CN113652665A - Vacuum coating system with cleaning device - Google Patents
Vacuum coating system with cleaning device Download PDFInfo
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- CN113652665A CN113652665A CN202110946645.4A CN202110946645A CN113652665A CN 113652665 A CN113652665 A CN 113652665A CN 202110946645 A CN202110946645 A CN 202110946645A CN 113652665 A CN113652665 A CN 113652665A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 70
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 238000004544 sputter deposition Methods 0.000 claims abstract description 41
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 238000002203 pretreatment Methods 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 239000007888 film coating Substances 0.000 claims abstract description 5
- 238000009501 film coating Methods 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 5
- 238000007599 discharging Methods 0.000 claims description 16
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 10
- 150000002500 ions Chemical class 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A vacuum coating system with a cleaning device comprises a body unit, at least one sputtering device and the cleaning device. The body unit comprises a shell body defining a vacuum cavity, a central shaft and a carrying platform capable of rotating at an equal angular rate by taking the central shaft as an axis, wherein the carrying platform is arranged in the vacuum cavity and is provided with a plurality of filling seats which are arranged around the central shaft and are suitable for being used for arranging a plurality of substrates. The at least one sputtering device is arranged on the shell and faces the filling seat, and is suitable for plating elements on the surface of the substrate. The cleaning device is arranged on the body unit and is suitable for performing pre-treatment on the substrate which is not subjected to film coating so as to reduce impurities or pollution on the substrate. Therefore, the effects of uniformly coating, improving the adhesive force of the coating and improving the yield can be achieved.
Description
Technical Field
The invention relates to a vacuum coating system, in particular to a vacuum coating system with a cleaning device.
Background
Currently, the conventional coating technique uses a linear vacuum coating method, which is to perform a plurality of repeated processes by moving a substrate back and forth between working sections. However, the linear reciprocating motion is a variable speed motion, and when the substrate does not pass through the working zone at a constant speed, the film thickness of the coating film tends to be uneven. In addition, when there is impurities or contamination on the substrate to be plated, the yield of the plated film is not good.
Disclosure of Invention
The present invention is directed to a vacuum coating system having a cleaning apparatus that solves the above problems.
The vacuum coating system with the cleaning device is suitable for coating a plurality of substrates and comprises a body unit, at least one sputtering device and the cleaning device.
The body unit comprises a shell body defining a vacuum cavity, a central shaft and a carrying platform capable of rotating at an equal angular rate by taking the central shaft as an axis, wherein the carrying platform is arranged in the vacuum cavity and is provided with a plurality of filling seats which are arranged around the central shaft and suitable for being used for arranging the substrate.
The at least one sputtering device is arranged on the shell and faces the filling seat, and is suitable for plating elements on the surface of the substrate.
The cleaning device is arranged on the body unit and is suitable for performing pre-treatment on the substrate which is not subjected to film coating so as to reduce impurities or pollution on the substrate.
The vacuum coating system with the cleaning device is characterized in that the cleaning device is a plasma cleaning device.
According to the vacuum coating system with the cleaning device, the cleaning device is arranged on the shell, is positioned in the vacuum cavity and is suitable for performing pre-treatment on the substrate arranged on the filling seat.
The vacuum coating system with the cleaning device of the invention, the shell defines an inlet and an outlet suitable for the substrate to enter and exit, and the cleaning device is positioned adjacent to the inlet and the outlet.
The vacuum coating system with the cleaning device comprises a shell, an inlet and an outlet, wherein the shell defines the inlet and the outlet, the inlet and the outlet are suitable for the substrate to enter and exit, the body unit further comprises an external shell connected with the shell, a buffer door capable of openably closing the inlet and the outlet, and an unloading module arranged in the external shell, the external shell defines a feeding space suitable for placing the substrate which is not subjected to coating, a discharging space suitable for placing the substrate which is subjected to coating, and a buffer space communicating the feeding space, the discharging space and the inlet and the outlet, the unloading module is arranged in the buffer space, is suitable for placing the substrate in the feeding space on the filling seat, and is suitable for placing the substrate on the filling seat into the discharging space.
