CN110253157A - A kind of laser boring diced system for semiconductor material - Google Patents
A kind of laser boring diced system for semiconductor material Download PDFInfo
- Publication number
- CN110253157A CN110253157A CN201910556704.XA CN201910556704A CN110253157A CN 110253157 A CN110253157 A CN 110253157A CN 201910556704 A CN201910556704 A CN 201910556704A CN 110253157 A CN110253157 A CN 110253157A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- wall
- side wall
- mounting base
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 title claims abstract description 22
- 230000004888 barrier function Effects 0.000 claims abstract description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 238000003698 laser cutting Methods 0.000 claims description 18
- 244000309464 bull Species 0.000 claims description 14
- 238000005096 rolling process Methods 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 208000036829 Device dislocation Diseases 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to semiconductor fields, especially a kind of laser boring diced system for semiconductor material, splashing for the waste material that existing cutting generates influences the precision of infrared distance sensor, the problem of carrying out punch operation is inconvenient to using X/Y axis, now propose following scheme, it includes pedestal, the upper end side wall of the pedestal is fixedly connected with mounting base, the mounting base is hollow structure, the inner wall of the mounting base is fixedly connected with stepper motor, the inner wall of the mounting base is rotatably connected to and the matched ball-screw of the output shaft of stepper motor, sliding sleeve is equipped with sliding shoe on the ball-screw, the upper end side wall of the sliding shoe is fixedly connected with light barrier, slide bar is fixedly connected between the two sides inner wall of the mounting base, measurement of the infrared distance sensor to light barrier is protected by mounting base, reduce external influence, it mentions The precision of high ranging, and make workbench rotation to which punch-cuts be rapidly completed by the cooperation of worm and worm wheel etc..
Description
Technical field
The present invention relates to semiconductor processing technology field more particularly to a kind of laser boring cuttings for semiconductor material
System.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is in radio, TV
It has a wide range of applications on machine and thermometric.If diode is exactly the device using semiconductor fabrication.Semiconductor refers to that one kind is led
It can electrically be controlled, range can be from insulator to the material between conductor.No matter from the perspective of science and technology or economic development,
The importance of semiconductor is all very huge.Today most electronic product, as computer, mobile phone or number record
Core cell in sound machine all has extremely close connection with semiconductor.Common semiconductor material has silicon, germanium, GaAs
Deng, and silicon is even more most influential one kind in business application in various semiconductor materials.
It needs to cut it in the process to semiconductor, punch, in the prior art, filled using laser cutting
It sets and semiconductor process very common, be in the prior art more because laser cutting device process velocity is fast, precision is high
Mature technological means, but when utilizing laser cutting device to semiconductor machining, infrared distance sensor is utilized to carry out distance
Positioning is a kind of common mode, and infrared distance sensor is generally placed into the external world and carries out range measurement, will lead in this way
The waste material generated during laser cutting impacts the measurement accuracy of infrared distance sensor, in addition, in the prior art
By X/Y axis drive laser cutting device moved, be inconvenient in this way when being punched to semiconductor, and punch at
Circular precision is not also high.
In conclusion still having certain inconvenience when carrying out punch-cuts to semiconductor, for this purpose, it is proposed that a kind of
It solves the above problems for the laser boring diced system of semiconductor material.
Summary of the invention
A kind of laser boring diced system for semiconductor material proposed by the present invention solves and utilizes laser cutting dress
When setting to semiconductor machining, generally infrared distance sensor is placed into the external world and carries out range measurement, will lead to laser in this way
The waste material generated during cutting impacts the measurement accuracy of infrared distance sensor, in addition, passing through in the prior art
X/Y axis drives laser cutting device to be moved, and is inconvenient in this way when punching to semiconductor, and punches into circle
Precision also not high problem.
