CN113658886A - Substrate cleaning apparatus and substrate cleaning method - Google Patents

Substrate cleaning apparatus and substrate cleaning method Download PDF

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Publication number
CN113658886A
CN113658886A CN202110929176.5A CN202110929176A CN113658886A CN 113658886 A CN113658886 A CN 113658886A CN 202110929176 A CN202110929176 A CN 202110929176A CN 113658886 A CN113658886 A CN 113658886A
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China
Prior art keywords
substrate
cleaning
cleaning arm
arm
measuring
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Granted
Application number
CN202110929176.5A
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Chinese (zh)
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CN113658886B (en
Inventor
彭竑凯
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Changxin Memory Technologies Inc
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Changxin Memory Technologies Inc
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Priority to CN202110929176.5A priority Critical patent/CN113658886B/en
Publication of CN113658886A publication Critical patent/CN113658886A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The embodiment of the application relates to a substrate cleaning device and a substrate cleaning method thereof. Wherein, base plate belt cleaning device includes: a body; the first cleaning arm is movably arranged on the machine body and moves along the machine body to contact the first surface of the substrate; the measuring module measures the horizontal weighing value of the first cleaning arm; the horizontal adjusting mechanism adjusts the water balance value within a preset range according to the measuring result of the measuring module, and the first cleaning arm contacts the first surface of the substrate to clean the substrate in a state of horizontally balancing value within the preset range. The embodiment of the application can effectively improve the cleaning effect.

Description

Substrate cleaning apparatus and substrate cleaning method
Technical Field
The present disclosure relates to integrated circuit technologies, and more particularly, to a substrate cleaning apparatus and a substrate cleaning method thereof.
Background
In semiconductor manufacturing, a substrate cleaning apparatus is often used to clean a substrate. In the cleaning process, the magazine particles on the surface of the substrate can be removed by using mechanical force (one end l force in the nic length direction of one end in the Mech length direction) and the like, so that the surface defects of the substrate are reduced, and the product yield is improved.
The mechanical force mainly contacts the surface of the substrate through the cleaning arm, and then the surface of the substrate is cleaned through friction, so that magazine particles are physically removed, and the effect of cleaning the substrate is achieved.
However, the conventional substrate cleaning apparatus often has a phenomenon of poor cleaning effect and loss of product yield after cleaning the substrate.
Disclosure of Invention
In view of the above, embodiments of the present disclosure provide a substrate cleaning apparatus and a substrate cleaning method thereof. The substrate cleaning device can effectively avoid abnormal patterns generated by the angle problem of the cleaning arm, and reduces the yield loss of products.
In a first aspect, an embodiment of the present application provides a substrate cleaning apparatus, configured to clean a substrate, where the cleaning apparatus includes: a body; a first cleaning arm movably mounted to the body, the first cleaning arm moving along the body to contact a first surface of the substrate; a measurement module that measures a horizontal metrology value of the first cleaning arm; the horizontal adjusting mechanism adjusts the horizontal weighing value within a preset range according to the measuring result of the measuring module, and the first cleaning arm contacts the first surface of the substrate to clean the substrate in a state of the horizontal weighing value within the preset range.
In some embodiments, when the water balance value of the first cleaning arm is within the preset range, the water level of the first cleaning arm is greater than 0.
In some embodiments, when the water balance value of the first cleaning arm is within the preset range, the water level of the first cleaning arm is (0.08 mm-0.2 mm)/100 mm.
In some embodiments, one end of the first cleaning arm in the length direction is movably mounted on the machine body, the other end in the length direction is a free end, and the first cleaning arm slides along the machine body to contact the first surface of the substrate; the measuring module is used for measuring a water balance value between one end of the first cleaning arm in the length direction and the other end of the first cleaning arm in the length direction.
In some embodiments, the first wash arm comprises: one end of the first supporting cover is slidably mounted on the machine body, and the other end of the first supporting cover is a free end; the first roller brush is rotatably arranged on the first supporting cover, and a plurality of particle bulges are arranged on the surface of the first roller brush.
In some embodiments, the substrate cleaning apparatus further comprises: and a cleaning liquid supply unit attached to the body, the cleaning liquid supply unit spraying a cleaning liquid onto the substrate.
