CN113666649A - Metal soft solder for vacuum glass - Google Patents
Metal soft solder for vacuum glass Download PDFInfo
- Publication number
- CN113666649A CN113666649A CN202111011809.0A CN202111011809A CN113666649A CN 113666649 A CN113666649 A CN 113666649A CN 202111011809 A CN202111011809 A CN 202111011809A CN 113666649 A CN113666649 A CN 113666649A
- Authority
- CN
- China
- Prior art keywords
- vacuum glass
- nano
- soft solder
- metal soft
- light absorption
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 38
- 239000011521 glass Substances 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 24
- 230000031700 light absorption Effects 0.000 claims abstract description 22
- 239000007787 solid Substances 0.000 claims abstract description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 16
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 238000004093 laser heating Methods 0.000 description 3
- 239000005341 toughened glass Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
The invention discloses a metal soft solder for vacuum glass in the field of brazing materials, which comprises a solid strip-shaped body, wherein the surface of the body is coated with a nano light absorption material. The invention can solve the problem that the mechanical strength of the vacuum glass is seriously influenced by the great residual thermal stress in the sealing of the metal soft solder for the vacuum glass in the prior art.
Description
Technical Field
The invention relates to the field of brazing materials, in particular to a metal soft solder for vacuum glass.
Background
The vacuum glass is a new generation of energy-saving and environment-friendly glass, and has obvious product performance advantages compared with commonly used glass products such as common single-layer toughened glass, double-layer hollow glass and the like. The composite material has the advantages of sound insulation performance, heat preservation performance and anti-condensation function, has high-efficiency energy-saving effect and environment pollution reduction effect in wide fields of buildings, refrigeration and heating electric appliances, traffic and the like, and has very large potential and application market.
The vacuum glass is essentially formed by packaging two pieces of common toughened glass through an airtight sealing material, wherein the airtight sealing mostly adopts low-temperature glass powder or flexible metal soft solder, a vacuum layer with the thickness of 0.3-0.4 mm is formed between the two pieces of glass through vacuum, and metal supports are arranged between the two pieces of glass in an array manner to offset atmospheric pressure. In the existing flexible metal soft solder sealing technology, a metalized layer is formed on the surface of glass, and then the flexible metal soft solder is heated between the metalized layers of two pieces of glass in various modes such as electromagnetic induction, infrared or integral heating, so that the flexible metal soft solder and the metalized layer are combined to complete sealing. However, since the metal and the glass are not welded by the same material, and additional material is added to the sealing layer, the components of the sealing layer are complex, the thermal expansion coefficients of the layers of the sealing material are not matched, and a large residual thermal stress is generated in the heating and cooling processes of the sealing treatment, which seriously affects the mechanical strength of the vacuum glass.
Disclosure of Invention
The invention aims to provide a metal soft solder for vacuum glass, which solves the problem that the mechanical strength of the vacuum glass is seriously influenced by large residual thermal stress in the sealing process of the metal soft solder for the vacuum glass in the prior art.
In order to achieve the purpose, the basic technical scheme of the invention is as follows: a metal soft solder for vacuum glass comprises a solid ribbon-shaped body, and the surface of the body is coated with a nano light absorption material.
The principle and the advantages of the scheme are as follows: in practical application, the nano light absorption material is coated on the surface of the body to enhance the light absorption performance of the surface of the metal soft solder, and a laser heating mode is combined for use, so that the laser heat can be absorbed by the metal soft solder more efficiently in the sealing process, the heat effect is greatly improved in the laser processing process, the metal soft solder is fully melted and reliably and effectively combined with a metallization layer, a reticular metallization layer structure and a mode of adding the light absorption material in the metal soft solder are adopted, the nano light absorption material can effectively amplify the heat effect of laser energy and uniformly disperse in the metal soft solder, so that the heat expansion and cold contraction of the solder are more uniform in the sealing process of the metal soft solder, the phenomenon of concentrated overheating cannot occur, the generation of thermal residual stress is caused, and the problem of the residual stress of the sealing layer is reliably and effectively solved by matching with the laser heating mode, meanwhile, the production efficiency and the product yield are improved.
