CN113675160A - Impact flow double-layer flow guide micro-channel heat sink suitable for high heat flow density device - Google Patents
Impact flow double-layer flow guide micro-channel heat sink suitable for high heat flow density device Download PDFInfo
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- 239000002826 coolant Substances 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 136
- 230000004907 flux Effects 0.000 claims description 12
- 239000002355 dual-layer Substances 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012809 cooling fluid Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 18
- 238000001816 cooling Methods 0.000 abstract description 11
- 238000012546 transfer Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 10
- 230000000737 periodic effect Effects 0.000 abstract description 8
- 230000001965 increasing effect Effects 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 19
- 239000012530 fluid Substances 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000010364 biochemical engineering Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
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- 238000002791 soaking Methods 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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Abstract
The invention relates to an impact flow double-layer flow guide micro-channel heat sink suitable for a high-heat-flow-density device, which has the characteristics of high-efficiency and uniform convection heat exchange performance, low pressure loss and high overall heat exchange. The coolant can shorten the stroke of the coolant in the channel to a greater extent in the invention, thereby reducing the pressure drop loss and improving the working stability of the system; secondly, the periodic truncated middle layer can reduce pressure drop resistance of the channel and simultaneously enable the upper and lower layers of cooling agents to generate turbulent flow, so that a flow boundary layer is damaged, and heat transfer characteristics are enhanced; thirdly, the upper layer channel and the lower layer channel are connected, so that the coolant flow paths are increased, the turbulent flow area is increased, and the overall heat dissipation effect of the system is improved; most importantly, the design can obviously mix the upper-layer coolant and the lower-layer coolant through the flow guide structure of the middle cut-off area, so that the cooling performance of the upper-layer coolant is improved to a greater extent, and the heat transfer efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of micro-channel enhanced heat dissipation, and particularly relates to an impact flow double-layer flow guide micro-channel heat sink suitable for a high heat flow density device.
Background
With the sounding of trade war in China and China in recent years, research and development bottlenecks of domestic electronic chip technology are concerned by the masses. In the advanced engineering technical fields of energy power, biochemical engineering, aerospace and the like, the heat transfer load of a heat exchange system of a high-density and ultra-precision miniature electronic device is increased day by day. The heat flux density of devices such as aerospace very large scale integrated circuits, laser mirrors, national defense military equipment microelectronic components and the like is higher than 103W/cm2Very large in heat dissipation floor areaUnder the working condition of small and high transient heat flux density, if the surface temperature of the device can not be effectively reduced and the surface temperature distribution uniformity of the device can be maintained, the working performance and stability of the device can be rapidly reduced, and even the device can be burnt. Therefore, the heat dissipation problem of the high heat flow density microelectronic device restricts the development of high and new technology, and is more and more widely paid high attention by the international heat and mass transfer boundary and the related industrial fields.
The heat dissipation problem of the high heat flow density micro component is widely paid high attention by heat and mass transfer students at home and abroad, and the application prospect is very wide. At present, the attention of researchers in the field of micro-scale heat dissipation at home and abroad is focused on related heat dissipation systems such as a micro-channel heat sink, a micro heat pipe soaking plate, an integrated micro cooler, a micro jet array heat sink, a micro refrigerator and the like. Among them, the micro-channel heat sink system has become a focus of attention of scholars at home and abroad due to its advantages of small volume, light dead weight, large specific surface area, high heat exchange strength per unit area, and the like. Since the concept of "Microchannel Heat Sinks (MHS)" was first proposed in 1981, a Microchannel heat sink system using liquid as a system working medium is widely considered as an effective way to solve the heat dissipation problem of high heat flow density micro devices. However, for high heat flux density micro devices with higher heat dissipation requirements, the micro-channel heat sink system with a simple structure has not been able to meet the requirements.