In some embodiments, the substrate cleaning apparatus further comprises: the second cleaning arm is arranged opposite to the first cleaning arm, the second cleaning arm is contacted with the second surface of the substrate to clean the substrate, and the first surface and the second surface are opposite.
In some embodiments, the second wash arm comprises: the two ends of the second supporting cover are free ends, and the second supporting cover is movably arranged on the machine body through a lifting shaft; and the second roller brush is rotatably arranged on the second supporting cover, and a plurality of particle bulges are distributed on the surface of the second roller.
In some embodiments, the measurement module comprises: the first sensor is arranged on the top wall of the machine body, a first measuring point is selected on the first cleaning arm, and the first sensor is positioned above the first measuring point so as to measure a first distance between the first measuring point and the top wall of the machine body; the second sensor is arranged on the top wall of the machine body, a second measuring point is selected on the first cleaning arm, and the second sensor is positioned above the second measuring point, wherein the second measuring point and the first measuring point are arranged along the length direction of the first cleaning arm so as to measure a second distance between the second measuring point and the top wall of the machine body; a processing section calculating a difference between the first distance and the second distance to measure the level metric value.
In some embodiments, the base plate is supported within the body by a support portion that includes a plurality of pinch rollers.
In some embodiments, the horizontal adjustment mechanism comprises an adjustment screw.
In a second aspect, an embodiment of the present application further provides a substrate cleaning method, including: providing a substrate cleaning apparatus as described above; providing a substrate and supporting the substrate in the body; measuring a horizontal metrology value of the first wash arm using the measurement module; adjusting the horizontal weighing value within a preset range by using the horizontal adjusting mechanism; and moving the first cleaning arm along the machine body, wherein the first cleaning arm contacts the first surface of the substrate in a state of a horizontal weighing value within the preset range to clean the substrate.
In some embodiments, the step of measuring a level metric of the first wash arm comprises: selecting a first measuring point on the first cleaning arm, and measuring a first distance between the first measuring point and the top wall of the machine body; selecting a second measuring point on the first cleaning arm along the length arrangement direction of the first cleaning arm, and measuring a second distance between the second measuring point and the top wall of the machine body; calculating a difference between the first distance and the second distance to measure the horizontal metric value.
In some embodiments, the substrate is cleaned using a first cleaning arm while the substrate is held in a rotated state.
The embodiment of the application provides a substrate cleaning device and a substrate cleaning method thereof, a first cleaning arm of the substrate cleaning device can be in a state that a horizontal weighing value is within a preset range through measurement of a measuring module and adjustment of a horizontal adjusting mechanism, a substrate is cleaned by a first surface which is in contact with the substrate, the angle of the first cleaning arm can be monitored in real time and can be adjusted in time, abnormal patterns caused by the angle are effectively avoided, product yield loss is reduced, and a cleaning effect is effectively improved. In addition, in some embodiments, the measuring module feeds back a distance difference between two detection points of the first cleaning arm through two sensors, and quantifies the horizontal weighing value of the first cleaning arm, so that the measurement accuracy is ideal.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a front view of a substrate cleaning apparatus provided in an embodiment;
FIG. 2 is a side view of a substrate cleaning apparatus provided in one embodiment;
fig. 3 is a front view of a substrate cleaning apparatus provided in another embodiment;
fig. 4 is a schematic flow chart illustrating a substrate cleaning method according to an embodiment.
Description of reference numerals:
description of reference numerals: 110-housing, 120-first support structure, 130-top wall, 200-first cleaning arm, 210-first support cover, 220-first roller brush, 300-measuring module, 310-first sensor, 320-second sensor, 400-leveling mechanism, 600-second cleaning arm, 610-second support cover, 620-second roller brush, 700-lifting shaft, 810-clamping roller.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Spatial relational terms, such as "under," "below," "under," "over," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, in this specification, the term "and/or" includes any and all combinations of the associated listed items.
Embodiments of the application are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments (and intermediate structures) of the application, such that variations from the shapes shown are to be expected due to, for example, manufacturing techniques and/or tolerances. Thus, embodiments of the present application should not be limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing techniques.
