CN113629180A - Packaging method of miniature semiconductor refrigerator - Google Patents
Packaging method of miniature semiconductor refrigerator Download PDFInfo
- Publication number
- CN113629180A CN113629180A CN202110869860.9A CN202110869860A CN113629180A CN 113629180 A CN113629180 A CN 113629180A CN 202110869860 A CN202110869860 A CN 202110869860A CN 113629180 A CN113629180 A CN 113629180A
- Authority
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- China
- Prior art keywords
- graphite jig
- monomer
- solder paste
- ceramic wafer
- steel mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 99
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 50
- 239000010439 graphite Substances 0.000 claims abstract description 50
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 32
- 239000010959 steel Substances 0.000 claims abstract description 32
- 238000010030 laminating Methods 0.000 claims abstract description 19
- 230000001680 brushing effect Effects 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 40
- 239000000178 monomer Substances 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 31
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a packaging method of a miniature semiconductor refrigerator, which comprises the steps of cutting an upper ceramic plate and a lower ceramic plate into single ceramic plates, arranging each single ceramic plate on a graphite jig, brushing glue on each single ceramic plate in batches by adopting a steel mesh, sending the graphite jig loaded with a plurality of single ceramic plates into a chip laminating machine to attach particles, and welding. The practical production verifies that the production efficiency of the method is improved by 200 percent compared with the traditional packaging method, and the product percent of pass is improved by 10 percent compared with the traditional packaging method.
Description
Technical Field
The invention belongs to the field of semiconductor refrigeration, and particularly relates to a packaging method of a miniature semiconductor refrigerator.
Background
Tec (thermoelectric cooler), semiconductor cooler: it is a device for producing cold by using the thermo-electric effect of semiconductor, also called thermoelectric refrigerator. The semiconductor refrigerator has the characteristics of no noise, no vibration, no need of refrigerant, small volume, light weight and the like, and has the advantages of reliable work, simple and convenient operation and easy cold quantity regulation. Because the refrigeration coefficient of the TEC is small, and the electricity consumption is relatively large, the TEC is mainly used for occasions with small refrigeration consumption and small occupied space, such as the cooling of certain elements in electronic equipment and radio communication equipment; some are also used in domestic refrigerators but are not economical. The semiconductor refrigerator can also be made into a zero point instrument for ensuring the zero point temperature in the temperature measurement of the thermocouple. The micro semiconductor refrigerator is smaller in size than a conventional semiconductor refrigerator, and is commonly used for digital products and the like.
The current common packaging method of the miniature semiconductor refrigerator is to spot solder paste on a lower ceramic chip, attach particles on the lower ceramic chip through a patch device, perform reflow soldering treatment, spot solder paste on an upper ceramic chip, cover the upper ceramic chip on the lower ceramic chip, perform reflow soldering treatment and then slice the lower ceramic chip to complete packaging. However, this prior art process mainly suffers from the following disadvantages: 1. in the existing process flow, tin paste needs to be dotted on the upper ceramic piece and the lower ceramic piece, so that the time cost is improved, and the production efficiency is reduced; 2. in the existing process flow, when the upper and lower ceramic plates are cut into slices after packaging is finished, metal dust can cause short circuit of the TEC, and the qualification rate of products is reduced.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the packaging method of the miniature semiconductor refrigerator, which has high universality, can be suitable for large-scale packaging and can effectively improve the production yield and the production efficiency at the same time.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows:
a packaging method of a miniature semiconductor cooler comprises the following steps:
(1) slicing the lower ceramic wafer with the graphical metal layer into a single lower ceramic wafer, and then mounting the single lower ceramic wafer on a graphite jig;
(2) attaching a steel mesh to the graphite jig, and brushing solder paste at the solder paste brushing holes on the steel mesh so as to brush the solder paste on the patterned metal layer of the ceramic wafer under each monomer;
(3) attaching heat conducting particles to the single lower ceramic plates brushed with the solder paste in batches, then welding, and inverting the single lower ceramic plates welded with the heat conducting particles on a wafer disc of a chip laminating machine;
(4) slicing the upper ceramic wafer with the graphical metal layer into a single upper ceramic wafer, and mounting the single upper ceramic wafer on a graphite jig;
(5) attaching a steel mesh to the graphite jig, and brushing solder paste at the solder paste brushing holes on the steel mesh so as to brush the solder paste on the patterned metal layer of the ceramic wafer on each monomer;
(6) and (3) correspondingly attaching the inverted monomer lower ceramic plates to the monomer upper ceramic plates brushed with the tin paste in batches, and welding to obtain the miniature semiconductor refrigerator.