The pump work circulation type double-layer micro-channel internal cooling is the mainstream mode of micro-channel cooling. The fins are main heat exchange strengthening structures applied to the internal channels, and the fins can increase the heat transfer area, reduce the heat resistance of convective heat transfer and enhance the heat exchange performance. Through the search of prior art documents, Chinese patent application No. 202011101893.0, publication date 2020, 12 months and 04 days, patent name: a microchannel heat sink with a double-layer complex staggered structure is based on the traditional double-layer microchannel heat sink, and the direction of a straight channel is changed in the respective planes of an upper layer channel and a lower layer channel to form a matrix subchannel and the matrix subchannel is arranged at a certain angle. The advantage is that the coolant changes the flow direction, destroys the thermal boundary layer, and forms stronger fluid disturbance, thereby enhancing the heat transfer. However, the heat dissipation characteristics of the upper layer coolant in the double-layer micro-channel are not fully utilized because the cooling performance of the upper layer coolant in the double-layer micro-channel is not substantially improved by the internal structure of the heat sink. And the coolant has longer stroke in the heat sink of the structure, thereby increasing the pressure drop loss in the channel. Resulting in a decrease in system stability performance.
Disclosure of Invention
The technical problem solved by the invention is as follows: the invention relates to an impact jet flow double-layer flow guide structure micro-channel heat sink which has high-efficiency and uniform convection heat exchange performance, low pressure loss and high overall heat exchange characteristic and is suitable for thermal management of a high-heat-flow-density device, aiming at solving the technical problems that the heat dissipation capacity of a cooling working medium fluid of an upper layer channel in the existing double-layer micro-channel heat sink is low and the cooling potential is not fully developed.
The technical scheme of the invention is as follows: an impact jet flow double-layer flow guide structure micro-channel heat sink suitable for heat management of a high heat flow density device is characterized by comprising a heat sink top, a heat sink base, an intermediate layer, a plurality of clapboards and a plurality of flow guide structures;
the plurality of clapboards are positioned between the top of the heat sink and the base of the heat sink and are arranged in parallel, and the clapboards are vertical to the top of the heat sink, so that a plurality of areas are formed; each area is provided with a flow guide structure; the clapboard is positioned at the top of the heat sink and is provided with a through hole which is used as an inlet of the micro-channel heat sink;
the flow guide structures comprise a plurality of first flow guide structures and a plurality of second flow guide structures, the first flow guide structures and the second flow guide structures are arranged at intervals in a staggered mode, and the first flow guide structures are located in the middle of the partition plate and are parallel to the heat sink base; an included angle exists between the second flow guide structure and two adjacent first flow guide structures.
The further technical scheme of the invention is as follows: the included angle between the second flow guide structure and two adjacent first flow guide structures is 30-150 degrees.
The further technical scheme of the invention is as follows: the plurality of baffles comprise a plurality of first baffles and a plurality of second baffles, the first baffles and the second baffles are arranged in parallel at staggered intervals, one end of each first baffle, which is close to the top of the heat sink, is vertically provided with a notch, and the notches are provided with second flow guide structures for further flow guide of cooling fluid in the double-layer microchannel heat sink.
The further technical scheme of the invention is as follows: the inlet is aligned with the notch in the first baffle plate.
The further technical scheme of the invention is as follows: the distribution of the flow guide structures forms an intermediate layer integrally, the area between the intermediate layer and the top of the heat sink serves as an upper-layer channel, and the area between the intermediate layer and the heat sink base serves as a lower-layer channel.
The further technical scheme of the invention is as follows: the heat sink is divided into an inlet area, a flow splitting area, a flow guide area, a confluence area and an outlet area according to the flow process sequence of the coolant; the inlet area is positioned in the middle area of the top of the heat sink, and ports on two sides of the upper-layer channel and the lower-layer channel are outlet areas; the flow dividing region is positioned at the center of the middle layer in the double-layer microchannel, and the middle layer is in a hollow structure, and the coolant can flow to the upper and lower layers of microchannels along the structure; and second flow guide structures are respectively arranged on two sides of the shunting area to form flow guide areas, and a flow combining area is formed between the first flow guide structure and the second flow guide structure.
