively arranged on the same side of the through hole; or,
the piezoelectric film is arranged at one end of the through hole, and the vibrating diaphragm is arranged at the other end of the through hole.
Further, when the piezoelectric film and the diaphragm are respectively arranged on the same side of the through hole, the diaphragm is convex; or,
the piezoelectric film is arranged at one end of the through hole, and when the vibrating diaphragm is arranged at the other end of the through hole, the vibrating diaphragm is in a convex shape when the areas of the end surfaces at the two ends of the through hole are equal; when the end surface areas of the two ends of the through hole are unequal, the vibrating diaphragm is arranged at one end with a large area of the through hole, and the piezoelectric film is arranged at one end with a small area of the through hole.
Further, the supporting piece is a PCB board, and the through hole is formed in the PCB board;
the signal processing circuit is integrated at a position outside the accommodating space of the PCB.
Further comprises an upper gland and a lower gland,
the upper gland is a first cylinder with one end part shrinking inwards, and the inner side wall of the first cylinder is provided with internal threads; the lower gland is a second cylinder, the outer side wall of the second cylinder is provided with an external thread, and the second cylinder extends into the first cylinder along the end, which is not provided with the inward contraction, of the first cylinder and is in threaded connection with the first cylinder in a matching manner;
the support part is extruded and fixed by the contraction part of the first cylinder and the end part of the second cylinder extending into the first cylinder, wherein the piezoelectric film and the vibrating diaphragm are arranged at one end of the support part far away from the second cylinder, and the vibrating diaphragm covers the piezoelectric film on the support part.
Further, a sound absorption layer is arranged on the part, located in the accommodating space, of the supporting piece.
Further, a charge amplifier is included in the signal processing circuit.
The utility model discloses a contact pickup microphone forms inclosed accommodation space that is full of fluid vibrations medium with vibrating diaphragm, piezoelectric film and support piece, and piezoelectric film's area is less than the area of vibrating diaphragm, when gathering the vibrations condition of target object, with vibrating diaphragm contact target object, the target object can drive the vibrating diaphragm vibrations, the vibrating diaphragm will shake the condition and act on the accommodation space, thereby make piezoelectric film produce the signal of telecommunication, because the area of vibrating diaphragm is greater than piezoelectric film, so piezoelectric film's amplitude of vibration can be greater than the range of vibrating diaphragm, the signal of telecommunication that makes piezoelectric film produce can be bigger, thereby can be high sensitivity ground, the vibrations condition of the collection target object on high fidelity ground.
Drawings
Fig. 1 is a schematic cross-sectional view of a contact pickup microphone according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a contact pickup microphone according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a contact pickup microphone according to an embodiment of the present invention;
FIG. 4 is a view A-A of FIG. 3 according to the present invention;
fig. 5 is a schematic structural diagram of a contact pickup microphone according to yet another embodiment of the present invention;
fig. 6 is a schematic structural diagram of a stethoscope according to an embodiment of the present invention.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the embodiment of the present invention provides a contact pickup microphone 1, including a signal processing circuit, a rigid supporting member 10, a piezoelectric film 20, and a vibrating diaphragm 30, where the signal processing circuit is electrically connected to the piezoelectric film 20; a through hole 11 is formed in the supporting part 10, the through hole 11 is hermetically sealed by the piezoelectric film 20, the vibrating diaphragm 30 covers the through hole 11, and the edge of the vibrating diaphragm 30 is hermetically connected to the supporting part 10; a closed accommodating space 40 filled with a fluid vibration medium is formed among the piezoelectric film 20, the support 10 and the diaphragm 30, wherein at least a portion of the piezoelectric film 20 covering the through hole 11 is an inner wall of the accommodating space 40, and a portion of the diaphragm 30 constituting the inner wall of the accommodating space 40 is larger than a portion of the piezoelectric film 20 covering the through hole 11, that is, an orthographic area of one side of the diaphragm 30 opposite to the through hole 11 is larger than an area of an end of the through hole 11.
The signal processing circuit generally includes a signal amplifying circuit, a filter circuit, a compressing circuit, an analog-to-digital conversion circuit, a radio frequency transmitting circuit, and the like, and is configured to process an electrical signal generated by the piezoelectric film 20 as required. For example, the electrical signal is first amplified by the signal amplifying circuit, then clutter-filtered by the filter circuit, then the analog signal is converted into a digital signal by the analog-to-digital conversion circuit, and finally the digital signal is compressed by the compression circuit and the radio frequency transmitting circuit and transmitted to the player 2 and other devices, while in another embodiment, the player 2 and other devices are connected by a signal line, and the radio frequency transmitting circuit is not required. In other embodiments, the corresponding signal processing circuit may be provided according to the actual use case.
