CN113635467A

CN113635467A - Semiconductor production device

Info

Publication number: CN113635467A
Application number: CN202111197240.1A
Authority: CN
Inventors: 詹华贵
Original assignee: Jiangsu Yujing Photoelectric Technology Co ltd
Current assignee: Jiangsu Yujing Photoelectric Technology Co ltd
Priority date: 2021-10-14
Filing date: 2021-10-14
Publication date: 2021-11-12
Anticipated expiration: 2041-10-14
Also published as: CN113635467B

Abstract

The invention relates to the technical field of semiconductor processing, and discloses a semiconductor production device, which solves the problem that the semiconductor is deviated due to unstable pressing in the cutting process, so that the cutting quality of the semiconductor is low; the semiconductor cutting device adopts clamping and fixing of the semiconductor in different directions, improves the cutting stability of the semiconductor, can avoid the displacement phenomenon of the semiconductor in the cutting process, and further improves the cutting quality of the semiconductor.

Description

Semiconductor production device

Technical Field

The invention belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor production device.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion and the like, and the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, so that most of electronic products such as computers, mobile phones or digital recorders are closely related to the semiconductor, and the semiconductor is generally required to be cut in the processing process.

Because the semiconductor is difficult to fix in the cutting process at present, the semiconductor is easy to deviate in the cutting process, so that the cutting of the semiconductor is unstable, and the cutting quality is low.

Disclosure of Invention

In view of the above situation, in order to overcome the defects in the prior art, the present invention provides a semiconductor manufacturing apparatus, which effectively solves the problem of low semiconductor cutting quality caused by the fact that the semiconductor is not stably pressed during the cutting process in the prior art and the deviation occurs.

In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor production device comprises a base, wherein support columns are symmetrically arranged at the bottom end of the base, a support frame is arranged at the top end of the base, a cutting mechanism is arranged at the inner top end of the support frame, a support table located below the cutting mechanism is arranged at the top end of the base, an installation seat is arranged in the middle of the top end of the support table, an operation table is arranged at the top end of the installation seat, a metal placing plate is arranged at the top end of the operation table, sliding plates are symmetrically arranged on two sides of the installation seat, gear teeth are arranged on one side of the bottom end of each sliding plate at equal intervals, through grooves are formed in the sliding plates, insertion rods penetrating into the through grooves are symmetrically connected to two sides of the installation seat, a moving cylinder is arranged at the top ends of the two sliding plates, clamping rods located on two sides of the metal placing plate are elastically penetrated and inserted into the moving cylinder, the two sliding plates are connected through clamping mechanisms, and an adsorption mechanism is arranged inside the support table;

the clamping mechanism comprises a first motor, a first rotating shaft, a second rotating shaft, a third rotating shaft, a first gear, a second gear, a third gear, a first belt pulley, a second belt pulley and a conveying belt, the first motor is installed on one side of the supporting table, the first rotating shaft is installed on the other side of the supporting table, the second rotating shaft is connected with an output shaft of the first motor, one end of the second rotating shaft is located on one side of the first rotating shaft, the third rotating shaft connected with the outer wall of the supporting table is arranged on one side, away from the first rotating shaft and the second rotating shaft, the first rotating shaft is connected with the first gear, the second rotating shaft is connected with the first gear in a meshed mode, the first belt pulley is sleeved on the first rotating shaft and the second rotating shaft, a third gear connected with the gear teeth in a meshed mode and a second belt pulley located on one side of the third gear are arranged on two third rotating shafts, and the two adjacent first belt pulleys are connected with the second belt pulley through the conveying belt.

Preferably, one side of the supporting table is provided with a mounting plate, and the sliding plate is provided with a second groove which is in sliding connection with the mounting plate.

Preferably, the middle positions of the two sides of the operating platform are provided with first grooves sleeved outside the moving barrel, the clamping rods are of T-shaped structures, and the bottom ends of the clamping rods are connected with the inner bottom end of the moving barrel through first springs.

Preferably, the metal placing plate is of a concentric circle structure, the top end of the operating platform is provided with an air vent located at the center of the metal placing plate, the supporting platform is internally provided with a containing groove, and the mounting seat is internally provided with a communicating groove communicated with the containing groove and the air vent.

Preferably, the adsorption apparatus includes gear four, pinion rack, piston plate, stabilizer one, dead lever and movable groove, is connected with the gear four that is located the holding tank inside on the rotation axis two, and the inside swing joint in intercommunication groove has the piston plate, and bottom one side of piston plate is equipped with the pinion rack of being connected with four meshing of gear, and the movable groove has been seted up to the inner bottom of pinion rack, and the inside interlude in movable groove has the dead lever of being connected with the inner bottom of holding tank, and the bottom opposite side of piston plate is equipped with the stabilizer one of being connected with the inner bottom of holding tank.