According to the vacuum coating system with the cleaning device, the outer shell further defines a cleaning space communicated with the feeding space, and the cleaning device is arranged in the cleaning space and is suitable for performing pretreatment on the substrate closest to the cleaning space in the feeding space.
According to the vacuum coating system with the cleaning device, the unloading module is a mechanical arm.
According to the vacuum coating system with the cleaning device, the carrying platform is made of stainless steel, titanium, molybdenum metal or aluminum alloy and is polygonal.
The vacuum coating system with the cleaning device comprises at least one sputtering device and a cleaning device, wherein the sputtering device is provided with a sputtering source, an anode suitable for being electrically connected with the substrate and a cathode electrically connected with the sputtering source.
The invention has the beneficial effects that: the filling seat surrounding the central shaft is arranged for the substrate to be arranged, the carrying platform drives the filling seat and the substrate to rotate at the equal angular rate by taking the central shaft as the axis, so that the substrate can circulate in a working section of the sputtering device through rotation to achieve the effect of uniform coating, and the cleaning device is arranged for cleaning and other necessary pre-treatment on the substrate, so that the coating adhesive force of the substrate is improved, and the effect of improving the yield is achieved.
Drawings
FIG. 1 is an exploded perspective view of a first embodiment of a vacuum coating system having a cleaning apparatus according to the present invention;
FIG. 2 is a partial cross-sectional view of the first embodiment;
FIG. 3 is a partial cross-sectional view of a second embodiment of a vacuum coating system having a cleaning apparatus of the present invention;
FIG. 4 is a photograph of a conventional non-cleaned coated substrate after a hundred-grid test;
FIGS. 5, 6 and 7 are photographs of the front, back and hundreds of squares of a substrate coated with a film according to the present invention;
FIGS. 8, 9 and 10 are photographs of the front, back and hundreds of squares of the coated substrate cleaned under the second test condition according to the present invention;
FIGS. 11, 12 and 13 are photographs of the front, back and hundreds of squares of a coated substrate cleaned under a third test condition according to the present invention; and
fig. 14, 15 and 16 are photographs of the front surface, the back surface and the photos after the hundred-grid test of the coated substrate cleaned under the fourth test condition according to the present invention.
Detailed Description
Referring to fig. 1 and 2, the first embodiment of the vacuum coating system with a cleaning device according to the present invention is suitable for coating a plurality of substrates 7, and includes a main body unit 1, a plurality of sputtering devices 4, and a cleaning device 5. In this first embodiment, a blocking device 6 can also be included. The number of the sputtering devices 4 can be one or any number, and is not limited to this.
The body unit 1 comprises a body device 2 and a feeding and discharging device 3. The body device 2 includes a housing 21 defining a vacuum chamber 22, a central shaft 23, and a stage 24 capable of rotating around the central shaft 23, wherein the stage 24 is disposed in the vacuum chamber 22 and includes a plurality of filling seats 241 disposed around the central shaft 23 and adapted to accommodate the substrate 7.
The housing 21 has an annular wall 211, an upper cover 212, and an access opening 213, and the annular wall 211 and the upper cover 212 together define the vacuum chamber 22, and cooperate with the carrier 24 to define a working space 221 in the vacuum chamber 22. The inlet and outlet 213 is located on the wall 211 and is suitable for the substrate 7 to enter and exit.
The stage 24 has a polygonal tubular structure and defines each side as a side 242. The material of the carrying platform 24 is one of stainless steel, titanium, molybdenum metal or aluminum alloy. The carrier 24 is adapted to carry the substrate 7. The stage 24 is capable of rotating at an angular rate, not limited to clockwise or counterclockwise rotation, between 5rpm and 60 rpm.
The filling seat 241 is formed on the side surface 242 and faces the sputtering device 4. The area of each of the filling bases 241 is substantially larger than that of each of the substrates 7, so that each of the substrates 7 can be reliably mounted on the stage 24.
