CN206578408U - Semiconductor chilling plate weld mold - Google Patents
Semiconductor chilling plate weld mold Download PDFInfo
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- CN206578408U CN206578408U CN201720231364.XU CN201720231364U CN206578408U CN 206578408 U CN206578408 U CN 206578408U CN 201720231364 U CN201720231364 U CN 201720231364U CN 206578408 U CN206578408 U CN 206578408U
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Abstract
The utility model is related to a kind of semiconductor chilling plate weld mold, belongs to semiconductor chilling plate field, including the first frame, the second frame, the 3rd frame and the 4th frame, and the first frame is parallel with the second frame, and is detachably connected by multiple first cuttings；First cutting is respectively positioned on same plane, and spacing is equal；3rd frame is parallel with the 4th frame, and is detachably connected by multiple second cuttings；Second cutting is respectively positioned on same plane, and spacing is equal；First cutting is stacked with the second cutting, and is mutually perpendicular to, and constitutes lattice-shaped structure；The processing of the utility model product manufacturing is simple and convenient, operate with simple and efficient, assembly and disassembly is convenient and swift, can either ensure element (semiconductor refrigerating crystal grain) welding when not be shifted over it is inclined under the premise of, realize two-sided welding, the operation difficulty of semiconductor chilling plate welding can be reduced again, greatly improve production efficiency and the product quality and refrigerating efficiency of semiconductor chilling plate.
Description
Technical field
The utility model is related to electronic component field, more particularly to a kind of semiconductor chilling plate weld mold.
Background technology
As electronic technology is developed rapidly, in Electronic Components Manufacturing and manufacturing process, based on quick production and erector
Skill requires more and more stricter, proposes a kind of new thinking and mounting process method, solves production efficiency and production technology, is very
Necessary and urgent.
Semiconductor chilling plate is a kind of solid-state refrigeration device, and N-P thermoelements are made up of some, thermoelectric material is utilized
The peltier effect (Peltier effect) of material；When logical direct current, the one side of cooling piece absorbs heat, and another side releases heat
Amount, so as to realize the purpose of refrigeration；The refrigeration modes have without mechanical moving element, no refrigerant and environment-friendly type it is simple in construction
The characteristics of.
At present, semiconductor chilling plate species is various, there is TEC series, TEM series, TES series, TEF series etc., and market should
With more ripe.With the rapid development of electronic technology, replacing traditional ceramics substrate using metal material substrate, New Refrigerating is used as
Plate base is just in high speed development.But it is irregular not to temperature-difference refrigerating piece manufacturing technology level due to each producer and research unit
Together, cause temperature-difference refrigerating product very different, this is also to limit one of factor that cooling piece is widely used.
The welding of traditional semiconductor chilling plate generally uses grid mould and two-sided welding two ways.
Grid mould profile uses grid Mold Making cooling piece, is separately to weld on the two sides of cooling piece；It is being brushed with
Mould is put on the refrigeration plate base of tin cream, then N-type and p-type semiconductor material are put into mould, is then welded；Weld
Into after one side, mould is taken out, then welds cooling piece another side substrate.Though this mode is not moved when can ensure that element welding
Position and tilt, but troublesome poeration and efficiency is low, and cooling piece one side by welding twice, welding matter can be substantially reduced
Amount.
Two-sided welding mode is will freeze welding substrate solder printed on both sides or tin cream, then by N-type and P-type semiconductor material
Material by design drawing be placed on one side with printing solder or tin cream cooling piece substrate surface on, then another side be printed with solder or
Tin cream substrate is placed on above, and two sides is welded simultaneously.Obviously, which is in welding process, due to printing solder or tin
Cream is shunk in high temperature, and component is acted on by solder or tin cream shrink tension, easily causes the phenomenons such as element displacement, inclination.
Both the above manufactures the mode of production, and manufacture produces finished product in use, and finished product service efficiency is low, rapid wear
It is bad.Therefore, urgent need will solve above traditional handicraft mode, improve semiconductor chilling plate production efficiency.