The rigid supporting member 10 means that when the diaphragm 30 vibrates, the supporting member 10 does not generate excessive vibration, thereby improving fidelity.
The piezoelectric film 20 is a piezoelectric polyvinylidene fluoride (PVDF) polymer film, and is a film which can generate corresponding electric signals after being deformed due to external force interference, and the larger the deformation is, the larger the generated electric signals are, the same piezoelectric film 20 has the characteristics. The piezoelectric film 20 is disposed at the through hole 11 on the support 10 to provide a space for the piezoelectric film 20 to vibrate.
The diaphragm 30 is a layer of film capable of sensing vibration of the target. In this embodiment, the diaphragm 30 has rigidity, so as to prevent the diaphragm 30 from deforming itself and the piezoelectric film 20 from deforming weakly when the accommodating space 40 is compressed.
The portion of the piezoelectric film 20 at least covering the through hole 11 is an inner wall of the accommodating space 40, and the portion of the diaphragm 20 forming the inner wall of the accommodating space 40 is larger than the portion of the piezoelectric film 20 covering the through hole 11, which means that after the piezoelectric film 20 covers the through hole 11 and the diaphragm 30 covers the through hole 11, a gap is formed between the portion of the piezoelectric film 20 corresponding to the through hole 11 and the portion of the diaphragm 3 corresponding to the through hole 11, and for practical application, the diaphragm 30 protrudes out of the through hole for setting, so as to conveniently receive a vibration signal. In this embodiment, the diaphragm 30 covers the through hole 11, which means that an orthographic projection of the diaphragm 30 toward the through hole 11 covers the through hole 11, and an edge of the diaphragm 30 is connected to a supporting member at a periphery of an end portion of the through hole 11. The accommodating space 40 is filled with a fluid vibration medium, which may be air or other gas, or a liquid such as water. Different vibration media can be selected according to specific use environments, for example, mainly collecting vibration of a target object in air, air is generally set in the accommodating space 40 as the vibration media, and in other embodiments, collecting vibration of a target object in water, water is selected to be set in the accommodating space 40 as the vibration media, and the like.
The contact pickup microphone 1 of this embodiment, when gathering the vibrations condition of target, with vibrating diaphragm 30 contact target, the target can drive vibrating diaphragm 30 vibrations, vibrating diaphragm 30 will shake the condition and act on accommodation space 40, thereby make piezoelectric film 20 seal the through-hole 11 part and take place corresponding deformation and produce the signal of telecommunication, because the area of the vibrating diaphragm 30 part of accommodation space 40 inner wall is greater than piezoelectric film 20 and seals the area of through-hole 11 part, so piezoelectric film 20's amplitude of vibration can be greater than vibrating diaphragm 30, the signal of telecommunication that makes piezoelectric film 20 produce can be bigger, thereby the vibrations condition of the collection target that can high sensitivity, the vibrations condition of more real reduction target. In this embodiment, in order to reduce the area of the piezoelectric film 20 corresponding to the through hole, the piezoelectric film 20 is disposed in a plane.
Referring to fig. 2, in the present embodiment, the diaphragm 30 is configured to be a convex shape, and the edge of the diaphragm 30 is hermetically connected to the supporting member 10, because an accommodating space is formed between the piezoelectric film 20 and the diaphragm 30, the vertex of the convex surface of the diaphragm 30 is far away from the piezoelectric film 20. The convex shape may be any semi-spherical shape obtained by cutting a sphere in any direction, or other irregular convex shapes. The convex-shaped diaphragm 30 can increase the area of the diaphragm 30, and is convenient for collecting the vibration condition of the target object.
In this embodiment, the edge of the diaphragm 30 connected to the support 10 is corrugated or corrugated, and the edge of the corrugated or corrugated diaphragm 30 connected to the support 10 can also provide a very large dynamic range and a very low hysteresis of the diaphragm 30 when the diaphragm 30 receives pressure interference; or the edge of the diaphragm 30 is connected to the support 10 through the flexible body 31, that is, one end of the flexible body 31 is hermetically connected to the support, and the other end is hermetically connected to the edge of the diaphragm 30, and the flexible body can also provide a very large dynamic range and a delay as low as possible for the diaphragm 30. When the diaphragm 30 is pressed, the edge connected to the support member 10 is largely deformed, thereby realizing a large-efficiency compression accommodating space 40, making the amount of deformation of the piezoelectric film 20 larger, and thus improving the sensitivity and fidelity of the contact type sound pickup microphone 1 of the embodiment.
