CN116093013B - Fixing device and fixing method for semiconductor packaging substrate - Google Patents
Fixing device and fixing method for semiconductor packaging substrate Download PDFInfo
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- CN116093013B CN116093013B CN202310186038.1A CN202310186038A CN116093013B CN 116093013 B CN116093013 B CN 116093013B CN 202310186038 A CN202310186038 A CN 202310186038A CN 116093013 B CN116093013 B CN 116093013B
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- groove
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- connecting rod
- fixing
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 title abstract description 52
- 238000000034 method Methods 0.000 title abstract description 10
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 238000003860 storage Methods 0.000 claims description 39
- 238000001125 extrusion Methods 0.000 claims description 36
- 230000007246 mechanism Effects 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 21
- 239000000741 silica gel Substances 0.000 claims description 21
- 229910002027 silica gel Inorganic materials 0.000 claims description 21
- 238000004140 cleaning Methods 0.000 claims description 7
- 230000010405 clearance mechanism Effects 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 8
- 239000012634 fragment Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 241000883990 Flabellum Species 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 125000003003 spiro group Chemical group 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000037081 physical activity Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning In General (AREA)
Abstract
The invention relates to the technical field of substrate fixing, in particular to a fixing device and a fixing method of a semiconductor packaging substrate.
Description
Technical Field
The invention relates to the technical field of substrate fixing, in particular to a fixing device and a fixing method of a semiconductor packaging substrate.
Background
The substrate material is a basic material for manufacturing semiconductor elements and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial needle rubbing garnet and the like which are materials used in the semiconductor industry, is manufactured by taking high-purity aluminum oxide (alumina) as a main raw material and performing high-pressure molding and high-temperature sintering, and then performing cutting and polishing.
Disclosure of Invention
The present invention is directed to a fixing device for a semiconductor package substrate, which solves the above-mentioned problems of the related art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a fixing device of semiconductor package base plate, includes base plate body, base, the inside of base is provided with the lifting unit who goes up and down, the inside of lifting unit is provided with the adjustment mechanism who fixes lifting unit, the top of lifting unit is provided with the fixed establishment who fixes the base plate body, just the base plate body is located the top of fixed establishment, one side top of fixed establishment is provided with the clearance mechanism who clears up the base plate body.
Optionally, the lifting component is including seting up at the screw thread one of base inner wall surface, the inside slip of base is provided with the lifter plate, screw thread two has been seted up to the outside surface of lifter plate, screw thread two and screw thread one spiro union, the top rotation of lifter plate is provided with pivot one, the fixed rotor plate that is provided with in top of pivot one, just the rotor plate rotates with the base to be connected, the outside fixed surface of pivot one is provided with the flabellum, the ventilation hole has been seted up to the inside of rotor plate.
Optionally, adjustment mechanism is a plurality of, adjustment mechanism is including seting up the spout one inside the rotor plate, the inside slip of spout one is provided with connecting rod one, just connecting rod one runs through the rotor plate, connecting rod one is located the outside fixed surface of spout one inside and is provided with the extrusion piece, the inside fixed reset spring one that is provided with of spout one, just reset spring one's the other end and extrusion piece fixed connection.
Optionally, the draw-in groove has been seted up to the inside of lifter plate, the bottom mounting of connecting rod one is provided with the fixture block, the fixture block is elastic material, just the fixture block has the ductility, fixture block and draw-in groove movable extrusion connection, the inside bottom mounting of draw-in groove is provided with the guide post, the guide post is the toper, just guide post and draw-in groove movable extrusion connection.
Optionally, fixed establishment is including fixed the standing groove that sets up on the rotor plate top, spout two has been seted up at the both ends of standing groove, the inside slip of spout two is provided with S-shaped shell fragment, the standing groove is close to the fixed tooth piece first that is provided with of one end of S-shaped shell fragment, one side that the S-shaped shell fragment is close to tooth piece first is fixed to be provided with tooth piece second, just tooth piece second and tooth piece first adaptation, the inside slip of standing groove is provided with the backup pad, just backup pad and S-shaped shell fragment fixed connection, the bottom mounting of backup pad is provided with reset spring two, reset spring two' S the other end and rotor plate fixed connection.
Optionally, a chute IV is arranged on one side of the placing groove close to the S-shaped elastic sheet, a rack is fixedly arranged on one side of the inner wall of the chute IV, and a chute V is arranged in the chute IV.