The application provides a substrate cleaning device and a substrate cleaning method thereof. In one embodiment, referring to fig. 1 and 2, a substrate cleaning apparatus for cleaning a substrate, such as a glass substrate, a wafer, etc., is provided. The substrate cleaning apparatus includes a body, a first cleaning arm 200, a measuring module 300, and a leveling mechanism 400.
The body may be a mounting base on which the first cleaning arm 200, etc. are mounted. As an example, the body may include a housing 110, a first support structure 120 coupled to the housing 110 for supporting the first cleaning arm 200, and the like. Alternatively, the housing may include the first support structure 120 supporting the first cleaning arm 200 instead of the housing 110, which is not limited in this application.
The first cleaning arm 200 is a movable arm for cleaning the surface of the substrate. Which is movably mounted to the body, i.e., the first cleaning arm 200 is movable relative to the body.
Specifically, when the substrate is placed at the cleaning position, the first cleaning arm 200 may move toward the substrate along the body to contact the first surface of the substrate, thereby performing the friction cleaning of the surface of the substrate.
The measuring module 300 is used to measure the horizontal weighing value of the first cleaning arm 200. It should be noted that the water balance value of the first cleaning arm 200 may be the water level of the first cleaning arm 200, or may be a relative value, such as an angle, which can balance the water level of the first cleaning arm 200. The levelness of the first cleaning arm 200 is a height deviation of both ends of a selected section of the first cleaning arm having a preset length in a vertical direction.
The horizontal adjustment mechanism 400 may be used to adjust the water balance value of the first cleaning arm 200 within a preset range according to the measurement result of the measurement module 300. The preset range is a value range which can enable the cleaning effect to reach the preset standard.
As an example, the leveling mechanism may include an adjustment screw, such that the leveling amount of the first cleaning arm is adjusted by the adjustment screw.
It will be appreciated that multiple cooperative measurement adjustments may be made using the measurement module 300 and the level adjustment mechanism 400 such that the water balance value of the first wash arm 200 is within a predetermined range.
Specifically, after the leveling mechanism 400 performs the leveling according to the measurement result of the measuring module 300, the measuring module 300 may measure the leveling value of the first cleaning arm 200 again, so as to check the leveling result to determine whether the leveling value of the first cleaning arm 200 is within the preset range. When the level weighing value of the first cleaning arm 200 is within the preset range, the adjustment using the level adjustment mechanism 400 is stopped. When the water balance amount of the first cleaning arm 200 is not within the preset range, the horizontal adjustment mechanism 400 is continuously used for horizontal adjustment until the water balance amount of the first cleaning arm 200 is within the preset range.
In this embodiment, the horizontal adjustment of the first cleaning arm 200 may affect the amount of impurities such as particles on the surface of the substrate, and the horizontal measurement value of the first cleaning arm 200 may be controlled within a predetermined range through the measurement of the measurement module and the adjustment of the horizontal adjustment mechanism 400, thereby improving the yield. When the substrate cleaning apparatus of the present embodiment is used for cleaning, the first cleaning arm 200 contacts the first surface of the substrate to clean the substrate in a state where the horizontal weighing value is within the preset range, so that the cleaning effect can be effectively improved.
In one embodiment, the levelness of the first cleaning arm 200 is greater than 0 when the levelness measure of the first cleaning arm 200 is within a predetermined range. The height deviation of two ends of the selection section with the preset length of the first cleaning arm in the vertical direction is larger than 0.
When the first cleaning arm 200 cleans a substrate (specifically, when the first roller brush 220 cleans the substrate), various environmental factors may affect the substrate. Therefore, when the first cleaning arm 200 cleans the substrate, the cleaning effect gradually changes along the length direction.
In this embodiment, when the horizontal weighing value of the first cleaning arm 200 is set within the preset range, the offset corresponding to the first cleaning arm 200 is greater than 0, so that the distances between the first cleaning arm 200 and the substrate at different positions in the length direction (specifically, at different positions of the first roller brush 220 in the length direction) are different. The smaller the distance between the first cleaning arm 200 and the substrate, the greater the cleaning force. The greater the distance between the first rinse arm 200 and the substrate, the less the cleaning force. At this time, the influence of various environmental factors on the cleaning effect can be compensated through the distance between the first cleaning arm 200 and the substrate, so that the first cleaning arm 200 can uniformly and effectively clean all parts of the substrate, thereby improving the final cleaning effect.
