CN110253157B - Laser drilling and cutting system for semiconductor material - Google Patents
Laser drilling and cutting system for semiconductor material Download PDFInfo
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- CN110253157B CN110253157B CN201910556704.XA CN201910556704A CN110253157B CN 110253157 B CN110253157 B CN 110253157B CN 201910556704 A CN201910556704 A CN 201910556704A CN 110253157 B CN110253157 B CN 110253157B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 title claims abstract description 23
- 238000005520 cutting process Methods 0.000 title claims abstract description 21
- 238000005553 drilling Methods 0.000 title claims description 7
- 238000004080 punching Methods 0.000 claims abstract description 16
- 230000004888 barrier function Effects 0.000 claims abstract description 15
- 238000003698 laser cutting Methods 0.000 claims description 20
- 244000309464 bull Species 0.000 claims description 5
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract 5
- 238000000034 method Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 4
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to the field of semiconductors, in particular to a laser punching and cutting system for semiconductor materials, which aims at the problem that the accuracy of an infrared distance measuring sensor is influenced by the splashing of waste materials generated by the existing cutting and the punching operation is inconvenient by utilizing an X/Y axis, and the invention provides the following scheme that the laser punching and cutting system comprises a base, wherein the side wall of the upper end of the base is fixedly connected with an installation seat, the installation seat is of a hollow structure, the inner wall of the installation seat is fixedly connected with a stepping motor, the inner wall of the installation seat is rotatably connected with a ball screw matched with an output shaft of the stepping motor, a sliding block is slidably sleeved on the ball screw, the side wall of the upper end of the sliding block is fixedly connected with a light barrier, a sliding rod is fixedly connected between the inner walls of the two sides of the installation seat, the, improve the precision of range finding to thereby the cooperation through worm and worm wheel etc. makes the workstation rotate and accomplish the cutting of punching fast.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a laser drilling and cutting system for a semiconductor material.
Background
The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
Need cut it in the course of working to the semiconductor, punch, among the prior art, it is very common to utilize laser cutting device to process the semiconductor, because laser cutting device process velocity is fast, the precision is high, be comparatively ripe technical means among the prior art, but utilize laser cutting device to process the semiconductor, it is a commonly used mode to utilize infrared distance measuring sensor to carry out distance location, and infrared distance measuring sensor generally places and carries out distance measurement in the external world, the waste material that can lead to laser cutting's in-process to produce leads to the fact the influence to infrared distance measuring sensor's measurement accuracy like this, in addition, drive laser cutting device through the X/Y axle among the prior art and remove, it is very inconvenient when punching the semiconductor like this, and it is not high to punch into circular precision yet.
In summary, there is still a certain inconvenience in the punching and cutting of semiconductor materials, and therefore, a laser punching and cutting system for semiconductor materials is proposed to solve the above problems.
Disclosure of Invention
The invention provides a laser punching and cutting system for semiconductor materials, which solves the problems that when a laser cutting device is used for processing a semiconductor, an infrared distance measuring sensor is generally placed in the outside for distance measurement, so that waste materials generated in the laser cutting process influence the measurement precision of the infrared distance measuring sensor.
In order to achieve the purpose, the invention adopts the following technical scheme:
a laser punching and cutting system for semiconductor materials comprises a base, wherein the upper end side wall of the base is fixedly connected with a mounting seat, the mounting seat is of a hollow structure, the inner wall of the mounting seat is fixedly connected with a stepping motor, the inner wall of the mounting seat is rotatably connected with a ball screw matched with an output shaft of the stepping motor, a sliding block is sleeved on the ball screw in a sliding manner, the upper end side wall of the sliding block is fixedly connected with a light barrier, a sliding rod is fixedly connected between the inner walls of the two sides of the mounting seat, a sliding sleeve is sleeved on the sliding rod in a sliding manner, the lower end side wall of the sliding sleeve is fixedly connected with the side wall of the light barrier far away from the sliding block, an infrared distance measuring sensor is fixedly connected with the inner wall of the mounting seat, the side wall of the light barrier far away from the infrared distance measuring sensor is, the utility model discloses a pneumatic telescopic link, including base, telescopic end, mounting groove, bearing, runner, fixed cover, telescopic end fixedly connected with laser cutting device, the mounting groove has been seted up to the upper end lateral wall of base, the lateral wall fixedly connected with uniform velocity motor of mounting groove, the lateral wall of mounting groove rotates through the bearing and is connected with the worm that matches with the output shaft of uniform velocity motor, the diapire of mounting groove rotates through the pivot and is connected with the bull stick, fixed cover is equipped with the worm wheel that matches with the worm on the bull stick, the one end that the pivot was kept away from to the bull stick runs through the opening and the fixedly connected with.