To achieve the goals above, present invention employs following technical solutions:
A kind of laser boring diced system for semiconductor material, including pedestal, the upper end side wall of the pedestal are fixed
It is connected with mounting base, the mounting base is hollow structure, and the inner wall of the mounting base is fixedly connected with stepper motor, the installation
The inner wall of seat be rotatably connected to the matched ball-screw of the output shaft of stepper motor, sliding sleeve, which is equipped with, on the ball-screw slides
Motion block, the upper end side wall of the sliding shoe are fixedly connected with light barrier, are fixedly connected between the two sides inner wall of the mounting base
Slide bar, sliding sleeve is equipped with sliding sleeve on the slide bar, and the bottom side of the wall and light barrier of the sliding sleeve are fixed far from the side wall of sliding shoe
Connection, the inner wall of the mounting base are fixedly connected with infrared distance sensor, and the light barrier is far from infrared distance sensor
Side wall is fixedly connected with cross bar, and the cross bar runs through the inner wall of mounting base and be fixedly connected with far from one end of light barrier pneumatically to be stretched
Contracting bar, the telescopic end of the Pneumatic extension bar are fixedly connected with laser cutting device, and the upper end side wall of the pedestal offers peace
Tankage, the side wall of the mounting groove are fixedly connected with uniform speed electric motor, the side wall of the mounting groove by bearing be rotatably connected to
The matched worm screw of the output shaft of uniform speed electric motor, the bottom wall of the mounting groove are rotatably connected to bull stick by shaft, on the bull stick
Fixing sleeve is equipped with to be run through the opening of mounting groove far from one end of shaft and is fixedly connected with the matched worm gear of worm screw, the bull stick
Workbench, the workbench are hollow structure, are equipped with clamping device in the workbench.
Preferably, the clamping device includes positive and negative motor, and the positive and negative motor is fixedly connected with the inner wall of workbench, institute
The output shaft for stating positive and negative motor is fixedly connected with gear, and the top and bottom sidewall of the workbench slidably connects matched with the gear
Rack gear, the side wall of two rack gears are fixedly connected to strut, and the upper end side wall of the workbench offers two bar shapeds and opens
Mouthful, two struts extend through two strip gabs, and the strut outside workbench is fixedly connected with grip block.
Preferably, the two sides side wall of the rack gear is fixedly connected to baffle, and the side wall of the rack gear offers limiting slot,
Gag lever post is slidably connected in the limiting slot, the gag lever post runs through the opening of limiting slot and fixes with the inner wall of workbench and connects
It connects.
Preferably, the bottom side of the wall of the workbench is fixedly connected there are two support rod, and two support rods distinguish position
Symmetrical in the two sides of bull stick, the support rod is fixedly connected with sliding block, the upper end side wall of the pedestal far from one end of workbench
It offers and the matched annular groove of sliding block.
Preferably, the upper end side wall of the mounting base is fixedly connected with multi-colour alarm lamp, the multi-colour alarm lamp respectively with
Infrared distance sensor and servo motor electrical connection.
Compared with prior art, the beneficial effects of the present invention are:
1, by being arranged infrared distance sensor to mounting base inner wall in the present invention, and ball-screw and sliding shoe are utilized
Cooperation drive light barrier mobile, can rapidly and accurately measure mobile distance in this way and then be cut, be avoided infrared
Distance measuring sensor is guaranteed the accuracy of cutting position by external influence, in addition, driving worm and worm wheel by uniform speed electric motor
Workbench rotation is rotated and then driven, quickly semiconductor can be punched in this way, of simple structure and strong practicability.
2, make rack gear movement using the rotation of positive and negative motor driven gear in the present invention, so that strut and grip block be driven to move
It is dynamic, can be rapidly completed in this way and the clamping of semiconductor is loosened, facilitate pick-and-place, in addition, using baffle block rack gear avoid its with
Gear separation, and the limitation of gag lever post does not interfere the sliding of rack gear and guarantee rack gear in sliding process will not wallowing motion, and also
Have and played a supporting role by support rod and sliding block to workbench, and can smooth rotation to completing quick punch-cuts.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the laser boring diced system for semiconductor material proposed by the present invention；
Fig. 2 is the structural schematic diagram in Fig. 1 at A；
Fig. 3 is the structural schematic diagram in Fig. 1 at B；
Fig. 4 is the structural schematic diagram in Fig. 1 at C.
