CN113658928A - 一种立式功率端子双面散热功率模块 - Google Patents

一种立式功率端子双面散热功率模块 Download PDF

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CN113658928A
CN113658928A CN202110934394.8A CN202110934394A CN113658928A CN 113658928 A CN113658928 A CN 113658928A CN 202110934394 A CN202110934394 A CN 202110934394A CN 113658928 A CN113658928 A CN 113658928A
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insulating substrate
power terminal
power module
heat dissipation
silver paste
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孙静
姚礼军
言锦春
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Shanghai Daozhi Technology Co ltd
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Abstract

本发明公开了一种立式功率端子双面散热功率模块，包括功率模块本体，所述功率模块本体包括相对设置的第一绝缘基板、第二绝缘基板及设置在两绝缘基板之间的若干芯片及导电连接块，所述芯片的下表面通过连接层与所述第一绝缘基板连接，芯片的上表面通过连接层与导电连接块连接并通过金属导线与所述第一绝缘基板电性连接，所述导电连接块的上表面通过连接层与所述第二绝缘基板连接；所述第一绝缘基板上设置有功率端子和控制端子，所述功率端子与第一绝缘基板连接的焊脚处开设有圆弧孔，功率端子远离圆弧孔的一端朝第一绝缘基板一侧弯折并垂直于第一绝缘基板使之成为立式功率端子，第一绝缘基板和第二绝缘基板之间通过环氧塑封体注塑加工。