Preferably, the cutting mechanism consists of a fixed plate, a pressing unit, a cutting unit and a pushing unit, the fixed plate is fixedly arranged at the inner top end of the support frame, the pressing unit and the pushing unit are arranged at the bottom end of the fixed plate, the cutting unit is arranged below the pressing unit, the pressing unit comprises a motor II, an internal thread cylinder I, a stabilizing piece II, a T-shaped screw rod, a connecting seat, a groove, a placing groove I and a pressing plate, the motor II is installed at the bottom end of a fixing plate, an output shaft of the motor II is connected with the internal thread cylinder I, the internal thread of the internal thread cylinder I is connected with the T-shaped screw rod, the stabilizing piece II is symmetrically arranged at the two sides of the bottom end of the internal thread cylinder I, the two stabilizing pieces II are connected through the connecting seat, the placing groove I is formed in the inner bottom end of the connecting seat, the groove communicated with the placing groove I is formed in the top end of the connecting seat, and the bottom end of the T-shaped screw rod penetrates through the inside of the groove and is connected with the pressing plate located inside the placing groove I.

Preferably, clamping grooves are symmetrically formed in two sides of the T-shaped screw, and clamping blocks in sliding connection with the clamping grooves are arranged on two sides of the inner wall of the groove.

Preferably, the pushing unit comprises a fifth gear, a rotating shaft, a sixth gear, a second internal thread cylinder, a thread block and a push rod, the fifth gear is installed outside the first internal thread cylinder, the rotating shaft is installed at the bottom end of the fixing plate and located on one side of the second motor, the sixth gear meshed with the fifth gear is arranged on the rotating shaft, the thread block is arranged at the bottom end of the rotating shaft, the second internal thread cylinder is connected to the thread block, and the push rod connected with the connecting seat is arranged on one side of the second internal thread cylinder.

Preferably, the cutting unit comprises a second placing groove, a cutting knife and an electric telescopic rod, the second placing groove is arranged at the bottom end of the connecting seat, the second placing groove is located outside the first placing groove, the cutting knife is movably connected inside the second placing groove, the cutting knife is of a rectangular structure, and the top end of the cutting knife is connected with the inner top end of the second placing groove through the electric telescopic rod.

Preferably, stabilizing member one and stabilizing member two all include female pipe, spring two and son pole, and the bottom both sides of an internal thread section of thick bamboo one and bottom one side of piston plate all are connected with female pipe, and the inside of female pipe has all alternate the son pole, and through two elastic connection of spring between female pipe and the son pole, and the son pole is connected with the top of connecting seat and the interior bottom of holding tank respectively.

Compared with the prior art, the invention has the beneficial effects that:

(1) during work, through the supporting table, the mounting seat, the operating table, the metal placing plate, the first groove, the inserting rod, the through groove, the sliding plate, the moving cylinder, the clamping rod, the clamping mechanism, the adsorption mechanism and the gear teeth, the side wall clamping and the top pressing of the semiconductor and the adsorption of the bottom of the semiconductor are conveniently carried out according to the semiconductor with different lengths, and the design of the cutting mechanism is matched, so that the top pressing of the semiconductor is conveniently carried out, and the cutting of the semiconductor is simultaneously realized;

(2) through the design of the motor I, the rotating shaft II, the rotating shaft III, the gear I, the gear II, the gear III, the belt pulley I, the belt pulley II and the conveying belt, the side walls of the semiconductors with different lengths can be clamped and fixed conveniently, and the flexibility of clamping the semiconductors is improved;

(3) through the design of the gear IV, the toothed plate, the piston plate, the stabilizing piece I, the fixed rod and the movable groove, the vacuum adsorption of the bottom of the semiconductor is realized, so that the fixation of the bottom of the semiconductor is improved, and the stability of the semiconductor cutting is high;

(4) through the design of the motor II, the internal thread cylinder I, the stabilizing piece II, the T-shaped screw rod, the connecting seat, the groove, the placing groove I and the pressing plate, the pressing plate can conveniently press the center of the top of the semiconductor, and the stability of the semiconductor cutting is effectively improved;

(5) through the design of five, axis of rotation, six, the internal thread section of thick bamboo two, screw block and push rod of gear, be convenient for realize that the connecting seat presses on the semiconductor top to the design of cooperation standing groove two, cutting knife and electric telescopic handle is convenient for carry out the rectangle cutting to the semiconductor, the effectual cutting quality that has improved the semiconductor.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.