The feeding and discharging device 3 has an outer casing 31 connected to the housing 21, a buffer door 32 openably closing the inlet and outlet 213, a feeding door 33 openably installed on the left side of the outer casing 31 in fig. 2, a discharging door 34 openably installed on the right side of the outer casing 31 in fig. 2, and an unloading module 35 installed in the outer casing 31.
The outer shell 31 defines a feeding space 311 for placing the substrate 7 which is not coated, a discharging space 312 for placing the substrate 7 which is coated, and a communicating space for communicating the feeding spaceThe chamber 311, the discharge space 312, and the buffer space 313 of the inlet/outlet 213. When the buffer door 32 is opened and the feeding door 33 and the discharging door 34 are closed, the pressure value in the external shell 31 is about 10-3Torr (Torr).
The buffer door 32 can move left and right in fig. 2 to open or close the port 213, and the buffer door 32 is used for closing the port 213 to maintain the vacuum pressure in the vacuum chamber 22.
The feed gate 33 and the discharge gate 34 are each used for the entry and exit of one trolley 8 carrying the substrate 7. The feeding door 33 is adapted to allow the trolley 8 carrying the substrate 7 that is not coated to enter the feeding space 311, and to open the feeding door 33 to replace a new trolley 8 loaded with the substrate 7 after the substrate 7 on the trolley 8 is used up. The discharge door 34 is adapted to allow the carriage 8 carrying the substrate 7 after coating to be removed from the discharge space 312 and replaced with an empty carriage 8.
A translation module 81 and a pushing module 82 are generally disposed on the trolley 8, the translation module 81 is adapted to move the substrate 7 in the up-down direction of fig. 2, and the pushing module 82 is adapted to push the substrate 7 at the end outwards or receive the substrate 7 and place the substrate on the translation module 81. The details of the expansion of the trolley 8 are not further elaborated since a person skilled in the art can deduce the details from the above description.
The unloading module 35 is disposed in the buffer space 313. The unloading module 35 has a receiving platform 351 adapted to receive the substrate 7, and an unloading member 352 disposed on the housing 31 and connected to the receiving platform 351. The unloading member 352 is adapted to place the substrate 7, which is not coated, in the loading space 311 on the filling stage 241 in conjunction with the receiving stage 351, and to place the substrate 7, which is coated on the filling stage 241, on the discharging space 312. The unloading module 35 can be implemented by using a robot arm, a slide rail, a bracket, or other mechanisms, and the details of the unloading module 35 can be derived by those skilled in the art from the above description, so that the description is omitted.
The sputtering device 4 is disposed in the housing 21 and faces the filling seat 241, and is adapted to plate an element on the surface of the substrate 7. In the first embodiment, the sputtering apparatus 4 is spaced from the stage 24 and is disposed around the stage 24 on the surrounding wall 211, and the coating direction is toward the central axis 23.
In the first embodiment, the sputtering apparatus 4 is used for sputtering a coating film against electromagnetic interference (hereinafter, referred to as EMI) on the substrate 7, and each has a target assembly 41 with at least one target, a sputtering source 42 for mounting the corresponding target assembly 41, and an air valve 43. Each sputtering source 42 is electrically connected to the cathode of the corresponding sputtering apparatus 4, and the substrate 7 disposed on each filling seat 241 of the carrier 24 is electrically connected to the anode of the corresponding sputtering apparatus 4 or grounded. The gas valve 43 is configured to output an inert gas (e.g., argon), so that the inert gas is cracked into a plasma (plasma) by a high voltage provided by each sputtering source 42 and impacts the target of each target assembly 41, so that the target of each target assembly 41 is sputtered from target particles and is cracked into ions by each plasma to be deposited on the corresponding substrate 7 when flying to the corresponding substrate 7; wherein the coating film deposited on each substrate 7 has the elements of the target of the respective corresponding target assembly 41. In the first embodiment, the EMI resistant coating is sputtered on each substrate 7, and the target material can be conventional TiN, NiCr or Al2O3And materials for improving adhesion, and materials with high conductivity coefficient such as Cu and Ag, and SUS (stainless steel) targets can be used. Therefore, when each target assembly 41 is a plurality of targets, one multilayer film can be deposited on each substrate 7.