Optionally, spout three has been seted up on the top of backup pad, the inside slip of spout three is provided with the fixed plate, one side of fixed plate is fixed to be provided with the silica gel piece, silica gel piece and base plate body movable extrusion are connected, the inside rotation of spout three is provided with the threaded rod, the threaded rod runs through fixed plate, backup pad, just threaded rod and fixed plate spiro union, threaded rod and five sliding connection of spout, the threaded rod is located the fixed gear that is provided with of one end of spout four inside, just gear and rack engagement.
Optionally, the clearance mechanism is including seting up the spout six in standing groove one side, the inside slip of spout six is provided with the slider, the fixed gas storage tank that is provided with in top of slider, the inside slip of gas storage tank is provided with connecting rod two, the fixed breather pipe that is provided with in top of connecting rod two.
Optionally, the bottom mounting of breather pipe is provided with clean soft brush, just clean soft brush and base plate body activity extrusion connection, the venthole has been seted up to the bottom of breather pipe, one side intercommunication of air storage tank is provided with the hose, just the other end and the breather pipe intercommunication of hose are connected, the connecting rod is located the inside one end fixed sealing gasket that is provided with of air storage tank, sealing gasket and the inner wall sealing swing joint of air storage tank, sealing gasket's bottom mounting is provided with reset spring three, just reset spring's the other end and the bottom inner wall fixed connection of air storage tank.
Optionally, before processing the substrate body, the first connecting rod is pushed to drive the rotating plate to rotate in the base, the clamping block at the bottom end of the first connecting rod drives the lifting plate to synchronously rotate, the lifting plate drives the second screw thread to rotate along the first screw thread in the base, the lifting plate simultaneously ascends along the first screw thread through the second screw thread, the lifting plate synchronously ascends through the clamping block and the first connecting rod to enable the substrate body placed above the rotating plate to ascend, when the substrate body is processed and fixed, the substrate body is placed at the top end of the supporting plate, at the moment, the S-shaped elastic piece is broken off to be close to one end of the first tooth block, the second tooth block is in non-fit with the first tooth block, the S-shaped elastic piece is pressed to slide along the second sliding groove, the S-shaped elastic piece drives the supporting plate to slide in the placing groove, the support plate extrudes the reset spring II, the support plate drives the threaded rod to slide along the chute five, the threaded rod drives the gear to slide along the chute four, the gear rotates along the rack due to the meshing of the gear and the rack, the gear drives the threaded rod to rotate, the fixing plate screwed with the threaded rod drives the silica gel sheet to slide along the chute three, when the silica gel sheet is connected with the base plate body in an extrusion mode, the S-shaped elastic sheet is loosened to be close to one end of the first tooth block, the second tooth block is matched with the first tooth block, the second tooth block and the first tooth block fix the position of the support plate through the S-shaped elastic sheet, the fixing plate does not rotate along with the threaded rod to generate the position, the fixing plate drives the silica gel sheet to be connected with the base plate body in an extrusion mode, the base plate body is fixed, when the base plate body is being processed, the first connecting rod is pulled, the connecting rod is driven to extrude the piece and slide in the inside of spout one to extrude piece extrusion reset spring one, and drive the fixture block and remove when connecting rod one, make the fixture block no longer extrude with the guide post and be connected, thereby make the diameter of fixture block be less than the draw-in groove, the fixture block is along with the removal of connecting rod one this moment, the fixture block is taken out from the inside of draw-in groove, simultaneously fixture block and draw-in groove cancel extrusion are connected, promote connecting rod one this moment, make connecting rod one drive the rotor plate rotate, the rotor plate rotates the base plate body that drives the fixed establishment top rotates, and the rotor plate drives the flabellum through the pivot and rotates, the inside that the flow air that produces when making the flabellum rotate flows into the standing groove through the ventilation hole, dispel the heat to the base plate body, when processing the base plate body, the pulling air storage groove drives the slider and slides along spout six, simultaneously the air storage groove drives the breather pipe through the connecting rod two, and the breather pipe drives clean soft brush to the surface of base plate body clear up, the piece that produces when the base plate body surface absorption's of a piece, press the connecting rod two, make connecting rod two drive sealing gasket in the inside slip at the inside of air storage groove, and sealing gasket extrusion reset spring, and the inside the air storage plate body is passed through the air-jet-out of the air duct to the inside the air storage hose.
Compared with the prior art, the invention has the beneficial effects that:
1. before processing the base plate body, the staff makes the connecting rod drive the rotation plate in the inside of base through promoting connecting rod one, simultaneously drives the lifter plate synchronous rotation through the fixture block of connecting rod one bottom, and the lifter plate drives screw thread two at this moment and rotates along the inside screw thread one of base, and the lifter plate rises simultaneously along screw thread one through screw thread two, and the lifter plate passes through fixture block, connecting rod one and drives the rotation plate synchronous rising for place the base plate body of rotor plate top also rises, makes things convenient for the staff to adjust suitable working position according to self condition, avoids bending over for a long time and makes the staff produce the discomfort, leads to influencing work efficiency.
