CN205784747U - A kind of plate type heat exchanger - Google Patents
A kind of plate type heat exchanger Download PDFInfo
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- CN205784747U CN205784747U CN201620188285.0U CN201620188285U CN205784747U CN 205784747 U CN205784747 U CN 205784747U CN 201620188285 U CN201620188285 U CN 201620188285U CN 205784747 U CN205784747 U CN 205784747U
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- heat exchanger
- exchanger plates
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- brazing solder
- layer
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Abstract
This utility model relates to a kind of plate type heat exchanger, described heat exchanger includes and is sequentially overlapped, by heat exchanger plates one (2a) and heat exchanger plates two (2b), the plate package (2) constituted, being compounded with brazing solder layer (5) on heat exchanger plates base material flat board at least one side, heat exchanger plates base material plate stamping extrudes herringbone ripple and forms heat exchanger plates one (2a) and heat exchanger plates two (2b).This utility model relates to a kind of plate type heat exchanger, and making is simple, production prices are cheap and production efficiency is high.
Description
Technical field
This utility model relates to the plate type heat exchanger of a kind of firm and reliable connection, belongs to technical field of heat exchangers.
Background technology
At present, plate type heat exchanger is the most efficient heat-exchange device, and the sides adjacent of every piece of heat exchanger plates is usually different working medium
Runner, for refrigeration working medium is worked time heat or Cooling capacity exchanging out.It it is all plate such as DE4422178 and WO/94/14021/
The typical structure of formula heat exchanger；
Conventional plate type heat exchanger manufacturing process is: first passes through mould and suppresses production heat exchanger plates, brazing solder zero respectively
Part, then according to heat exchanger plates, brazing solder, heat exchanger plates ... be sequentially overlapped and fit together；The board-like of this structure is used to change
Hot device needs to arrange brazing solder between adjacent heat exchanger plates, and brazing solder needs to utilize mould to be pressed into and heat exchanger plates
The ripple struction of the same profile, and it is sufficiently expensive to manufacture the mould of brazing solder parts, labour cost, the most not only adds whole
The operation of individual processing technology and make to add its manufacturing cost；Simultaneously as the material of brazing solder typically than relatively thin,
Soft, it is difficult to utilize mechanical hand to take and put, manual type can only be used to assemble, therefore constrain in manufacture of heat exchangers
Automated production, is unfavorable for improving its yield.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, it is provided that a kind of making is simple, production prices are cheap and produces
The plate type heat exchanger that efficiency is high.
The purpose of this utility model is achieved in that
A kind of plate type heat exchanger, described heat exchanger includes and is sequentially overlapped, by heat exchanger plates one and heat exchanger plates two, the heat exchange constituted
Plate group, heat exchanger plates base material flat board at least one side is compounded with brazing solder layer, and heat exchanger plates base material plate stamping extrudes herringbone ripple
Stricture of vagina forms heat exchanger plates one and heat exchanger plates two；Described brazing solder layer is elemental metals layer or alloy-layer；When brazing solder layer is
During elemental metals layer, by plating mode, elemental metals is electroplated on heat exchanger plates one and heat exchanger plates two；When brazing solder layer is
During alloy-layer, being attached at by alloy-layer on heat exchanger plates base material flat board, heat exchanger plates base material plate stamping extrudes the formation of herringbone ripple and changes
Hot plate one and heat exchanger plates two.
This utility model one plate type heat exchanger, described heat exchanger plates one and heat exchanger plates two are respectively provided with irregular herringbone
Ripple, forms the first inter-plate gap and the second inter-plate gap between adjacent heat exchanger plates one and heat exchanger plates two, between described first plate between
Gap is arranged alternately with the second inter-plate gap for two kinds of different media of circulation.
This utility model one plate type heat exchanger, low spot that ripple on heat exchanger plates one is recessed and the ripple on heat exchanger plates two
The high point of epirelief mutually supports formation contact point.
This utility model one plate type heat exchanger, it is curved that the edge of described heat exchanger plates one and heat exchanger plates two is provided with a circle
Curl edge, the curved edge between adjacent heat exchanger plates one and heat exchanger plates two mutually supports formation contact surface.