The cleaning device 5 is disposed in the housing 21 adjacent to the inlet/outlet 213 and located in the vacuum chamber 22. The cleaning device 5 is a plasma (plasma) cleaning device, and is adapted to perform a pre-treatment on the substrate 7 without being coated, so as to reduce impurities or contamination on the substrate 7.
The blocking device 6 includes a plurality of vacuum tubes 61 surrounding the surrounding wall 211 and adjacent to the sputtering device 4, and a plurality of sputtering masks 62 located in the vacuum chamber 22, wherein the vacuum tubes 61 are communicated with the vacuum chamber 22, and continuously operate to evacuate during the coating of the substrate 7, so that the pressure value corresponding to each target assembly 41 in the vacuum chamber 22 is constantly higher than the pressure value of the vacuum tubes 61 at both sides thereof, and thereby a pressure difference is formed, and target particles and ions thereof which cannot be deposited on each substrate 7 can be discharged from the vacuum chamber 22 through the vacuum tubes 61 by the pressure difference.
Each sputtering mask 62 is disposed on the surrounding wall 211 and masks the corresponding sputtering device 4, each sputtering mask 62 has three mounting holes 621 adjacent to each other, and the mounting holes 621 are disposed corresponding to the sputtering devices 4 respectively. Therefore, the moving range of the target particles and the ions formed by the cracked target particles between the sputtering devices 4 in the vacuum chamber 22 can be limited, and the ions fly to the corresponding substrates 7 through the mounting holes 621, so as to avoid contamination to other sputtering sources 42 or the surrounding walls 211.
In the implementation of the present invention, the trolley 8 carrying the substrate 7 without being coated is moved into the feeding space 311 through the feeding door 33, and the unloaded trolley 8 is placed in the discharging space 312 through the discharging door 34. Then, the feeding door 33 and the discharging door 34 are closed, the buffer door 32 is opened, the unloading module 35 moves the substrate 7 in the feeding space 311 without being coated into the filling seats 241, at this time, the carrier 24 stops for a fixed time after each filling seat 241 faces the unloading module 35 in cooperation with each fixed angle of rotation, so that the unloading module 35 can place the substrate 7 well, and the buffer door 32 is closed until the substrate 7 is placed on each filling seat 241. Then, the cleaning device 5 is started to clean each substrate 7 in sequence, and at this time, the carrier 24 is also stopped for a predetermined time after each filling seat 241 is directed to the cleaning device 5 with every fixed rotation angle, so that the cleaning device 5 can clean each substrate 7 well.
After the cleaning is completed, the carrier 24 is first started to rotate to make each filling seat 241 drive each substrate 7 correspondingly arranged around the central shaft 23 to rotate at a required rotation speed, so that each substrate 7 circulates in the annular working space 221 before the sputtering device 4, and then the vacuum tube 61 is started to make the pressure value of the vacuum chamber 22 reach a background pressure (10)-5～10-6Torr (Torr)); then, argon gas is introduced into the vacuum chamber 22 to make the pressure value of the vacuum chamber 22 reach a working pressure (10)-2～10-3Torr) and a high voltage is provided at each sputtering source 42 to cause the argon to split into the aforementioned plasma to bombard the target of the respective target assembly 41. The targets are sputtered to target particles and split into ions, whereby the target particles and the ions sputtered from the targets of the target assemblies 41 are sputtered onto the substrates 7. After the coating is completed, the carrier 24 stops rotating, the buffer door 32 is opened again, the unloading module 35 first unloads a substrate 7 that has been coated on the corresponding filling seat 241 and sends the substrate 7 into the trolley 8 in the discharging space 312, then a substrate 7 that has not been coated is taken from the feeding space 311 and moved into the empty filling seat 241 after being unloaded, then the carrier 24 rotates by a fixed angle and stops, the unloading module 35 continues to unload the substrate 7 that has been coated on the next corresponding filling seat 241, and then the substrate 7 that has not been coated is placed on the empty filling seat 241. This is continued until all the coated substrates 7 have been completely unloaded from the trolleys 8 in the discharge space 312 and all the filling seats 241 have been replaced with uncoated substrates 7, and then the discharge door 34 is opened (at this time, the buffer door 32 is closed), and the trolleys 8 in the discharge space 312 are replaced with empty trolleys 8.