2. When processing the base plate body and fixing, place the base plate body on the top of backup pad, it is close to the one end of tooth piece to break S-shaped shell fragment, make tooth piece two cancel the adaptation with tooth piece one, press S-shaped shell fragment simultaneously and slide in the inside of standing groove along spout two, S-shaped shell fragment drives the backup pad and slides in the inside of standing groove simultaneously, and backup pad extrusion reset spring two, the backup pad drives the threaded rod at this moment, the gear slides, the gear rotates along the rack, the gear drives the threaded rod rotation, make the fixed plate with threaded rod spiro union drive the silica gel piece along spout three slides, make silica gel piece and base plate body extrusion connection, thereby fix the base plate body, and after processing is accomplished, break off the one end that moves S-shaped shell fragment and be close to tooth piece one end, make tooth piece two cancel the adaptation with tooth piece, reset spring two rebound drive backup pad return to initial position this moment, and the backup pad passes through the fixed plate, the gear drives the fixed plate, the silica gel piece returns to initial position, make the fixed plate, the silica gel piece cancel the centre gripping of base plate body after having processed, convenience is taken out the base plate body after processing.
3. When processing the base plate body, pulling connecting rod one this moment, connecting rod one is driven to extrude the piece and is sliding in the inside of spout one, and extrude piece extrusion reset spring one, and drive the fixture block and remove when connecting rod one removes, make the fixture block no longer be connected with the guide post extrusion, thereby make the diameter of fixture block be less than the draw-in groove, the fixture block is along with the removal of connecting rod one this moment, the fixture block takes out from the inside of draw-in groove, promote connecting rod one this moment, make connecting rod one drive the rotor plate rotate, the rotor plate rotates the base plate body that drives the fixed establishment top and rotates, make things convenient for the staff to process the different angles of base plate body, and the rotor plate rotates, the rotor plate drives the flabellum through the pivot and rotates, the inside of ventilation hole inflow standing groove is passed through to the air that produces when making the flabellum rotate, dispel the heat to the base plate body, avoid damaging the base plate body to the heat that produces when cutting the base plate body.
4. When processing the base plate body, the pulling air storage, make the air storage drive the slider and six slides along the spout, the air storage passes through connecting rod second drive breather pipe simultaneously and remove, and the breather pipe drives clean soft brush and clear up the surface of base plate body, the piece that produces when avoiding cutting the base plate body influences staff's operation, can't clear up when the absorptive piece in base plate body surface makes, press connecting rod second, make connecting rod second drive sealing gasket slide in the inside of air storage, and sealing gasket extrusion reset spring third, the inside of air intake pipe is passed through hose extrusion to sealing gasket with the inside of air storage this moment, the venthole of air rethread breather pipe bottom flows and spouts to the surface of base plate body, make the air blow away the piece that will adsorb at base plate body surface, thereby make things convenient for the staff to continue processing the base plate body, the precision when avoiding the piece to influence the cutting.
Drawings
FIG. 1 is a schematic diagram showing the whole structure of a fixing device for a semiconductor package substrate according to the present invention;
FIG. 2 is a cross-sectional view of a semiconductor package substrate mounting apparatus according to one embodiment of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2 showing a semiconductor package substrate fixing apparatus according to the present invention;
FIG. 4 is a cross-sectional view of a semiconductor package substrate mounting apparatus according to the present invention;
fig. 5 is an enlarged view of a portion B of a fixing device 4 of a semiconductor package substrate according to the present invention;
fig. 6 is a cross-sectional view of a fixing device for a semiconductor package substrate according to the present invention;
fig. 7 is an enlarged view of a portion C of a fixing device 6 of a semiconductor package substrate according to the present invention;
fig. 8 is an enlarged view of a portion D of a semiconductor package substrate holder 6 according to the present invention.