In figure: 1 pedestal, 2 mounting bases, 3 stepper motors, 4 ball-screws, 5 sliding shoes, 6 light barriers, 7 slide bars, 8 sliding sleeves, 9
Infrared distance sensor, 10 cross bars, 11 Pneumatic extension bars, 12 laser cutting devices, 13 uniform speed electric motors, 14 worm screws, 15 worm gears, 16
Workbench, 17 clamping devices, 1701 positive and negative motors, 1702 gears, 1703 rack gears, 1704 struts, 1705 grip blocks, 18 baffles,
19 gag lever posts, 20 support rods, 21 sliding blocks, 22 multi-colour alarm lamps, 23 bull sticks.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-4, a kind of laser boring diced system for semiconductor material, including pedestal 1, the upper end of pedestal 1
Side wall is fixedly connected with mounting base 2, and the upper end side wall of mounting base 2 is fixedly connected with multi-colour alarm lamp 22, and multi-colour alarm lamp 22 is adopted
With red, yellow and green, illustrate work safety when green, illustrates that drill process is made a fault in red and yellow, mention
Awake worker overhauls, and multi-colour alarm lamp 22 is electrically connected with infrared distance sensor 9 and servo motor respectively, during mounting base 2 is
Hollow structure, the inner wall of mounting base 2 are fixedly connected with stepper motor 3, and the inner wall of mounting base 2 is rotatably connected to and stepper motor 3
The matched ball-screw 4 of output shaft, sliding sleeve is equipped with sliding shoe 5 on ball-screw 4, and the upper end side wall of sliding shoe 5 is fixedly connected
There is light barrier 6, slide bar 7 is fixedly connected between the two sides inner wall of mounting base 2, sliding sleeve is equipped with sliding sleeve 8 on slide bar 7, sliding sleeve 8
Bottom side of the wall is fixedly connected with light barrier 6 far from the side wall of sliding shoe 5, and the inner wall of mounting base 2 is fixedly connected with infrared distance measurement biography
Sensor 9 can measure to fast accurate the mobile distance of laser cutting device 12 using infrared distance sensor 9；
Light barrier 6 is fixedly connected with cross bar 10 far from the side wall of infrared distance sensor 9, and cross bar 10 is far from light barrier 6
One end runs through the inner wall of mounting base 2 and is fixedly connected with Pneumatic extension bar 11, and the telescopic end of Pneumatic extension bar 11 is fixedly connected with
Laser cutting device 12, using the vertical distance of the telescopic adjustment laser cutting device 12 of Pneumatic extension bar 11, keep its close or
Person offers mounting groove far from workbench 16, the upper end side wall of pedestal 1, and the side wall of mounting groove is fixedly connected with uniform speed electric motor 13,
The side wall of mounting groove is rotatably connected to by bearing to be led to the matched worm screw 14 of the output shaft of uniform speed electric motor 13, the bottom wall of mounting groove
It crosses shaft and is rotatably connected to bull stick, fixing sleeve is equipped with and the matched worm gear 15 of worm screw 14, the one end of bull stick far from shaft on bull stick
Through mounting groove opening and be fixedly connected with workbench 16, the bottom side of the wall of workbench 16 is fixedly connected there are two support rod
20, the two sides that two support rods 20 are located at bull stick are symmetrical, and support rod 20 is fixedly connected with cunning far from one end of workbench 16
Block 21, the upper end side wall of pedestal 1 offer with the matched annular groove of sliding block 21, by support rod 20 and sliding block 21 to workbench
16 play a supporting role, and can smooth rotation to completing quick punch-cuts；
Workbench 16 is hollow structure, and clamping device 17 is equipped in workbench 16, and clamping device 17 includes positive and negative motor
1701, positive and negative motor 1701 is fixedly connected with the inner wall of workbench 16, and the output shaft of positive and negative motor 1701 is fixedly connected with gear
1702, the top and bottom sidewall of workbench 16 slidably connects and the matched rack gear 1703 of gear 1702, the two sides side of rack gear 1703
Wall is fixedly connected to baffle 18, and the side wall of rack gear 1703 offers limiting slot, and gag lever post 19 is slidably connected in limiting slot, limit
Position bar 19 runs through the opening of limiting slot and is fixedly connected with the inner wall of workbench 16, blocks rack gear 1703 using baffle 18 and avoids it
It is separated with gear 1702, and the limitation of gag lever post 19 does not interfere the sliding of rack gear 1703 and guarantees rack gear 1703 in sliding process
Will not wallowing motion, the side wall of two rack gears 1703 is fixedly connected to strut 1704, and the upper end side wall of workbench 16 offers
Two strip gabs, two struts 1704 extend through two strip gabs, and the strut 1704 outside workbench 16 is fixed to be connected
It is connected to grip block 1705.