As an example, when the level balance value of the first cleaning arm may be set within a preset range, the levelness of the first cleaning arm may be (0.08mm to 0.2mm)/100 mm. That is, the height deviation of both ends of the selected section of the first wash arm having a length of 100mm in the vertical direction may be (0.08mm to 0.02 mm). Within this range, the first cleaning arm 200 contacts and cleans the surface of the substrate in an inclined state, and generates an acceptable frictional force against the surface of the substrate, thereby effectively wiping off impurities such as particles on the surface of the substrate. As an example, when the length of the first cleaning arm is 350mm, the height deviation of the two ends in the vertical direction is 0.3mm, 0.45mm, 0.5mm, 0.6mm, for example.
In one embodiment, one end of the first cleaning arm 200 in the length direction is movably mounted to the body. Meanwhile, the other end of the first cleaning arm 200 in the length direction is a free end. The first cleaning arm 200 slides along the body to contact the first surface of the substrate.
The measuring module 300 is used to measure a water balance amount between one end in the length direction and the other end in the length direction of the first cleaning arm 200, that is, measure a water balance amount between both ends in the length direction of the first cleaning arm 200. At this time, it is possible to effectively prevent the first cleaning arm 200 from being affected by other environmental factors in the length direction to cause a poor cleaning effect.
In one embodiment, the first cleaning arm 200 includes a first support cover 210 and a first roller brush 220.
One end of the first supporting cover 210 in the length direction is slidably mounted on the body, and the other end in the length direction is a free end, so that the first cleaning arm 200 can conveniently and effectively move to the substrate in a sliding manner, thereby cleaning the substrate.
The first roller brush 220 is rotatably installed on the first support cover 210, and a plurality of particle protrusions are arranged on the surface of the first roller brush 220. The plurality of particle protrusions can be arranged in a close-packed manner, so that the substrate can be effectively cleaned by friction.
Of course, in other embodiments, the first cleaning arm 200 may be mounted in other ways. For example, it may be mounted by a lifting shaft, etc. This is not limited by the present application.
In one embodiment, the measurement module 300 includes a first sensor 310 and a second sensor 320. Meanwhile, the body may include a top wall 130. The sensors 310 and 320 measure the distance from the first cleaning arm 200 to determine the water balance value of the first cleaning arm 200, and the water level is quantified by feeding back the distance difference between the measuring points on the first cleaning arm 200, and if the water level deviates, for example, exceeds a preset range, the machine can be stopped, and the water level can be adjusted in time by the adjusting mechanism 400.
As an example, at this time, the body may include the housing 110, and the top wall 130 may be a top of the housing 110.
The first sensor 310 and the second sensor 320 are disposed on the top wall 130, so as to facilitate installation and debugging of the first sensor 310 and the second sensor 320.
And, a first measuring point is selected on the first cleaning arm 200, and the first sensor 310 is disposed above the first measuring point, thereby measuring a first distance d1 between the first measuring point and the top wall 130.
Meanwhile, a second measuring point is selected on the first cleaning arm 200, and the second sensor 320 is disposed above the second measuring point, thereby measuring a second distance d2 between the second measuring point and the top wall 130.
As an example, the first sensor 310 and the second sensor 320 may be distance sensors, or tilt sensors.
The top wall 130 is level, so that the levelness of the first cleaning arm 200 can be obtained by calculating the difference between the first distance d1 and the second distance d2 and the distance d3 between the first measuring point and the second measuring point.
It will be appreciated that when the first measuring point and the second measuring point are fixed and the distance therebetween is fixed (e.g. 100mm), the difference between the first distance d1 and the second distance d2 or both can be used as the water balance value, and the water balance value of the first cleaning arm is, for example: (d1-d2)/d3 is (0.08 mm-0.2 mm)/100 mm.
As an example, the measuring module 300 may further include a processing unit (not shown), such as a processor with an arithmetic function, electrically connected to the first sensor 310 and the second sensor 320, so as to automatically calculate the difference between the first distance d1 and the second distance d 2.
Of course, the processing unit may not be provided, and only the first distance d1 and the second distance d2 may be measured, and then the difference between the first distance d1 and the second distance d2 may be calculated by the relevant staff.