In the figure: 1. a substrate body; 2. a base; 3. a lifting assembly; 31. a first thread; 32. a lifting plate; 33. a second thread; 34. a first rotating shaft; 35. a rotating plate; 36. a fan blade; 37. a vent hole; 4. an adjusting mechanism; 41. a first chute; 42. a first connecting rod; 43. extruding the sheet; 44. a first reset spring; 45. a clamping block; 46. a clamping groove; 47. a guide post; 5. a fixing mechanism; 51. a placement groove; 52. a second chute; 53. s-shaped spring plates; 54. tooth block I; 55. tooth block II; 56. a support plate; 57. a chute III; 58. a fixing plate; 59. a silicone sheet; 510. a threaded rod; 511. a gear; 512. a second reset spring; 513. a chute IV; 514. a rack; 515. a chute V; 6. a cleaning mechanism; 61. a chute six; 62. a slide block; 63. a gas storage tank; 64. a second connecting rod; 65. a vent pipe; 66. cleaning the soft brush; 67. a hose; 68. a sealing gasket; 69. and a return spring III.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 to 8, the invention provides a fixing device for a semiconductor package substrate, which comprises a substrate body 1 and a base 2, wherein a lifting assembly 3 for lifting is arranged in the base 2, an adjusting mechanism 4 for fixing the lifting assembly 3 is arranged in the lifting assembly 3, a fixing mechanism 5 for fixing the substrate body 1 is arranged at the top end of the lifting assembly 3, the substrate body 1 is positioned at the top end of the fixing mechanism 5, and a cleaning mechanism 6 for cleaning the substrate body 1 is arranged at the top end of one side of the fixing mechanism 5.
Further, when processing base plate body 1, place base plate body 1 on the top of fixed establishment 5, make fixed establishment 5 fix base plate body 1, make things convenient for the staff to process base plate body 1, and operate lifting assembly 3 work during the use, make lifting assembly 3 adjust the height of base plate body 1 through fixed establishment 5, make things convenient for the staff to adjust suitable working position according to self condition, improve work efficiency, and adjust lifting assembly 3 through adjustment mechanism 4, make things convenient for the staff to change in a flexible way the adjustment of height and angle of base plate body 1, convenient operation, when processing base plate body 1, clean the surface of base plate body 1 through clearance mechanism 6, the piece that produces when avoiding the cutting covers the surface at base plate body 1, and then influence the operating accuracy of staff.
The lifting assembly 3 comprises a first thread 31 arranged on the surface of the inner wall of the base 2, a lifting plate 32 is arranged in the base 2 in a sliding mode, a second thread 33 is arranged on the outer side surface of the lifting plate 32, the second thread 33 is in threaded connection with the first thread 31, a first rotating shaft 34 is rotatably arranged at the top end of the lifting plate 32, a rotating plate 35 is fixedly arranged at the top end of the first rotating shaft 34, the rotating plate 35 is rotatably connected with the base 2, fan blades 36 are fixedly arranged on the outer side surface of the first rotating shaft 34, and ventilation holes 37 are formed in the rotating plate 35.
Further, before processing the substrate body 1, the staff drives the rotation plate 35 to rotate in the base 2 through pushing the first connecting rod 42, meanwhile, the lifting plate 32 is driven to synchronously rotate through the clamping block 45 at the bottom end of the first connecting rod 42, at this time, the lifting plate 32 drives the second screw thread 33 to rotate along the first screw thread 31 in the base 2, meanwhile, the lifting plate 32 ascends along the first screw thread 31 through the second screw thread 33, the lifting plate 32 drives the rotation plate 35 to synchronously ascend through the clamping block 45 and the first connecting rod 42, so that the substrate body 1 placed above the rotation plate 35 also ascends, the convenience is brought to the staff, the proper working position is adjusted according to the self condition, the long-time bending is avoided, the staff is uncomfortable, and the work efficiency is influenced.
The adjusting mechanism 4 is a plurality of, and adjusting mechanism 4 is including seting up the spout one 41 in rotor plate 35 inside, and the inside slip of spout one 41 is provided with connecting rod one 42, and connecting rod one 42 runs through rotor plate 35, and connecting rod one 42 is located the outside fixed surface that spout one 41 is inside and is provided with extrusion piece 43, and the inside of spout one 41 is fixedly provided with reset spring one 44, and the other end and the extrusion piece 43 fixed connection of reset spring one 44.
The draw-in groove 46 has been seted up to the inside of lifter plate 32, and the bottom mounting of connecting rod one 42 is provided with fixture block 45, and fixture block 45 is the elasticity material, and fixture block 45 has ductility, and fixture block 45 and draw-in groove 46 movable extrusion connection, and the inside bottom mounting of draw-in groove 46 is provided with guide post 47, and guide post 47 is the toper, and guide post 47 and draw-in groove 46 movable extrusion connection.