From the above description, the advantages of the foregoing first embodiment can be summarized as follows:
1. by arranging the sputtering device 4 in a manner of facing the filling base 241, and arranging the carrying table 24 capable of rotating at an equal angular rate by taking the central shaft 23 as an axis and a plurality of filling bases 241 arranged around the central shaft 23 in a matching manner, the substrate 7 can be driven by the rotation of the carrying table 24 to circulate in the working section of the sputtering device 4 at an equal speed, so as to achieve the effect of making the coating thickness of the substrate 7 uniform.
In addition, the cleaning device 5 is used for cleaning the substrate 7 and other necessary pre-treatments to reduce impurities or pollution on the substrate 7, so that the coating adhesion of the substrate 7 can be improved, and the effect of improving the yield is achieved.
Referring to fig. 4, fig. 4 is a photograph of the conventional non-cleaned coated substrate 7 after a cross-cut test, and it can be clearly seen from the photograph that the coating on the left side of fig. 4 is torn off by the adhesive tape to reveal the bottom color of the substrate 7, which shows that the adhesion of the coating is not good.
Referring to fig. 5 to 16 and table 1 below, it can be clearly seen from the photos after the baige test in fig. 7, 10, 13 and 16 that the left and right sides of the cleaned coated substrate 7 have no obvious difference after the baige test tape is peeled off, which indicates that the coating is still well attached to the substrate 7, and it is proved that the present invention can actually and effectively improve the adhesion of the coating on the substrate 7. The column of pretreatment in table 1 indicates the plasma power used by the cleaning apparatus 5.
TABLE 1
2. Through will belt cleaning device 5 set up in casing 21 just is located in vacuum cavity 22, can make full use of the space in the vacuum cavity 22 to further retrench the shared volume of external shell 31 reaches the effect that reduces whole space.
3. By providing the barrier device 6, it is possible to discharge target particles and ions thereof that have not been deposited on each substrate 7, and to limit the range of sputtering of the target particles and ions thereof, thereby preventing the target particles and ions formed by the target particles having been separated from contaminating the respective sputtering source 42 or the surrounding wall 211.
Referring to fig. 3, a second embodiment of the vacuum coating system with a cleaning device according to the present invention is similar to the first embodiment, and the difference between the second embodiment and the first embodiment is:
the outer shell 31 also defines a cleaning space 314 communicating with the feeding space 311. The cleaning device 5 is disposed in the cleaning space 314 and adapted to perform a pre-treatment on the substrate 7 in the feed space 311 closest to the cleaning space 314.
In this way, the second embodiment can achieve the same effects as the first embodiment, such as uniform coating thickness, improved yield, and prevention of contamination of the sputtering source 42, and the cleaning device 5 is separated from the vacuum chamber 22 and disposed in the external housing 31, so that not only the maintenance operation of the cleaning device 5 can be facilitated, but also the substrate 7 that is not coated can be cleaned first by using other operation time (for example, when the unloading module 35 unloads the substrate 7 that has been coated to the discharge space 312), so as to achieve the effect of further saving time.
The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and the invention is still within the scope of the present invention by simple equivalent changes and modifications made according to the claims and the contents of the specification.
Claims (9)
1. The utility model provides a vacuum coating system with belt cleaning device, is applicable to the coating film of several base plates which characterized in that:
the vacuum coating system comprises a body unit, at least one sputtering device and a cleaning device;
the body unit comprises a shell body defining a vacuum cavity, a central shaft and a carrying platform capable of rotating at an equal angular rate by taking the central shaft as an axis, wherein the carrying platform is arranged in the vacuum cavity and is provided with a plurality of filling seats which are arranged around the central shaft and suitable for being used for arranging the substrate;
the at least one sputtering device is arranged on the shell and faces the filling seat, and is suitable for plating elements on the surface of the substrate;
the cleaning device is arranged on the body unit and is suitable for performing pre-treatment on the substrate which is not subjected to film coating so as to reduce impurities or pollution on the substrate.