In one embodiment, the measurement module 300 further comprises a calibration unit (not shown in the figures). The calibration unit is used for calibrating the levelness between the first sensor 310 and the second sensor 320, so as to ensure that the second sensor 320 and the first sensor 310 are located at the same horizontal position, and thus, the measurement accuracy is ensured.
In one embodiment, the substrate cleaning apparatus further includes a cleaning liquid supply portion (not shown). The cleaning liquid supply part is mounted on the machine body.
Specifically, at this time, the machine body may further include another support structure (not shown in the drawings) for mounting the cleaning liquid supply portion, so that the cleaning liquid supply portion is mounted to the support structure.
The cleaning liquid supply part is used for spraying cleaning liquid to the substrate, and the cleaning liquid can specifically comprise chemical solution and/or ultrapure water and the like, and removes the defects of particles and the like on the surface of the substrate through electrical characteristics, thereby improving the yield.
In this case, the substrate cleaning apparatus can perform chemical cleaning using the cleaning liquid sprayed from the cleaning liquid supply unit while performing physical cleaning using the first cleaning arm 200, thereby improving the cleaning effect.
In one embodiment, the substrate cleaning apparatus further comprises a second cleaning arm 600. The second cleaning arm 600 is disposed opposite to the first cleaning arm 200, so that the second cleaning arm 600 and the first cleaning arm 200 can respectively clean the substrate from both sides of the substrate when cleaning the substrate. From the viewpoint of obtaining a desired cleaning effect, the water balance of the second cleaning arm 600, for example, the water level, may be 0, so that the second cleaning arm 200 supports and contacts the substrate in a horizontal state, thereby preventing the substrate from being disturbed in balance, and the substrate from being squeezed.
Specifically, the first cleaning arm 200 contacts a first surface of the substrate to clean the substrate, and the second cleaning arm 600 contacts a second surface of the substrate to clean the substrate, the first surface being opposite to the second surface.
In one embodiment, the second cleaning arm 600 includes a second support cap 610 and a second roller brush 620.
Both ends of the second support cover 610 are free ends. And, the second support cover 610 is movably mounted to the body by a lifting shaft 700, so as to be moved toward the substrate by the lifting shaft 700.
Specifically, at this time, the body may further include a second support structure (not shown), and the lifting shaft 700 may be specifically mounted on the second support structure.
The second roller brush 620 is rotatably installed on the second supporting cover 610, and a plurality of particle protrusions are arranged on the surface of the second roller brush 620. The plurality of particle protrusions can be arranged in a close-packed manner, so that the substrate can be effectively cleaned by friction.
In this embodiment, the movement of the second cleaning arm 600 toward the substrate can be effectively achieved by the elevating shaft 700.
As an example, the lifting shaft 700 may be disposed on a central axis of the second support cover 610, so as to facilitate that various environmental influences on positions of the second cleaning arm 600 during the cleaning process are the same, thereby facilitating that the second cleaning arm 600 can uniformly and effectively clean the substrate everywhere.
Of course, the present application is not so limited. For example, in other embodiments, the water balance of the second cleaning arm 600 may be the same as the first cleaning arm 200, but different from the water balance of the first cleaning arm 200, such as the water level, the first cleaning arm 200 has one end away from the substrate and the other end close to the substrate, and the corresponding end of the second cleaning arm 600 is close to the substrate and the other end away from the substrate, so as to keep the substrate balanced and scrub particles on the substrate surface. At this time, the elevating shaft 700 may not be disposed on the central axis of the second support cover 610. Alternatively, the second supporting cover 610 of the second cleaning arm 600 may be slidably mounted on the machine body (see fig. 3), and further, the second supporting cover moves towards the substrate in a sliding manner to contact the substrate, so as to clean the second surface of the substrate.
In one embodiment, the substrate cleaning apparatus further comprises a substrate support. The substrate support includes a plurality of pinch rollers 810. A plurality of pinch rollers 810 are used to pinch the support substrate. Meanwhile, the plurality of pinch rollers 810 drive the substrate to rotate, so that all parts of the substrate can be uniformly and effectively cleaned.
In one embodiment, the substrate cleaning apparatus includes a body, a first cleaning arm 200, a measuring module 300, a level adjustment mechanism 400, a cleaning solution supply part, a second cleaning arm 600, and a substrate support part.