Utility model content
Technical problem to be solved in the utility model is to provide that a kind of manufacture processing is simple and convenient, it is easy to be fast to operate with
Prompt semiconductor chilling plate weld mold.
The technical scheme that the utility model solves above-mentioned technical problem is as follows：
A kind of semiconductor chilling plate weld mold, including the first frame in the same plane, the second frame, the 3rd side
Frame and the 4th frame；First frame is oppositely arranged in parallel with second frame, and by multiple perpendicular to described first
First cutting of frame is detachably connected；Multiple first cuttings are respectively positioned on same plane, and spacing is equal；Institute
The 3rd frame is stated to be oppositely arranged in parallel with the 4th frame, and can by multiple the second cuttings perpendicular to the 3rd frame
Dismounting links together；Multiple second cuttings are respectively positioned on same plane, and spacing is equal；
The two ends of first frame one end respectively with the 3rd frame, the 4th frame one end it is adjacent and hang down
Directly, the two ends of second frame other end respectively with the 3rd frame, the 4th frame the other end it is adjacent and hang down
Directly；First cutting is stacked with second cutting, and multiple first cuttings and multiple second cuttings are mutual
Vertically, and lattice-shaped structure is constituted.
Compared with prior art, the beneficial effects of the utility model are：
The processing of the utility model product manufacturing is simple and convenient, operates with simple and efficient, and mould is by the first frame, the second side
Frame, the 3rd frame, the 4th frame, the first cutting and the second cutting assemble, the first cutting and the second cutting after being completed
Lattice-shaped structure is constituted, the heat-radiating substrate that a bar printing has tin cream the lattice-shaped structure can be positioned over during assembling
Side, and fixed by the first frame with the chucking power of the second frame and the chucking power of the 3rd frame and the 4th frame, so
By the element arrangements figure being pre-designed, by semiconductor refrigerating crystal grain, (N-type semiconductor material element and p-type semiconductor material are first afterwards
Part) be put into lattice-shaped structure, and with first piece of heat-radiating substrate perpendicular contact, while another bar printing to be had to the radiating base of tin cream
Plate is positioned over the opposite side of lattice-shaped structure, and is fixed by the chucking power of the first frame and the second frame, is finally returned in vacuum
Vacuum welding in fluid welding stove, the mould assembly and disassembly is convenient and swift, can either ensure element (semiconductor refrigerating crystal grain)
Be not shifted over during welding with it is inclined under the premise of, realize two-sided welding, can reduce again semiconductor chilling plate welding operation
Difficulty, greatly improves production efficiency and the product quality and refrigerating efficiency of semiconductor chilling plate.
On the basis of above-mentioned technical proposal, the utility model can also do following improvement.
As a kind of preferred embodiment of the present utility model, first frame is close to the side of second frame
Edge is respectively equipped with least one flange strap with second frame close to the edge of the side of first frame, described
Flange strap is respectively positioned in approximately the same plane；Plane where the flange strap of place respectively with the plane where first cutting, institute
Plane where stating the second cutting is parallel, and with the plane where first cutting, the plane where second cutting it
Between distance be all higher than zero.
Beneficial effect using above-mentioned preferred scheme is：Placing the first bar printing in an assembling process has the radiating base of tin cream
During plate, heat-radiating substrate can be made to be located between the lattice-shaped structure of mould and flange strap, coordinate the first frame and the second frame
The heat-radiating substrate is fixed for chucking power and the chucking power of the 3rd frame and the 4th frame, more efficient to avoid heat-radiating substrate
It is shifted over and tilts, so as to more facilitate the progress of follow-up welding operation, improves Product jointing quality.
As another preferred embodiment of the present utility model, plane and first cutting where the flange strap
The distance between the plane at place is three points of width of first frame along the flange strap to the first cutting direction
One of to 2/3rds.
Beneficial effect using above-mentioned preferred scheme is：Both the grid that first piece of heat-radiating substrate is positioned over to mould are more facilitated
Between grating texture and flange strap, when can effectively ensure that another piece of heat-radiating substrate is positioned over the opposite side of the lattice-shaped structure again
It can be clamped by the first frame with the second frame.