Further, the nano light absorption material is an organic solution of nano silver, nano gold or nano graphene. Such a nano light absorbing material preferably has a strong light absorbing property, and can absorb laser light more favorably.
Further, the concentration of the nano silver, the nano gold or the nano graphene in the organic solution is 0.1 to 2 percent. Such a concentration is preferred to ensure a good laser amplification effect, and too large a concentration may result in too large an amount of laser energy absorbed and amplified, which may adversely affect subsequent sealing.
Further, the thickness of the body is 0.3-0.6mm, and the width is 0.6-1.5 mm. Such a size is preferable and is more suitable for sealing treatment of vacuum glass.
Further, the body is vacuum plasma cleaned before coating the nano light absorbing material. Preferably, the surface of the body is ensured to be clean, the contact angle of the surface is reduced, and the adhesion performance of the nanometer light absorption material is improved.
Further, the body is cleaned by vacuum plasma, and the surface contact angle is 0-15 degrees. Preferably, the nano light absorption material can be uniformly attached to the surface of the body, the surface treatment effect of the body is ensured, and the light absorption performance of the nano light absorption material on the metal solder is improved.
Further, the body is a tin-based metal alloy or an indium-based metal alloy. Preferably, the body is easier to be heated and melted, the melting point is about 150-220 ℃, the tempered glass cannot be annealed, and the mechanical strength of the tempered vacuum glass can be ensured.
Further, the solvent of the organic solution is ethanol or acetone or diethyl ether. Preferably, after the nano light absorption material is coated on the surface of the body, the organic solvent can be conveniently and effectively removed through infrared heating, and the modified metal soft solder with strong light absorption effect is obtained.
Drawings
Fig. 1 is a schematic view of embodiment 1 of the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
reference numerals in the drawings of the specification include: a body 1 and a nanometer light absorption material 2.
Example 1, as shown in fig. 1: a metal soft solder for vacuum glass comprises a solid strip-shaped body 1, wherein the body 1 is an indium tin alloy with the thickness of 0.3-0.6mm and the width of 0.6-1.5 mm. The surface of the body 1 is coated with a nano light absorption material 2, the nano light absorption material 2 is an organic solution of nano silver, nano gold or nano graphene, and a solvent of the organic solution is ethanol. The concentration of the nano silver in the organic solution is 0.1-2%. The body 1 is cleaned by vacuum plasma before being coated with the nano light absorption material 2, and the contact angle of the surface of the body 1 is smaller than 15 degrees after being cleaned by the vacuum plasma.
The specific implementation process is as follows: in the production of vacuum glass, the metal soft solder is adopted for sealing, the metal soft solder is clamped between two pieces of glass, a metallization layer is arranged on the glass and is used for welding with the metal soft solder, the laser welding mode is adopted, the surface of the metal soft solder provided by the invention is modified to enhance the light absorption effect, and the metal soft solder can be combined with the metallization layer more stably under the laser treatment to complete the sealing of the vacuum glass vacuum cavity. The mode that adopts unique metallization layer structure and add the extinction material in metal soft solder like this, nanometer extinction material 2 can effectual enlargies and disperse laser energy for metal solder is at the in-process of sealing-in, and the expend with heat and contract with cold of solder is more even, can not appear concentrating overheated phenomenon, leads to the production of thermal residual stress. The problem of sealing layer residual stress is reliably and effectively solved in a mode of matching with laser heating, and meanwhile production efficiency and product yield are improved.
Example 2, in this example, the nano light absorption material is an organic solution of nano gold.
In example 3, the light absorbing nanomaterial in this example is an organic solution of nanographene.
Example 4, the body in this example is a tin-silver alloy.
Example 5, the body in this example is a tin-copper alloy.
Example 6, the body in this example is a tin-silver alloy.
Example 7, the solvent of the organic solution in this example was acetone.
Example 8, the solvent of the organic solution in this example was diethyl ether.
The foregoing is merely an example of the present invention and common general knowledge in the art of specific structures and/or features of the invention has not been set forth herein in any way. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (8)
1. A metal solder for vacuum glass, characterized in that: comprises a solid strip-shaped body, and the surface of the body is coated with a nano light absorption material.
