CN113658766A - 一种耐潮防电极金属迁移玻璃式封装的金浆ntc热敏电阻 - Google Patents
一种耐潮防电极金属迁移玻璃式封装的金浆ntc热敏电阻 Download PDFInfo
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Abstract
本发明公开了一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,包括金浆电极NTC热敏电阻半导体芯片、玻璃保护外壳、金属杜镁丝引线、金浆电极和NTC芯片陶瓷本体,所述金浆电极NTC热敏电阻半导体芯片的一端设置有两组金属杜镁丝引线,且金浆电极NTC热敏电阻半导体芯片的外侧包裹有玻璃保护外壳。本发明所设计的电阻相较于常规电阻体积更小,对于温度的控制更加精准,且合理的结构设计使得安装更加的方便。
Description
技术领域
本发明涉及热敏电阻技术领域,具体为一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻。
背景技术
现今社会、国家和消费者对家用电器测温控温安全使用保护意识越来越高,同时对测温产品除了灵敏反应快也提出新的、更高的要求。耐高温、耐潮耐迁移就是近年来需求最多的要求。
目前国内NTC热敏电阻器行业产品都是使用银浆、银钯浆、钯浆等作为NTC热敏电阻的电极材料,这些材料在稀有金属是比较活跃的金属元素,只要在通电的过程中有潮湿情况,就会发生银迁移的现象,从而造成NTC热敏电阻器测控温失效。
发明内容
为实现上述目的,本发明提供如下技术方案:一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,包括金浆电极NTC热敏电阻半导体芯片、玻璃保护外壳、金属杜镁丝引线、金浆电极和NTC片陶瓷本体,所述金浆电极NTC热敏电阻半导体芯片的一端设置有两根金属杜镁丝引线,且金浆电极NTC热敏电阻半导体芯片的外侧包裹有玻璃保护外壳,所述玻璃保护外壳包裹住金属杜镁丝引线和金属杜镁丝引线的连接处;
所述玻璃保护外壳包括金浆电极和NTC芯片陶瓷本体,所述金浆电极均匀的涂抹在NTC芯片陶瓷本体的上下两面。
优选的;所述玻璃保护外壳的外型呈类椭圆状,且中部凹陷呈扁平状。
优选的;所述玻璃保护外壳的厚度小于0.3㎜。
优选的;所述金浆电极的厚度在0.05mm到0.2mm之间。
上述耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻的制造方法,该方法包括如下步骤:
步骤一:将金浆粘和在NTC芯片陶瓷本体的两面,通过高温烧成形成固态的金浆电极NTC热敏电阻半导体芯片,即金桨在NTC芯片陶瓷本体两面形成金浆电极,
步骤二:将涂抹金浆的金属杜镁丝引线和金浆电极NTC热敏电阻半导体芯片1两面的金浆电极进行组合,通过高温烧结到一起。
步骤三:在金浆电极NTC热敏电阻半导体芯片和金属杜镁丝引线外侧套上玻璃保护外壳,然后进入烧结设备烧结形成。
与现有技术相比,本发明的有益效果如下:
体积小,测温精度高,热响应时间快,结构简单,耐高温,耐潮防迁移,可靠性高,此外,NTC热敏电阻型温度传感器组件中的金浆电极外侧套设有玻璃保护外壳,可以有效的保护产品内半导体芯片不被破坏,避免使用过程中出现腐蚀破损等情况,采用这种NTC热敏电阻型温度传感器的电池组工作安全度高、控温速度快、延长NTC热敏电阻器使用寿命,且该热敏电阻特殊的结构设计可以便于在安装时候更加的方便。
附图说明
图1为本发明的结构示意图;
图2为本发明的金浆电极NTC热敏电阻半导体芯片结构示意图;
图3为本发明的金属杜镁丝引线结构示意图。
图中:1、金浆电极NTC热敏电阻半导体芯片;2、玻璃保护外壳;3、金属杜镁丝引线;4、金浆电极;5、NTC芯片陶瓷本体。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1:请参阅图1-3,一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,包括金浆电极NTC热敏电阻半导体芯片1、玻璃保护外壳2、金属杜镁丝引线3、金浆电极4和NTC芯片陶瓷本体5,所述金浆电极NTC热敏电阻半导体芯片1的一端设置有两根金属杜镁丝引线3,且金浆电极NTC热敏电阻半导体芯片1的外侧包裹有玻璃保护外壳2,所述玻璃保护外壳2包裹住金浆电极NTC热敏电阻半导体芯片1和金属杜镁丝引线3的连接处;
所述玻璃保护外壳2包括金浆电极4和NTC芯片陶瓷本体5,所述所述金浆电极4均匀的涂抹在NTC芯片陶瓷本体5的上下两面。
优选的;所述玻璃保护外壳2的外型呈类椭圆状,且中部凹陷呈扁平状。
优选的;所述玻璃保护外壳2的厚度小于0.3㎜。
优选的;所述金浆电极4的厚度在0.05mm到0.2mm之间。