Further, when the substrate body 1 is being processed, the first connecting rod 42 is pulled at this time, the first connecting rod 42 drives the extrusion piece 43 to slide in the interior of the first sliding groove 41, and the extrusion piece 43 extrudes the first return spring 44, and the first connecting rod 42 moves while driving the clamping block 45 to move, so that the clamping block 45 is no longer connected with the guide post 47 in an extrusion mode, the diameter of the clamping block 45 is smaller than that of the clamping groove 46, at this time, the clamping block 45 moves along with the movement of the first connecting rod 42, the clamping block 45 is taken out from the inside of the clamping groove 46, meanwhile, the clamping block 45 and the clamping groove 46 cancel extrusion connection, at this time, the first connecting rod 42 is pushed, the first connecting rod 42 drives the rotating plate 35 to rotate, the rotating plate 35 drives the substrate body 1 at the top of the fixing mechanism 5 to rotate, the convenience staff processes different angles of the substrate body 1, and the rotating plate 35 rotates while the rotating plate 35 drives the fan blade 36 to rotate through the first rotating shaft 34, the flowing air generated during the rotation of the fan blade 36 flows into the inside of the placing groove 51 through the vent hole 37, the heat dissipation of the substrate body 1 is avoided to be generated during cutting the substrate body 1, after the angle is adjusted, the first connecting rod 42 is released, the first connecting rod 45 is driven from the inside the clamping block 45 is taken out from the inside the clamping groove 46 through the inside of the clamping block 45, the clamping block 45 is simultaneously, the first connecting rod 45 is driven by the reset spring 44 drives the first return spring 44, the first connecting rod 45 is driven to rotate the second connecting rod 45 through the reset spring and the clamping groove 45 is driven to rotate the inside the groove 45, and the groove 45 is prevented from being connected with the inside the groove 45 through the groove and the groove 45 is compressed through the groove 45, and the groove is kept to be connected with the groove, and the groove is prevented to be connected to be the 45 and the inside the 45.
The fixing mechanism 5 comprises a placing groove 51 fixedly arranged at the top end of the rotating plate 35, two ends of the placing groove 51 are provided with a second sliding groove 52, an S-shaped elastic piece 53 is slidably arranged in the second sliding groove 52, one end, close to the S-shaped elastic piece 53, of the placing groove 51 is fixedly provided with a first tooth block 54, one side, close to the first tooth block 54, of the S-shaped elastic piece 53 is fixedly provided with a second tooth block 55, the second tooth block 55 is matched with the first tooth block 54, a supporting plate 56 is slidably arranged in the placing groove 51, the supporting plate 56 is fixedly connected with the S-shaped elastic piece 53, a second reset spring 512 is fixedly arranged at the bottom end of the supporting plate 56, and the other end of the second reset spring 512 is fixedly connected with the rotating plate 35.
A fourth sliding groove 513 is formed in one side, close to the S-shaped elastic sheet 53, of the placing groove 51, a rack 514 is fixedly arranged on one side of the inner wall of the fourth sliding groove 513, and a fifth sliding groove 515 is formed in the fourth sliding groove 513.
The spout III 57 has been seted up on the top of backup pad 56, the inside slip of spout III 57 is provided with fixed plate 58, one side of fixed plate 58 is fixed to be provided with silica gel piece 59, silica gel piece 59 and base plate body 1 movable extrusion connection, the inside rotation of spout III 57 is provided with threaded rod 510, threaded rod 510 runs through fixed plate 58, backup pad 56, and threaded rod 510 and fixed plate 58 spiro union, threaded rod 510 and spout V515 sliding connection, threaded rod 510 is located the inside one end of spout IV 513 and is fixedly provided with gear 511, and gear 511 and rack 514 meshing.