Preferably, in the step (3), the attaching the heat conductive particles in batch includes: the graphite jig provided with the single lower ceramic wafer brushed with the solder paste is collected by the cartridge clip, then the cartridge clip is placed on the chip laminating machine equipment, the graphite jig is conveyed to the working position of the chip laminating machine by the chip laminating machine equipment, and then the heat conduction particles are attached to the ceramic wafer under each single.
Preferably, in the step (6), the step of correspondingly attaching the inverted single lower ceramic sheet to the single upper ceramic sheet brushed with the solder paste in batches includes: the graphite jig with the ceramic wafer on the monomer is collected by the cartridge clip, then the cartridge clip is placed on chip laminating machine equipment, the graphite jig in the cartridge clip is grabbed by the chip laminating machine and conveyed to an equipment working position, and the inverted ceramic wafer under the monomer is correspondingly attached to the ceramic wafer on the monomer with the tin paste in batches.
Preferably, the graphite jig is provided with a plurality of limiting grooves for limiting the single ceramic wafers; the limiting grooves are regularly distributed on the graphite jig.
Preferably, the tin paste brushing holes on the steel mesh are arranged according to the positions of the limiting grooves on the graphite jig and the patterned metal layer on the single ceramic wafer; and a plurality of solder paste brushing holes are formed in the area of the steel mesh, which is opposite to the patterned metal layer of the single ceramic wafer in each limiting groove.
Preferably, the edge of the graphite jig is provided with a plurality of protrusions or positioning grooves, and the corresponding position of the steel mesh is provided with positioning holes or protrusions matched with the protrusions or positioning grooves.
Preferably, in the step (3) and the step (6), the soldering is reflow soldering.
The beneficial effects produced by the invention are as follows:
according to the invention, the upper ceramic plate and the lower ceramic plate are cut into the single ceramic plates, the single ceramic plates are arranged on the graphite jig, the single ceramic plates are brushed with glue in batches by adopting the steel mesh, and then the graphite jig loaded with the plurality of single ceramic plates is sent to the chip laminating machine to attach the particles and are welded, so that the problem of short circuit of the semiconductor refrigerator caused by metal dust generated by slicing can be avoided, the cost can be reduced, the efficiency is improved, and the product percent of pass is increased. The practical production verifies that the production efficiency of the method is improved by 200 percent compared with the traditional packaging method, and the product percent of pass is improved by 10 percent compared with the traditional packaging method.
Drawings
Fig. 1 is a schematic position diagram of a graphite jig, a steel mesh and a single ceramic wafer.
Fig. 2 is a clamping diagram of a graphite jig.
Fig. 3 is an exploded view of a miniature semiconductor.
Reference numerals:
1. a graphite jig; 2. a ceramic plate is arranged on the monomer; 3. a steel mesh; 4. thermally conductive particles; 5. tin paste; 6. a single lower ceramic plate; 7. a cartridge clip; 8. and patterning the metal layer.
Detailed Description
The invention is further described below with reference to the drawings and specific preferred embodiments of the description, without thereby limiting the scope of protection of the invention.