The first cleaning arm 200 includes a first support cover 210 and a first roller brush 220. One end of the first supporting cover 210 in the length direction is slidably mounted on the body, and the other end in the length direction is a free end. The first roller brush 220 is rotatably installed on the first support cover 210. And, a plurality of particle protrusions are arranged on the surface of the first roller brush 220.
The second cleaning arm 600 includes a second support cap 610 and a second roller brush 620. The two ends of the second supporting cover 610 are free ends and are movably mounted on the machine body through a lifting shaft 700. The elevating shaft 700 is positioned on the central axis of the second support cover 610. The second roller brush 620 is rotatably installed on the second support cover 610. And, a plurality of particle protrusions are arranged on the surface of the second roller brush 620.
When cleaning the substrate, the plurality of pinch rollers 810 of the substrate support portion pinch and support the substrate while rotating the substrate.
Thereafter, the first cleaning arm 200 is brought close to the substrate from above the substrate to contact the substrate, thereby cleaning the first surface of the substrate. The second cleaning arm 600 is brought close to the substrate from below the substrate to contact the substrate, thereby cleaning the second surface of the substrate. The cleaning liquid supply unit sprays a cleaning liquid onto the first surface and/or the second surface of the substrate, thereby simultaneously performing physical cleaning and chemical cleaning on the substrate.
In the cleaning process, various environmental factors such as horizontal rotation of the substrate, vertical rotation of the first roller brush 220 and/or the second roller brush 620, and a liquid flow field generated by the cleaning liquid may have adverse effects on the cleaning effects of the first cleaning arm 200 and the second cleaning arm 600.
In this embodiment, before the substrate is cleaned, the horizontal adjustment mechanism 400 may adjust the water balance value of the first cleaning arm 200 within a preset range according to the measurement result of the measurement module 300, so as to compensate the adverse effect of various environmental factors on the cleaning effect through the level of the first cleaning arm 200, thereby improving the cleaning effect.
And the second cleaning arm 600 is positioned under the substrate so as to be movably mounted to the body by a lifting shaft 700. The lifting shaft 700 is located on the central axis of the second support cover 610, so that various environmental influences on various positions of the second cleaning arm 600 in the cleaning process are the same, and the second cleaning arm 600 can clean various positions of the substrate uniformly and effectively.
Of course, in other embodiments, the lifting shaft 700 is not located on the central axis of the second support cover 610 of the second cleaning arm 600, or the second cleaning arm 600 is slidably mounted on the machine body, the water balance value of the second cleaning arm 600 may be measured in a similar manner to the first cleaning arm 200, and the water balance value of the second cleaning arm 600 may be adjusted within a suitable range according to the measurement structure. Alternatively, in other embodiments, the first cleaning arm 200 is a cleaning arm positioned below the substrate.
In one embodiment, referring to fig. 4, a method for cleaning a substrate is provided, including:
step S100, providing the substrate cleaning device;
step S200, providing a substrate and supporting the substrate in a machine body;
step S300, measuring a horizontal weighing value of the first cleaning arm by using a measuring module;
step S400, adjusting the water balance value within a preset range by using a horizontal adjusting mechanism;
step S500, the first cleaning arm is moved along the body, and the first cleaning arm contacts the first surface of the substrate to clean the substrate in a state of a horizontal weighing value within a preset range.
In one embodiment, step S300 includes:
step S310, selecting a first measuring point on a first cleaning arm, and measuring a first distance between the first measuring point and the top wall of the machine body;
step S320, selecting a second measuring point on the first cleaning arm along the length arrangement direction of the first cleaning arm, and measuring a second distance between the second measuring point and the top wall of the machine body;
in step S330, a difference between the first distance and the second distance is calculated to measure the horizontal metric value.
In one embodiment, the substrate is cleaned using a first cleaning arm while the substrate is held in a rotated state.
For the specific definition of the substrate cleaning method, reference may be made to the above definition of the substrate cleaning apparatus, which is not described herein again.
It should be understood that, although the steps in the flowchart of fig. 4 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 4 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed in turn or alternately with other steps or at least a portion of the other steps or stages.