Semiconductor is put on workbench 16 by the present invention when needing to punch semiconductor, makes positive and negative motor 1701
It rotates forward, positive and negative motor 1701 is rotated with moving gear 1702, slides rack gear 1703 by engagement, rack gear 1703 drives
Strut 1704 is mobile, and grip block 1705 follows strut 1704 thus to press from both sides semiconductor to close to the movement of the direction of semiconductor
It holds on workbench 16, the radius length then punched as needed adjusts the position of laser cutting device 12, and laser cutting is
The horizontal laser beam issued from laser becomes laser beam vertically downward through 45 ° of total reflection mirrors, by lens focus, in coke
It is polymerized to a minimum hot spot at point, when hot spot is radiated on material, material is made to be heated to vapourizing temperature quickly, evaporation forms hole
Hole, the movement with light beam to material, and cooperate auxiliary gas, usually inert gas, the waste residue of fusing is blown away, hole is connected
The very narrow joint-cutting of continuous formation width completes the cutting to material；
When adjusting the position of laser cutting device 12, makes stepper motor 3 that ball-screw 4 be driven to rotate, pass through 7 He of slide bar
The limitation of sliding sleeve 8 makes sliding shoe 5 along 4 transverse shifting of ball-screw, and such sliding shoe 5 is able to drive 6 transverse shifting of light barrier,
And the spacing of light barrier 6 is measured when the movement of light barrier 6 using infrared distance sensor 9, infrared distance sensor 9 has a pair
Infrared signal transmitting and reception diode, the infrared distance sensor 9LDM301 utilized launch a branch of infrared light, are being irradiated to
The process that a reflection is formed after object is reflected into sensor and is followed by the collection of letters number, then receives transmitting using image procossing and connects
The data of the time difference of receipts calculate the distance of object after signal processor processes；
And light barrier 6 drives cross bar 10 and pneumatic telescopic rod 11 mobile in the process of moving, it in this way can quickly, accurately
Laser cutting device 12 is moved to designated position by ground, after being moved to designated position, first makes Pneumatic extension bar 11 that laser be driven to cut
The decline of device 12 is cut, laser cutting device 12 is opened and punch-cuts is carried out to semiconductor, then uniform speed electric motor 13 is made to drive worm screw 14
Rotation makes bull stick that workbench 16 be driven to rotate by the rotation of worm gear 15, and this makes it possible to quickly to partly leading on workbench 16
Body carries out punch-cuts, and structure is simple, easy to operate, again rotates backward positive and negative motor 1701 after the completion of punching, grip block
1705 separate with semiconductor, and this makes it possible to remove semiconductor from workbench 16.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (5)
1. a kind of laser boring diced system for semiconductor material, including pedestal (1), which is characterized in that the pedestal (1)
Upper end side wall be fixedly connected with mounting base (2), the mounting base (2) is hollow structure, and the inner wall of the mounting base (2) fixes
It is connected with stepper motor (3), the inner wall of the mounting base (2) is rotatably connected to and the matched rolling of output shaft of stepper motor (3)