Further, when the base plate body 1 is processed and fixed, the base plate body 1 is placed on the top end of the supporting plate 56, at this time, the S-shaped elastic piece 53 is broken close to one end of the first tooth block 54, so that the second tooth block 55 and the first tooth block 54 are out of fit, meanwhile, the S-shaped elastic piece 53 is pressed to slide along the second sliding groove 52 in the placing groove 51, meanwhile, the S-shaped elastic piece 53 drives the supporting plate 56 to slide in the placing groove 51, and the supporting plate 56 presses the return spring second 512, at this time, the supporting plate 56 drives the threaded rod 510 to slide along the fifth sliding groove 515, the threaded rod 510 drives the gear 511 to slide along the fourth sliding groove 513, and as the gear 511 is meshed with the rack 514, the gear 511 rotates along the rack 514, meanwhile, the gear 511 drives the threaded rod 510 to rotate, so that the fixing plate 58 screwed with the threaded rod 510 drives the silica gel sheet 59 to slide along the third sliding groove 57, and when the silica gel sheet 59 is connected with the base plate body 1 in a pressing manner, loosening one end of the S-shaped elastic sheet 53 close to the first tooth block 54 to enable the second tooth block 55 to be matched with the first tooth block 54, fixing the position of the supporting plate 56 through the S-shaped elastic sheet 53 at the moment, enabling the fixing plate 58 not to rotate along with the threaded rod 510 to generate the position, enabling the fixing plate 58 to drive the silica gel sheet 59 to be kept in extrusion connection with the base plate body 1, fixing the base plate body 1, facilitating working of the base plate body 1 by workers, breaking one end of the S-shaped elastic sheet 53 close to the first tooth block 54 after the working is finished, enabling the second tooth block 55 to be out of matching with the first tooth block 54, enabling the second return spring 512 to rebound to drive the supporting plate 56 to return to the initial position, enabling the supporting plate 56 to drive the fixing plate 58 and the silica gel sheet 59 to return to the initial position through the threaded rod 510 and the gear 511, enabling the fixing plate 58 and the silica gel sheet 59 to cancel clamping and fixing the base plate 1, the processed substrate body 1 is conveniently taken out, and the operation is convenient.
The cleaning mechanism 6 comprises a sliding groove six 61 formed in one side of the placing groove 51, a sliding block 62 is slidably arranged in the sliding groove six 61, an air storage groove 63 is fixedly formed in the top end of the sliding block 62, a connecting rod two 64 is slidably arranged in the air storage groove 63, and an air pipe 65 is fixedly arranged at the top end of the connecting rod two 64.
The bottom end mounting of breather pipe 65 is provided with clean soft brush 66, and clean soft brush 66 and base plate body 1 activity extrusion are connected, the venthole has been seted up to the bottom of breather pipe 65, one side intercommunication of air storage tank 63 is provided with hose 67, and the other end and the breather pipe 65 intercommunication of hose 67 are connected, the fixed sealing washer 68 that is provided with of one end that is located air storage tank 63 inside of connecting rod two 64, sealing washer 68 and the inner wall sealing swing joint of air storage tank 63, the bottom mounting of sealing washer 68 is provided with reset spring three 69, and the other end and the bottom inner wall fixed connection of air storage tank 63 of reset spring three 69.
Further, when processing base plate body 1, pulling gas storage tank 63 makes gas storage tank 63 drive slider 62 and slides along spout six 61, simultaneously gas storage tank 63 drives breather pipe 65 through connecting rod two 64 and removes, and breather pipe 65 drives clean soft brush 66 and clear up the surface of base plate body 1, the piece that produces when avoiding cutting base plate body 1 influences the operation of staff, can't clear up the piece that produces when base plate body 1 surface absorption makes, press connecting rod two 64, make connecting rod two 64 drive seal gasket 68 and slide in the inside of gas storage tank 63, and seal gasket 68 extrudees reset spring three 69, seal gasket 68 is with the inside air of gas storage tank 63 through hose 67 extrusion into breather pipe 65 this moment, the air is flowed out and is spouted to the surface of base plate body 1 through the venthole of breather pipe 65 bottom, make the piece that the air will adsorb at base plate body 1 surface blow away, thereby make things convenient for the staff to continue to process base plate body 1, the precision when avoiding the piece to influence the cutting.