In this embodiment, the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, or the piezoelectric film 20 is disposed at one end of the through hole 11, and the diaphragm 30 is disposed at the other end of the through hole. In a specific embodiment, as shown in fig. 4, when the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, the diaphragm 30 is convex and covers the piezoelectric film 20, the edge of the diaphragm 30 is connected to the supporting member 10, and usually, a gap is formed between the edge of the diaphragm 30 and the edge of the piezoelectric film 20, so that the volume of the accommodating space 40 can be increased as much as possible, the piezoelectric film 20 is covered on the upper end of the through hole 11, and then the diaphragm 30 is also disposed on the end, when the accommodating space is squeezed in use, because the piezoelectric film 20 and the diaphragm 30 are disposed on the same side of the supporting member 10, the piezoelectric film is not easily deformed by sinking into the through hole and is not separated from the supporting member 10; in another embodiment, as shown in fig. 1 and fig. 2, when the piezoelectric film 20 is disposed at one end of the through hole 11 and the diaphragm 30 is disposed at the other end of the through hole 11, when the end surfaces of the two ends of the through hole 11 have the same area, the diaphragm 30 is convex and covers the through hole 11; when the end surfaces of the two ends of the through hole are unequal in area, the diaphragm is arranged at the end with the larger area of the through hole, and the piezoelectric film is arranged at the end with the smaller area of the through hole, that is, when the diaphragm 30 is convex and the piezoelectric film 20 is flat, the inner diameters of the through holes 11 can be the same at the two ends; when the diaphragm 30 and the piezoelectric film 20 are both flat, the opening area of the through hole 11 at the end where the diaphragm 30 is disposed is larger than the opening area at the end where the piezoelectric film 20 is disposed. In other embodiments, the piezoelectric film 20 and/or the diaphragm 30 may also be disposed in the middle of the through hole 11, as long as the diaphragm 30 conveniently receives the vibration signal, for example, the supporting member is a sandwich structure, and the edges of the piezoelectric film 20 and the diaphragm 30 are clamped by the sandwich structure.
In this embodiment, the supporting member 10 is a PCB, the through hole 11 is formed in the PCB, the signal processing circuit is integrated at a position outside the accommodating space 40 of the PCB, and the PCB is used as the supporting member 10, so that the signal processing circuit can be conveniently integrated on the supporting member 10. In a specific embodiment, a vibrating diaphragm 30 is disposed on one side of the PCB, and the signal processing circuit is integrated on the other side of the PCB, so that the signal processing circuit does not affect the contact between the end where the vibrating diaphragm 30 is disposed and the target. In this embodiment, the signal processing circuit is integrated at a position other than the accommodating space 40 of the supporting frame, so that the signal processing circuit is conveniently arranged, and the convenience and volume of the contact type sound pickup microphone 1 are improved.
In this embodiment, the sound absorbing layer 50 is disposed on a portion of the supporting member 10 located in the accommodating space 40, and the sound absorbing layer 50 can prevent sound waves from being reflected in the accommodating cavity to affect the sensing, so as to improve the fidelity. The sound absorbing layer 50 may be formed by laying cotton, sponge, cloth, flexible rubber, etc.
In this embodiment, the signal processing circuit includes a charge amplifier, that is, the specific electrical signal amplifying circuit is a charge amplifier. The charge amplifier amplifies the acquired vibration signal in the form of energy, and the amplification effect of the charge amplifier is far better than that of a common voltage amplifier: the signal action is closer to the auditory sensation of human ears, and the output signal accords with the use habits of a mechanical stethoscope and the like; the signal effect is not influenced by the change of the output impedance, particularly the frequency change, and the fidelity is greatly improved; the circuit is simple, and the very low high-pass cut-off frequency is conveniently obtained. In this embodiment, the electric signal amplification is performed by using the charge amplifier, and the relatively balanced signal amplification from 1Hz to 10KHz can be easily obtained.
Referring to fig. 3 and 4, in a specific embodiment, a through hole 11 is formed in the middle of a circular PCB in the thickness direction, a piezoelectric film 20 is disposed at the through hole 11, and the piezoelectric film 20 tightly seals the through hole 11; then covering a vibrating diaphragm 30 with a spherical section on the piezoelectric film 20, so that an accommodating space 40 is enclosed among the piezoelectric film 20, the PCB and the vibrating diaphragm 30, and paving sound-absorbing materials such as sponge on the PCB in the accommodating space 40; and a signal processing circuit is integrated on the side of the PCB where the diaphragm 30 is not arranged, and the signal processing circuit is connected with the piezoelectric film 20. In this implementation, the contact type sound pickup microphone 1 may further include a housing, and an opening protruding the diaphragm 30 is formed in the housing, so that the diaphragm 30 is conveniently in contact with a target object.