As another preferred embodiment of the present utility model, plane and first cutting where the flange strap
The distance between the plane at place is two points of width of first frame along the flange strap to the first cutting direction
One of.
Beneficial effect using above-mentioned preferred scheme is：Two pieces of heat-radiating substrates are located at equal during the lattice-shaped structure both sides of mould
Preferably it can be fixed by the first frame with the chucking power of the second frame and the chucking power of the 3rd frame and the 4th frame.
As another preferred embodiment of the present utility model, second cutting is located at first cutting away from institute
State the side of flange strap.
Beneficial effect using above-mentioned preferred scheme is：More facilitate the grid that first piece of heat-radiating substrate is positioned over to mould
Between shape structure and flange strap, energy when another piece of heat-radiating substrate is positioned over the opposite side of the lattice-shaped structure is can effectively ensure that again
It is enough to be clamped by the first frame with the second frame.
As another preferred embodiment of the present utility model, second cutting is located at the 3rd frame close to institute
State the edge of the side of the edge or the 4th frame of the side of the 4th frame close to the 3rd frame.
Beneficial effect using above-mentioned preferred scheme is：Second piece of heat-radiating substrate is more facilitated to be positioned over the lattice-shaped structure
Opposite side so that second piece of heat-radiating substrate is fixed only by the chucking power of the first frame and the second frame, second piece radiating
Substrate can on the outside of the 3rd frame and the 4th frame between the first frame of insertion and the second frame, place it is fixed it is simpler,
It is convenient, fast.
As another preferred embodiment of the present utility model, one end of first cutting is leaned on first frame
The side of nearly second frame is fixedly connected or grafting, the side grafting of the other end and the second frame close to first frame
Or be fixedly connected；One end of second cutting is fixedly connected or inserted close to the side of the 4th frame with the 3rd frame
Connect, the other end with the 4th frame is close to the side grafting of the 3rd frame or is fixedly connected.
Beneficial effect using above-mentioned preferred scheme is：First frame is detachable by the first cutting with second frame
Connection is simpler, convenient, fast, the 3rd frame and the 4th frame by the second cutting be detachably connected it is simpler,
It is convenient, fast.
As another preferred embodiment of the present utility model, one end of multiple first cuttings passes through multiple first
Bar shaped slot is with first frame close to the side grafting of second frame, and the other end and the second frame are close to described first
The side of frame is fixedly connected；One end of multiple second cuttings is leaned on by multiple Article 3 shape slots with the 3rd frame
The side grafting of nearly 4th frame, the other end is fixedly connected with the 4th frame close to the side of the 3rd frame.
Beneficial effect using above-mentioned preferred scheme is：Realize that grafting is simpler by cutting and the cooperation of bar shaped slot
It is single, convenient, fast.
As another preferred embodiment of the present utility model, one end and first side of multiple first cuttings
Frame is fixedly connected close to the side of second frame, and the other end is by multiple second bar shaped slots and the second frame close to described
The side grafting of first frame；One end of multiple second cuttings is with the 3rd frame close to the side of the 4th frame
Be fixedly connected, the other end by multiple Article 4 shape slots and the 4th frame close to the 3rd frame side grafting.
Beneficial effect using above-mentioned preferred scheme is：All the first cutting can be that a part fixes company with the first frame
Connect, with the second frame grafting；Another part and the first frame grafting, are fixedly connected with the second frame；All the second cuttings can be with
It is that a part is fixedly connected with the 3rd frame, with the 4th frame grafting；Another part and the 3rd frame grafting, it is solid with the 4th frame
Fixed connection；Selectivity is more versatile and flexible when manufacturing processing mold.
As another preferred embodiment of the present utility model, multiple first bar shaped slots are evenly arranged in described
First frame is on the side of second frame；Multiple second bar shaped slots are evenly arranged in second frame and leaned on
On the side of nearly first frame；Multiple Article 3 shape slots are evenly arranged in the 3rd frame close to the described 4th
On the side of frame；Multiple Article 4 shape slots are evenly arranged in the 4th frame close to the side of the 3rd frame
On.