Working principle: before processing the substrate body 1, a worker pushes the first connecting rod 42 to drive the first rotating plate 35 to rotate in the base 2, and simultaneously drives the lifting plate 32 to synchronously rotate through the clamping block 45 at the bottom end of the first connecting rod 42, and at the moment, the lifting plate 32 drives the second screw thread 33 to rotate along the first screw thread 31 in the base 2, and simultaneously the lifting plate 32 lifts along the first screw thread 31 through the second screw thread 33, and the lifting plate 32 drives the first rotating plate 35 to synchronously lift through the clamping block 45 and the first connecting rod 42, so that the substrate body 1 placed above the rotating plate 35 also lifts, thereby being convenient for the worker to adjust a proper working position according to self conditions, when the substrate body 1 is processed and fixed, the substrate body 1 is placed at the top end of the supporting plate 56, and at the moment, the S-shaped elastic sheet 53 is close to one end of the first tooth block 54, so that the second tooth block 55 and the first tooth block 54 are not matched, simultaneously, the S-shaped elastic sheet 53 is pressed to slide in the placing groove 51 along the second sliding groove 52, meanwhile, the S-shaped elastic sheet 53 drives the supporting plate 56 to slide in the placing groove 51, the supporting plate 56 extrudes the reset spring II 512, the supporting plate 56 drives the threaded rod 510 to slide along the fifth sliding groove 515, the threaded rod 510 drives the gear 511 to slide along the fourth sliding groove 513, the gear 511 is meshed with the rack 514, so that the gear 511 rotates along the rack 514, the gear 511 drives the threaded rod 510 to rotate, the fixing plate 58 screwed with the threaded rod 510 drives the silica gel sheet 59 to slide along the third sliding groove 57, when the silica gel sheet 59 is connected with the base plate body 1 in a pressing mode, one end of the S-shaped elastic sheet 53, close to the first toothed block 54, is loosened, the second toothed block 55 is matched with the first toothed block 54, and the second toothed block 55 and the first toothed block 54 fix the position of the supporting plate 56 through the S-shaped elastic sheet 53, the fixing plate 58 does not rotate along with the threaded rod 510 to generate a position, so that the fixing plate 58 drives the silica gel sheet 59 to be in extrusion connection with the substrate body 1, the substrate body 1 is fixed, a worker can conveniently process the substrate body 1, when the substrate body 1 is being processed, the first connecting rod 42 is pulled, the first connecting rod 42 drives the first extruding sheet 43 to slide in the first sliding groove 41, the first extruding sheet 43 extrudes the return spring 44, the first connecting rod 42 moves and drives the clamping block 45 to move, the clamping block 45 is not in extrusion connection with the guide post 47 any more, the diameter of the clamping block 45 is smaller than that of the clamping groove 46, the clamping block 45 is taken out from the inside of the clamping groove 46 along with the movement of the first connecting rod 42, the clamping block 45 is in extrusion connection with the clamping groove 46, the first connecting rod 42 is pushed, the first connecting rod 42 drives the rotating plate 35 to rotate, the rotation of the rotating plate 35 drives the substrate body 1 at the top end of the fixing mechanism 5 to rotate, which is convenient for workers to process different angles of the substrate body 1, and the rotating plate 35 drives the fan blades 36 to rotate through the first rotating shaft 34 while the rotating plate 35 rotates, so that flowing air generated when the fan blades 36 rotate flows into the inside of the placement groove 51 through the vent holes 37 to radiate heat of the substrate body 1, when the substrate body 1 is processed, the air storage groove 63 is pulled, the air storage groove 63 drives the sliding block 62 to slide along the sliding groove six 61, meanwhile, the air storage groove 63 drives the vent pipe 65 to move through the second connecting rod 64, and the vent pipe 65 drives the cleaning soft brush 66 to clean the surface of the substrate body 1, thereby avoiding the influence of chips generated when the substrate body 1 is cut on the operation of workers, when the chips adsorbed on the surface of the substrate body 1 can not be cleaned, the second connecting rod 64 is pressed, the second connecting rod 64 drives the sealing gasket 68 to slide in the air storage groove 63, the sealing gasket 68 extrudes the third reset spring 69, at the moment, the sealing gasket 68 extrudes air in the air storage groove 63 into the air pipe 65 through the hose 67, and the air flows out through the air outlet hole at the bottom end of the air pipe 65 and is sprayed to the surface of the substrate body 1, so that the air blows away the scraps adsorbed on the surface of the substrate body 1, and the substrate body 1 is conveniently processed by workers continuously.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. The utility model provides a fixing device of semiconductor package base plate, includes base plate body (1), base (2), its characterized in that, the inside of base (2) is provided with lift subassembly (3) that go up and down, the inside of lift subassembly (3) is provided with adjustment mechanism (4) that go on fixing to lift subassembly (3), the top of lift subassembly (3) is provided with fixed establishment (5) that go on fixing to base plate body (1), just base plate body (1) are located the top of fixed establishment (5), one side top of fixed establishment (5) is provided with clearance mechanism (6) that clear up base plate body (1);