Referring to fig. 5, in yet another embodiment, the contact pickup microphone 1 includes an upper pressing cover 81, a lower pressing cover 82, a supporting member 10, a signal processing circuit, a diaphragm 30, a piezoelectric film 20, and a flexible body 31; the upper gland 81 is a first cylinder with one end part shrinking inwards, and the inner side wall of the first cylinder is provided with internal threads; the lower gland 82 is a second cylinder, the outer side wall of the second cylinder is provided with an external thread, and the second cylinder extends into the first cylinder along the end, which is not provided with the inward contraction, of the first cylinder and is in threaded connection with the first cylinder in a matching manner; the supporting member 10 is pressed and fixed by the contracted portion of the first cylinder and the end portion of the second cylinder extending into the first cylinder, wherein the diaphragm 30 is disposed at one end of the supporting member 10 away from the second cylinder, and the diaphragm 30 covers the piezoelectric film 20 on the supporting member 10. The support member 10 is provided with a through hole 11, one end of the through hole 11 far away from the lower gland 82 covers the piezoelectric film 20, the edge of one side of the support member 10 far away from the lower gland is provided with a flexible body 31, the edge of the diaphragm 30 is connected with the flexible body 31, namely, the edge of the contraction part of the first cylinder covers the edge of the diaphragm 30, the edge of the diaphragm 30 is connected with one end surface of the support member 10 through the flexible body 31, the other end surface of the support member 10 and the end part of the second cylinder extending into the first cylinder are extruded, and when the lower gland 82 and the upper gland 81 are in relative threaded connection, the diaphragm 30, the flexible body 31 and the support member 10 are fixedly pressed between the upper gland 81 and the county gland. The contact type pickup microphone 1 of the embodiment has a simple structure, the piezoelectric film 20 is arranged on the same side as the diaphragm 30, and when the accommodating space is extruded, the piezoelectric film 20 is not easy to separate from the support member 10 due to the concave deformation towards the through hole 11; the diaphragm 30 is convex and covers the whole support member 10, so that the volume of the accommodating space can be increased, the ratio of the area of the diaphragm 30 to the area of the piezoelectric film 20 is increased as much as possible, when the accommodating space is extruded, the electric signal of the piezoelectric film 20 is improved, and the vibration condition of the target object can be acquired with high sensitivity and high fidelity; the flexible body 31 can provide a great dynamic range and a retardation as low as possible for the diaphragm 30; the upper pressing cover 81 and the lower pressing cover 82 are provided to facilitate fixing the supporting member 10 and mounting the diaphragm 30, etc., and have a simple structure.
The contact type sound pickup microphone 1 of the embodiment can sensitively collect the vibration signal of the target object and restore the vibration signal into the sound signal with high fidelity.
Referring to fig. 6 and fig. 1, the present embodiment further provides a stethoscope, which includes a contact sound pickup microphone 1 and a player 2, where the player 2 receives and plays an audio signal of the contact sound pickup microphone 1, the contact sound pickup microphone 1 includes a signal processing circuit, a rigid supporting member 10, a piezoelectric film 20, and a diaphragm 30, and the signal processing circuit is electrically connected to the piezoelectric film 20; a through hole 11 is formed in the supporting part 10, the through hole 11 is hermetically sealed by the piezoelectric film 20, the vibrating diaphragm 30 covers the through hole 11, and the edge of the vibrating diaphragm 30 is hermetically connected to the supporting part 10; a closed accommodating space 40 filled with a fluid vibration medium is formed among the piezoelectric film 20, the support 10 and the diaphragm 30, wherein at least a portion of the piezoelectric film 20 covering the through hole 11 is an inner wall of the accommodating space 40, and a portion of the diaphragm 30 constituting the inner wall of the accommodating space 40 is larger than a portion of the piezoelectric film 20 covering the through hole 11, that is, an orthographic area of one side of the diaphragm 30 opposite to the through hole 11 is larger than an area of an end of the through hole 11.
The signal processing circuit generally includes a signal amplifying circuit, a filter circuit, a compressing circuit, an analog-to-digital conversion circuit, a radio frequency transmitting circuit, and the like, and is configured to process an electrical signal generated by the piezoelectric film 20 as required. For example, the electrical signal is first amplified by the signal amplifying circuit, then clutter-filtered by the filter circuit, then the analog signal is converted into a digital signal by the analog-to-digital conversion circuit, and finally the digital signal is compressed by the compression circuit and the radio frequency transmitting circuit and transmitted to the player 2 and other devices, while in another embodiment, the player 2 and other devices are connected by a signal line, and the radio frequency transmitting circuit is not required. In other embodiments, the corresponding signal processing circuit may be provided according to the actual use case.