The further technical scheme of the invention is as follows: defining d as the diameter of a heat sink inlet end of a micro-channel with an impact jet flow double-layer flow guide structure, H as the total height of the double-layer micro-channel, huc as the height of an upper-layer channel, hlc as the height of a lower-layer channel, H as the heat sink height of the micro-channel with the impact jet flow double-layer flow guide structure, lb as the length of the flow guide structure, lm as the length of the center of the middle layer, lt as the length of the extending parts of two sides of the middle layer, L as the heat sink length of the micro-channel with the impact jet flow double-layer flow guide structure, w as the width of the micro-channel, wb as the width of the flow guide structure, wherein d is more than or equal to 0.6mm and less than or equal to 1 mm; h is more than or equal to 2mm and less than or equal to 5 mm; h is more than or equal to 3mm and less than or equal to 6 mm; lb is more than or equal to 1.2mm and less than or equal to 1.6 mm; lm is more than or equal to 1.4mm and less than or equal to 1.8 mm; l is more than or equal to 18mm and less than or equal to 25 mm; w is more than or equal to 0.5mm and less than or equal to 0.8 mm; wb is more than or equal to 0.2mm and less than or equal to 0.3 mm. And d < h; d is less than or equal to wb; h is less than or equal to H.
The further technical scheme of the invention is as follows: the components may be machined from silicon, copper, or the like.
Effects of the invention
The invention has the technical effects that: firstly, the invention overcomes the defects that the heat dissipation capability of the coolant of the upper layer in the existing double-layer micro-channel heat sink is low and the cooling potential is not fully developed. The coolant in the microchannel heat sink with the impinging jet double-layer flow guide structure can shorten the stroke of the coolant in the channel to a greater extent, thereby reducing the pressure drop loss and improving the working stability of the system; secondly, the periodic truncated middle layer can reduce pressure drop resistance of the channel and simultaneously enable the upper and lower layers of cooling agents to generate turbulent flow, so that a flow boundary layer is damaged, and heat transfer characteristics are enhanced; thirdly, the upper layer channel and the lower layer channel are connected, so that the coolant flow paths are increased, the turbulent flow area is increased, and the overall heat dissipation effect of the system is improved; most importantly, the design can obviously mix the upper-layer coolant and the lower-layer coolant through the flow guide structure of the middle cut-off area, so that the cooling performance of the upper-layer coolant is improved to a greater extent, and the heat transfer efficiency is improved.
Drawings
FIG. 1 is a perspective view of a microchannel heat sink with an impinging jet double-layer flow guide structure according to the present invention. FIG. 2 is a cross-sectional top view of a dual set channel interlayer of example 1 of the present invention;
FIG. 3 is a front view of a single set of channels in example 1 of the present invention with the side walls removed;
FIG. 4 is a cloud graph numerically simulating the temperature gradient of the substrate in example 1 of the present invention;
FIG. 5 is a front view of a single set of channels in example 2 of the present invention with the side walls removed;
FIG. 6 is a numerical simulation cloud of the substrate temperature gradient in example 2 of the present invention;
FIG. 7 is a front view of a single set of channels in example 3 of the present invention with the side walls removed;
FIG. 8 is a cloud graph numerically simulating the temperature gradient of the substrate in example 3 of the present invention;
description of reference numerals: 1. the heat sink comprises an inlet area, a flow distribution area, a flow guide area, a flow converging area, a flow guide area, an upper-layer channel outlet area, a lower-layer channel outlet area, a middle layer, a heat sink base, a heat sink top, a middle layer cut-off area, a first flow guide structure and a second flow guide structure, wherein the inlet area comprises 2, the flow distribution area, 3, the flow guide area, 4, the flow converging area, 5, the upper-layer channel outlet area, 6, the lower-layer channel outlet area, 7, the middle layer, 8, the heat sink base, 9, the heat sink top, 10, the middle layer cut-off area and 11; 12. a second flow guiding structure; 13. a first separator; 14-second baffle
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
The embodiments of the present invention will be described in detail below with reference to the drawings, and the embodiments show specific embodiments and operation flows, but the scope of the present invention is not limited to the embodiments described below.
Referring to fig. 1 to 8, the present invention provides an impinging jet dual-layer flow guide structure microchannel heat sink suitable for thermal management of high heat flux devices, which is characterized in that: the impinging jet double-layer flow guide type microchannel heat sink has 5 areas, and is divided into an inlet area, a flow splitting area, a flow guide area, a confluence area and an outlet area according to a coolant flow path sequence.
Further, the structure inlet area is positioned in the middle area of the top of the heat sink; and ports on two sides of the double-layer channel are heat sink structure outlet areas.
Furthermore, the flow distribution area is positioned at the center of the middle layer in the double-layer micro-channel, and the middle layer is a hollow structure, and the coolant can flow to the upper and lower micro-channels along the structure.