Description

一种立式功率端子双面散热功率模块
技术领域
本发明涉及电力电子学领域，具体涉及一种立式功率端子双面散热功率模块。
背景技术
随着新能源汽车行业对功率模块的小型化要求不断提升，模块散热条件越来越严峻。平面型水平式双面散热模块由于功率端子与模块散热绝缘基板平行，安装方式受到了限制。现有市场上的双面散热功率模块，其绝缘基板，大多都是平行设定相同形状尺寸，但是相同形状尺寸的模块，在内部布局方式和模块后期安装方式容易受到限制，因此立式功率端子双面散热功率模块的发明，补充和丰富了功率模块的内部布局方式和模块安装方式，增加了双面散热功率模块的安装适配度。
发明内容
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种既能提高模块散热能力，又能丰富模块安装方式，还能有效提高模块安装适配性的立式功率端子双面散热功率模块。
本发明的目的是通过如下技术方案来完成的，一种立式功率端子双面散热功率模块，包括功率模块本体，所述功率模块本体包括相对设置的第一绝缘基板、第二绝缘基板及设置在两绝缘基板之间的若干芯片及导电连接块，所述芯片的下表面通过连接层与所述第一绝缘基板连接，芯片的上表面通过连接层与导电连接块连接并通过键合或焊接金属导线与所述第一绝缘基板电性连接以实现功率模块本体的电气控制连接，所述导电连接块的上表面通过连接层与所述第二绝缘基板连接；所述第一绝缘基板上设置有功率端子和控制端子，功率端子和控制端子在成品切筋前为完整的引线框架，所述功率端子与第一绝缘基板连接的焊脚处开设有圆弧孔，功率端子远离圆弧孔的一端朝第一绝缘基板一侧弯折并垂直于第一绝缘基板使之成为立式功率端子，第一绝缘基板和第二绝缘基板之间的相对空隙通过环氧塑封体注塑加工以实现电气隔离。
进一步地，所述第一绝缘基板和第二绝缘基板均为双面覆金属层绝缘基板，第一绝缘基板和第二绝缘基板的相对面为带沟槽平面金属层，中间层为由氧化铝或氮化硅制成的绝缘层，第一绝缘基板和第二绝缘基板相互背离的一侧为用于与散热系统连接以进行散热的平整金属层，且该平整金属层与环氧塑封体的外表面齐平并外露于环氧塑封体。
进一步地，所述连接层为银浆烧结或锡焊焊接连接层，银浆烧结采用的银浆为微米级、纳米级或者两者混合体的银浆材料，银浆材料为银膜或者银膏形式；所述锡焊焊接采用SnPb,SnAg, SnAgCu,PbSnAg含Sn焊接材料之一，焊接最高温度控制在100°~400°之间。
进一步地，所述导电连接块的材质为AlSiC、AlC、Cu或Cu-Mo，导电连接块的表面镀有镍、金、银材料之一或其合金材料。
进一步地，所述金属导线为线状或带状结构，金属导线通过超声波方式被键合或通过焊接连接于芯片和第一绝缘基板之间，所述金属导线采用纯铝、纯铜、纯金材料之一或其合金材料制成。
进一步地，所述芯片为IGBT或SiC芯片，芯片表面电镀有金、银材料之一或其合金材料，且芯片上集成有温度和电流传感器。
本发明的有益技术效果在于：本发明通过使用立式功率端子双面散热功率模块，使模块内部布局方式和模块外部安装方式更加丰富，安装适配性更大，模块双面均可用于直接水冷，提高模块散热能力，提高模块长时间工作可靠性，提高模块功率循环能力，在现有模块体积的前提下进一步提升电流等级，提高了模块集成度。
附图说明
图1为本发明的侧面截面示意图；
图2为本发明的正面截面示意图；
图3为本发明所述引线框架的示意图；
图4为本发明所述功率模块本体的电路示意图。
具体实施方式
为使本领域的普通技术人员更加清楚地理解本发明的目的、技术方案和优点，以下结合附图和实施例对本发明做进一步的阐述。
在本发明的描述中，需要理解的是，“上”、“下”、“左”、“右”、“内”、“外”、“横向”、“竖向”等术语所指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明，而不是指示或暗示所指的装置或原件必须具有特定的方位，因此不能理解为对本发明的限制。
如图1-4所示，本发明所述的一种立式功率端子双面散热功率模块，包括功率模块本体，所述功率模块本体包括相对设置的第一绝缘基板1、第二绝缘基板2及设置在两绝缘基板之间的若干芯片3及导电连接块4，所述芯片3的下表面通过连接层5与所述第一绝缘基板1连接，芯片3的上表面通过连接层5与导电连接块4连接并通过键合或焊接金属导线6与所述第一绝缘基板1电性连接以实现功率模块本体的电气控制连接，所述导电连接块4的上表面通过连接层5与所述第二绝缘基板2连接；所述第一绝缘基板1上设置有功率端子7和控制端子8，功率端子7和控制端子8在成品切筋前为完整的引线框架，表面电镀有金、银等材料之一或其合金材料。
参照图1-2所示，所述功率端子7与第一绝缘基板1连接的焊脚处开设有圆弧孔10，功率端子7远离圆弧孔10的一端朝第一绝缘基板1一侧弯折并垂直于第一绝缘基板使之成为立式功率端子，方便应用于不同方向和位置的安装需求，丰富了模块安装的方式。第一绝缘基板1和第二绝缘基板之间2的相对空隙通过环氧塑封体9注塑加工以实现电气隔离，所述环氧塑封体采用高温高压条件，使用环氧料填充整体功率模块两块绝缘基板之间的空隙，以此实现电气隔离。所述功率端子7包括设置有圆弧孔的焊脚、朝向第二绝缘基板倾斜使得功率端子延伸出环氧塑封体9的一端位于环氧塑封体中间位置的第一弯折边、横向延伸的连接边及垂直于该连接边的立式端子边。
参照图1所示，所述第一绝缘基板1和第二绝缘基板2均为双面覆金属层绝缘基板，绝缘基板的形状可根据实际要求进行更改，第一绝缘基板1与第二绝缘基板2可以相同形状，也可以不同形状，第一绝缘基板1和第二绝缘基板2的相对面为带沟槽平面金属层11，带沟槽平面金属层11的表面局部电镀有金、银等，以便于银浆烧结或焊接或铝线键合，作为导电层；中间层12为由氧化铝或氮化硅等材料制成的绝缘层，第一绝缘基板1和第二绝缘基板2相互背离的一侧为用于与散热系统连接以进行散热的平整金属层13，且该平整金属层13与环氧塑封体9的外表面齐平并外露于环氧塑封体。
参照图1所示，所述连接层5为银浆烧结或锡焊焊接连接层，银浆烧结采用的银浆为微米级、纳米级或者两者混合体的银浆材料，银浆材料为银膜或者银膏形式，银浆可在较低温度及高压下课实现烧结，烧结完成后熔化温度可达700℃甚至更高。所述锡焊焊接采用SnPb,SnAg, SnAgCu,PbSnAg含Sn焊接材料之一，焊接最高温度控制在100°~400°之间。所述导电连接块的材质为AlSiC、AlC、Cu或Cu-Mo，导电连接块的表面镀有镍、金、银等材料之一或其合金材料，使其可用于焊接。
所述金属导线6为线状或带状结构，金属导线6通过超声波方式被键合或通过焊接连接于芯片3和第一绝缘基板1之间，所述金属导线6采用纯铝、纯铜、纯金材料之一或其合金材料制成。所述芯片3为IGBT或SiC等芯片，芯片3表面电镀有金、银等材料之一或其合金材料，且芯片3上集成有温度和电流传感器。图2为模块整体内部布局。需要说明的是，在实际应用中可根据实际需要，功率模块中所包含的芯片的数量还可以为其它数量，本发明并不限于此。
如图2-3所示，模块的功率端子7和控制端子8与绝缘基板导电层连接部分形状，将焊脚处做圆弧孔处理，这样可以更好的确认焊接效果。模块的导电连接块部分，导电连接块可以根据实际需求设计成不同的形状，这样使得导电连接块的适用度更高，既可以起到连接导通作用，也可以满足不同芯片布局。图3所示的实施例中，模块的引线框架，在保证满足电气间隙、热阻等前提下，对模块引线框架的连接端子部分的头部做了特殊尖角设计，这样可以简化尖角成型加工过程。双面冷却封装技术由于可显著降低芯片结温，是一种具有广阔发展前景的封装结构。
本文中所描述的具体实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，但凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (6)