The rigid supporting member 10 means that when the diaphragm 30 vibrates, the supporting member 10 does not generate excessive vibration, thereby improving fidelity.
The piezoelectric film 20 is a piezoelectric polyvinylidene fluoride (PVDF) polymer film, and is a film which can generate corresponding electric signals after being deformed due to external force interference, and the larger the deformation is, the larger the generated electric signals are, the same piezoelectric film 20 has the characteristics. The piezoelectric film 20 is disposed at the through hole 11 on the support 10 to provide a space for the piezoelectric film 20 to vibrate.
The diaphragm 30 is a layer of film capable of sensing vibration of the target. In this embodiment, the diaphragm 30 has rigidity, so as to prevent the diaphragm 30 from deforming itself and the piezoelectric film 20 from deforming weakly when the accommodating space 40 is compressed.
The portion of the piezoelectric film 20 at least covering the through hole 11 is an inner wall of the accommodating space 40, and the portion of the diaphragm 20 forming the inner wall of the accommodating space 40 is larger than the portion of the piezoelectric film 20 covering the through hole 11, which means that after the piezoelectric film 20 covers the through hole 11 and the diaphragm 30 covers the through hole 11, a gap is formed between the portion of the piezoelectric film 20 corresponding to the through hole 11 and the portion of the diaphragm 3 corresponding to the through hole 11, and for practical application, the diaphragm 30 protrudes out of the through hole for setting, so as to conveniently receive a vibration signal. In this embodiment, the diaphragm 30 covers the through hole 11, which means that an orthographic projection of the diaphragm 30 toward the through hole 11 covers the through hole 11, and an edge of the diaphragm 30 is connected to a supporting member at a periphery of an end portion of the through hole 11. The accommodating space 40 is filled with a fluid vibration medium, which may be air or other gas, or a liquid such as water. Different vibration media can be selected according to specific use environments, for example, mainly collecting vibration of a target object in air, air is generally set in the accommodating space 40 as the vibration media, and in other embodiments, collecting vibration of a target object in water, water is selected to be set in the accommodating space 40 as the vibration media, and the like.
The contact pickup microphone 1 of this embodiment, when gathering the vibrations condition of target, with vibrating diaphragm 30 contact target, the target can drive vibrating diaphragm 30 vibrations, vibrating diaphragm 30 will shake the condition and act on accommodation space 40, thereby make piezoelectric film 20 seal the through-hole 11 part and take place corresponding deformation and produce the signal of telecommunication, because the area of the vibrating diaphragm 30 part of accommodation space 40 inner wall is greater than piezoelectric film 20 and seals the area of through-hole 11 part, so piezoelectric film 20's amplitude of vibration can be greater than vibrating diaphragm 30, the signal of telecommunication that makes piezoelectric film 20 produce can be bigger, thereby the vibrations condition of the collection target that can high sensitivity, the vibrations condition of more real reduction target. In this embodiment, in order to reduce the area of the piezoelectric film 20 corresponding to the through hole, the piezoelectric film 20 is disposed in a plane.
Referring to fig. 2, in the present embodiment, the diaphragm 30 is configured to be a convex shape, and the edge of the diaphragm 30 is hermetically connected to the supporting member 10, because an accommodating space is formed between the piezoelectric film 20 and the diaphragm 30, the vertex of the convex surface of the diaphragm 30 is far away from the piezoelectric film 20. The convex shape may be any semi-spherical shape obtained by cutting a sphere in any direction, or other irregular convex shapes. The convex-shaped diaphragm 30 can increase the area of the diaphragm 30, and is convenient for collecting the vibration condition of the target object.
In this embodiment, the edge of the diaphragm 30 connected to the support 10 is corrugated or corrugated, and the edge of the corrugated or corrugated diaphragm 30 connected to the support 10 can also provide a very large dynamic range and a very low hysteresis of the diaphragm 30 when the diaphragm 30 receives pressure interference; or the edge of the diaphragm 30 is connected to the support 10 through the flexible body 31, that is, one end of the flexible body 31 is hermetically connected to the support, and the other end is hermetically connected to the edge of the diaphragm 30, and the flexible body can also provide a very large dynamic range and a delay as low as possible for the diaphragm 30. When the diaphragm 30 is pressed, the edge connected to the support member 10 is largely deformed, thereby realizing a large-efficiency compression accommodating space 40, and making the amount of deformation of the piezoelectric film 20 larger, thereby improving the sensitivity and fidelity of the contact type sound pickup microphone 1 of the embodiment.