In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of FIG. 1 according to the present invention;

FIG. 3 is a schematic view of the construction of the skateboard of the present invention;

FIG. 4 is a schematic front view of the clamping mechanism of the present invention;

FIG. 5 is a schematic top view of the clamping mechanism of the present invention;

FIG. 6 is a schematic view of the adsorption mechanism of the present invention;

FIG. 7 is an enlarged view of the structure of FIG. 2 at A according to the present invention;

FIG. 8 is a schematic view of the cutting mechanism of the present invention;

in the figure: 1. a base; 2. a support pillar; 3. a support frame; 4. a cutting mechanism; 5. a support table; 6. a mounting seat; 7. an operation table; 8. a metal placement plate; 9. a first groove; 10. inserting a rod; 11. a through groove; 12. a slide plate; 13. moving the drum; 14. a clamping rod; 15. a clamping mechanism; 16. an adsorption mechanism; 17. gear teeth; 18. a second groove; 19. mounting a plate; 20. a first motor; 21. a first rotating shaft; 22. a second rotating shaft; 23. a third rotating shaft; 24. a first gear; 25. a second gear; 26. a third gear; 27. a first belt pulley; 28. a second belt pulley; 29. a conveyor belt; 30. a vent hole; 31. accommodating grooves; 32. a communicating groove; 33. a fourth gear; 34. a toothed plate; 35. a piston plate; 36. a first stabilizing piece; 37. fixing the rod; 38. a movable groove; 39. a fixing plate; 40. a second motor; 41. a first internal thread cylinder; 42. a second stabilizing member; 43. a T-shaped screw; 44. a connecting seat; 45. grooving; 46. placing the first groove; 47. a pressing plate; 48. a second placing groove; 49. a cutting knife; 50. an electric telescopic rod; 51. a fifth gear; 52. a rotating shaft; 53. a sixth gear; 54. a second internal thread cylinder; 55. a thread block; 56. a push rod; 57. a card slot; 58. and (7) clamping blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the first embodiment, as shown in fig. 1 to 8, the semiconductor clamping device comprises a base 1, wherein support columns 2 are symmetrically arranged at the bottom end of the base 1, a support frame 3 is arranged at the top end of the base 1, a cutting mechanism 4 is arranged at the inner top end of the support frame 3, a support table 5 is arranged at the top end of the base 1 and is positioned below the cutting mechanism 4, a mounting seat 6 is arranged at the middle position of the top end of the support table 5, an operation table 7 is arranged at the top end of the mounting seat 6, a metal placing plate 8 is arranged at the top end of the operation table 7, through the design of the metal placing plate 8, convenience is brought to the semiconductor cutting at the top end of the metal placing plate 8, further protection of the operation table 7 can be realized, sliding plates 12 are symmetrically arranged at two sides of the mounting seat 6, gear teeth 17 are equidistantly arranged on one side of the bottom end of the sliding plates 12, through the design of the gear teeth 17, convenience is provided for the adjustment of the two sliding plates 12, further, the two clamping rods 14 can be used for clamping and fixing semiconductors with different lengths, stability is improved for the cutting of semiconductors, and further cutting quality can be improved, through grooves 11 are formed in the sliding plates 12, insertion rods 10 inserted into the through grooves 11 are symmetrically connected to two sides of the mounting seat 6, moving cylinders 13 are arranged at the top ends of the two sliding plates 12, clamping rods 14 located on two sides of the metal placing plate 8 are elastically inserted into the moving cylinders 13, the two sliding plates 12 are connected through clamping mechanisms 15, an adsorption mechanism 16 is arranged inside the supporting table 5, the semiconductors can be conveniently adsorbed on the metal placing plate 8 through the design of the adsorption mechanism 16, the bottom of the semiconductors can be fixed, and convenience is brought to the later-stage cutting of the semiconductors;

the clamping mechanism 15 comprises a motor I20, a rotating shaft I21, a rotating shaft II 22, a rotating shaft III 23, a gear I24, a gear II 25, a gear III 26, a belt pulley I27, a belt pulley II 28 and a conveying belt 29, wherein the motor I20 is installed on one side of the support platform 5, the rotating shaft I21 is installed on the other side of the support platform 5, the rotating shaft II 22 is connected with an output shaft of the motor I20, one end of the rotating shaft II 22 is located on one side of the rotating shaft I21, the rotating shaft III 23 connected with the outer wall of the support platform 5 is arranged on the side, away from the rotating shaft I21 and the rotating shaft II 22, of the rotating shaft I22, the gear II 25 connected with the gear I24 in a meshing mode is arranged on the rotating shaft I21, the belt pulley I27 is sleeved on the rotating shaft I21 and the rotating shaft II 22, the gear III 26 connected with the gear teeth 17 in a meshing mode and the belt pulley II 28 located on one side of the gear III 26 are arranged on the two rotating shafts III 23, two adjacent pulleys 27 and 28 are connected through a transmission belt 29;