Beneficial effect using above-mentioned preferred scheme is：The bar shaped slot opened up so on frame is with being fixedly connected on side
Cutting on frame will be arranged in the form at staggeredly interval, and it is more convenient, more firm during grafting that two frames are carried out.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model product；
Fig. 2 is the attachment structure schematic diagram of the first frame and the second frame in the utility model；
Fig. 3 is the side cross-sectional view of product in Fig. 2；
Fig. 4 is the attachment structure schematic diagram of the 3rd frame and the 4th frame in the utility model；
Fig. 5 is the first frame and the attachment structure schematic diagram of the first cutting in the utility model；
Fig. 6 is the second frame and the attachment structure schematic diagram of the first cutting in the utility model；
Fig. 7 is the 3rd frame and the attachment structure schematic diagram of the second cutting in the utility model；
Fig. 8 is the 4th frame and the attachment structure schematic diagram of the second cutting in the utility model；
In accompanying drawing, the list of parts representated by each label is as follows：
1st, the first frame, the 2, second frame, the 3, the 3rd frame, the 4, the 4th frame, the 5, first cutting, the 6, second cutting, 7,
Flange strap, the 8, first bar shaped slot, the 9, second bar shaped slot, 10, Article 3 shape slot, 11, Article 4 shape slot, 12, radiating
Substrate, 13, semiconductor refrigerating crystal grain.
Embodiment
Principle of the present utility model and feature are described below in conjunction with accompanying drawing, example is served only for explaining this practicality
It is new, it is not intended to limit scope of the present utility model.
Embodiment
As shown in Figures 1 to 8, a kind of semiconductor chilling plate weld mold, including the first frame in the same plane
1st, the second frame 2, the 3rd frame 3 and the 4th frame 4；First frame 1 is oppositely arranged in parallel with second frame 2, and
It is detachably connected by multiple the first cuttings 5 perpendicular to first frame 1；The equal position of multiple first cuttings 5
In on same plane, and spacing is equal；3rd frame 3 is oppositely arranged in parallel with the 4th frame 4, and is hung down by multiple
Straight the second cutting 6 in the 3rd frame 3 is detachably connected；Multiple second cuttings 6 are respectively positioned on same plane
On, and spacing is equal；
The two ends of first frame 1 one end respectively with the 3rd frame 3, the 4th frame 4 one end it is adjacent
And vertical, the two ends of second frame 2 other end respectively with the 3rd frame 3, the other end phase of the 4th frame 4
It is adjacent and vertical；First cutting 5 is stacked with second cutting 6, multiple first cuttings 5 and multiple described second
Cutting 6 is mutually perpendicular to, and constitutes lattice-shaped structure.
The processing of the utility model product manufacturing is simple and convenient, operates with simple and efficient, and mould is by the first frame 1, second
Frame 2, the 3rd frame 3, the 4th frame 4, the first cutting 5 and the second cutting 6 assemble, the He of the first cutting 5 after being completed
Second cutting 6 constitutes lattice-shaped structure, and the heat-radiating substrate 12 that a bar printing can be had to tin cream during assembling is positioned over
The side of the lattice-shaped structure, and pass through the chucking power and the 3rd frame 3 and the 4th frame 3 of the first frame 1 and the second frame 2
Chucking power fix, then by the element arrangements figure being pre-designed by semiconductor refrigerating crystal grain 13 (N-type semiconductor material element and
P-type semiconductor material element) it is put into lattice-shaped structure, and so that one end of semiconductor refrigerating crystal grain 13 and first piece of radiating base
The perpendicular contact of plate 12, while the heat-radiating substrate 12 that another bar printing has tin cream is positioned over into the opposite side of lattice-shaped structure, and leads to
Cross the first frame 1 to fix with the chucking power of the second frame 2 and the chucking power of the 3rd frame 3 and the 4th frame 3, while making semiconductor
The other end and second piece of perpendicular contact of heat-radiating substrate 12 of refrigeration crystal grain 13, finally vacuum welding is in vacuum back-flow brazier
Can, the mould assembly and disassembly is convenient and swift, can either be shifted over when ensuring element (semiconductor refrigerating crystal grain 13) welding
Under the premise of inclined, two-sided welding is realized, the operation difficulty of semiconductor chilling plate welding can be reduced again, production is greatly improved
The product quality and refrigerating efficiency of efficiency and semiconductor chilling plate.