Furthermore, the middle layers of the double-layer micro-channels in the heat sink structure are distributed in a periodically truncated mode. The middle layer in the periodic truncation type distribution is arranged close to the side wall surface, so that the discontinuous area is positioned in the internal cooling channel. The truncated interlayers extending from the center to both sides each present 3 truncated regions, each of the same length.
Furthermore, the flow guide structure is positioned at the center of the truncation position of the middle layer and is periodically distributed along with the truncation position, and the length of the flow guide structure is lbWidth of wb. The parameters of the diversion structure in each cut-off position are the same.
Furthermore, the cross section of the flow guide structure is of any shape, and the flow guide structure is perpendicular to the base surface of the channel or forms an included angle of 30-150 degrees with the base surface.
The invention provides an impact jet flow double-layer micro-channel flow guide structure suitable for cooling micro-channel heat sink liquid, which comprises an inlet area 1, a flow division area 2, a flow guide area 3, a flow guide area 4, a confluence area 5, an upper-layer channel outlet area 6, a lower-layer channel outlet area 7, an intermediate layer 8, a heat sink substrate 9, a heat sink top 10 and an intermediate layer cut-off area. The coolant enters the heat sink system from an inlet area 1 on the upper surface of the impinging jet double-layer microchannel, enters a flow splitting area 2 in the middle area through the inlet area 1, and respectively flows into the upper and lower microchannels and flows towards outlet ends on two sides. The coolant respectively flows into the flow guide areas 3 in the upper and lower micro-channels, and the coolant is changed by a certain angle along the height direction of the heat sink through the flow guide structure, and simultaneously, a mixed vortex is generated, so that the coolant on the upper and lower layers is guided and mixed, and a stronger fluid disturbance phenomenon is formed. Thereby improving the heat dissipation characteristic of the upper-layer low-temperature fluid and improving the integral enhanced heat transfer effect of the micro-channel heat sink system.
It should be noted that, referring to fig. 3, d, the diameter of the inlet end of the microchannel heat sink with the impinging jet double-layer flow guide structure is d being more than or equal to 0.6mm and less than or equal to 1 mm; h. h is more than or equal to 2mm and less than or equal to 5 mm; huc, the height of an upper-layer channel, hlc, the height of a lower-layer channel, and the heat sink height of a micro-channel with an H-impact jet double-layer flow guide structure, wherein H is more than or equal to 3mm and less than or equal to 6 mm; lb is the length of the flow guide structure, and lb is more than or equal to 1.2mm and less than or equal to 1.6 mm; lm., the length of the middle layer at the center is more than or equal to 1.4mm and less than or equal to 1.8 mm; lt., the length of the extending part at the two sides of the middle layer is L, the heat sink length of the micro-channel of the impinging jet double-layer flow guide structure is L which is more than or equal to 18mm and less than or equal to 25 mm; w is the width of the micro-channel, and w is more than or equal to 0.5mm and less than or equal to 0.8 mm; wb. the width of the diversion structure is more than or equal to 0.2mm and less than or equal to wb and less than or equal to 0.3 mm.
Fig. 2 and 3 show embodiment 1 of the present invention. In this embodiment, the cross-section of the flow guiding structure is rectangular, and the length of the flow guiding structure is lbWidth of wbThe diversion structure and the substrate form an included angle of 90 degrees, and the spacing distance between the truncated type interlayers is kept unchanged. The coolant enters the internal channel of the heat sink and is divided into two parts, one part flows into the upper-layer channel, and the other part flows into the lower-layer channel. The upper and lower layers of cooling agent are crossed at the vertical flow guide structures at the two sides of the heat sinkAnd the vertical flow guide structure forms a vortex to generate a stronger turbulent flow phenomenon and destroy a thermal boundary layer. After being mixed, the coolant passes through the periodic middle layer to reconstruct the upper layer fluid and the lower layer fluid, and flows to two sides to enter the flow guide structure of the next period. Therefore, the coolant generates a continuous turbulent flow effect through the periodic flow guide structure, the flowing heat exchange characteristic is obviously enhanced, the heat exchange uniformity of the micro-channel is improved, and the overall heat exchange efficiency of the heat sink system is improved. To demonstrate the heat dissipation advantage of this configuration design, FIG. 4 shows the heat flux density at the inlet diameter of 0.5mm, the outlet hydraulic diameter of 0.89mm, and the base heat flux density of 100W/cm2The substrate temperature gradient values for example 1 under the conditions are modeled. The colors in the different regions of the figure represent the temperatures in that region. The magnitude of the temperature values is indicated by the numbers in the figure relative to the different colors. The smaller the substrate temperature color difference is, the better the temperature gradient regulation effect is, the lighter the substrate temperature cloud picture color is, the lower the substrate peak temperature is, and the better the heat dissipation effect is. In the example 1, the peak temperature of the substrate is lower, and the temperature gradient regulation effect of the heat sink substrate is obvious.