Ballscrew (4), sliding sleeve is equipped with sliding shoe (5) on the ball-screw (4), and the upper end side wall of the sliding shoe (5) is fixed to be connected
It is connected to light barrier (6), is fixedly connected with slide bar (7) between the two sides inner wall of the mounting base (2), slided on the slide bar (7)
It is arranged with sliding sleeve (8), the bottom side of the wall of the sliding sleeve (8) is fixedly connected with light barrier (6) far from the side wall of sliding shoe (5), institute
The inner wall for stating mounting base (2) is fixedly connected with infrared distance sensor (9), and the light barrier (6) is far from infrared distance sensor
(9) side wall is fixedly connected with cross bar (10), and the one end of the cross bar (10) far from light barrier (6) is through the interior of mounting base (2)
Wall is simultaneously fixedly connected with Pneumatic extension bar (11), and the telescopic end of the Pneumatic extension bar (11) is fixedly connected with laser cutting device
(12), the upper end side wall of the pedestal (1) offers mounting groove, and the side wall of the mounting groove is fixedly connected with uniform speed electric motor
(13), the side wall of the mounting groove by bearing be rotatably connected to the matched worm screw of output shaft (14) of uniform speed electric motor (13),
The bottom wall of the mounting groove is rotatably connected to bull stick (23) by shaft, and fixing sleeve is equipped with and worm screw (14) on the bull stick (23)
Matched worm gear (15), the bull stick (23) run through the opening of mounting groove far from one end of shaft and are fixedly connected with workbench
(16), the workbench (16) is hollow structure, is equipped with clamping device (17) in the workbench (16).
2. a kind of laser boring diced system for semiconductor material according to claim 1, which is characterized in that described
Clamping device (17) includes positive and negative motor (1701), and the positive and negative motor (1701) is fixedly connected with the inner wall of workbench (16),
The output shaft of the positive and negative motor (1701) is fixedly connected with gear (1702), and the top and bottom sidewall of the workbench (16) slides
It is connected with and is fixedly connected to strut with gear (1702) matched rack gear (1703), the side wall of two rack gears (1703)
(1704), the upper end side wall of the workbench (16) offers two strip gabs, and two struts (1704) extend through
Two strip gabs are located at the described strut (1704) of workbench (16) outside and are fixedly connected with grip block (1705).
3. a kind of laser boring diced system for semiconductor material according to claim 2, which is characterized in that described
The two sides side wall of rack gear (1703) is fixedly connected to baffle (18), and the side wall of the rack gear (1703) offers limiting slot, institute
State and slidably connected in limiting slot gag lever post (19), the gag lever post (19) through limiting slot opening and with workbench (16)
Inner wall is fixedly connected.
4. a kind of laser boring diced system for semiconductor material according to claim 1, which is characterized in that described
The bottom side of the wall of workbench (16) is fixedly connected there are two support rod (20), and two support rods (20) are located at bull stick
(23) two sides are symmetrical, and the support rod (20) is fixedly connected with sliding block (21), the pedestal far from the one end of workbench (16)
(1) upper end side wall offers and sliding block (21) matched annular groove.