This utility model one plate type heat exchanger, between the plate face of described curved edge and heat exchanger plates one and heat exchanger plates two
Angle is α, α ∈ (75 °, 90 °).
This utility model one plate type heat exchanger, brazing solder layer compound on described heat exchanger plates one and heat exchanger plates two has
Less than 1100 DEG C of liquidus temperatures；Described plate package has higher than 1200 DEG C of solidus temperatures.
This utility model one plate type heat exchanger, including at least 95% weight in brazing solder layer compound on described heat exchanger plates
The copper of amount.
This utility model one plate type heat exchanger, comprise in brazing solder layer compound on described heat exchanger plates respectively organizes material
Percentage by weight relation be:
The Ni of >=40 %；
<35 %Fe；
<11 %Cr；
<7 %Si；
<2%B。
A kind of processing technology of plate type heat exchanger, described technique includes following step:
Step one, processing substrate: composite brazing solder layer 5 on the surface, one or both sides of coiled strip；When brazing solder layer 5
During for elemental metals layer, by plating mode, elemental metals is electroplated on coiled strip；When brazing solder layer 5 is alloy-layer, will
Alloy-layer is attached on coiled strip；
Step 2, substrate cut: put down by the heat exchanger plates base material that the coiled strip of compound upper brazing solder layer 5 cuts into dimension
Plate；
Step 3, punch forming: upper brazing solder layer 5 and the heat exchanger plates base material flat board cut will be combined in step 2
Utilize press to carry out punch forming to arrive surface there is herringbone corrugated heat-exchange plate；
Step 4, punching trimming: die-cut to the heat exchanger plates after molding so that on it, form through hole, and by heat exchanger plates edge
Heels remove；
Step 5, dry or clean: step 4 is produced the heat exchanger plates finished product obtained and carries out washing or entering drying oven
Carry out drying of heating；
Step 6, assembling: heat exchanger plates superposition is compressed and constitutes plate package；
Step 7, welding: the plate package obtained in step 6 is put in vacuum drying oven and carry out high-temperature soldering, high-temperature soldering
After end, stop heating and the integrally-built plate package sealing of welding composition one is retained in a vacuum furnace along with vacuum drying oven
Cooling cools down, so that it cools down in vacuum environment, the unexpected situations such as variable color will not occur；
Step 8, pressure testing: take out the plate package inflation after being cooled to room temperature and test its sealing；The pressure of gas injection
It is 1.5 atmospheric pressure；
Step 9: packaging: wait shipment after being packed by the plate package of pressure testing；
In above-mentioned steps two, the liquidus temperature of brazing solder layer is less than the solidus temperature of heat exchanger plates base material flat board,
So that in heating process, when brazing solder layer is in fused solution, heat exchanger plates base material flat board is still in solid-state；
In above-mentioned steps seven, when plate package is welded in the vacuum environment higher than 1120 DEG C.