In this embodiment, the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, or the piezoelectric film 20 is disposed at one end of the through hole 11, and the diaphragm 30 is disposed at the other end of the through hole. In a specific embodiment, as shown in fig. 4, when the piezoelectric film 20 and the diaphragm 30 are respectively disposed on the same side of the through hole 11, the diaphragm 30 is convex and covers the piezoelectric film 20, the edge of the diaphragm 30 is connected to the supporting member 10, generally, a gap is formed between the edge of the diaphragm 30 and the edge of the piezoelectric film 20, so that the volume of the accommodating space 40 can be increased as much as possible, the piezoelectric film 20 covers the upper end of the through hole 11, and then the diaphragm 30 is also disposed on the end, when the accommodating space is squeezed in use, because the piezoelectric film 20 and the diaphragm 30 are disposed on the same side of the supporting member 10, the piezoelectric film is not easily deformed to be separated from the supporting member 10 due to being recessed into the through hole; in another embodiment, as shown in fig. 1 and fig. 2, when the piezoelectric film 20 is disposed at one end of the through hole 11 and the diaphragm 30 is disposed at the other end of the through hole 11, when the end surfaces of the two ends of the through hole 11 have the same area, the diaphragm 30 is convex and covers the through hole 11; when the end surfaces of the two ends of the through hole are unequal in area, the diaphragm is arranged at the end with the larger area of the through hole, and the piezoelectric film is arranged at the end with the smaller area of the through hole, that is, when the diaphragm 30 is convex and the piezoelectric film 20 is flat, the inner diameters of the through holes 11 can be the same at the two ends; when the diaphragm 30 and the piezoelectric film 20 are both flat, the opening area of the through hole 11 at the end where the diaphragm 30 is disposed is larger than the opening area at the end where the piezoelectric film 20 is disposed. In other embodiments, the piezoelectric film 20 and/or the diaphragm 30 may also be disposed in the middle of the through hole 11, as long as the diaphragm 30 conveniently receives the vibration signal, for example, the supporting member is a sandwich structure, and the edges of the piezoelectric film 20 and the diaphragm 30 are clamped by the sandwich structure.
In this embodiment, the supporting member 10 is a PCB, the through hole 11 is formed in the PCB, the signal processing circuit is integrated at a position outside the accommodating space 40 of the PCB, and the PCB is used as the supporting member 10, so that the signal processing circuit can be conveniently integrated on the supporting member 10. In a specific embodiment, a vibrating diaphragm 30 is disposed on one side of the PCB, and the signal processing circuit is integrated on the other side of the PCB, so that the signal processing circuit does not affect the contact between the end where the vibrating diaphragm 30 is disposed and the target. In this embodiment, the signal processing circuit is integrated at a position other than the accommodating space 40 of the supporting frame, so that the signal processing circuit is conveniently arranged, and the convenience and volume of the contact type sound pickup microphone 1 are improved.
In this embodiment, the sound absorbing layer 50 is disposed on a portion of the supporting member 10 located in the accommodating space 40, and the sound absorbing layer 50 can prevent sound waves from being reflected in the accommodating cavity to affect the sensing, so as to improve the fidelity. The sound absorbing layer 50 may be formed by laying cotton, sponge, cloth, flexible rubber, etc.
In this embodiment, the signal processing circuit includes a charge amplifier, that is, the specific electrical signal amplifying circuit is a charge amplifier. The charge amplifier amplifies the acquired vibration signal in the form of energy, and the amplification effect of the charge amplifier is far better than that of a common voltage amplifier: the signal action is closer to the auditory sensation of human ears, and the output signal accords with the use habits of a mechanical stethoscope and the like; the signal effect is not influenced by the change of the output impedance, particularly the frequency change, and the fidelity is greatly improved; the circuit is simple, and the very low high-pass cut-off frequency is conveniently obtained. In this embodiment, the electric signal amplification is performed by using the charge amplifier, and the relatively balanced signal amplification from 1Hz to 10KHz can be easily obtained.
Referring to fig. 3 and 4, in a specific embodiment, a through hole 11 is formed in the middle of a circular PCB in the thickness direction, a piezoelectric film 20 is disposed at the through hole 11, and the piezoelectric film 20 tightly seals the through hole 11; then covering a vibrating diaphragm 30 with a spherical section on the piezoelectric film 20, so that an accommodating space 40 is enclosed among the piezoelectric film 20, the PCB and the vibrating diaphragm 30, and paving sound-absorbing materials such as sponge on the PCB in the accommodating space 40; and a signal processing circuit is integrated on the side of the PCB where the diaphragm 30 is not arranged, and the signal processing circuit is connected with the piezoelectric film 20. In this implementation, the contact type sound pickup microphone 1 may further include a housing, and an opening protruding the diaphragm 30 is formed in the housing, so that the diaphragm 30 is conveniently in contact with a target object.
