CN113667394B - UV illumination demolding temporary protective coating and application thereof - Google Patents
UV illumination demolding temporary protective coating and application thereof Download PDFInfo
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- CN113667394B CN113667394B CN202110935203.XA CN202110935203A CN113667394B CN 113667394 B CN113667394 B CN 113667394B CN 202110935203 A CN202110935203 A CN 202110935203A CN 113667394 B CN113667394 B CN 113667394B
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- protective coating
- temporary protective
- photoinitiator
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to the technical field of coatings, in particular to a temporary protective coating for UV light demolding and application thereof. Directly drill holes on the surface of the multilayer PCB circuit board, copper scraps are easy to generate, and the drilling precision is affected. Based on the problems, the invention provides the UV light demolding temporary protective coating, free photoinitiator in the coating is subjected to light curing under a specific emission wavelength by an energy absorption initiation coating system to form a temporary protective coating on the surface of a PCB multilayer circuit board, the specific emission wavelength perfectly avoids the absorption wavelength range of the photoinitiator 2959, the PCB multilayer circuit board is subjected to high-energy irradiation under a high-pressure mercury lamp after being drilled, a large amount of energy is absorbed by a photoinitiator 2959 segment of a modified polyurethane structure in the temporary protective coating to be broken, the temporary protective coating is fragmented, and finally the temporary protective coating is subjected to strong shrinkage under the high-energy effect, so that the PCB multilayer circuit board can be automatically peeled off from the surface of the PCB multilayer circuit board.
Description
Technical Field
The invention relates to the technical field of coatings, in particular to a temporary protective coating for UV light demolding and application thereof.
Background
The PCB circuit board is used as a core component of electronic products such as mobile phones, and is continuously developed toward a high-precision direction. In order to achieve an increase in the density of fixed-volume circuits, electronics manufacturers have developed high-density interconnect printed circuit boards that are separated from one another by an insulating layer through the superposition of multiple layers of circuit boards. The traditional mode is that holes are drilled among insulating layers, and then the holes are plated with metal, so that circuit conduction among layer-by-layer circuits is realized, and the circuit density is greatly improved.
The method is also only applicable to multilayer circuits with fewer layers, and can only be used for multilayer boards with more layers, but the multilayer boards with more layers are almost directly drilled, the copper surface is free of auxiliary coating, and the drilling precision is seriously affected.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to solve the technical problems that: directly drill holes on the surface of the multilayer PCB circuit board, copper scraps are easy to generate, and the drilling precision is affected.
The technical scheme adopted for solving the technical problems is as follows: the invention provides a temporary protective coating for UV light demolding, which comprises the following components in parts by weight:
specifically, the acrylic resin is one or a combination of more than two of epoxy acrylic resin, polyurethane acrylic resin, polyester acrylic resin and silicon modified acrylic resin.
Specifically, the active monomer is one or a mixture of more than two of pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, 1, 6-ethylene glycol diacrylate and tripropylene glycol diacrylate.
Specifically, the modified polyurethane is prepared according to the following steps:
20.1g of IPDI and 0.04g of catalyst DBTDL are added into a three-hole round-bottomed flask, then the temperature of the round-bottomed flask is raised to 70 ℃, 20.4g of PEG-1000 is dripped into the flask under the protection of nitrogen, after the dripping is completed, the reaction is stirred for 4 hours, 50mL of THF and 9.26g of photoinitiator 2959 are added into a reaction system, the reaction is monitored by FTIR measurement, the isocyanate characteristic absorption peak of the IPDI in the reactant is not reduced any more, 3.72g of HEA and 0.005g of hydroquinone are added into the reaction system, the reaction is continued at 70 ℃ until the isocyanate characteristic absorption peak of the IPDI disappears on the FTIR spectrum, finally, the solvent is removed by rotary evaporation, and colorless high-viscosity liquid modified polyurethane acrylate is obtained.
Specifically, the leveling agent is an organosilicon leveling agent.
Specifically, the dispersing agent is a polymer dispersing agent.
Specifically, the defoamer is an organosilicon defoamer or a polyether defoamer.
Specifically, the inorganic powder is one or two of talcum powder, flaky mica powder and transparent powder.
Specifically, the particle size of the talcum powder is 1500-5000 meshes; the particle size of the flaky mica powder or transparent powder is 1500-3000 meshes.
Specifically, the photoinitiator is TPO, photoinitiator 819, ITX, photoinitiator 907, and photoinitiator 784.