1.一种立式功率端子双面散热功率模块，包括功率模块本体，其特征在于：所述功率模块本体包括相对设置的第一绝缘基板、第二绝缘基板及设置在两绝缘基板之间的若干芯片及导电连接块，所述芯片的下表面通过连接层与所述第一绝缘基板连接，芯片的上表面通过连接层与导电连接块连接并通过键合或焊接金属导线与所述第一绝缘基板电性连接以实现功率模块本体的电气控制连接，所述导电连接块的上表面通过连接层与所述第二绝缘基板连接；所述第一绝缘基板上设置有功率端子和控制端子，功率端子和控制端子在成品切筋前为完整的引线框架，所述功率端子与第一绝缘基板连接的焊脚处开设有圆弧孔，功率端子远离圆弧孔的一端朝第一绝缘基板一侧弯折并垂直于第一绝缘基板使之成为立式功率端子，第一绝缘基板和第二绝缘基板之间的相对空隙通过环氧塑封体注塑加工以实现电气隔离。
2.根据权利要求1所述的立式功率端子双面散热功率模块，其特征在于：所述第一绝缘基板和第二绝缘基板均为双面覆金属层绝缘基板，第一绝缘基板和第二绝缘基板的相对面为带沟槽平面金属层，中间层为由氧化铝或氮化硅制成的绝缘层，第一绝缘基板和第二绝缘基板相互背离的一侧为用于与散热系统连接以进行散热的平整金属层，且该平整金属层与环氧塑封体的外表面齐平并外露于环氧塑封体。
3.根据权利要求1或2所述的立式功率端子双面散热功率模块，其特征在于：所述连接层为银浆烧结或锡焊焊接连接层，银浆烧结采用的银浆为微米级、纳米级或者两者混合体的银浆材料，银浆材料为银膜或者银膏形式；所述锡焊焊接采用SnPb,SnAg, SnAgCu,PbSnAg含Sn焊接材料之一，焊接最高温度控制在100°~400°之间。
4.根据权利要求3所述的立式功率端子双面散热功率模块，其特征在于：所述导电连接块的材质为AlSiC、AlC、Cu或Cu-Mo，导电连接块的表面镀有镍、金、银材料之一或其合金材料。
5.根据权利要求3所述的立式功率端子双面散热功率模块，其特征在于：所述金属导线为线状或带状结构，金属导线通过超声波方式被键合或通过焊接连接于芯片和第一绝缘基板之间，所述金属导线采用纯铝、纯铜、纯金材料之一或其合金材料制成。
6.根据权利要求3所述的立式功率端子双面散热功率模块，其特征在于：所述芯片为IGBT或SiC芯片，芯片表面电镀有金、银材料之一或其合金材料，且芯片上集成有温度和电流传感器。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114743947A (zh) * 2022-04-11 2022-07-12 中国工程物理研究院电子工程研究所 基于to形式的功率器件封装结构及封装方法
CN116705726A (zh) * 2023-08-08 2023-09-05 合肥阿基米德电子科技有限公司 一种免焊模块封装结构及其双面散热模块封装结构

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114743947A (zh) * 2022-04-11 2022-07-12 中国工程物理研究院电子工程研究所 基于to形式的功率器件封装结构及封装方法
CN114743947B (zh) * 2022-04-11 2023-09-19 中国工程物理研究院电子工程研究所 基于to形式的功率器件封装结构及封装方法
CN116705726A (zh) * 2023-08-08 2023-09-05 合肥阿基米德电子科技有限公司 一种免焊模块封装结构及其双面散热模块封装结构
CN116705726B (zh) * 2023-08-08 2023-10-27 合肥阿基米德电子科技有限公司 一种免焊模块封装结构及其双面散热模块封装结构

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