CN113626374A - 一种堆叠芯片 - Google Patents

一种堆叠芯片 Download PDF

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Publication number
CN113626374A
CN113626374A CN202111028371.7A CN202111028371A CN113626374A CN 113626374 A CN113626374 A CN 113626374A CN 202111028371 A CN202111028371 A CN 202111028371A CN 113626374 A CN113626374 A CN 113626374A
Authority
CN
China
Prior art keywords
programmable gate
gate array
memory
storage
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111028371.7A
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English (en)
Chinese (zh)
Inventor
郭一欣
江喜平
左丰国
王嵩
周骏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Unilc Semiconductors Co Ltd
Original Assignee
Xian Unilc Semiconductors Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Unilc Semiconductors Co Ltd filed Critical Xian Unilc Semiconductors Co Ltd
Priority to CN202111028371.7A priority Critical patent/CN113626374A/zh
Publication of CN113626374A publication Critical patent/CN113626374A/zh
Priority to PCT/CN2022/113699 priority patent/WO2023030051A1/fr
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
    • G06F15/7867—Architectures of general purpose stored program computers comprising a single central processing unit with reconfigurable architecture
    • G06F15/7871—Reconfiguration support, e.g. configuration loading, configuration switching, or hardware OS
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F2015/761—Indexing scheme relating to architectures of general purpose stored programme computers
    • G06F2015/763—ASIC
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F15/00—Digital computers in general; Data processing equipment in general
    • G06F15/76—Architectures of general purpose stored program computers
    • G06F2015/761—Indexing scheme relating to architectures of general purpose stored programme computers
    • G06F2015/768—Gate array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CN202111028371.7A 2021-09-02 2021-09-02 一种堆叠芯片 Pending CN113626374A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111028371.7A CN113626374A (zh) 2021-09-02 2021-09-02 一种堆叠芯片
PCT/CN2022/113699 WO2023030051A1 (fr) 2021-09-02 2022-08-19 Puce superposée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111028371.7A CN113626374A (zh) 2021-09-02 2021-09-02 一种堆叠芯片

Publications (1)

Publication Number Publication Date
CN113626374A true CN113626374A (zh) 2021-11-09

Family

ID=78388996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111028371.7A Pending CN113626374A (zh) 2021-09-02 2021-09-02 一种堆叠芯片

Country Status (2)

Country Link
CN (1) CN113626374A (fr)
WO (1) WO2023030051A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023030051A1 (fr) * 2021-09-02 2023-03-09 西安紫光国芯半导体有限公司 Puce superposée
WO2024159717A1 (fr) * 2023-01-31 2024-08-08 北京清微智能科技有限公司 Puce 3d reconfigurable et son procédé d'intégration

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116828866A (zh) * 2023-06-07 2023-09-29 阿里巴巴达摩院(杭州)科技有限公司 集成电路组件、处理器和片上系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1765021A (zh) * 2004-02-16 2006-04-26 索尼株式会社 半导体器件
CN111564429A (zh) * 2020-04-29 2020-08-21 北京大学深圳研究生院 一种集成电路三维异质集成芯片及封装方法
US20200365225A1 (en) * 2019-01-11 2020-11-19 Samsung Electronics Co., Ltd. Multi-chip package
WO2021011115A1 (fr) * 2019-07-15 2021-01-21 Xilinx, Inc. Dispositif de circuit intégré comportant une pluralité de puces empilées et son procédé de fabrication
US20210247910A1 (en) * 2020-02-07 2021-08-12 Sunrise Memory Corporation High capacity memory circuit with low effective latency
CN216118778U (zh) * 2021-09-02 2022-03-22 西安紫光国芯半导体有限公司 一种堆叠芯片

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9374094B1 (en) * 2014-08-27 2016-06-21 Altera Corporation 3D field programmable gate array system with reset manufacture and method of manufacture thereof
CN111727503B (zh) * 2019-04-15 2021-04-16 长江存储科技有限责任公司 具有可编程逻辑器件和异构存储器的统一半导体器件及其形成方法
JP7331119B2 (ja) * 2019-04-15 2023-08-22 長江存儲科技有限責任公司 複数の機能性チップを伴う三次元ｎａｎｄメモリデバイスの集積
CN110870062A (zh) * 2019-04-30 2020-03-06 长江存储科技有限责任公司 具有可编程逻辑器件和nand闪存的键合半导体器件及其形成方法
CN113626374A (zh) * 2021-09-02 2021-11-09 西安紫光国芯半导体有限公司 一种堆叠芯片

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1765021A (zh) * 2004-02-16 2006-04-26 索尼株式会社 半导体器件
US20200365225A1 (en) * 2019-01-11 2020-11-19 Samsung Electronics Co., Ltd. Multi-chip package
WO2021011115A1 (fr) * 2019-07-15 2021-01-21 Xilinx, Inc. Dispositif de circuit intégré comportant une pluralité de puces empilées et son procédé de fabrication
US20210247910A1 (en) * 2020-02-07 2021-08-12 Sunrise Memory Corporation High capacity memory circuit with low effective latency
CN111564429A (zh) * 2020-04-29 2020-08-21 北京大学深圳研究生院 一种集成电路三维异质集成芯片及封装方法
CN216118778U (zh) * 2021-09-02 2022-03-22 西安紫光国芯半导体有限公司 一种堆叠芯片

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023030051A1 (fr) * 2021-09-02 2023-03-09 西安紫光国芯半导体有限公司 Puce superposée
WO2024159717A1 (fr) * 2023-01-31 2024-08-08 北京清微智能科技有限公司 Puce 3d reconfigurable et son procédé d'intégration

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Country or region after: China

Address after: 710000, floor 4, block a, No. 38, Gaoxin 6th Road, Zhangba street, high tech Zone, Xi'an, Shaanxi

Applicant after: Xi'an Ziguang Guoxin Semiconductor Co.,Ltd.

Address before: 710000, floor 4, block a, No. 38, Gaoxin 6th Road, Zhangba street, high tech Zone, Xi'an, Shaanxi

Applicant before: XI''AN UNIIC SEMICONDUCTORS Co.,Ltd.

Country or region before: China