5. a kind of laser boring diced system for semiconductor material according to claim 1, which is characterized in that described
The upper end side wall of mounting base (2) is fixedly connected with multi-colour alarm lamp (22), the multi-colour alarm lamp (22) respectively with infrared distance measurement
Sensor (9) and servo motor electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910556704.XA CN110253157B (en) | 2019-06-25 | 2019-06-25 | Laser drilling and cutting system for semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910556704.XA CN110253157B (en) | 2019-06-25 | 2019-06-25 | Laser drilling and cutting system for semiconductor material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110253157A true CN110253157A (en) | 2019-09-20 |
| CN110253157B CN110253157B (en) | 2021-02-26 |
Family
ID=67921509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910556704.XA Active CN110253157B (en) | 2019-06-25 | 2019-06-25 | Laser drilling and cutting system for semiconductor material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110253157B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111037119A (en) * | 2020-01-09 | 2020-04-21 | 沧州领创激光科技有限公司 | Continuous laser cutting machine |
| CN111230326A (en) * | 2020-02-14 | 2020-06-05 | 苏州爱果乐科技有限公司 | Double-shaft distance measurement positioning method based on infrared induction technology |
| CN111876865A (en) * | 2020-08-13 | 2020-11-03 | 东台远欣机械有限公司 | Structure-adjustable early warning device for twisting machine |
| CN112612182A (en) * | 2020-12-09 | 2021-04-06 | 胡满 | High-precision chip photoetching machine and production process |
| CN112900506A (en) * | 2021-01-21 | 2021-06-04 | 饶远时 | Pile foundation quality detection device and use method |
| CN113001037A (en) * | 2021-02-23 | 2021-06-22 | 李豪 | Cutting equipment for chip wafer processing |
| CN113635467A (en) * | 2021-10-14 | 2021-11-12 | 江苏煜晶光电科技有限公司 | Semiconductor production device |
| CN113927105A (en) * | 2021-09-30 | 2022-01-14 | 张�浩 | Cutting device for semiconductor |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080037003A1 (en) * | 2004-01-09 | 2008-02-14 | Kazuhiro Atsumi | Laser Processing Method And Device |
| CN201271782Y (en) * | 2008-07-01 | 2009-07-15 | 北京大恒激光设备有限公司 | Follow-up laser cutting device and laser cutting machine equipped therewith |
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN104625766B (en) * | 2014-12-17 | 2017-07-28 | 山东理工大学 | Two-degree-of-freedom tilting workbench with double ball pairs |
| CN107186359A (en) * | 2017-06-27 | 2017-09-22 | 安徽联亚智能装备制造有限公司 | A kind of intelligent high-speed laser cutting machine control system |
| CN208179010U (en) * | 2018-05-04 | 2018-12-04 | 周招方 | Clamping device is used in a kind of cutting of copper pipe |
| CN208662707U (en) * | 2018-07-11 | 2019-03-29 | 常州江南万利机械配件有限公司 | A kind of forging cutter device |
| CN208811316U (en) * | 2018-08-17 | 2019-05-03 | 苏州斯尔特微电子有限公司 | A kind of High Precision Automatic cutting machine |
-
2019
- 2019-06-25 CN CN201910556704.XA patent/CN110253157B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080037003A1 (en) * | 2004-01-09 | 2008-02-14 | Kazuhiro Atsumi | Laser Processing Method And Device |
| CN201271782Y (en) * | 2008-07-01 | 2009-07-15 | 北京大恒激光设备有限公司 | Follow-up laser cutting device and laser cutting machine equipped therewith |
| CN104625766B (en) * | 2014-12-17 | 2017-07-28 | 山东理工大学 | Two-degree-of-freedom tilting workbench with double ball pairs |
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN107186359A (en) * | 2017-06-27 | 2017-09-22 | 安徽联亚智能装备制造有限公司 | A kind of intelligent high-speed laser cutting machine control system |
| CN208179010U (en) * | 2018-05-04 | 2018-12-04 | 周招方 | Clamping device is used in a kind of cutting of copper pipe |
| CN208662707U (en) * | 2018-07-11 | 2019-03-29 | 常州江南万利机械配件有限公司 | A kind of forging cutter device |
| CN208811316U (en) * | 2018-08-17 | 2019-05-03 | 苏州斯尔特微电子有限公司 | A kind of High Precision Automatic cutting machine |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111037119A (en) * | 2020-01-09 | 2020-04-21 | 沧州领创激光科技有限公司 | Continuous laser cutting machine |
