CN113661476A - 显示基板及其制备方法、显示装置 - Google Patents
显示基板及其制备方法、显示装置 Download PDFInfo
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- CN113661476A CN113661476A CN202080000262.1A CN202080000262A CN113661476A CN 113661476 A CN113661476 A CN 113661476A CN 202080000262 A CN202080000262 A CN 202080000262A CN 113661476 A CN113661476 A CN 113661476A
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Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
- H01L2224/06154—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
- H01L2224/06155—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示基板及其制备方法、显示装置。该显示基板(1)包括衬底基板(100)、子像素单元(20)、数据线(103)、扫描线(105)、多个测试接触垫(1071)周边区第一绝缘层(1074)以及辅助电极层。衬底基板(100)包括显示区(101)以及周边区(102)，周边区(102)包括测试邦定区(107)。多个测试接触垫每个(1071)包括第一测试接触垫金属层(1072)以及第二测试接触垫金属层(1073)，第二测试接触垫金属层(1073)覆盖所述第一测试接触垫金属层(1072)且至少在第一测试接触垫金属层(1072)的至少部分周边与第一测试接触垫金属层(1072)接触，辅助电极层包括位于测试邦定区(107)中的多个第一转接电极图案(1076)以及位于显示区(101)中的多个辅助电极(219)。
Description
PCT国内申请，说明书已公开。
Claims (25)
- PCT国内申请，权利要求书已公开。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410221837.2A CN118102778A (zh) | 2020-03-12 | 2020-03-12 | 显示基板及其制备方法、显示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/079005 WO2021179251A1 (zh) | 2020-03-12 | 2020-03-12 | 显示基板及其制备方法、显示装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410221837.2A Division CN118102778A (zh) | 2020-03-12 | 2020-03-12 | 显示基板及其制备方法、显示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113661476A true CN113661476A (zh) | 2021-11-16 |
| CN113661476B CN113661476B (zh) | 2024-04-02 |
Family
ID=77671153
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410221837.2A Pending CN118102778A (zh) | 2020-03-12 | 2020-03-12 | 显示基板及其制备方法、显示装置 |
| CN202080000262.1A Active CN113661476B (zh) | 2020-03-12 | 2020-03-12 | 显示基板及其制备方法、显示装置 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410221837.2A Pending CN118102778A (zh) | 2020-03-12 | 2020-03-12 | 显示基板及其制备方法、显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20220328599A1 (zh) |
| CN (2) | CN118102778A (zh) |
| WO (1) | WO2021179251A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220007830A (ko) * | 2020-07-10 | 2022-01-19 | 삼성디스플레이 주식회사 | 회로 기판 및 이를 포함하는 표시 장치 |
| CN114286510B (zh) * | 2021-12-28 | 2024-01-19 | 武汉天马微电子有限公司 | 线路板、显示模组及显示装置 |
| CN117158126A (zh) * | 2022-02-18 | 2023-12-01 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204463778U (zh) * | 2015-01-08 | 2015-07-08 | 昆山龙腾光电有限公司 | 显示面板及显示面板测试治具 |
| CN107544720A (zh) * | 2016-06-23 | 2018-01-05 | 株式会社日本显示器 | 阵列基板、显示装置以及传感器电极的检查方法 |
| US20190116662A1 (en) * | 2016-05-24 | 2019-04-18 | Boe Technology Group Co., Ltd. | Circuit board structure, binding test method and display device |
| CN110867139A (zh) * | 2019-11-28 | 2020-03-06 | 上海中航光电子有限公司 | 一种阵列基板、显示面板及显示装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11600234B2 (en) * | 2015-10-15 | 2023-03-07 | Ordos Yuansheng Optoelectronics Co., Ltd. | Display substrate and driving method thereof |
| KR102652572B1 (ko) * | 2018-12-03 | 2024-03-28 | 엘지디스플레이 주식회사 | 플렉서블 전계 발광 표시장치 |
| CN109725447B (zh) * | 2019-02-22 | 2023-11-28 | 武汉华星光电技术有限公司 | 阵列基板、显示面板及显示装置 |
| CN110289225B (zh) * | 2019-06-28 | 2022-04-15 | 京东方科技集团股份有限公司 | 测试装置及方法、显示装置 |
| CN116916700A (zh) * | 2020-06-18 | 2023-10-20 | 京东方科技集团股份有限公司 | 显示基板和显示装置 |
| CN112562586B (zh) * | 2020-08-28 | 2022-10-25 | 京东方科技集团股份有限公司 | 显示面板及显示装置 |
| CN113451385B (zh) * | 2021-08-30 | 2021-11-12 | 北京京东方技术开发有限公司 | 显示基板和显示装置 |
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2020
- 2020-03-12 US US17/436,149 patent/US20220328599A1/en active Pending
- 2020-03-12 CN CN202410221837.2A patent/CN118102778A/zh active Pending
- 2020-03-12 CN CN202080000262.1A patent/CN113661476B/zh active Active
- 2020-03-12 WO PCT/CN2020/079005 patent/WO2021179251A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204463778U (zh) * | 2015-01-08 | 2015-07-08 | 昆山龙腾光电有限公司 | 显示面板及显示面板测试治具 |
| US20190116662A1 (en) * | 2016-05-24 | 2019-04-18 | Boe Technology Group Co., Ltd. | Circuit board structure, binding test method and display device |
| CN107544720A (zh) * | 2016-06-23 | 2018-01-05 | 株式会社日本显示器 | 阵列基板、显示装置以及传感器电极的检查方法 |
| CN110867139A (zh) * | 2019-11-28 | 2020-03-06 | 上海中航光电子有限公司 | 一种阵列基板、显示面板及显示装置 |
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| CN118102778A (zh) | 2024-05-28 |
| US20220328599A1 (en) | 2022-10-13 |
| CN113661476B (zh) | 2024-04-02 |
| WO2021179251A1 (zh) | 2021-09-16 |
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