In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features of the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (14)

1. A substrate cleaning apparatus for cleaning a substrate, comprising:
a body;
a first cleaning arm movably mounted to the body, the first cleaning arm moving along the body to contact a first surface of the substrate;
a measurement module that measures a horizontal metrology value of the first cleaning arm;
the horizontal adjusting mechanism adjusts the horizontal weighing value within a preset range according to the measuring result of the measuring module, and the first cleaning arm contacts the first surface of the substrate to clean the substrate in a state of the horizontal weighing value within the preset range.
2. The apparatus of claim 1, wherein the first cleaning arm has a water level greater than 0 when the water balance of the first cleaning arm is within the predetermined range.
3. The apparatus of claim 1, wherein the first cleaning arm has a water level of (0.08mm to 0.2mm)/100mm when the water balance value of the first cleaning arm is within the predetermined range.
4. The substrate cleaning apparatus according to claim 1, wherein one end of the first cleaning arm in a length direction is movably mounted to the body, and the other end in the length direction is a free end, and the first cleaning arm slides along the body to contact the first surface of the substrate;
the measuring module is used for measuring a water balance value between one end of the first cleaning arm in the length direction and the other end of the first cleaning arm in the length direction.
5. The substrate cleaning apparatus of claim 1, wherein the first cleaning arm comprises:
one end of the first supporting cover is slidably mounted on the machine body, and the other end of the first supporting cover is a free end;
the first roller brush is rotatably arranged on the first supporting cover, and a plurality of particle bulges are arranged on the surface of the first roller brush.
6. The substrate cleaning apparatus according to claim 1, further comprising: and a cleaning liquid supply unit attached to the body, the cleaning liquid supply unit spraying a cleaning liquid onto the substrate.
7. The substrate cleaning apparatus according to claim 1, further comprising:
the second cleaning arm is arranged opposite to the first cleaning arm, the second cleaning arm is contacted with the second surface of the substrate to clean the substrate, and the first surface and the second surface are opposite.
8. The substrate cleaning apparatus of claim 7, wherein the second cleaning arm comprises:
the two ends of the second supporting cover are free ends, and the second supporting cover is movably arranged on the machine body through a lifting shaft;
and the second roller brush is rotatably arranged on the second supporting cover, and a plurality of particle bulges are distributed on the surface of the second roller.
9. The substrate cleaning apparatus of claim 1, wherein the measurement module comprises: the first sensor is arranged on the top wall of the machine body, a first measuring point is selected on the first cleaning arm, and the first sensor is positioned above the first measuring point so as to measure a first distance between the first measuring point and the top wall of the machine body;
the second sensor is arranged on the top wall of the machine body, a second measuring point is selected on the first cleaning arm, and the second sensor is positioned above the second measuring point, wherein the second measuring point and the first measuring point are arranged along the length direction of the first cleaning arm so as to measure a second distance between the second measuring point and the top wall of the machine body;
a processing section calculating a difference between the first distance and the second distance to measure the level metric value.
10. The substrate cleaning apparatus according to claim 1, wherein the substrate is supported in the body by a support portion, the support portion including a plurality of pinch rollers.
11. The substrate cleaning apparatus of claim 1, wherein the horizontal adjustment mechanism comprises an adjustment screw.
12. A method of cleaning a substrate, comprising:
providing a substrate cleaning apparatus according to any one of claims 1 to 11;
providing a substrate and supporting the substrate in the body;
measuring a horizontal metrology value of the first wash arm using the measurement module;
adjusting the horizontal weighing value within a preset range by using the horizontal adjusting mechanism;
and moving the first cleaning arm along the machine body, wherein the first cleaning arm contacts the first surface of the substrate in a state of a horizontal weighing value within the preset range to clean the substrate.
13. A method for cleaning a substrate as recited in claim 12, wherein measuring the horizontal metrology value of the first cleaning arm comprises:
selecting a first measuring point on the first cleaning arm, and measuring a first distance between the first measuring point and the top wall of the machine body;
selecting a second measuring point on the first cleaning arm along the length arrangement direction of the first cleaning arm, and measuring a second distance between the second measuring point and the top wall of the machine body;
calculating a difference between the first distance and the second distance to measure the horizontal metric value.
14. The substrate cleaning method according to claim 12, wherein the substrate is cleaned using a first cleaning arm while being held in a state of being rotated.
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