Preferably, fixture includes positive and negative motor, the inner wall fixed connection of positive and negative motor and workstation, the output shaft fixedly connected with gear of positive and negative motor, the equal sliding connection of the upper and lower lateral wall of workstation has the rack that matches with the gear, two the equal fixedly connected with branch of lateral wall of rack, two bar openings, two have been seted up to the upper end lateral wall of workstation branch runs through two bar openings respectively, is located outside the workstation branch fixedly connected with grip block.
Preferably, the both sides lateral wall of rack is the equal fixedly connected with baffle, the spacing groove has been seted up to the lateral wall of rack, sliding connection has the gag lever post in the spacing groove, the gag lever post run through the opening of spacing groove and with the inner wall fixed connection of workstation.
Preferably, the lower extreme lateral wall fixedly connected with two bracing pieces of workstation, two the bracing piece is located the bilateral symmetry of bull stick respectively, the one end fixedly connected with slider of workstation is kept away from to the bracing piece, the annular spout that matches with the slider is seted up to the upper end lateral wall of base.
Preferably, the upper end lateral wall fixedly connected with polychrome warning light of mount pad, polychrome warning light is connected with infrared distance measuring sensor and servo motor electricity respectively.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the infrared distance measuring sensor is arranged on the inner wall of the mounting seat, and the light barrier is driven to move by the cooperation of the ball screw and the sliding block, so that the moving distance can be measured quickly and accurately to cut, the infrared distance measuring sensor is prevented from being influenced by the outside, the accuracy of a cutting position is ensured, in addition, the worm and the worm wheel are driven to rotate by the uniform speed motor to drive the workbench to rotate, and thus, the semiconductor can be punched quickly, the structure is simple, and the practicability is high.
2. In the invention, the positive and negative motors are used for driving the gears to rotate so as to drive the rack to move, so that the support rod and the clamping block to move, the clamping and releasing of the semiconductor can be rapidly finished, the taking and the placing are convenient, in addition, the baffle is used for blocking the rack to avoid the separation of the rack and the gears, the limitation of the limiting rod does not interfere with the sliding of the rack and ensures that the rack cannot obliquely swing in the sliding process, the support rod and the sliding block play a supporting role on the workbench, and the support rod and the sliding block can smoothly rotate so as to finish rapid punching.
Drawings
FIG. 1 is a schematic structural diagram of a laser drilling and cutting system for semiconductor materials according to the present invention;
FIG. 2 is a schematic view of the structure at A in FIG. 1;
FIG. 3 is a schematic view of the structure at B in FIG. 1;
fig. 4 is a schematic structural diagram at C in fig. 1.
In the figure: the device comprises a base 1, a mounting seat 2, a stepping motor 3, a ball screw 4, a sliding block 5, a light barrier 6, a sliding rod 7, a sliding sleeve 8, an infrared distance measuring sensor 9, a cross rod 10, a pneumatic telescopic rod 11, a laser cutting device 12, a uniform speed motor 13, a worm 14, a worm gear 15, a workbench 16, a clamping mechanism 17, a positive and negative motor 1701, a gear 1702, a rack 1703, a strut 1704, a clamping block 1705, a baffle 18, a limiting rod 19, a supporting rod 20, a sliding block 21, a multicolor warning lamp 22 and a rotating rod 23.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-4, a laser punching and cutting system for semiconductor materials, which comprises a base 1, wherein the upper end side wall of the base 1 is fixedly connected with a mounting seat 2, the upper end side wall of the mounting seat 2 is fixedly connected with a multicolor warning lamp 22, the multicolor warning lamp 22 adopts red, yellow and green, the working safety is described when the color is green, a punching process error is described when the color is red and yellow, a worker is reminded of overhauling, the multicolor warning lamp 22 is respectively and electrically connected with an infrared distance measuring sensor 9 and a servo motor, the mounting seat 2 is of a hollow structure, the inner wall of the mounting seat 2 is fixedly connected with a stepping motor 3, the inner wall of the mounting seat 2 is rotatably connected with a ball screw 4 matched with an output shaft of the stepping motor 3, a sliding sleeve 5 is arranged on the ball screw 4, the upper end side wall of the sliding block 5 is fixedly connected with a light baffle 6, a sliding sleeve 8 is slidably sleeved on the sliding rod 7, the side wall of the lower end of the sliding sleeve 8 is fixedly connected with the side wall, far away from the sliding block 5, of the light barrier 6, an infrared distance measuring sensor 9 is fixedly connected with the inner wall of the mounting seat 2, and the infrared distance measuring sensor 9 can be used for quickly and accurately measuring the moving distance of the laser cutting device 12;