by starting the first motor 20, the first motor 20 drives the second rotating shaft 22 to rotate, the second rotating shaft 22 drives the first gear 24 and one of the first belt pulleys 27 to rotate, further, the second gear 25 can be rotated through the meshing relationship between the first gear 24 and the second gear 25, further, the first rotating shaft 21 rotates, the first rotating shaft 21 drives the first belt pulley 27 to rotate, then, the first belt pulley 27 is connected with the second belt pulley 28 through the transmission belt 29, the third rotating shaft 23 can be rotated, further, the third rotating shaft 23 drives the third gear 26 to rotate, through the meshing relationship between the third gear 26 and the gear teeth 17, the two sliding plates 12 can relatively and horizontally move, the sliding plates 12 can slide on the inserted link 10, meanwhile, the sliding plates 12 can drive the moving cylinder 13 to move, the moving cylinder 13 drives the clamping rod 14 to move, further, the relative movement of the clamping rod 14 can be realized, and further, the clamping rod 14 can be convenient to clamp the side wall of the semiconductor, simultaneously upwards pull clamping rod 14, make the first extension of spring, and then can make clamping rod 14 shift up to make clamping rod 14's top be located the top of semiconductor, under the reverse action of spring one, realize clamping rod 14 and to the pressing of semiconductor, and then can realize the lateral wall and the top centre gripping of semiconductor, improved the stability of laying of semiconductor, and then provide convenience for the cutting of semiconductor.

Embodiment two, on the basis of embodiment one, as shown in fig. 3, 4 and 5, one side of the supporting table 5 is provided with a mounting plate 19, the sliding plate 12 is provided with two grooves 18 slidably connected with the mounting plate 19, the sliding plate 12 can slide on the mounting plate 19 conveniently through the design of the mounting plate 19 and the two grooves 18, the moving stability of the sliding plate 12 is effectively improved, the middle positions of the two sides of the operating platform 7 are provided with first grooves 9 sleeved outside the moving cylinder 13, the moving cylinder 13 can be moved to the two sides of the metal placing plate 8 conveniently through the design of the first grooves 9, the semiconductor on the top of the metal placing plate 8 can be clamped conveniently, the clamping rod 14 is of a T-shaped structure, the bottom end of the clamping rod 14 is connected with the inner bottom end of the moving cylinder 13 through a first spring, the clamping rod 14 is connected with the moving cylinder 13 through a first spring, and the height adjustment of the clamping rod 14 is further facilitated, and then conveniently make the top of clamping rod 14 press to the top of semiconductor, through the counter force of spring one, can realize the top centre gripping to the semiconductor.

In the third embodiment, based on the first embodiment, as shown in fig. 1, 2, 5, 6 and 7, the metal placing plate 8 is a concentric structure, the top end of the operating platform 7 is provided with a vent hole 30 located at the center of the metal placing plate 8, the supporting platform 5 is provided with an accommodating groove 31 inside, the mounting base 6 is provided with a communicating groove 32 communicating with the accommodating groove 31 and the vent hole 30 inside, the adsorbing mechanism 16 comprises a gear four 33, a toothed plate 34, a piston plate 35, a first stabilizing part 36, a fixed rod 37 and a movable groove 38, the rotating shaft two 22 is connected with the gear four 33 located inside the accommodating groove 31, the communicating groove 32 is movably connected with the piston plate 35 inside, the toothed plate 34 meshed with the gear four 33 is arranged on one side of the bottom end of the piston plate 35, the inner bottom end of the toothed plate 34 is provided with the movable groove 38, the fixed rod 37 connected with the inner bottom end of the accommodating groove 31 is inserted into the movable groove 38, the other side of the bottom end of the piston plate 35 is provided with a first stabilizing part 36 connected with the bottom end of the accommodating groove 31;