Compared with prior art, the beneficial effects of the utility model are:
This utility model, before heat exchanger plates is suppressed, is compounded in one layer of brazing solder in the plane of heat exchanger plates base material flat board
Layer, and the liquidus temperature of brazing solder layer is less than the solidus temperature of heat exchanger plates base material flat board；Closely it is combined subsequently and is provided with
The heat exchanger plates base material flat board of brazing solder layer is the most compressing；Enter after cleaning, assembling in the vacuum environment of 1120 DEG C
Welding, now brazing solder melting layer becomes liquid and flows, and the low spot of ripple on adjacent two pieces of heat exchanger plates, high point is connect
Touch the contact point formed to surround；When temperature reduces cooling, the brazing solder layer solidification of thawing, adjacent heat exchanger plates is led to each other
Cross contact point to be permanently connected together；And during whole welding, the curved edge in adjacent heat exchanger plates is formed
Contact surface also fills out the brazing solder being filled with molten condition, forms permanently connected sealing surface and formation is respectively used to after solidification
First inter-plate gap of one medium and the second inter-plate gap 4 for second medium；
During whole, the brazing solder layer on heat exchanger plates surface is to carry out physics patch by the form of " flat board and flat board "
Conjunction method is compounded in its surface, and recombination process was carried out before suppressing described plate；Heat exchanger plates is by cold before corrugating
The roll bending that roll process manufactures, brazing solder has two kinds of forms: one, alloy material, now brazing solder can also be manufactured into and compare
Thin roll bending shape, the so flat board of volume are combined by techniques such as stickups with flat board, and suitable easily carries out industrialized production；
Two, elemental metals, now the brazing solder layer on heat exchanger plates surface is to be compounded in its surface, and recombination process by electric plating method
Carried out, by utilizing electrolysis principle to plate other metal of a thin layer or conjunction on heat exchanger plates metal surface before suppressing described plate
The method of gold so that brazing solder is compounded in heat exchanger plates surface, is suitable for industrialized production；
Meanwhile, the brazing solder layer on heat exchanger plates surface has less than 1100 DEG C of liquidus temperatures；And heat exchanger plates base material flat board
Have higher than 1200 DEG C of solidus temperatures；The plate package formed when heat exchanger plates is in the vacuum furnace of about 1150 DEG C
Time, brazing solder melting layer becomes liquid, and heat exchanger plates or solid, under capillary action, liquid brazing solder flowing
And fill the fine gap between full adjacent heat exchanger plates, and when cooling, plate package is welded into permanently connected heat exchanger；
And in the production process of heat exchanger plates, eliminate manufacture and the assembling of solder parts, simplify production process, reduce and be manufactured into
This, simultaneously facilitate the large-scale batch production of automatization.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of plate type heat exchanger of this utility model.
Fig. 2 is Fig. 1 partial approach figure of a kind of plate type heat exchanger of this utility model.
Fig. 3 is the fit structure schematic diagram of the adjacent heat exchanger plates of a kind of plate type heat exchanger of this utility model.
Fig. 4 is heat exchanger plates base material flat board and the structural representation of brazing solder layer of a kind of plate type heat exchanger of this utility model
Figure.
Wherein:
Heat exchanger plates one 2a, heat exchanger plates two 2b；
First inter-plate gap the 3, second inter-plate gap 4, brazing solder layer 5, contact point 6, curved edge 7, contact surface 8,
Detailed description of the invention
Seeing Fig. 1 ~ 4, a kind of plate type heat exchanger that this utility model relates to, described heat exchanger includes by heat exchanger plates one 2a
With the plate package 2 that heat exchanger plates two 2b is sequentially overlapped composition, heat exchanger plates base material flat board at least one side is compounded with brazing solder
Layer 5, heat exchanger plates base material plate stamping extrudes herringbone ripple and forms heat exchanger plates one 2a and heat exchanger plates two 2b；
Owing to brazing solder layer 5 is together stamped and formed out heat exchanger plates one 2a and heat exchanger plates two 2b together with heat exchanger plates base material flat board,
Therefore when assembling plate package 2, it is only necessary to be sequentially overlapped heat exchanger plates one 2a and heat exchanger plates two 2b, it is not necessary to additionally lay soldering
Solder, the most not only simplifies flow process, reduces cost, improves efficiency；And the mechanized equipments such as available mechanical hand are straight
Meet exchange hot plate one 2a and heat exchanger plates two 2b carries out industrialization, large-scale production further increases efficiency；
Be respectively provided with irregular herringbone ripple on described heat exchanger plates one 2a and heat exchanger plates two 2b, adjacent heat exchanger plates one 2a and
Form the first inter-plate gap 3 and the second inter-plate gap 4 between heat exchanger plates two 2b, between described first inter-plate gap 3 and the second plate between