Specifically, the temporary protective coating for UV light demolding is prepared according to the following steps:
(1) Under the light-shielding condition, the components are stirred and mixed uniformly according to the formula amount to obtain the temporary protective coating;
(2) Uniformly coating the obtained temporary protective coating on the surface of a PCB to form a protective coating film, irradiating under an ultraviolet lamp, wherein the emission wavelength avoids the whole absorption wavelength range of a photoinitiator 2959, the lamp is 5cm away from the coating layer, and the energy is 300-500mj/cm 2 And (3) pre-curing the protective coating under the action of a photoinitiator to obtain the temporary protective coating subjected to UV light demolding.
The beneficial effects of the invention are as follows:
the free photoinitiator in the coating prepared by the invention absorbs energy to trigger a coating system to perform photo-curing under a specific emission wavelength to form a temporary protective coating on the surface of the PCB multilayer circuit board, the specific emission wavelength perfectly avoids the absorption wavelength range of the photoinitiator 2959, the PCB multilayer circuit board is placed under a high-pressure mercury lamp to perform high-energy irradiation after drilling, and the photoinitiator 2959 segment of the modified polyurethane structure in the temporary protective coating absorbs a large amount of energy to break so as to fragment the temporary protective coating, finally the temporary protective coating is strongly contracted under the action of high energy, and the temporary protective coating can be automatically peeled off from the surface of the PCB multilayer circuit board to achieve the film stripping effect.
Detailed Description
The present invention will now be described in further detail with reference to examples.
The acrylic resin used in the invention is one or a combination of more than two of epoxy acrylic resin, polyurethane acrylic resin, polyester acrylic resin and silicon modified acrylic resin.
The active monomer used in the invention is one or a mixture of more than two of pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, 1, 6-ethylene glycol diacrylate and tripropylene glycol diacrylate.
The modified polyurethane used in the invention is prepared according to the following steps:
20.1g of IPDI and 0.04g of catalyst DBTDL are added into a three-hole round-bottomed flask, then the temperature of the round-bottomed flask is raised to 70 ℃, 20.4g of PEG-1000 is dripped into the flask under the protection of nitrogen, after the dripping is completed, the reaction is stirred for 4 hours, 50mL of THF and 9.26g of photoinitiator 2959 are added into a reaction system, the reaction is monitored by FTIR measurement, the isocyanate characteristic absorption peak of the IPDI in the reactant is not reduced any more, 3.72g of HEA and 0.005g of hydroquinone are added into the reaction system, the reaction is continued at 70 ℃ until the isocyanate characteristic absorption peak of the IPDI disappears on the FTIR spectrum, finally, the solvent is removed by rotary evaporation, and colorless high-viscosity liquid modified polyurethane acrylate is obtained.
The leveling agent used in the invention is an organosilicon leveling agent.
The dispersing agent used in the invention is a polymer dispersing agent.
The defoamer used in the invention is an organosilicon defoamer or a polyether defoamer.
The photoinitiators used in the present invention are TPO, photoinitiator 819, ITX, photoinitiator 907.
The inorganic powder used in the invention is one or two of talcum powder, flaky mica powder and transparent powder.
The particle size of talcum powder used in the invention is 1500-5000 meshes; the particle size of the flaky mica powder or transparent powder is 1500-3000 meshes.
Example 1
The invention provides a temporary protective coating for UV light demolding, which comprises the following components in parts by weight:
example 2
The invention provides a temporary protective coating for UV light demolding, which comprises the following components in parts by weight:
example 3
The invention provides a temporary protective coating for UV light demolding, which comprises the following components in parts by weight:
example 4
The invention provides a temporary protective coating for UV light demolding, which comprises the following components in parts by weight:
application:
(1) In the embodiment 1-5, under the light-shielding condition, the components are stirred and mixed uniformly according to the formula amount to obtain the temporary protective coating;
(2) Temporary obtained in examples 1 to 5The protective coating is uniformly coated on the surface of a PCB circuit board to form a protective coating film, and is respectively placed under ultraviolet lamps with wavelengths of 393nm, 405nm, 230nm and 382nm, wherein the distance between the lamps and the coating is 5cm, and the energy is 300-500mj/cm 2 The protective coating is pre-cured under the action of a photoinitiator, so that a temporary protective coating for UV light demolding is obtained; drilling a PCB multilayer circuit board, and irradiating the temporary protective coating with a high-pressure mercury lamp with irradiation energy of 1000-1500mj/cm 2 The photoinitiator 2959 absorbs energy, so that resin matrix fragments in the coating are broken, the temporary protective coating is fragmented, strong shrinkage occurs under the action of high energy, and finally the coating is peeled off from the surface of the PCB, so that the automatic film stripping effect is achieved.
Comparative example 1 was used as in example 1, except that the photoinitiator used in the coating system of comparative example 1 was photoinitiator 2959 and the pre-cure was performed using a high pressure mercury lamp irradiating 5cm from the coating with an energy of 1000-1500mj/cm 2 . As a result, it was found that the paint could not be pre-cured.