| CN111230326A (en) * | 2020-02-14 | 2020-06-05 | 苏州爱果乐科技有限公司 | Double-shaft distance measurement positioning method based on infrared induction technology |
| CN111230326B (en) * | 2020-02-14 | 2021-11-02 | 苏州爱果乐智能家居有限公司 | Double-shaft distance measurement positioning method based on infrared induction technology |
| CN111876865A (en) * | 2020-08-13 | 2020-11-03 | 东台远欣机械有限公司 | Structure-adjustable early warning device for twisting machine |
| CN111876865B (en) * | 2020-08-13 | 2021-10-22 | 东台远欣机械有限公司 | Structure-adjustable early warning device for twisting machine |
| CN112612182A (en) * | 2020-12-09 | 2021-04-06 | 胡满 | High-precision chip photoetching machine and production process |
| CN112900506A (en) * | 2021-01-21 | 2021-06-04 | 饶远时 | Pile foundation quality detection device and use method |
| CN113001037A (en) * | 2021-02-23 | 2021-06-22 | 李豪 | Cutting equipment for chip wafer processing |
| CN113927105A (en) * | 2021-09-30 | 2022-01-14 | 张�浩 | Cutting device for semiconductor |
| CN113635467A (en) * | 2021-10-14 | 2021-11-12 | 江苏煜晶光电科技有限公司 | Semiconductor production device |
| CN113635467B (en) * | 2021-10-14 | 2021-12-10 | 江苏煜晶光电科技有限公司 | Semiconductor production device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110253157B (en) | 2021-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110253157A (en) | A kind of laser boring diced system for semiconductor material | |
| US4197888A (en) | Log centering apparatus and method using transmitted light and reference edge log scanner | |
| CN105387817A (en) | Device for rapidly detecting size parameters of cylinder type excircle shape | |
| CN103801823A (en) | Wafer alignment positioning device and method | |
| CN109530912A (en) | Based on interior coaxial focusing mechanism and based on interior coaxial focusing method | |
| CN110238547A (en) | It is a kind of for measuring the system and measurement method of high power laser focal position | |
| CN114311155B (en) | High-precision punching equipment for furniture board and using method thereof | |
| CN107116374B (en) | A kind of main shaft of numerical control machine tool knife handle and vibration measuring method with vibration measurement with laser function | |
| CN109205248A (en) | Circular saw prints feeding servo positioning system | |
| CN108044241B (en) | A kind of auxiliary locator being cut by laser machine people | |
| CN115876102B (en) | Device for measuring tree height by using unmanned aerial vehicle and measuring method thereof | |
| CN215393144U (en) | Laser processing apparatus | |
| CN211262151U (en) | Ultrasonic measurement and control device for EVA casting film production | |
| CN211651543U (en) | Bottle embryo angularity measuring device | |
| JPH0538714A (en) | Automatic stone working machine | |
| JPS5838919A (en) | Method and device for measuring shape of lens edge of spectacle frame | |
| CN218799965U (en) | High-precision laser cutting mechanism | |
| KR20030043550A (en) | rambling universal drill machine | |
| CN112643158B (en) | Cutting equipment clamping arm with auxiliary positioning structure for molding die blanks | |
| CN219798243U (en) | High-precision composite sheet surface height detection device | |
| CN206235312U (en) | A kind of new dise knife knife block gauging instrument | |
| JPH1123256A (en) | Circularity measuring machine | |
| CN219561770U (en) | Simple focusing structure of laser module | |
| CN218511898U (en) | Calibration device for measuring temperature distance of infrared thermometer | |
| CN218396057U (en) | Rotatable inclined hole processing tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240517 Address after: 221600 3rd Floor, Building A11, North Side of Pei Highway and East Side of Hanrun Road (Science and Technology Entrepreneurship Park), Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Security Emergency Medical Industry Technology Research Institute (Xuzhou) Co.,Ltd. Country or region after: China Address before: 221600 South Ring Road (Fengpei Road) North of Peixian County, Xuzhou City, Jiangsu Province Patentee before: Jiangsu Navigation Industry Co.,Ltd. Country or region before: China |