the side wall of the light barrier 6 far away from the infrared distance measuring sensor 9 is fixedly connected with a cross rod 10, one end of the cross rod 10 far away from the light barrier 6 penetrates through the inner wall of the mounting seat 2 and is fixedly connected with a pneumatic telescopic rod 11, the telescopic end of the pneumatic telescopic rod 11 is fixedly connected with a laser cutting device 12, the vertical distance of the laser cutting device 12 is adjusted by the telescopic of the pneumatic telescopic rod 11 to enable the cross rod to be close to or far away from a workbench 16, the side wall of the upper end of the base 1 is provided with a mounting groove, the side wall of the mounting groove is fixedly connected with a uniform motor 13, the side wall of the mounting groove is rotatably connected with a worm 14 matched with an output shaft of the uniform motor 13 through a bearing, the bottom wall of the mounting groove is rotatably connected with a rotating rod through a rotating shaft, a worm wheel 15 matched with the worm 14 is fixedly sleeved on the, the two support rods 20 are respectively positioned on two sides of the rotating rod symmetrically, one end of each support rod 20, which is far away from the workbench 16, is fixedly connected with a sliding block 21, the side wall of the upper end of the base 1 is provided with an annular sliding groove matched with the sliding block 21, the support rods 20 and the sliding blocks 21 play a supporting role on the workbench 16, and the workbench can smoothly rotate so as to complete rapid punching and cutting;
the worktable 16 is of a hollow structure, a clamping mechanism 17 is arranged in the worktable 16, the clamping mechanism 17 comprises a positive and negative motor 1701, the positive and negative motor 1701 is fixedly connected with the inner wall of the worktable 16, an output shaft of the positive and negative motor 1701 is fixedly connected with a gear 1702, the upper and lower side walls of the worktable 16 are respectively and slidably connected with a rack 1703 matched with the gear 1702, the side walls of the two sides of the rack 1703 are respectively and fixedly connected with a baffle 18, the side wall of the rack 1703 is provided with a limit groove, a limit rod 19 is slidably connected in the limit groove, the limit rod 19 penetrates through the opening of the limit groove and is fixedly connected with the inner wall of the worktable 16, the rack 1703 is blocked by the baffle 18 to avoid being separated from the gear 1702, the limit of the limit rod 19 does not hinder the sliding of the rack 1703 and ensures that the rack 1703 cannot obliquely swing in the sliding process, the side walls of the two rack 1703 are respectively, the two struts 1704 penetrate through the two strip-shaped openings, and the struts 1704 outside the workbench 16 are fixedly connected with clamping blocks 1705.
When a semiconductor needs to be punched, the semiconductor is placed on a workbench 16, a positive and negative motor 1701 is rotated in a positive direction, the positive and negative motor 1701 drives a gear 1702 to rotate, a rack 1703 slides through meshing action, a rack 1703 drives a support 1704 to move, a clamping block 1705 moves along the support 1704 in a direction close to the semiconductor, so that the semiconductor is clamped on the workbench 16, then the position of a laser cutting device 12 is adjusted according to the length of a radius needing to be punched, the laser cutting is realized by that a horizontal laser beam emitted by a laser is changed into a vertical downward laser beam through a 45-degree total reflection mirror and then is focused through a lens, a tiny light spot is gathered at a focus, when the light spot is irradiated on the material, the material is heated to a vaporization temperature quickly, holes are formed through evaporation, the material is moved along with the light beam, and an auxiliary gas, generally an inert gas is matched to blow away molten waste residue, making the holes continuously form slits with narrow width to finish the cutting of the material;
when the position of the laser cutting device 12 is adjusted, the stepping motor 3 drives the ball screw 4 to rotate, the sliding block 5 is enabled to move transversely along the ball screw 4 through the limitation of the sliding rod 7 and the sliding sleeve 8, so that the sliding block 5 can drive the light barrier 6 to move transversely, the distance between the light barriers 6 is measured by the infrared distance measuring sensor 9 when the light barrier 6 moves, the infrared distance measuring sensor 9 is provided with a pair of infrared signal transmitting and receiving diodes, the infrared distance measuring sensor 9LDM301 transmits a beam of infrared light, a reflecting process is formed after the infrared light irradiates an object, the infrared light is reflected to the sensor and then receives the signal, then the data of the time difference between transmitting and receiving is received by image processing, and the distance of the object is calculated after the data is processed by the signal;