The invention provides a packaging method of a miniature semiconductor refrigerator, which comprises the following steps:
(1) slicing the lower ceramic wafer with the patterned metal layer 8 into single lower ceramic wafers 6, arranging the patterned metal layer 8 on each single lower ceramic wafer 6, and then installing the single lower ceramic wafers 6 on the graphite jig 1, as shown in fig. 1;
(2) attaching a steel mesh 3 to the graphite jig 1 and positioning the graphite jig 1 and the graphite jig, wherein a solder paste brushing hole is formed in the steel mesh 3 in a region corresponding to the patterned metal layer 8 of each monomer lower ceramic plate 6, a solder paste 5 is brushed at the solder paste brushing hole corresponding to each monomer lower ceramic plate 6 on the steel mesh 3, and the solder paste 5 falls onto the patterned metal layer 8 of each monomer lower ceramic plate 6 from the hole so as to brush the solder paste 5 on the patterned metal layer 8 of each monomer lower ceramic plate 6;
(3) attaching the heat conducting particles 4 to the monomer lower ceramic plates 6 brushed with the solder paste 5 in batches, then performing reflow soldering, and inverting the monomer lower ceramic plates 6 welded with the heat conducting particles 4 on a wafer disc of a chip attaching machine;
(4) slicing the upper ceramic wafer with the graphical metal layer 8 into single upper ceramic wafers 2, arranging the graphical metal layer 8 on each single upper ceramic wafer 2, and installing the single upper ceramic wafers 2 on the graphite jig 1;
(5) attaching a steel mesh 3 to the graphite jig 1, positioning the graphite jig 1 and the graphite jig, brushing solder paste 5 at solder paste brushing holes of the ceramic plates 2 on the steel mesh 3 corresponding to the monomers, and dropping the solder paste 5 onto the patterned metal layer 8 of the ceramic plates 2 on the corresponding monomers from the holes so as to brush the solder paste 5 on the ceramic plates 2 on the monomers;
(6) and (3) correspondingly attaching the inverted monomer lower ceramic plates 6 on the monomer upper ceramic plates 2 brushed with the solder paste 5 in batches, and performing reflow soldering to obtain the miniature semiconductor refrigerator.
In the step (3), attaching the heat conductive particles 4 in batch includes: the graphite jig 1 loaded with the monomer lower ceramic plate 6 brushed with the solder paste 5 is collected by the cartridge clip 7, as shown in fig. 2, the cartridge clip 7 is placed on the chip laminating machine equipment, the graphite jig 1 is conveyed to the working position of the chip laminating machine by the chip laminating machine equipment, and then the heat conducting particles 4 are attached to the monomer lower ceramic plate 6.
In the step (6), the step of correspondingly attaching the inverted monomer lower ceramic pieces 6 on the monomer upper ceramic pieces 2 brushed with the solder paste 5 in batches comprises the following steps: the graphite jig 1 loaded with the monomer upper ceramic plate 2 is collected by the cartridge clip 7, then the cartridge clip 7 is placed on the chip laminating machine equipment, the graphite jig 1 in the cartridge clip 7 is grabbed by the chip laminating machine and conveyed to the equipment working position, and the inverted monomer lower ceramic plate 6 is correspondingly attached to the monomer upper ceramic plate 2 brushed with the tin paste 5 in batches.
The graphite jig 1 is provided with a plurality of limiting grooves for limiting the single ceramic plates, as shown in fig. 3; the limiting grooves are regularly distributed on the graphite jig 1.
The holes in the steel mesh 3 are arranged according to the positions of the limiting grooves on the graphite jig 1 and the patterned metal layer 8 on the single ceramic wafer; the steel mesh 3 is provided with a plurality of pores in the area facing the patterned metal layer 8 of the single ceramic wafer in each limiting groove, as shown in fig. 3. The arrangement mode can ensure that the solder paste 5 can just fall to the specific position of the patterned metal layer 8 of the single ceramic wafer through the holes on the steel mesh 3 when the solder paste 5 is brushed, so that the accuracy of the brushing position of the solder paste 5 position and the consistency of the solder paste 5 positions of the upper and lower single ceramic wafers can be ensured, and the packaging quality, the yield and the consistency of the miniature semiconductor can be ensured.
A plurality of protrusions or positioning grooves are arranged on the edges of the graphite jig 1 and the steel mesh 3, and a plurality of positioning holes or protrusions matched with the protrusions or grooves are arranged at corresponding positions of the steel mesh 3, as shown in fig. 3. When the solder paste 5 needs to be brushed, the steel mesh 3 can be attached to the graphite jig 1, the graphite jig 1 and the steel mesh 3 are limited by the matched protrusion-hole or groove-protrusion, the graphite jig 1 and the steel mesh 3 are accurately positioned, the steel mesh 3 can be prevented from being out of position when the solder paste 5 is brushed subsequently, and the consistency and yield of final products are improved.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner. Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or equivalent modifications, without departing from the spirit and scope of the invention, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention.