2. The vacuum coating system with a cleaning apparatus according to claim 1, wherein: the cleaning device is a plasma cleaning device.
3. The vacuum coating system with a cleaning apparatus according to claim 1, wherein: the cleaning device is arranged on the shell, is positioned in the vacuum cavity and is suitable for performing pre-treatment on the substrate arranged on the filling seat.
4. The vacuum coating system with a cleaning apparatus according to claim 3, wherein: the housing defines an access opening adapted for access to the substrate, and the cleaning device is located adjacent the access opening.
5. The vacuum coating system with a cleaning apparatus according to claim 1, wherein: the body unit further comprises an external shell connected with the shell, a buffer door capable of openably closing the inlet and the outlet, and an unloading module arranged in the external shell, wherein the external shell defines a feeding space suitable for placing substrates which are not subjected to film coating, a discharging space suitable for placing the substrates which are subjected to film coating, and a buffer space communicating the feeding space, the discharging space and the inlet and the outlet, and the unloading module is arranged in the buffer space, is suitable for placing the substrates in the feeding space in the filling seat and is suitable for placing the substrates on the filling seat into the discharging space.
6. The vacuum plating system with a cleaning device according to claim 5, wherein: the outer shell further defines a cleaning space communicated with the feeding space, and the cleaning device is arranged in the cleaning space and is suitable for performing pre-treatment on the substrate closest to the cleaning space in the feeding space.
7. The vacuum plating system with a cleaning device according to claim 5, wherein: the unloading module is a mechanical arm.
8. The vacuum coating system with a cleaning apparatus according to claim 1, wherein: the carrying platform is made of stainless steel, titanium, molybdenum metal or aluminum alloy and is polygonal.
9. The vacuum coating system with a cleaning apparatus according to claim 1, wherein: the at least one sputtering device is provided with a sputtering source, an anode suitable for being electrically connected with the substrate, and a cathode electrically connected with the sputtering source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110946645.4A CN113652665A (en) | 2021-08-18 | 2021-08-18 | Vacuum coating system with cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110946645.4A CN113652665A (en) | 2021-08-18 | 2021-08-18 | Vacuum coating system with cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113652665A true CN113652665A (en) | 2021-11-16 |
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| CN202110946645.4A Pending CN113652665A (en) | 2021-08-18 | 2021-08-18 | Vacuum coating system with cleaning device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104372298A (en) * | 2014-11-13 | 2015-02-25 | 邵海平 | High-energy ion beam substrate treatment and vacuum vapor plating device and method |
| CN211689220U (en) * | 2020-03-10 | 2020-10-16 | 友威科技股份有限公司 | Coating system with bidirectional loading track |
| CN212533113U (en) * | 2020-05-29 | 2021-02-12 | 深圳市信濠光电科技股份有限公司 | Vacuum coating machine |
| CN112481595A (en) * | 2020-11-20 | 2021-03-12 | 中国电子科技集团公司第四十八研究所 | Ion beam sputtering coating equipment |
-
2021
- 2021-08-18 CN CN202110946645.4A patent/CN113652665A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104372298A (en) * | 2014-11-13 | 2015-02-25 | 邵海平 | High-energy ion beam substrate treatment and vacuum vapor plating device and method |
| CN211689220U (en) * | 2020-03-10 | 2020-10-16 | 友威科技股份有限公司 | Coating system with bidirectional loading track |
| CN212533113U (en) * | 2020-05-29 | 2021-02-12 | 深圳市信濠光电科技股份有限公司 | Vacuum coating machine |
| CN112481595A (en) * | 2020-11-20 | 2021-03-12 | 中国电子科技集团公司第四十八研究所 | Ion beam sputtering coating equipment |
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Application publication date: 20211116 |