In the utility model, edge and second side of first frame 1 close to the side of second frame 2
Frame 2 is preferably respectively provided to a few flange strap 7, the equal position of the flange strap 7 close to the edge of the side of first frame 1
In in approximately the same plane, such as Fig. 2, Fig. 3；Plane where place flange strap 7 respectively with the plane where first cutting 5,
Plane where second cutting 6 is parallel, and with it is flat where the plane where first cutting 5, second cutting 6
The distance between face is all higher than zero., can be with when so placing the first bar printing in an assembling process and having the heat-radiating substrate 12 of tin cream
Heat-radiating substrate 12 is located between the lattice-shaped structure of mould and flange strap 7, coordinate the clamping of the first frame 1 and the second frame 2
The heat-radiating substrate 12 is fixed for power and the chucking power of the 3rd frame 3 and the 4th frame 4, more efficient to avoid heat-radiating substrate
12 are shifted over and tilt, so as to more facilitate the progress of follow-up welding operation, improve Product jointing quality.
The distance between plane where the flange strap 7 and plane where first cutting 5 preferably described the
2nd/to three/3rd of width of one frame 1 along the flange strap 7 to the direction of the first cutting 5；So both more
It is convenient that first piece of heat-radiating substrate 12 is positioned between the lattice-shaped structure of mould and flange strap 7, it can effectively ensure that again another
Block heat-radiating substrate 12 can be clamped when being positioned over the opposite side of the lattice-shaped structure by the first frame 1 with the second frame 2.
When the distance between the plane where the flange strap 7 and the plane where first cutting 5 are described first
Width of the frame 1 along the flange strap 7 to the direction of the first cutting 5 1/2nd when, best results, two pieces of heat-radiating substrates
12 can preferably pass through the chucking power of the first frame 1 and the second frame 2 and the when being located at the lattice-shaped structure both sides of mould
The chucking power of three frames 3 and the 4th frame 4 is fixed.
Second cutting 6 is preferably located at side of first cutting 5 away from the flange strap 7；So more facilitate
First piece of heat-radiating substrate 12 is positioned between the lattice-shaped structure of mould and flange strap 7, can effectively ensure that another piece dissipates again
Hot substrate 12 can be clamped when being positioned over the opposite side of the lattice-shaped structure by the first frame 1 with the second frame 2.
Second cutting 6 is preferably located at edge or the institute of side of the 3rd frame 3 close to the 4th frame 4
State edge of the 4th frame 4 close to the side of the 3rd frame 3；Second piece of heat-radiating substrate 12 is so more facilitated to be positioned over
The opposite side of the lattice-shaped structure so that second piece of heat-radiating substrate 12 only by the first frame 1 and the second frame 2 chucking power
It is fixed, second piece of heat-radiating substrate 12 can be inserted from the 3rd frame 3 and the outside of the 4th frame 4 first frame 1 and the second frame 2 it
Between, place fixation simpler, convenient, fast.
In the utility model, one end of first cutting 5 is with first frame 1 close to the side of second frame 2
Face is fixedly connected or grafting, the other end with the second frame 2 is close to the side grafting of first frame 1 or is fixedly connected；It is described
One end of second cutting 6 is fixedly connected or grafting with the 3rd frame 3 close to the side of the 4th frame 4, the other end with
4th frame 4 close to the 3rd frame 3 side grafting or be fixedly connected.Such first frame 1 leads to second frame 2
Cross the first cutting 5 and be detachably connected simpler, convenient, fast, the 3rd frame 3 passes through the second cutting 6 with the 4th frame 4
It is detachably connected simpler, convenient, fast.
The utility model can be that one end of all first cuttings 5 passes through multiple first bar shaped slots 8 and described the
One frame 1 is close to the side grafting of second frame 2, and the other end and the second frame 2 are consolidated close to the side of first frame 1
Fixed connection；All one end of second cuttings 6 by multiple Article 3 shape slots 10 and the 3rd frame 3 close to described the
The side grafting of four frames 4, the other end is fixedly connected with the 4th frame 4 close to the side of the 3rd frame 3.