Referring to fig. 5, in yet another embodiment, the contact pickup microphone 1 includes an upper pressing cover 81, a lower pressing cover 82, a supporting member 10, a signal processing circuit, a diaphragm 30, a piezoelectric film 20, and a flexible body 31; the upper gland 81 is a first cylinder with one end part shrinking inwards, and the inner side wall of the first cylinder is provided with internal threads; the lower gland 82 is a second cylinder, the outer side wall of the second cylinder is provided with an external thread, and the second cylinder extends into the first cylinder along the end, which is not provided with the inward contraction, of the first cylinder and is in threaded connection with the first cylinder in a matching manner; the supporting member 10 is pressed and fixed by the contracted portion of the first cylinder and the end portion of the second cylinder extending into the first cylinder, wherein the diaphragm 30 is disposed at one end of the supporting member 10 away from the second cylinder, and the diaphragm 30 covers the piezoelectric film 20 on the supporting member 10. The support member 10 is provided with a through hole 11, one end of the through hole 11 far away from the lower gland 82 covers the piezoelectric film 20, the edge of one side of the support member 10 far away from the lower gland is provided with a flexible body 31, the edge of the diaphragm 30 is connected with the flexible body 31, namely, the edge of the contraction part of the first cylinder covers the edge of the diaphragm 30, the edge of the diaphragm 30 is connected with one end surface of the support member 10 through the flexible body 31, the other end surface of the support member 10 and the end part of the second cylinder extending into the first cylinder are extruded, and when the lower gland 82 and the upper gland 81 are in relative threaded connection, the diaphragm 30, the flexible body 31 and the support member 10 are fixedly pressed between the upper gland 81 and the county gland. The contact type pickup microphone 1 of the embodiment has a simple structure, the piezoelectric film 20 is arranged on the same side as the diaphragm 30, and when the accommodating space is extruded, the piezoelectric film 20 is not easy to separate from the support member 10 due to the concave deformation towards the through hole 11; the diaphragm 30 is convex and covers the whole support member 10, so that the volume of the accommodating space can be increased, the ratio of the area of the diaphragm 30 to the area of the piezoelectric film 20 is increased as much as possible, when the accommodating space is extruded, the electric signal of the piezoelectric film 20 is improved, and the vibration condition of the target object can be acquired with high sensitivity and high fidelity; the flexible body 31 can provide a great dynamic range and a retardation as low as possible for the diaphragm 30; the upper pressing cover 81 and the lower pressing cover 82 are provided to facilitate fixing the supporting member 10 and mounting the diaphragm 30, etc., and have a simple structure.
The stethoscope of the embodiment can sensitively collect the vibration signal of the target object and restore the vibration signal into a sound signal with high fidelity due to the arrangement of the contact type sound pickup microphone of the embodiment.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (11)
1. A contact type pickup microphone is characterized by comprising a signal processing circuit, a rigid support piece, a piezoelectric film and a vibrating diaphragm, wherein the signal processing circuit is electrically connected with the piezoelectric film;
the supporting piece is provided with a through hole, the piezoelectric film seals and covers the through hole in a closed manner, the vibrating diaphragm covers the through hole, and the edge of the vibrating diaphragm is connected to the supporting piece in a closed manner; and a closed containing space filled with fluid vibration media is formed among the piezoelectric film, the vibrating diaphragm and the supporting piece, wherein at least the part of the piezoelectric film, which covers the through hole, is the inner wall of the containing space, and the part of the vibrating diaphragm, which forms the inner wall of the containing space, is larger than the part of the piezoelectric film, which covers the through hole.
2. The contact pickup microphone as claimed in claim 1, wherein the diaphragm is formed in a convex shape, and an edge of the diaphragm is hermetically connected to the supporting member.
3. The contact pickup microphone as claimed in claim 2, wherein the edge of the diaphragm connected to the support member is corrugated or undulated; or the edge of the diaphragm is connected with the support part through a flexible body.
4. The contact pickup microphone as claimed in claim 1, wherein the piezoelectric film and the diaphragm are respectively disposed on the same side of the through hole; or,
the piezoelectric film is arranged at one end of the through hole, and the vibrating diaphragm is arranged at the other end of the through hole.