Gap 4 is arranged alternately for two kinds of different media of circulation；Concretely, on heat exchanger plates one 2a, ripple is recessed low spot and heat exchanger plates
On two 2b, the high point of ripple epirelief mutually supports formation contact point 6；
Brazing solder layer 5 it is pasted with, on described brazing solder layer 5 on the plate face of described heat exchanger plates one 2a and heat exchanger plates two 2b
Be printed with and heat exchanger plates one 2a and the herringbone ripple of the corresponding coupling of heat exchanger plates two 2b so that brazing solder layer 5 with change
Together with hot plate one 2a fits tightly with the plate face of heat exchanger plates two 2b；
The edge of described heat exchanger plates one 2a and heat exchanger plates two 2b is provided with a circle curved edge 7, adjacent heat exchanger plates one
Curved edge 7 between 2a and heat exchanger plates two 2b mutually supports formation contact surface；Concretely, described curved edge 7 and heat exchange
Angle between the plate face of plate one 2a and heat exchanger plates two 2b is α, α ∈ (75 °, 90 °)；
Further, described brazing solder layer 5 is elemental metals layer or alloy-layer；When brazing solder layer 5 is elemental gold
When belonging to layer, by plating mode, elemental metals is electroplated on heat exchanger plates one 2a and heat exchanger plates two 2b；When brazing solder layer 5 is for closing
During layer gold, being attached at by alloy-layer on heat exchanger plates base material flat board, heat exchanger plates base material plate stamping extrudes herringbone ripple and forms heat exchange
Plate one 2a and heat exchanger plates two 2b；
Further, compound on described heat exchanger plates one 2a and heat exchanger plates two 2b brazing solder layer 5 has less than 1100 DEG C
Liquidus temperature；Described plate package 2 has higher than 1200 DEG C of solidus temperatures.
Further, including at least 95% weight in compound on described heat exchanger plates one 2a and heat exchanger plates two 2b brazing solder layer 5
The copper of amount；This is because, the liquidus temperature of copper is 1080 DEG C, and the copper mobility of liquid state is the best, is highly suitable as
Solder；
Further, comprise in compound on described heat exchanger plates one 2a and heat exchanger plates two 2b brazing solder layer 5 respectively organizes thing
The percentage by weight relation of matter is:
The Ni of >=40 %；
<35 %Fe；
<11 %Cr；
<7 %Si；
<2%B；
Wherein, the high-load of nickel solder is for increasing the decay resistance of product.
A kind of processing technology of plate type heat exchanger, described technique includes following step:
Step one, processing substrate: composite brazing solder layer 5 on the surface, one or both sides of coiled strip；When brazing solder layer 5
During for elemental metals layer, by plating mode, elemental metals is electroplated on coiled strip；When brazing solder layer 5 is alloy-layer, will
Alloy-layer is attached on coiled strip；
Step 2, substrate cut: put down by the heat exchanger plates base material that the coiled strip of compound upper brazing solder layer 5 cuts into dimension
Plate；
Step 3, punch forming: upper brazing solder layer 5 and the heat exchanger plates base material flat board cut will be combined in step 2
Utilize press to carry out punch forming to arrive surface there is herringbone corrugated heat-exchange plate；
Step 4, punching trimming: die-cut to the heat exchanger plates after molding so that on it, form through hole, and by heat exchanger plates edge
Heels remove；
Step 5, dry or clean: step 4 is produced the heat exchanger plates finished product obtained and carries out washing or entering drying oven
Carry out drying of heating；
Step 6, assembling: heat exchanger plates superposition is compressed and constitutes plate package 2；
Step 7, welding: the plate package 2 obtained in step 6 put into and carry out high-temperature soldering in vacuum drying oven, high temperature welds
After access node bundle, stop heating and welding composition one integrally-built plate package 2 is sealed reservation in a vacuum furnace along with vacuum
The cooling of stove cools down, so that it cools down in vacuum environment, the unexpected situations such as variable color will not occur；
Step 8, pressure testing: take out plate package 2 inflation after being cooled to room temperature and test its sealing；The pressure of gas injection
Power is 1.5 atmospheric pressure；
Step 9: packaging: wait shipment by the plate package 2 of pressure testing after being packed；
In above-mentioned steps one, the liquidus temperature of brazing solder layer 5 is less than the solidus temperature of heat exchanger plates base material flat board,
So that in heating process, when brazing solder layer 5 is in fused solution, heat exchanger plates base material flat board is still in solid-state；
In above-mentioned steps seven, when plate package 2 is welded in the vacuum environment higher than 1120 DEG C, brazing solder
Layer 5 is melted into liquid, flowing, and by the high point cantact shape of ripple on the low spot of the ripple on heat exchanger plates 2 a and heat exchanger plates 2b
The contact point 6 become surrounds；When temperature reduces cooling, the brazing solder layer 5 of thawing solidifies, and by heat exchanger plates one 2a and heat exchanger plates
Two 2b are permanently connected together each other by contact point 6；Meanwhile, the bending on described heat exchanger plates one 2a and heat exchanger plates two 2b
The contact surface 8 that edge 7 is formed also fills up brazing solder layer 5, when forming permanently connected sealing surface after its cooled and solidified.