when the first motor 20 rotates to enable the second rotating shaft 22 to rotate, the second rotating shaft 22 enables the fourth gear 33 to rotate, the height adjustment of the toothed plate 34 can be achieved through the meshing relationship between the fourth gear 33 and the toothed plate 34, and then the toothed plate 34 can be lifted up and down outside the fixed rod 37, the toothed plate 34 can drive the piston plate 35 to be lifted up and down inside the communication groove 32, and further the air outlet and air suction operations of the position of the vent hole 30 can be achieved, when the vent hole 30 is exhausted, the toothed plate 34 is moved upwards, and then the toothed plate 34 pushes the piston plate 35 to move upwards, so that the piston plate 35 can exhaust the air inside the communication groove 32 through the vent hole 30, and then a semiconductor is placed at the top end of the metal placing plate 8, at this time, the first motor 20 is started to rotate reversely, the second rotating shaft 22 drives the fourth gear 33 to rotate reversely, and then the toothed plate 34 can move downwards, the toothed plate 34 drives the piston plate 35 to move downwards, and the piston plate 35 moves downwards to enable the inside of the communication groove 32 to be in a vacuum state, and then realize the absorption to the semiconductor, can improve the stability of placing of semiconductor, for later stage semiconductor cutting improves the quality, can avoid the semiconductor to appear shifting and cause the semiconductor cutting quality low in the cutting process.

Fourth embodiment, on the basis of the first embodiment, as shown in fig. 1, 2 and 8, the cutting mechanism 4 is composed of a fixing plate 39, a pressing unit, a cutting unit and a pushing unit, the fixing plate 39 is fixedly installed at the inner top end of the support frame 3, the pressing unit and the pushing unit are installed at the bottom end of the fixing plate 39, the cutting unit is installed below the pressing unit, wherein the pressing unit includes a motor II 40, an internal thread cylinder I41, a stabilizing member II 42, a T-shaped screw 43, a connecting seat 44, a slot 45, a placing groove I46 and a pressing plate 47, the motor II 40 is installed at the bottom end of the fixing plate 39, an output shaft of the motor II 40 is connected with the internal thread cylinder I41, the internal thread of the internal thread cylinder I41 is connected with the T-shaped screw 43, two stabilizing members II 42 are symmetrically installed at two sides of the bottom end of the internal thread cylinder I41, the two stabilizing members II 42 are connected through the connecting seat 44, the placing groove I46 is opened at the inner bottom end of the connecting seat 44, the top end of the connecting seat 44 is provided with a slot 45 communicated with the first placing groove 46, the bottom end of the T-shaped screw 43 penetrates through the inside of the slot 45 and is connected with a pressing plate 47 positioned in the first placing groove 46, two sides of the T-shaped screw 43 are symmetrically provided with clamping grooves 57, and two sides of the inner wall of the slot 45 are provided with clamping blocks 58 connected with the clamping grooves 57 in a sliding manner;

when the semiconductor is placed on the metal placing plate 8, the second motor 40 is started, the second motor 40 drives the first internal thread cylinder 41 to rotate, the T-shaped screw 43 can stably move downwards in the groove 45 through the threaded connection relation between the first internal thread cylinder 41 and the T-shaped screw 43 and the connection relation between the matching connecting seat 44 and the first internal thread cylinder 41 through the second stabilizing piece 42, the clamping block 58 slides in the clamping groove 57, meanwhile, the T-shaped screw 43 can drive the pressing plate 47 to move downwards, pressing of the pressing plate 47 on the center position of the top of the semiconductor is achieved, and the semiconductor can be conveniently cut in the later period.

In a fifth embodiment, based on the fourth embodiment, as shown in fig. 1, 2 and 8, the pushing unit includes a gear five 51, a rotating shaft 52, a gear six 53, a second internal thread cylinder 54, a thread block 55 and a push rod 56, the gear five 51 is installed outside the first internal thread cylinder 41, the rotating shaft 52 is installed at the bottom end of the fixing plate 39 and is located at one side of the motor two 40, the rotating shaft 52 is provided with the gear six 53 engaged with the gear five 51, it should be noted here that the gear five 51 and the gear six 53 are equal in size, the thread sizes of the first internal thread cylinder 41 and the second internal thread cylinder 54 are equal in length, the threads of the T-shaped screw 43 and the thread block 55 are identical, the bottom end of the rotating shaft 52 is provided with the thread block 55, the second internal thread cylinder 54 is connected to the thread block 55, and the push rod 56 connected to the connecting base 44 is arranged at one side of the second internal thread cylinder 54;

when the first internal thread cylinder 41 rotates to enable the fifth gear 51 to rotate, the sixth gear 53 can drive the rotating shaft 52 to rotate through the meshing relationship between the fifth gear 51 and the sixth gear 53, the rotating shaft 52 drives the thread block 55 to rotate, the second internal thread cylinder 54 can move downwards through the connecting relationship between the thread block 55 and the second internal thread cylinder 54 and the fixed connection between the matching push rod 56 and the connecting seat 44, the second internal thread cylinder 54 pushes the connecting seat 44 to move downwards through the push rod 56, and as the diameter of the fifth gear 51 is equal to that of the sixth gear 53, the downward moving speed of the pressing plate 47 is equal to that of the connecting seat 44, the connecting seat 44 can also press the connecting seat 44 on the top of the semiconductor when the pressing plate 47 presses the semiconductor.