Fig. 5 shows example 2 of the present invention. In the present embodiment, the cross-sectional shape of the flow guiding structure is the same as that of example 1, and the included angle α between the flow guiding structure and the substrate is 135 °, and the spacing distance between the truncated interlayers is kept constant. The coolant enters the internal channel of the heat sink and is divided into two parts, one part flows into the upper-layer channel, and the other part flows into the lower-layer channel. The upper layer of coolant and the lower layer of coolant are intersected at the vertical flow guide structures on the two sides of the heat sink, and the upper layer of coolant can effectively enter the lower layer of channel through the flow guide structures and is fully mixed with the lower layer of coolant, so that a vortex with lower temperature is formed, an obvious turbulent flow phenomenon is generated, and a boundary layer is damaged. After being mixed, the coolant passes through the periodic middle layer to reconstruct the upper layer fluid and the lower layer fluid, and flows to two sides to enter the flow guide structure of the next period. Therefore, compared with embodiment 1, the flow guide structure in this embodiment can introduce the coolant of the upper channel into the lower channel more efficiently due to the included angle α of 135 ° with the substrate, so that the flow rate of the coolant of the upper channel entering the lower channel is increased, the heat exchange is strengthened, and the overall thermal performance of the channel is improved. FIG. 6 is a graph of a numerical simulation of the substrate temperature gradient for example 2 under the same geometric parameters. The comparison shows that the equidirectional inclined flow guide structure in the example 2 has slightly higher peak temperature of the substrate than the example 1, and has slightly lower heat dissipation performance than the example 1.
Fig. 7 shows example 3 of the present invention. In this embodiment, the cross-sectional shape of the flow guide structures is the same as that of example 1, and the two sides of the flow guide structures flow to the first and third flow guide structures at an angle α of 135 ° with respect to the substrate, the angle β of the second flow guide structure with respect to the substrate is 45 °, and the distance between the truncated interlayers is kept constant. The coolant enters the internal channel of the heat sink and is divided into two parts, one part flows into the upper-layer channel, and the other part flows into the lower-layer channel. The upper layer of coolant and the lower layer of coolant are crossed at the vertical flow guide structures on the two sides of the heat sink, and the upper layer of coolant can effectively enter the lower layer of channel through the first flow guide structure and is fully mixed with the lower layer of coolant to form a vortex with lower temperature, and generate an obvious turbulent flow phenomenon to destroy a boundary layer. After being mixed, the coolant passes through the periodic intermediate layer to reconstruct upper and lower layer fluids and flows to two sides to enter the second flow guide structure, the lower layer coolant after high-efficiency heat exchange is guided into the upper layer channel from the second flow guide structure and is fully mixed with the upper layer coolant to continuously form vortex and continuously generate turbulence linearity, and finally, the upper and lower layer coolant enters the third flow guide structure after being recombined through the periodic intermediate layer and repeats the flow guide effect in the first flow guide structure. Therefore, compared with embodiment 1, the present embodiment utilizes the angle change of the flow guiding structure to circularly guide the upper and lower layers of coolant, and maximizes the cooling potential of the upper layer of coolant on the basis of generating an obvious turbulent flow phenomenon, thereby improving the temperature uniformity of the heat sink substrate and strengthening the overall heat dissipation characteristic of the heat sink. FIG. 8 is a graph of a numerical simulation of the substrate temperature gradient for example 3 under the same geometric parameters. The color difference of the temperature cloud chart is minimum, and the color is lightest, which shows that the temperature cloud chart has a particularly outstanding regulating and controlling effect on the peak temperature and the temperature gradient of the heat sink base.