Can also be that one end of multiple first cuttings 5 is leaned on by multiple first bar shaped slots 8 with first frame 1
The side grafting of nearly second frame 2, the other end is fixedly connected with the second frame 2 close to the side of first frame 1；It is many
One end of individual second cutting 6 is by multiple Article 3 shape slots 10 and the 3rd frame 3 close to the 4th frame 4
Side grafting, the other end is fixedly connected with the 4th frame 4 close to the side of the 3rd frame 3.Meanwhile, multiple described first insert
One end of bar 5 is fixedly connected with first frame 1 close to the side of second frame 2, and the other end passes through multiple Article 2
Side grafting of the frame 2 of shape slot 9 and second close to first frame 1；One end of multiple second cuttings 6 and described the
Three frames 3 are fixedly connected close to the side of the 4th frame 4, and the other end passes through multiple Article 4 shape slots 11 and the 4th frame
4 close to the 3rd frame 3 side grafting；Such as Fig. 5 to Fig. 8.
So realize that grafting is simpler, convenient, fast by cutting and the cooperation of bar shaped slot, connected mode is more more
Sample, selectivity is also more versatile and flexible during manufacture processing mold.
Multiple first bar shaped slots 8 are preferably evenly arranged in first frame 1 close to the side of second frame 2
On face；Multiple second bar shaped slots 9 are preferably evenly arranged in second frame 2 close to the side of first frame 1
On；Multiple Article 3 shape slots 10 are preferably evenly arranged in the 3rd frame 3 close to the side of the 4th frame 4
On；Multiple Article 4 shape slots 11 are preferably evenly arranged in the 4th frame 4 close to the side of the 3rd frame 3
On.The bar shaped slot opened up so on frame and the cutting being fixedly connected on frame will be arranged in the form at staggeredly interval
Row, it is more convenient, more firm during grafting that two frames are carried out.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and
And in the case of without departing substantially from spirit or essential attributes of the present utility model, can realize that this practicality is new in other specific forms
Type.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and is nonrestrictive, this practicality is new
The scope of type limits by appended claims rather than described above, it is intended that the equivalency fallen in claim is contained
All changes in justice and scope are included in the utility model, any reference in claim should not be considered as into limitation
Involved claim.
Preferred embodiment of the present utility model is the foregoing is only, it is all in this practicality not to limit the utility model
Within new spirit and principle, any modification, equivalent substitution and improvements made etc. should be included in guarantor of the present utility model
Within the scope of shield.
Claims (10)
1. a kind of semiconductor chilling plate weld mold, it is characterised in that：Including the first frame (1) in the same plane,
Two frames (2), the 3rd frame (3) and the 4th frame (4)；First frame (1) is parallel with second frame (2) to be set relatively
Put, and be detachably connected by multiple the first cuttings (5) perpendicular to first frame (1)；Multiple described first
Cutting (5) is respectively positioned on same plane, and spacing is equal；3rd frame (3) is parallel with the 4th frame (4) to be set relatively
Put, and be detachably connected by multiple the second cuttings (6) perpendicular to the 3rd frame (3)；Multiple described second
Cutting (6) is respectively positioned on same plane, and spacing is equal；
The two ends of first frame (1) one end respectively with the 3rd frame (3), one end phase of the 4th frame (4)
It is adjacent simultaneously vertical, the two ends of second frame (2) other ends respectively with the 3rd frame (3), the 4th frame (4)
The other end is adjacent and vertical；First cutting (5) is stacked with second cutting (6), multiple first cuttings (5)
It is mutually perpendicular to multiple second cuttings (6), and constitutes lattice-shaped structure.
2. semiconductor chilling plate weld mold according to claim 1, it is characterised in that：First frame (1) is close
The edge of the edge of the side of second frame (2) and the side of close first frame (1) of second frame (2)
Place is respectively equipped with least one flange strap (7), and the flange strap (7) is respectively positioned in approximately the same plane；Where place flange strap (7)
Plane it is parallel with the plane where first cutting (5), the plane where second cutting (6) respectively, and with it is described
The distance between plane where plane, second cutting (6) where first cutting (5) is all higher than zero.