Sixth embodiment, on the basis of fourth embodiment, as shown in fig. 1, 2 and 8, the cutting unit includes a second placement groove 48, a cutting knife 49 and an electric telescopic rod 50, the second placement groove 48 is opened at the bottom end of the connecting base 44, the second placement groove 48 is located outside the first placement groove 46, the cutting knife 49 is movably connected inside the second placement groove 48, the cutting knife 49 is of a rectangular structure, and the top end of the cutting knife 49 is connected with the inner top end of the second placement groove 48 through the electric telescopic rod 50.

When connecting seat 44 all pressed at the semiconductor top with pressing down the board 47, through starting electric telescopic handle 50, can make electric telescopic handle 50 drive cutting knife 49 and move down, and then can make cutting knife 49 cut the semiconductor, accomplish the cutting work of semiconductor, this design is through pressing down top, both sides and the bottom to the semiconductor, and the effectual semiconductor of avoiding appears shifting in cutting process, and then has improved the cutting quality of semiconductor.

Seventh embodiment, based on the third embodiment or the fourth embodiment, as shown in fig. 2, 6, 7 and 8, each of the first stabilizing member 36 and the second stabilizing member 42 includes a female tube, a second spring and a second rod, the female tubes are connected to both sides of the bottom end of the first female threaded cylinder 41 and one side of the bottom end of the piston plate 35, the second rods are inserted into the female tubes, the female tubes and the second rods are elastically connected by the second spring, and the second rods are respectively connected to the top end of the connecting seat 44 and the inner bottom end of the receiving groove 31, when the first stabilizing member 36 is adjusted in height, in order to improve the lifting stability of the piston plate 35, the female rods can be lifted up and down outside the second rods, so as to achieve extension and contraction of the second spring, the first stabilizing member 36 improves the supporting stability of the piston plate 35, and the second stabilizing member 42 realizes the telescopic connection of the connecting seat 44 and the first female threaded cylinder 41.

The working principle is as follows: when the cutting machine works, when a semiconductor needs to be cut, the first motor 20 is started to rotate forwards, the first motor 20 enables the second rotating shaft 22 to rotate forwards, the first gear 24 rotates forwards, the second gear 25 rotates backwards through the meshing relation of the first gear 24 and the second gear 25, the first belt pulleys 27 rotate in opposite directions, the third rotating shafts 23 rotate in opposite directions through the connecting relation of the conveying belt 29, the third gears 26 rotate in opposite directions, the two sliding plates 12 can be separated from each other through the meshing relation of the third gears 26 and the gear teeth 17, the sliding plates 12 drive the moving cylinders 13 to separate from each other, the moving cylinders 13 drive the clamping rods 14 to separate from each other, the fourth gears 33 can rotate through the rotating relation of the fourth gears 33 and the toothed plates 34, the toothed plates 34 can move upwards, the toothed plates 34 drive the piston plates 35 to move upwards, and the piston plates 35 drive the mother pipe to move upwards, the second spring is extended, and the piston plate 35 discharges the gas in the communicating groove 32 through the vent hole 30, so that the communicating groove 32 is in a vacuum state, then the semiconductor is placed on top of the metal plate 8, the first motor 20 is started to rotate in reverse, so that the two sliding plates 12 drive the moving cylinders 13 to approach each other, and the two clamping bars 14 are brought closer to each other, while pulling the clamping bars 14 upwards, causing the spring to expand, and then the side walls of the clamping rods 14 clamp the side walls of the semiconductor, the top of the clamping rods 14 is positioned at the top of two sides of the semiconductor, and then under the reverse action of the first spring, the clamping and top pressing on the two sides of the semiconductor are realized, meanwhile, the gear four 33 can enable the toothed plate 34 to move downwards, the toothed plate 34 drives the piston plate 35 to move downwards, the metal placing plate 8 is adsorbed on the top of the metal placing plate 8 in a vacuum state, and thus the bottom adsorption of the semiconductor is realized;