the light barrier 6 drives the cross rod 10 and the pneumatic telescopic rod 11 to move in the moving process, so that the laser cutting device 12 can be rapidly and accurately moved to an appointed position, after the laser cutting device is moved to the appointed position, the pneumatic telescopic rod 11 drives the laser cutting device 12 to descend, the laser cutting device 12 is opened to punch and cut the semiconductor, the constant-speed motor 13 drives the worm 14 to rotate, the rotating rod drives the workbench 16 to rotate through the rotation of the worm wheel 15, so that the semiconductor on the workbench 16 can be rapidly punched and cut, the structure is simple, the operation is convenient, the forward and reverse motor 1701 rotates reversely after punching is completed, the clamping block 1705 is separated from the semiconductor, and the semiconductor can be taken down from the workbench 16.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (5)
1. The utility model provides a laser beam drilling cutting system for semiconductor material, includes base (1), its characterized in that, the upper end lateral wall fixedly connected with mount pad (2) of base (1), mount pad (2) are hollow structure, the inner wall fixedly connected with step motor (3) of mount pad (2), the inner wall of mount pad (2) rotates and is connected with ball (4) that match with the output shaft of step motor (3), sliding sleeve is equipped with sliding block (5) on ball (4), the upper end lateral wall fixedly connected with barn door (6) of sliding block (5), fixedly connected with slide bar (7) between the both sides inner wall of mount pad (2), sliding sleeve is equipped with sliding sleeve (8) on slide bar (7), the lateral wall fixed connection of sliding block (5) is kept away from to the lower extreme lateral wall and barn door (6) of sliding sleeve (8), the inner wall of the mounting seat (2) is fixedly connected with an infrared distance measuring sensor (9), the side wall of the light barrier (6) far away from the infrared distance measuring sensor (9) is fixedly connected with a cross rod (10), one end of the cross rod (10) far away from the light barrier (6) penetrates through the inner wall of the mounting seat (2) and is fixedly connected with a pneumatic telescopic rod (11), the telescopic end of the pneumatic telescopic rod (11) is fixedly connected with a laser cutting device (12), the upper end side wall of the base (1) is provided with a mounting groove, the side wall of the mounting groove is fixedly connected with a constant speed motor (13), the side wall of the mounting groove is rotatably connected with a worm (14) matched with an output shaft of the constant speed motor (13) through a bearing, the bottom wall of the mounting groove is rotatably connected with a rotating rod (23) through a rotating shaft, and the, the one end that the pivot was kept away from in bull stick (23) runs through the opening and the fixedly connected with workstation (16) of mounting groove, workstation (16) are hollow structure, be equipped with fixture (17) in workstation (16).
2. The laser punching and cutting system for the semiconductor material is characterized in that the clamping mechanism (17) comprises a positive and negative motor (1701), the positive and negative motor (1701) is fixedly connected with the inner wall of the workbench (16), a gear (1702) is fixedly connected with an output shaft of the positive and negative motor (1701), racks (1703) matched with the gear (1702) are respectively and slidably connected with the upper and lower side walls of the workbench (16), supporting rods (1704) are respectively and fixedly connected with the side walls of the two racks (1703), two strip-shaped openings are formed in the upper end side wall of the workbench (16), the two supporting rods (1704) respectively penetrate through the two strip-shaped openings, and a clamping block (1705) is fixedly connected with the supporting rods (1704) positioned outside the workbench (16).
3. The laser punching and cutting system for the semiconductor material according to claim 2, wherein the side walls of the two sides of the rack (1703) are fixedly connected with a baffle (18), the side walls of the rack (1703) are provided with a limiting groove, a limiting rod (19) is connected in the limiting groove in a sliding manner, and the limiting rod (19) penetrates through the opening of the limiting groove and is fixedly connected with the inner wall of the workbench (16).
4. The laser drilling and cutting system for the semiconductor material according to claim 1, wherein two support rods (20) are fixedly connected to a lower end side wall of the workbench (16), the two support rods (20) are respectively located on two sides of the rotating rod (23) and are symmetrical, a sliding block (21) is fixedly connected to one end of each support rod (20) far away from the workbench (16), and an annular sliding groove matched with the sliding block (21) is formed in an upper end side wall of the base (1).