上述耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻的制造方法,该方法包括如下步骤:
步骤一:将金浆粘和在NTC芯片陶瓷本体5的两面,通过高温烧成形成固态的金浆电极NTC热敏电阻半导体芯片1,即金浆在NTC芯片陶瓷本体5两面形成金浆电极4,
步骤二:将涂抹金浆的金属杜镁丝引线3和金浆电极NTC热敏电阻半导体芯片1两面的金浆电极进行组合,通过高温烧结到一起。
步骤三:在金浆电极NTC热敏电阻半导体芯片1和金属杜镁丝引线3外侧套上玻璃保护外壳2,然后进入烧结设备烧结形成。
实施例2,参阅图2-3,与实施例1基本相同,所不同在于玻璃保护外壳2的厚度和金浆电极4的厚度,具体如下:
玻璃保护外壳的厚度在0.2㎜到0.3mm之间,既可以起到较好的保护作用,又可以在保护的同时避免影响散热效果,将对散热的影响控制在最低范围内。
金浆电极的厚度在0.12㎜到0.2mm之间。
经检测,散热程度会相对变差,阻止变小,本身产生的热量也会变小。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (4)
1.一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,包括金浆电极NTC热敏电阻半导体芯片(1)、玻璃保护外壳(2)、金属杜镁丝引线(3)、金浆电极(4)和NTC芯片陶瓷本体(5),其特征在于:所述金浆电极NTC热敏电阻半导体芯片(1)的一端设置有两根金属杜镁丝引线(3),且金浆电极NTC热敏电阻半导体芯片(1)的外侧包裹有玻璃保护外壳(2),所述玻璃保护外壳(2)包裹住金浆电极NTC热敏电阻半导体芯片(1)和金属杜镁丝引线(3)的连接处;
所述玻璃保护外壳(2)包括金浆电极(4)和NTC芯片陶瓷本体(5),所述金浆电极(4)均匀的涂抹在NTC芯片陶瓷本体(5)的上下两面。
2.根据权利要求1所述的一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,其特征在于:所述玻璃保护外壳(2)的外型呈类椭圆状,且中部凹陷呈扁平状。
3.根据权利要求1所述的一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,其特征在于:所述玻璃保护外壳(2)的壁厚小于0.3㎜。
4.根据权利要求1所述的一种耐潮防电极金属迁移玻璃式封装的金浆NTC热敏电阻,其特征在于:所述金浆电极(4)的厚度在0.05mm到0.2mm之间。
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CN204834218U (zh) * | 2015-06-19 | 2015-12-02 | 孝感华工高理电子有限公司 | 可探测中高温的玻封二极管结构ntc热敏电阻 |
CN205748702U (zh) * | 2016-10-14 | 2016-11-30 | 深圳市富温传感技术有限公司 | 一种一体式薄膜ntc温度传感器 |
US20200090840A1 (en) * | 2017-12-20 | 2020-03-19 | Exsense Electronics Technology Co., Ltd. | Composite thermistor chip and preparation method thereof |
CN112397267A (zh) * | 2020-11-17 | 2021-02-23 | 深圳市科敏传感器有限公司 | 一种耐潮防电极金属迁移玻璃式封装的金浆ntc热敏电阻 |
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CN204834218U (zh) * | 2015-06-19 | 2015-12-02 | 孝感华工高理电子有限公司 | 可探测中高温的玻封二极管结构ntc热敏电阻 |
CN205748702U (zh) * | 2016-10-14 | 2016-11-30 | 深圳市富温传感技术有限公司 | 一种一体式薄膜ntc温度传感器 |
US20200090840A1 (en) * | 2017-12-20 | 2020-03-19 | Exsense Electronics Technology Co., Ltd. | Composite thermistor chip and preparation method thereof |
CN112397267A (zh) * | 2020-11-17 | 2021-02-23 | 深圳市科敏传感器有限公司 | 一种耐潮防电极金属迁移玻璃式封装的金浆ntc热敏电阻 |
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