then, the second motor 40 is started, the second motor 40 drives the first internal thread cylinder 41 to rotate, the first internal thread cylinder 41 can be driven by the first internal thread cylinder 41 to rotate, the T-shaped screw 43 can be stably moved downwards in the slot 45 by the threaded connection relationship between the first internal thread cylinder 41 and the T-shaped screw 43 and the connection relationship between the connecting seat 44 and the first internal thread cylinder 41 by the second stabilizing member 42, the latch 58 can slide in the slot 57, the T-shaped screw 43 can drive the pressing plate 47 to move downwards to press the center position of the top of the semiconductor by the pressing plate 47, then, the first internal thread cylinder 41 rotates to drive the fifth gear 51 to rotate, the sixth gear 53 can drive the rotating shaft 52 to rotate by the meshing relationship between the fifth gear 51 and the sixth gear 53, the rotating shaft 52 drives the thread block 55 to rotate, and the second internal thread cylinder 54 can be moved downwards by the connection relationship between the thread block 55 and the second internal thread cylinder 54 and the fixed connection between the push rod 56 and the connecting seat 44, the second 54 of the internal thread section of thick bamboo promotes connecting seat 44 through push rod 56 and moves down, because the diameter of five 51 of gears equals with the diameter of six 53 of gears, and then the speed that moves down of pressing board 47 equals with the speed that moves down of connecting seat 44, consequently, can make when pressing board 47 and pressing the semiconductor, connecting seat 44 presses the semiconductor, start electric telescopic handle 50 after that, make electric telescopic handle 50 promote cutting knife 49 and move down, and then cutting knife 49 can cut the semiconductor, this design realizes pressing the multiple of semiconductor, effectively avoid the semiconductor to appear shifting in the cutting process, the cutting stability to the semiconductor has been improved, the cutting quality of semiconductor has been improved simultaneously.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor production apparatus comprising a base (1), characterized in that: the cutting device is characterized in that supporting columns (2) are symmetrically arranged at the bottom end of a base (1), a supporting frame (3) is arranged at the top end of the base (1), a cutting mechanism (4) is arranged at the inner top end of the supporting frame (3), a supporting table (5) positioned below the cutting mechanism (4) is arranged at the top end of the base (1), a mounting seat (6) is arranged at the middle position of the top end of the supporting table (5), an operating table (7) is arranged at the top end of the mounting seat (6), metal placing plates (8) are arranged at the top end of the operating table (7), sliding plates (12) are symmetrically arranged at two sides of the mounting seat (6), gear teeth (17) are equidistantly arranged at one side of the bottom end of each sliding plate (12), through grooves (11) are respectively formed in the sliding plates (12), inserting rods (10) inserted into the through grooves (11) are symmetrically connected to two sides of the mounting seat (6), moving cylinders (13) are respectively arranged at the top ends of the two sliding plates (12), clamping rods (14) positioned at two sides of the metal placing plates (8) are elastically inserted into the moving cylinders (13), the two sliding plates (12) are connected through a clamping mechanism (15), and an adsorption mechanism (16) is arranged inside the supporting platform (5);

the clamping mechanism (15) comprises a first motor (20), a first rotating shaft (21), a second rotating shaft (22), a third rotating shaft (23), a first gear (24), a second gear (25), a third gear (26), a first belt pulley (27), a second belt pulley (28) and a conveying belt (29), wherein the first motor (20) is installed on one side of the supporting platform (5), the first rotating shaft (21) is installed on the other side of the supporting platform (5), the second rotating shaft (22) is connected with an output shaft of the first motor (20), one end of the second rotating shaft (22) is located on one side of the first rotating shaft (21), the third rotating shaft (23) connected with the outer wall of the supporting platform (5) is arranged on one side, away from the first rotating shaft (21) and the second rotating shaft (22), the first gear (24) is connected onto the second rotating shaft (22), the second gear (25) connected with the first gear (24) in a meshed mode is arranged on the first rotating shaft (21), the first rotating shaft (21) and the second rotating shaft (22) are sleeved with a first belt pulley (27), the third rotating shafts (23) are provided with a third gear (26) meshed with the gear teeth (17) and a second belt pulley (28) located on one side of the third gear (26), and the adjacent two first belt pulleys (27) and the second belt pulley (28) are connected through a transmission belt (29).

2. A semiconductor manufacturing apparatus according to claim 1, wherein: one side of the supporting table (5) is provided with a mounting plate (19), and the sliding plate (12) is provided with a second groove (18) which is connected with the mounting plate (19) in a sliding manner.

3. A semiconductor manufacturing apparatus according to claim 1, wherein: the middle positions of two sides of the operating platform (7) are provided with first grooves (9) which are sleeved on the outer portion of the moving cylinder (13), the clamping rods (14) are of T-shaped structures, and the bottom ends of the clamping rods (14) are connected with the inner bottom end of the moving cylinder (13) through first springs.