2. A metal solder for vacuum glass according to claim 1, characterized in that: the nano light absorption material is an organic solution of nano silver, nano gold or nano graphene.
3. A metal solder for vacuum glass according to claim 2, characterized in that: the concentration of the nano silver, the nano gold or the nano graphene in the organic solution is 0.1-2%.
4. A metal solder for vacuum glass according to claim 3, characterized in that: the thickness of the body is 0.3-0.6mm, and the width is 0.6-1.5 mm.
5. A metal solder for vacuum glass according to claim 4, characterized in that: the body is vacuum plasma cleaned before being coated with the nano light absorption material.
6. A metal solder for vacuum glass according to claim 5, characterized in that: the contact angle of the surface of the body after vacuum plasma cleaning is 0-15 degrees.
7. A metal solder for vacuum glass according to claim 6, characterized in that: the body is a tin-based metal alloy or an indium-based metal alloy.
8. A metal solder for vacuum glass according to claim 7, characterized in that: the solvent of the organic solution is ethanol or acetone or diethyl ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111011809.0A CN113666649A (en) | 2021-08-31 | 2021-08-31 | Metal soft solder for vacuum glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111011809.0A CN113666649A (en) | 2021-08-31 | 2021-08-31 | Metal soft solder for vacuum glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113666649A true CN113666649A (en) | 2021-11-19 |
Family
ID=78547768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111011809.0A Pending CN113666649A (en) | 2021-08-31 | 2021-08-31 | Metal soft solder for vacuum glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113666649A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006082133A (en) * | 2004-09-17 | 2006-03-30 | Sumitomo Electric Ind Ltd | Method for joining metallic bodies |
| CN102079619A (en) * | 2009-11-27 | 2011-06-01 | 洛阳兰迪玻璃机器有限公司 | Glass plate combination sealing method |
| CN107285650A (en) * | 2017-05-15 | 2017-10-24 | 淮北蓄煌新能源科技有限公司 | The low temperature airtight connection of glass assembly is made in a kind of safety glass |
| CN109563726A (en) * | 2016-06-03 | 2019-04-02 | 康宁股份有限公司 | Method and apparatus for vacuum heat-insulation pane |
-
2021
- 2021-08-31 CN CN202111011809.0A patent/CN113666649A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006082133A (en) * | 2004-09-17 | 2006-03-30 | Sumitomo Electric Ind Ltd | Method for joining metallic bodies |
| CN102079619A (en) * | 2009-11-27 | 2011-06-01 | 洛阳兰迪玻璃机器有限公司 | Glass plate combination sealing method |
| CN102079631A (en) * | 2009-11-27 | 2011-06-01 | 洛阳兰迪玻璃机器有限公司 | Method for sealing tempered vacuum glass and product |
| CN109563726A (en) * | 2016-06-03 | 2019-04-02 | 康宁股份有限公司 | Method and apparatus for vacuum heat-insulation pane |
| CN107285650A (en) * | 2017-05-15 | 2017-10-24 | 淮北蓄煌新能源科技有限公司 | The low temperature airtight connection of glass assembly is made in a kind of safety glass |
Non-Patent Citations (3)
| Title |
|---|
| 普拉萨德: "复杂的引线键合互连工艺", 北京：中国宇航出版社 * |
| 杨金城著: "《理论物理文集》", 30 September 2015, 成都：电子科技大学出版社 * |
| 维尔拉•斯卡卡洛娃: "《石墨烯的性能、制备、表征及器件》", 31 August 2019, 哈尔滨：哈尔滨工业大学出版社 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Yongjiang Inventor after: Jiang Hong Inventor after: Cai Banghui Inventor after: Gong Youlai Inventor after: Wang Guojiao Inventor after: Fresh China Inventor before: Liu Yongjiang |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220406 Address after: 635100 No. 5, Keji Road, South District, Dazhu Industrial Park, Dazhou City, Sichuan Province Applicant after: Sichuan yingnuowei New Material Technology Co.,Ltd. Address before: 400000 No. 8-1, Xingde Road, Shapingba District, Chongqing Applicant before: Chongqing innoway energy saving and Environmental Protection Technology Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211119 |