Claims (7)
1. A packaging method of a miniature semiconductor cooler is characterized by comprising the following steps:
(1) slicing the lower ceramic wafer with the graphical metal layer into a single lower ceramic wafer, and then mounting the single lower ceramic wafer on a graphite jig;
(2) attaching a steel mesh to the graphite jig, and brushing solder paste at the solder paste brushing holes on the steel mesh so as to brush the solder paste on the patterned metal layer of the ceramic wafer under each monomer;
(3) attaching heat conducting particles to the monomer lower ceramic plates brushed with the tin paste in batches, then welding, and inverting the monomer lower ceramic plates welded with the heat conducting particles on a wafer disc of a chip laminating machine;
(4) slicing the upper ceramic wafer with the graphical metal layer into a single upper ceramic wafer, and mounting the single upper ceramic wafer on a graphite jig;
(5) attaching a steel mesh to the graphite jig, and brushing solder paste at the solder paste brushing holes on the steel mesh so as to brush the solder paste on the patterned metal layer of the ceramic wafer on each monomer;
(6) and (3) correspondingly attaching the inverted monomer lower ceramic plates to the monomer upper ceramic plates brushed with the tin paste in batches, and welding to obtain the miniature semiconductor refrigerator.
2. The method for packaging a micro semiconductor cooler according to claim 1, wherein the attaching the thermally conductive particles in bulk in step (3) comprises: the graphite jig for loading the monomer lower ceramic chip brushed with the tin paste is collected by a cartridge clip, the cartridge clip is placed on chip laminating machine equipment, the graphite jig is conveyed to a working position of the chip laminating machine by the chip laminating machine equipment, and then the heat conducting particles are attached to the monomer lower ceramic chip.
3. The packaging method of a micro semiconductor cooler according to claim 1, wherein in the step (6), the step of correspondingly attaching the inverted single lower ceramic sheet to the single upper ceramic sheet brushed with the solder paste in batch comprises: the graphite jig with the ceramic wafer on the monomer is collected by the cartridge clip, the cartridge clip is placed on chip laminating machine equipment, the graphite jig in the cartridge clip is grabbed by the chip laminating machine and conveyed to an equipment working position, and the inverted ceramic wafer under the monomer is correspondingly attached to the ceramic wafer on the monomer brushed with the tin paste in batches.
4. The packaging method of a micro semiconductor refrigerator according to claim 1, wherein the graphite jig is provided with a plurality of limiting grooves for limiting the single ceramic wafer; the limiting grooves are regularly distributed on the graphite jig.
5. The packaging method of a micro semiconductor cooler according to claim 4, wherein the solder paste-brushing holes on the steel mesh are arranged according to the position of the limiting groove on the graphite jig and the patterned metal layer on the single ceramic sheet; and a plurality of solder paste brushing holes are formed in the area of the steel mesh, which is opposite to the patterned metal layer of the single ceramic wafer in each limiting groove.
6. The packaging method of a micro semiconductor cooler according to claim 1, wherein the graphite jig has a plurality of protrusions or positioning grooves on its edge, and the steel mesh has positioning holes or protrusions at corresponding positions to engage with the protrusions or positioning grooves.
7. A method for packaging a micro semiconductor cooler according to claim 1, wherein the soldering is reflow soldering in step (3) and step (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110869860.9A CN113629180B (en) | 2021-07-30 | 2021-07-30 | Packaging method of miniature semiconductor refrigerator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110869860.9A CN113629180B (en) | 2021-07-30 | 2021-07-30 | Packaging method of miniature semiconductor refrigerator |
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| CN113629180A true CN113629180A (en) | 2021-11-09 |
| CN113629180B CN113629180B (en) | 2024-03-29 |
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| CN202110869860.9A Active CN113629180B (en) | 2021-07-30 | 2021-07-30 | Packaging method of miniature semiconductor refrigerator |
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| Publication number | Publication date |
|---|---|
| CN113629180B (en) | 2024-03-29 |
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