4. A semiconductor production apparatus according to claim 3, wherein: the metal placing plate (8) is of a concentric circle structure, the top end of the operating platform (7) is provided with an air vent (30) located at the center of the metal placing plate (8), the supporting platform (5) is internally provided with an accommodating groove (31), and the mounting seat (6) is internally provided with a communicating groove (32) communicated with the accommodating groove (31) and the air vent (30).

5. A semiconductor manufacturing apparatus according to claim 4, wherein: adsorption apparatus constructs (16) including four (33) gears, pinion rack (34), piston plate (35), stabilizer one (36), dead lever (37) and activity groove (38), be connected with on rotation axis two (22) and be located the inside gear four (33) of holding tank (31), the inside swing joint of intercommunication groove (32) has piston plate (35), the bottom one side of piston plate (35) is equipped with pinion rack (34) of being connected with four (33) meshing of gear, activity groove (38) have been seted up to the inner bottom end of pinion rack (34), the inside interlude of activity groove (38) has dead lever (37) of being connected with holding tank (31) inner bottom end, the bottom opposite side of piston plate (35) is equipped with stabilizer one (36) of being connected with holding tank (31) inner bottom end.

6. A semiconductor manufacturing apparatus according to claim 5, wherein: the cutting mechanism (4) consists of a fixing plate (39), a pressing unit, a cutting unit and a pushing unit, the fixing plate (39) is fixedly installed at the inner top end of the support frame (3), the pressing unit and the pushing unit are arranged at the bottom end of the fixing plate (39), the cutting unit is arranged below the pressing unit, the pressing unit comprises a motor II (40), an internal thread cylinder I (41), a stabilizing piece II (42), a T-shaped screw rod (43), a connecting seat (44), a slot (45), a placing groove I (46) and a pressing plate (47), the motor II (40) is installed at the bottom end of the fixing plate (39), an output shaft of the motor II (40) is connected with the internal thread cylinder I (41), the internal thread of the internal thread cylinder I (41) is connected with the T-shaped screw rod (43), the stabilizing piece II (42) is symmetrically arranged on two sides of the bottom end of the internal thread cylinder I (41), and the two stabilizing piece II (42) are connected through the connecting seat (44), a first placing groove (46) is formed in the inner bottom end of the connecting seat (44), a groove (45) communicated with the first placing groove (46) is formed in the top end of the connecting seat (44), and the bottom end of the T-shaped screw rod (43) penetrates through the inside of the groove (45) and is connected with a pressing plate (47) located inside the first placing groove (46).

7. A semiconductor manufacturing apparatus according to claim 6, wherein: clamping grooves (57) are symmetrically formed in two sides of the T-shaped screw (43), and clamping blocks (58) which are connected with the clamping grooves (57) in a sliding mode are arranged on two sides of the inner wall of the groove (45).

8. A semiconductor manufacturing apparatus according to claim 6, wherein: the pushing unit comprises a fifth gear (51), a rotating shaft (52), a sixth gear (53), a second internal thread cylinder (54), a thread block (55) and a push rod (56), the fifth gear (51) is installed outside the first internal thread cylinder (41), the rotating shaft (52) is installed at the bottom end of the fixing plate (39) and located on one side of the second motor (40), the sixth gear (53) meshed with the fifth gear (51) is arranged on the rotating shaft (52), the thread block (55) is arranged at the bottom end of the rotating shaft (52), the second internal thread cylinder (54) is connected to the thread block (55), and the push rod (56) connected with the connecting seat (44) is arranged on one side of the second internal thread cylinder (54).

9. A semiconductor manufacturing apparatus according to claim 6, wherein: the cutting unit comprises a second placing groove (48), a cutting knife (49) and an electric telescopic rod (50), the second placing groove (48) is arranged at the bottom end of the connecting seat (44), the second placing groove (48) is located outside the first placing groove (46), the cutting knife (49) is movably connected inside the second placing groove (48), the cutting knife (49) is of a rectangular structure, and the top end of the cutting knife (49) is connected with the inner top end of the second placing groove (48) through the electric telescopic rod (50).

10. A semiconductor manufacturing apparatus according to claim 6, wherein: stabilizing member (36) and stabilizing member two (42) all include female pipe, spring two and son pole, and the bottom both sides of an internal thread section of thick bamboo (41) and bottom one side of piston plate (35) all are connected with female pipe, and the inside of female pipe has all alternate son pole, and passes through two elastic connection of spring between female pipe and the son pole, and the son pole is connected with the top of connecting seat (44) and the interior bottom of holding tank (31) respectively.