5. The laser drilling and cutting system for semiconductor materials as claimed in claim 1, wherein a multicolor warning lamp (22) is fixedly connected to the upper end side wall of the mounting seat (2), and the multicolor warning lamp (22) is electrically connected with the infrared distance measuring sensor (9) and the servo motor respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910556704.XA CN110253157B (en) | 2019-06-25 | 2019-06-25 | Laser drilling and cutting system for semiconductor material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910556704.XA CN110253157B (en) | 2019-06-25 | 2019-06-25 | Laser drilling and cutting system for semiconductor material |
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| CN110253157A CN110253157A (en) | 2019-09-20 |
| CN110253157B true CN110253157B (en) | 2021-02-26 |
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| CN201910556704.XA Active CN110253157B (en) | 2019-06-25 | 2019-06-25 | Laser drilling and cutting system for semiconductor material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111037119A (en) * | 2020-01-09 | 2020-04-21 | 沧州领创激光科技有限公司 | Continuous laser cutting machine |
| CN111230326B (en) * | 2020-02-14 | 2021-11-02 | 苏州爱果乐智能家居有限公司 | Double-shaft distance measurement positioning method based on infrared induction technology |
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| CN113001037B (en) * | 2021-02-23 | 2022-09-06 | 内蒙古兴固科技有限公司 | Cutting equipment for chip wafer processing |
| CN113927105A (en) * | 2021-09-30 | 2022-01-14 | 张�浩 | Cutting device for semiconductor |
| CN113635467B (en) * | 2021-10-14 | 2021-12-10 | 江苏煜晶光电科技有限公司 | Semiconductor production device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201271782Y (en) * | 2008-07-01 | 2009-07-15 | 北京大恒激光设备有限公司 | Follow-up laser cutting device and laser cutting machine equipped therewith |
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN104625766B (en) * | 2014-12-17 | 2017-07-28 | 山东理工大学 | Two-degree-of-freedom tilting workbench with double ball pairs |
| CN107186359A (en) * | 2017-06-27 | 2017-09-22 | 安徽联亚智能装备制造有限公司 | A kind of intelligent high-speed laser cutting machine control system |
| CN208179010U (en) * | 2018-05-04 | 2018-12-04 | 周招方 | Clamping device is used in a kind of cutting of copper pipe |
| CN208662707U (en) * | 2018-07-11 | 2019-03-29 | 常州江南万利机械配件有限公司 | A kind of forging cutter device |
| CN208811316U (en) * | 2018-08-17 | 2019-05-03 | 苏州斯尔特微电子有限公司 | A kind of High Precision Automatic cutting machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4601965B2 (en) * | 2004-01-09 | 2010-12-22 | 浜松ホトニクス株式会社 | Laser processing method and laser processing apparatus |
-
2019
- 2019-06-25 CN CN201910556704.XA patent/CN110253157B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201271782Y (en) * | 2008-07-01 | 2009-07-15 | 北京大恒激光设备有限公司 | Follow-up laser cutting device and laser cutting machine equipped therewith |
| CN104625766B (en) * | 2014-12-17 | 2017-07-28 | 山东理工大学 | Two-degree-of-freedom tilting workbench with double ball pairs |
| CN105057893A (en) * | 2015-07-27 | 2015-11-18 | 上海微世半导体有限公司 | Laser drilling and cutting system for semiconductor material |
| CN107186359A (en) * | 2017-06-27 | 2017-09-22 | 安徽联亚智能装备制造有限公司 | A kind of intelligent high-speed laser cutting machine control system |
| CN208179010U (en) * | 2018-05-04 | 2018-12-04 | 周招方 | Clamping device is used in a kind of cutting of copper pipe |
| CN208662707U (en) * | 2018-07-11 | 2019-03-29 | 常州江南万利机械配件有限公司 | A kind of forging cutter device |
| CN208811316U (en) * | 2018-08-17 | 2019-05-03 | 苏州斯尔特微电子有限公司 | A kind of High Precision Automatic cutting machine |
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| CN110253157A (en) | 2019-09-20 |
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Effective date of registration: 20240517 Address after: 221600 3rd Floor, Building A11, North Side of Pei Highway and East Side of Hanrun Road (Science and Technology Entrepreneurship Park), Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Patentee after: Security Emergency Medical Industry Technology Research Institute (Xuzhou) Co.,Ltd. Country or region after: China Address before: 221600 South Ring Road (Fengpei Road) North of Peixian County, Xuzhou City, Jiangsu Province Patentee before: Jiangsu Navigation Industry Co.,Ltd. Country or region before: China |
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