3. semiconductor chilling plate weld mold according to claim 2, it is characterised in that：Where the flange strap (7)
The distance between plane where plane and first cutting (5) is first frame (1) along the flange strap (7) to institute
State 2nd/1st to three/3rd of the width in the first cutting (5) direction.
4. semiconductor chilling plate weld mold according to claim 3, it is characterised in that：Where the flange strap (7)
The distance between plane where plane and first cutting (5) is first frame (1) along the flange strap (7) to institute
State 1/2nd of the width in the first cutting (5) direction.
5. semiconductor chilling plate weld mold according to claim 3, it is characterised in that：Second cutting (6) is located at
Side of first cutting (5) away from the flange strap (7).
6. semiconductor chilling plate weld mold according to claim 5, it is characterised in that：Second cutting (6) is located at
3rd frame (3) is close to the edge of the side of the 4th frame (4) or the 4th frame (4) close to the described 3rd
The edge of the side of frame (3).
7. semiconductor chilling plate weld mold according to any one of claim 1 to 6, it is characterised in that：Described first
One end of cutting (5) is fixedly connected or grafting with first frame (1) close to the side of second frame (2), the other end
With the second frame (2) close to first frame (1) side grafting or be fixedly connected；One end of second cutting (6) with
3rd frame (3) is fixedly connected or grafting close to the side of the 4th frame (4), and the other end is leaned on the 4th frame (4)
The side grafting of nearly 3rd frame (3) is fixedly connected.
8. semiconductor chilling plate weld mold according to claim 7, it is characterised in that：Multiple first cuttings (5)
One end by multiple first bar shaped slots (8) and first frame (1) close to second frame (2) side grafting,
The other end is fixedly connected with the second frame (2) close to the side of first frame (1)；The one of multiple second cuttings (6)
The side grafting by multiple Article 3 shape slots (10) and close 4th frame (4) of the 3rd frame (3) is held, it is another
Hold and be fixedly connected with the 4th frame (4) close to the side of the 3rd frame (3).
9. semiconductor chilling plate weld mold according to claim 8, it is characterised in that：Multiple first cuttings (5)
One end and first frame (1) be fixedly connected close to the side of second frame (2), the other end passes through multiple Article 2
Shape slot (9) and the side grafting of close first frame (1) of the second frame (2)；One end of multiple second cuttings (6)
It is fixedly connected with the 3rd frame (3) close to the side of the 4th frame (4), the other end passes through multiple Article 4 shape slots
(11) with the side grafting of close 3rd frame (3) of the 4th frame (4).
10. semiconductor chilling plate weld mold according to claim 9, it is characterised in that：Multiple first bar shapeds are inserted
Groove (8) is evenly arranged in first frame (1) on the side of second frame (2)；Multiple second bar shapeds are inserted
Groove (9) is evenly arranged in second frame (2) on the side of first frame (1)；Multiple Article 3 shapes are inserted
Groove (10) is evenly arranged in the 3rd frame (3) on the side of the 4th frame (4)；Multiple Article 4 shapes are inserted
Groove (11) is evenly arranged in the 4th frame (4) on the side of the 3rd frame (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720231364.XU CN206578408U (en) | 2017-03-10 | 2017-03-10 | Semiconductor chilling plate weld mold |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720231364.XU CN206578408U (en) | 2017-03-10 | 2017-03-10 | Semiconductor chilling plate weld mold |
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| CN206578408U true CN206578408U (en) | 2017-10-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108067721A (en) * | 2017-11-27 | 2018-05-25 | 中国电子科技集团公司第十八研究所 | A kind of semiconductor cooler integrated welding connection device |
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2017
- 2017-03-10 CN CN201720231364.XU patent/CN206578408U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108067721A (en) * | 2017-11-27 | 2018-05-25 | 中国电子科技集团公司第十八研究所 | A kind of semiconductor cooler integrated welding connection device |
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