Additionally: it should be noted that above-mentioned detailed description of the invention is only a prioritization scheme of this patent, the skill of this area
Any change that art personnel are done according to above-mentioned design or improvement, all within the protection domain of this patent.
Claims (6)
1. a plate type heat exchanger, it is characterised in that: described heat exchanger includes by heat exchanger plates one (2a) and heat exchanger plates two (2b)
It is sequentially overlapped the plate package (2) of composition, heat exchanger plates base material flat board at least one side is compounded with brazing solder layer (5), heat exchange
Plate substrate plate stamping extrudes herringbone ripple and forms heat exchanger plates one (2a) and heat exchanger plates two (2b)；Described brazing solder layer (5) is
Elemental metals layer or alloy-layer；When brazing solder layer (5) is elemental metals layer, by plating mode, elemental metals is electroplated
To heat exchanger plates one (2a) and heat exchanger plates two (2b)；When brazing solder layer (5) is alloy-layer, alloy-layer is attached at heat exchanger plates
On base material flat board, heat exchanger plates base material plate stamping extrudes herringbone ripple and forms heat exchanger plates one (2a) and heat exchanger plates two (2b).
2. a kind of plate type heat exchanger, it is characterised in that: described heat exchanger plates one (2a) and heat exchanger plates two (2b)
On be respectively provided with irregular herringbone ripple, form the first inter-plate gap between adjacent heat exchanger plates one (2a) and heat exchanger plates two (2b)
(3) and the second inter-plate gap (4), described first inter-plate gap (3) and the second inter-plate gap (4) are arranged alternately for circulation two kinds
Different media.
3. as claimed in claim 2 a kind of plate type heat exchanger, it is characterised in that: the low spot that ripple on heat exchanger plates one (2a) is recessed
Formation contact point (6) is mutually supported with the high point of the ripple epirelief on heat exchanger plates two (2b).
4. a kind of plate type heat exchanger, it is characterised in that: described heat exchanger plates one (2a) and heat exchanger plates two (2b)
Edge be provided with a circle curved edge (7), the curved edge between adjacent heat exchanger plates one (2a) and heat exchanger plates two (2b)
(7) formation contact surface is mutually supported.
5. a kind of plate type heat exchanger, it is characterised in that: described curved edge (7) and heat exchanger plates one (2a)
With the angle between the plate face of heat exchanger plates two (2b) is α, α ∈ (75 °, 90 °).
6. a kind of plate type heat exchanger, it is characterised in that: described heat exchanger plates one (2a) and heat exchanger plates two (2b)
Upper compound brazing solder layer (5) has less than 1100 DEG C of liquidus temperatures；Described plate package (2) has higher than 1200 DEG C
Solidus temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620188285.0U CN205784747U (en) | 2016-03-11 | 2016-03-11 | A kind of plate type heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620188285.0U CN205784747U (en) | 2016-03-11 | 2016-03-11 | A kind of plate type heat exchanger |
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| Publication Number | Publication Date |
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| CN205784747U true CN205784747U (en) | 2016-12-07 |
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ID=57413320
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| CN201620188285.0U Active CN205784747U (en) | 2016-03-11 | 2016-03-11 | A kind of plate type heat exchanger |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110500814A (en) * | 2019-07-02 | 2019-11-26 | 江苏远卓设备制造有限公司 | A kind of plate-type evaporator |
-
2016
- 2016-03-11 CN CN201620188285.0U patent/CN205784747U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110500814A (en) * | 2019-07-02 | 2019-11-26 | 江苏远卓设备制造有限公司 | A kind of plate-type evaporator |
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