the lifting assembly (3) comprises a first thread (31) arranged on the surface of the inner wall of the base (2), a lifting plate (32) is arranged in the base (2) in a sliding mode, a second thread (33) is arranged on the outer side surface of the lifting plate (32), the second thread (33) is in threaded connection with the first thread (31), a first rotating shaft (34) is rotatably arranged at the top end of the lifting plate (32), a rotating plate (35) is fixedly arranged at the top end of the first rotating shaft (34), the rotating plate (35) is rotatably connected with the base (2), fan blades (36) are fixedly arranged on the outer side surface of the first rotating shaft (34), and vent holes (37) are formed in the rotating plate (35);
the plurality of adjusting mechanisms (4) are arranged, each adjusting mechanism (4) comprises a first sliding groove (41) arranged in the rotating plate (35), a first connecting rod (42) is arranged in the first sliding groove (41) in a sliding mode, the first connecting rod (42) penetrates through the rotating plate (35), a squeezing sheet (43) is fixedly arranged on the outer side surface of the first connecting rod (42) positioned in the first sliding groove (41), a first reset spring (44) is fixedly arranged in the first sliding groove (41), and the other end of the first reset spring (44) is fixedly connected with the squeezing sheet (43);
the lifting device is characterized in that a clamping groove (46) is formed in the lifting plate (32), a clamping block (45) is fixedly arranged at the bottom end of the first connecting rod (42), the clamping block (45) is made of elastic materials, the clamping block (45) is ductile, the clamping block (45) is movably connected with the clamping groove (46) in an extrusion mode, a guide column (47) is fixedly arranged at the bottom end of the inside of the clamping groove (46), the guide column (47) is conical, and the guide column (47) is movably connected with the clamping groove (46) in an extrusion mode;
the fixing mechanism (5) comprises a placing groove (51) fixedly arranged at the top end of the rotating plate (35), two ends of the placing groove (51) are provided with a second sliding groove (52), an S-shaped elastic piece (53) is slidably arranged in the second sliding groove (52), one end, close to the S-shaped elastic piece (53), of the placing groove (51) is fixedly provided with a first tooth block (54), one side, close to the first tooth block (54), of the S-shaped elastic piece (53) is fixedly provided with a second tooth block (55), the second tooth block (55) is matched with the first tooth block (54), a supporting plate (56) is slidably arranged in the placing groove (51), the supporting plate (56) is fixedly connected with the second S-shaped elastic piece (53), the bottom end of the supporting plate (56) is fixedly provided with a second return spring (512), and the other end of the second return spring (512) is fixedly connected with the rotating plate (35).
A fourth sliding groove (513) is formed in one side, close to the S-shaped elastic sheet (53), of the placing groove (51), a rack (514) is fixedly arranged on one side of the inner wall of the fourth sliding groove (513), and a fifth sliding groove (515) is formed in the fourth sliding groove (513);
a third sliding groove (57) is formed in the top end of the supporting plate (56), a fixing plate (58) is slidably arranged in the third sliding groove (57), a silica gel sheet (59) is fixedly arranged on one side of the fixing plate (58), the silica gel sheet (59) is movably connected with the base plate body (1) in an extrusion mode, a threaded rod (510) is rotatably arranged in the third sliding groove (57), the threaded rod (510) penetrates through the fixing plate (58) and the supporting plate (56), the threaded rod (510) is in threaded connection with the fixing plate (58), the threaded rod (510) is slidably connected with a fifth sliding groove (515), a gear (511) is fixedly arranged at one end of the threaded rod (510) located in the fourth sliding groove (513), and the gear (511) is meshed with the rack (514);
the cleaning mechanism (6) comprises a sliding groove six (61) arranged on one side of the placing groove (51), a sliding block (62) is arranged in the sliding groove six (61) in a sliding mode, an air storage groove (63) is fixedly formed in the top end of the sliding block (62), a connecting rod II (64) is arranged in the air storage groove (63) in a sliding mode, and a vent pipe (65) is fixedly arranged at the top end of the connecting rod II (64);
the bottom end fixing of breather pipe (65) is provided with clean soft brush (66), just clean soft brush (66) and base plate body (1) movable extrusion are connected, the venthole has been seted up to the bottom of breather pipe (65), one side intercommunication of air storage tank (63) is provided with hose (67), just the other end and the breather pipe (65) intercommunication of hose (67) are connected, connecting rod two (64) are located the fixed sealing washer (68) that are provided with of the inside one end of air storage tank (63), sealing washer (68) and the inner wall sealing swing joint of air storage tank (63), the bottom fixed of sealing washer (68) is provided with reset spring three (69), just the other end of reset spring three (69) and the bottom inner wall fixed connection of air storage tank (63).
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| CN202310186038.1A CN116093013B (en) | 2023-03-01 | 2023-03-01 | Fixing device and fixing method for semiconductor packaging substrate |
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| CN202310186038.1A CN116093013B (en) | 2023-03-01 | 2023-03-01 | Fixing device and fixing method for semiconductor packaging substrate |
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| CN116093013B true CN116093013B (en) | 2023-10-31 |
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| CN116943953B (en) * | 2023-06-08 | 2024-04-19 | 郑州轻工业大学 | Gluing device for packaging semiconductor refrigeration piece |
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