5. The contact pickup microphone as claimed in claim 4, wherein the diaphragm is convex when the piezoelectric film and the diaphragm are respectively disposed on the same side of the through hole; or,
the piezoelectric film is arranged at one end of the through hole, and when the vibrating diaphragm is arranged at the other end of the through hole, the vibrating diaphragm is in a convex shape when the areas of the end surfaces at the two ends of the through hole are equal; when the end surface areas of the two ends of the through hole are unequal, the vibrating diaphragm is arranged at one end with a large area of the through hole, and the piezoelectric film is arranged at one end with a small area of the through hole.
6. The contact pickup microphone of claim 1 wherein the support is a PCB board on which the through hole is provided;
the signal processing circuit is integrated at a position outside the accommodating space of the PCB.
7. The contact pickup microphone according to any one of claims 1 to 6, further comprising an upper cover and a lower cover,
the upper gland is a first cylinder with one end part shrinking inwards, and the inner side wall of the first cylinder is provided with internal threads; the lower gland is a second cylinder, the outer side wall of the second cylinder is provided with an external thread, and the second cylinder extends into the first cylinder along the end, which is not provided with the inward contraction, of the first cylinder and is in threaded connection with the first cylinder in a matching manner;
the support part is extruded and fixed by the contraction part of the first cylinder and the end part of the second cylinder extending into the first cylinder, wherein the piezoelectric film and the vibrating diaphragm are arranged at one end of the support part far away from the second cylinder, and the vibrating diaphragm covers the piezoelectric film on the support part.
8. A contact pickup microphone according to any one of claims 1 to 6, wherein a part of the support member located in the accommodation space is provided with a sound absorbing layer.
9. The contact pickup microphone as claimed in any one of claims 1 to 6, wherein a charge amplifier is included in the signal processing circuit.
10. A stethoscope comprises a contact type pickup microphone and a player, wherein the player receives and plays an audio signal of the contact type pickup microphone, and the contact type pickup microphone is characterized by comprising a signal processing circuit, a rigid supporting piece, a piezoelectric film and a vibrating film, wherein the signal processing circuit is electrically connected with the piezoelectric film;
the supporting piece is provided with a through hole, the piezoelectric film seals and covers the through hole in a closed manner, the vibrating diaphragm covers the through hole, and the edge of the vibrating diaphragm is connected to the supporting piece in a closed manner; and a closed containing space filled with fluid vibration media is formed among the piezoelectric film, the vibrating diaphragm and the supporting piece, wherein at least the part of the piezoelectric film, which covers and seals the through hole, is the inner wall of the containing space, and the part of the vibrating diaphragm, which forms the inner wall of the containing space, is larger than the part of the piezoelectric film, which covers and seals the through hole.
11. The stethoscope according to claim 10 wherein the contact pickup microphone is according to any one of claims 2-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520439788.6U CN204839566U (en) | 2015-06-23 | 2015-06-23 | Contact pickup microphone and stethoscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520439788.6U CN204839566U (en) | 2015-06-23 | 2015-06-23 | Contact pickup microphone and stethoscope |
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| Publication Number | Publication Date |
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| CN204839566U true CN204839566U (en) | 2015-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520439788.6U Active CN204839566U (en) | 2015-06-23 | 2015-06-23 | Contact pickup microphone and stethoscope |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104921751A (en) * | 2015-06-23 | 2015-09-23 | 杨松 | Contact type pickup microphone and stethoscope |
| WO2018040259A1 (en) * | 2016-08-31 | 2018-03-08 | 歌尔股份有限公司 | Sensitive membrane and mems microphone |
| CN112511933A (en) * | 2019-09-13 | 2021-03-16 | 陈汝建 | Microphone |
-
2015
- 2015-06-23 CN CN201520439788.6U patent/CN204839566U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104921751A (en) * | 2015-06-23 | 2015-09-23 | 杨松 | Contact type pickup microphone and stethoscope |
| WO2016206560A1 (en) * | 2015-06-23 | 2016-12-29 | 胡琨 | Contact sound pickup microphone and stethoscope |
| WO2018040259A1 (en) * | 2016-08-31 | 2018-03-08 | 歌尔股份有限公司 | Sensitive membrane and mems microphone |
| CN112511933A (en) * | 2019-09-13 | 2021-03-16 | 陈汝建 | Microphone |
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Effective date of registration: 20191016 Address after: 518000 Longquan Garden C10, People's North Road, Jinglong Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shi Ling Science and Technology Ltd. of Shenzhen Address before: 510000, room 126, 2107 Xin Xin Road, Yuexiu District temple, Guangdong, Guangzhou Patentee before: Yang Song |