Claims (8)
1. An impact jet flow double-layer flow guide structure micro-channel heat sink suitable for heat management of a high heat flow density device is characterized by comprising a heat sink top (9), a heat sink base (8), an intermediate layer (7), a plurality of partition plates and a plurality of flow guide structures;
the clapboards are positioned between the heat sink top (9) and the heat sink base (8) and are arranged in parallel, and the clapboards are perpendicular to the heat sink top (9) so as to form a plurality of areas; each area is provided with a flow guide structure; the clapboard is positioned at the top (9) of the heat sink and is provided with a through hole which is used as an inlet (1) of the micro-channel heat sink;
the flow guide structures comprise a plurality of first flow guide structures (11) and a plurality of second flow guide structures (12), the first flow guide structures (11) and the second flow guide structures (12) are arranged at intervals in a staggered mode, and the first flow guide structures (11) are located in the middle of the partition plate and are parallel to the heat sink base (8); an included angle exists between the second flow guide structure (12) and two adjacent first flow guide structures (11).
2. The impinging jet dual-layer flow guide structure microchannel heat sink suitable for thermal management of high heat flux devices as claimed in claim 1, wherein the included angle between the second flow guide structure (12) and two adjacent first flow guide structures (11) is 30 ° to 150 °.
3. The impinging jet double-layer flow guide structure microchannel heat sink suitable for thermal management of high heat flux devices as claimed in claim 1, wherein the plurality of partitions comprises a plurality of first partitions (13) and a plurality of second partitions (14), the first partitions (13) and the second partitions (14) are arranged in parallel in a staggered and spaced manner, a notch is vertically formed in one end of the first partition (13) close to the top (9) of the heat sink, and a second flow guide structure (12) is arranged at the notch and used for further guiding the cooling fluid in the double-layer microchannel heat sink.
4. The impinging jet double layer flow guiding structured microchannel heat sink for thermal management of high heat flux devices as claimed in claim 1 or 3 wherein said inlet (1) is aligned with a notch on the first partition (13).
5. An impinging jet dual layer flow directing structure microchannel heat sink suitable for thermal management of high heat flux devices as described in claim 1 wherein the distribution of flow directing structures forms the intermediate layer as a whole, the area between the intermediate layer and the top (9) of the heat sink being the upper layer channel and the area between the intermediate layer and the base (8) of the heat sink being the lower layer channel.
6. The impinging jet dual-layer flow-guiding structure microchannel heat sink suitable for thermal management of high heat flux devices of claim 1, wherein the heat sink is divided into an inlet zone, a flow splitting zone, a flow guiding zone, a flow converging zone and an outlet zone in the order of a coolant flow path; the inlet area is positioned in the middle area of the top of the heat sink, and ports on two sides of the upper-layer channel and the lower-layer channel are outlet areas; the flow dividing region is positioned at the center of the middle layer in the double-layer microchannel, and the middle layer is in a hollow structure, and the coolant can flow to the upper and lower layers of microchannels along the structure; second flow guide structures (12) are respectively arranged on two sides of the shunting area to form flow guide areas, and a flow combining area is formed between the first flow guide structure (11) and the second flow guide structure (12).
7. The impinging jet dual-layer flow guide structure microchannel heat sink suitable for high heat flux density device heat management of claim 1, wherein d is the diameter of the impinging jet dual-layer flow guide structure microchannel heat sink inlet, H is the total height of the dual-layer microchannel, huc is the height of the upper layer channel, hlc is the height of the lower layer channel, H is the height of the impinging jet dual-layer flow guide structure microchannel heat sink, lb is the length of the flow guide structure, lm is the length of the center of the middle layer, lt is the length of the two sides of the middle layer, L is the length of the impinging jet dual-layer flow guide structure microchannel heat sink, w is the width of the microchannel, wb is the width of the flow guide structure, wherein d is greater than or equal to 0.6mm and less than or equal to 1 mm; h is more than or equal to 2mm and less than or equal to 5 mm; h is more than or equal to 3mm and less than or equal to 6 mm; lb is more than or equal to 1.2mm and less than or equal to 1.6 mm; lm is more than or equal to 1.4mm and less than or equal to 1.8 mm; l is more than or equal to 18mm and less than or equal to 25 mm; w is more than or equal to 0.5mm and less than or equal to 0.8 mm; wb is more than or equal to 0.2mm and less than or equal to 0.3 mm. And d < h; d is less than or equal to wb; h is less than or equal to H.