Comparative example 2 was used as in example 1 except that the high-pressure mercury lamp in comparative example 2 was irradiated with energy of 300 to 500mj/cm 2 . As a result, it was found that the temporary protective coating could not be automatically peeled off from the surface of the PCB circuit board with strong shrinkage.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (8)
1. The temporary protective coating for UV light demolding is characterized by comprising the following components in parts by weight:
acrylic resin 5-20 parts
5-20 parts of active monomer
40-70 parts of modified polyurethane
0.1 to 0.5 part of leveling agent
0.1 to 0.5 part of dispersing agent
0.1 to 0.5 part of defoaming agent
10-20 parts of inorganic powder
3-6 parts of photoinitiator;
the modified polyurethane is prepared according to the following steps:
adding 20.1g of IPDI and 0.04g of catalyst DBTDL into a three-hole round-bottomed flask, then raising the temperature of the round-bottomed flask to 70 ℃, dropwise adding 20.4g of PEG-1000 into the flask under the protection of nitrogen, stirring for reaction for 4 hours, adding 50mL of THF and 9.26g of photoinitiator 2959 into a reaction system, monitoring the reaction by FTIR measurement, wherein the isocyanate characteristic absorption peak of the IPDI in the reactant is not reduced any more, adding 3.72g of HEA and 0.005g of hydroquinone into the reaction system, continuing the reaction at 70 ℃ until the isocyanate characteristic absorption peak of the IPDI disappears on the FTIR spectrum, and finally removing the solvent by rotary evaporation to obtain colorless high-viscosity liquid modified polyurethane acrylate; the photoinitiator is TPO, photoinitiator 819, ITX, photoinitiator 907 and photoinitiator 784.
2. The UV light-stripping temporary protective coating according to claim 1, wherein the acrylic resin is one or more of epoxy acrylic resin, polyurethane acrylic resin, polyester acrylic resin, and silicon modified acrylic resin.
3. The UV photopatterned temporary protective coating of claim 1, wherein the reactive monomer is one or a mixture of more than two of pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, tripropylene glycol diacrylate.
4. The UV light-stripping temporary protective coating as recited in claim 1, wherein the dispersant is a polymeric dispersant.
5. A temporary protective UV light de-filming coating according to claim 1, wherein said defoamer is a silicone defoamer or a polyether defoamer.
6. The temporary protective coating of claim 1, wherein the inorganic powder is one or both of talc, platy mica powder, and transparent powder.
7. A temporary protective coating for UV light release according to claim 6, wherein the talc has a particle size of 1500 mesh to 5000 mesh; the particle size of the flaky mica powder or transparent powder is 1500-3000 meshes.
8. A temporary protective coating for UV light release according to any one of claims 1-7, prepared by the steps of:
(1) Under the light-shielding condition, the components are stirred and mixed uniformly according to the formula amount to obtain the temporary protective coating;
(2) Uniformly coating the obtained temporary protective coating on the surface of a PCB to form a protective coating film, irradiating under an ultraviolet lamp, wherein the emission wavelength avoids the absorption wavelength range of a photoinitiator 2959, the distance between the lamp and the coating is 5cm, and the energy is 300-500mJ/cm 2 And (3) pre-curing the protective coating under the action of a photoinitiator to obtain the temporary protective coating subjected to UV light demolding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110935203.XA CN113667394B (en) | 2021-08-16 | 2021-08-16 | UV illumination demolding temporary protective coating and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110935203.XA CN113667394B (en) | 2021-08-16 | 2021-08-16 | UV illumination demolding temporary protective coating and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113667394A CN113667394A (en) | 2021-11-19 |
| CN113667394B true CN113667394B (en) | 2023-06-23 |
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| CN202110935203.XA Active CN113667394B (en) | 2021-08-16 | 2021-08-16 | UV illumination demolding temporary protective coating and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115160882B (en) * | 2022-06-17 | 2023-04-07 | 广东希贵光固化材料有限公司 | UV coating for HPE cover plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101481450B (en) * | 2008-01-07 | 2012-12-12 | 南通新昱化工有限公司 | Light-sensitive self-initiated polyurethane acrylic ester oligomer and method for synthesizing the same |
| CN103031053B (en) * | 2013-01-06 | 2015-07-29 | 北京海斯迪克新材料有限公司 | Touch-screen temporary protection UV solidifies peelable blue gel and preparation method thereof |
| CN105482689B (en) * | 2016-01-20 | 2017-11-07 | 上海应用技术学院 | Peelable blue glue and preparation method thereof |
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