8. The impinging jet dual layer fluidic structure microchannel heat sink of claim 1, wherein the component is fabricated from materials such as silicon, copper, and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110937700.3A CN113675160B (en) | 2021-08-16 | 2021-08-16 | Impact flow double-layer diversion micro-channel heat sink suitable for high heat flow density device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110937700.3A CN113675160B (en) | 2021-08-16 | 2021-08-16 | Impact flow double-layer diversion micro-channel heat sink suitable for high heat flow density device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113675160A true CN113675160A (en) | 2021-11-19 |
| CN113675160B CN113675160B (en) | 2024-01-30 |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152659A (en) * | 1990-10-17 | 1992-05-26 | Hitachi Ltd | Method and device for cooling multichip module |
| US5937517A (en) * | 1997-11-12 | 1999-08-17 | Eastman Kodak Company | Method of manufacturing bonded dual extruded, high fin density heat sinks |
| JP2002141164A (en) * | 2000-10-31 | 2002-05-17 | Miyaden Co Ltd | Transistor inverter device for high-power and high- frequency induction heating |
| US20030188849A1 (en) * | 2002-04-09 | 2003-10-09 | Gawve Warren Lee | Heat sink with multiple surface enhancements |
| JP2007142390A (en) * | 2005-11-14 | 2007-06-07 | Internatl Business Mach Corp <Ibm> | Cooling device, cooling system and heat conduction method |
| JP2008205421A (en) * | 2006-07-26 | 2008-09-04 | Furukawa Sky Kk | Heat exchanger |
| US20090283244A1 (en) * | 2008-05-13 | 2009-11-19 | Raschid Jose Bezama | Stacked and Redundant Chip Coolers |
| CN101586477A (en) * | 2008-05-23 | 2009-11-25 | 中国科学院工程热物理研究所 | Turbulent baffle heat transfer enhancing device with jet impingement function |
| US10306802B1 (en) * | 2015-08-28 | 2019-05-28 | Lockheed Martin Corporation | Micro jet impingement heat sink |
| CN112038311A (en) * | 2020-10-15 | 2020-12-04 | 哈尔滨理工大学 | Double-layer complex staggered structure micro-channel heat sink |
| CN112888264A (en) * | 2021-02-02 | 2021-06-01 | 西安交通大学 | Double-deck microchannel heat abstractor based on gas-liquid separation |
-
2021
- 2021-08-16 CN CN202110937700.3A patent/CN113675160B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152659A (en) * | 1990-10-17 | 1992-05-26 | Hitachi Ltd | Method and device for cooling multichip module |
| US5937517A (en) * | 1997-11-12 | 1999-08-17 | Eastman Kodak Company | Method of manufacturing bonded dual extruded, high fin density heat sinks |
| JP2002141164A (en) * | 2000-10-31 | 2002-05-17 | Miyaden Co Ltd | Transistor inverter device for high-power and high- frequency induction heating |
| US20030188849A1 (en) * | 2002-04-09 | 2003-10-09 | Gawve Warren Lee | Heat sink with multiple surface enhancements |
| JP2007142390A (en) * | 2005-11-14 | 2007-06-07 | Internatl Business Mach Corp <Ibm> | Cooling device, cooling system and heat conduction method |
| JP2008205421A (en) * | 2006-07-26 | 2008-09-04 | Furukawa Sky Kk | Heat exchanger |
| US20090283244A1 (en) * | 2008-05-13 | 2009-11-19 | Raschid Jose Bezama | Stacked and Redundant Chip Coolers |
| CN101586477A (en) * | 2008-05-23 | 2009-11-25 | 中国科学院工程热物理研究所 | Turbulent baffle heat transfer enhancing device with jet impingement function |
| US10306802B1 (en) * | 2015-08-28 | 2019-05-28 | Lockheed Martin Corporation | Micro jet impingement heat sink |
| CN112038311A (en) * | 2020-10-15 | 2020-12-04 | 哈尔滨理工大学 | Double-layer complex staggered structure micro-channel heat sink |
| CN112888264A (en) * | 2021-02-02 | 2021-06-01 | 西安交通大学 | Double-deck microchannel heat abstractor based on gas-liquid separation |
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| CN113675160B (en) | 2024-01-30 |
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