CN113625493B

CN113625493B - Display device

Info

Publication number: CN113625493B
Application number: CN202111083438.7A
Authority: CN
Inventors: 梁方熒; 印炜凌; 郑梦芸; 林富良
Original assignee: AU Optronics Kunshan Co Ltd; AU Optronics Corp
Current assignee: AU Optronics Kunshan Co Ltd; AU Optronics Corp
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2023-05-02
Anticipated expiration: 2041-09-15
Also published as: CN113625493A

Abstract

The invention provides a display device, which comprises a first substrate, a second substrate, a first switch module, a second switch module, a test pad and frame glue, wherein the first substrate is provided with a peripheral area and a display area which are adjacently arranged, and the display area is provided with a plurality of pixel units; the first switch module is arranged in the peripheral area and is electrically connected to the pixel units; the second switch module is arranged in the peripheral area and is electrically connected to the first switch module; the test pad is arranged in the peripheral area and is electrically connected to the second switch module; the second substrate is arranged opposite to the first substrate; the frame glue is arranged between the first substrate and the second substrate; the projection of the frame glue perpendicular to the first substrate is not overlapped with the projection of the test pad perpendicular to the first substrate. The invention can effectively avoid the short circuit between the conductive ball and the test pad in the frame glue and improve the solidification degree of the frame glue.

Description

Display device

Technical Field

The present invention relates to a display device, and more particularly, to a display device with improved test pad layout structure.

Background

With the development of technology, display devices are widely used in many electronic products, such as mobile phones, tablet computers, watches, etc.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a display device in the prior art. As shown in fig. 1, in the conventional display device 100, in order to test a pixel array in a display panel, a test pad 102 and a switch module 103 are generally disposed in a peripheral area BA of a first substrate 101, the switch module 103 is electrically connected to pixel units in a display area AA, and the test pad 102 is electrically connected to the switch module 103. During testing, the test jig is contacted with the test pad 102, the test signal is written into the pixel unit, and the current is read to judge whether the pixel unit is abnormal or not.

For a vertical electric field display device, a transparent conductive layer is provided on a second substrate (not shown in the figure), and the transparent conductive layer needs to have a common potential, and typically, a common potential signal is sent from a driving element on the first substrate 101 to the transparent conductive layer on the second substrate through a conductive Ball (e.g., gold Ball Au Ball) in the frame glue 104. In the conventional display device, a narrow frame design is adopted, the frame glue 104 generally covers the test pad 102, and when the first substrate 101 and the second substrate are combined, the transparent conductive layer on the second substrate is inevitably short-circuited with the test pad 102 through the conductive balls in the frame glue 104, so that other signals are at a common potential, and normal use of the subsequent display device 100 is affected. Moreover, the test pad 102 is located in the glue frame 104, and since the test pad 102 blocks light, the frame glue 104 is also easily cured incompletely, which affects the bonding effect between the first substrate 101 and the second substrate, and even contaminates the liquid crystal in the display device 100.

Disclosure of Invention

The invention aims to provide a display device which can effectively avoid short circuit between a conductive ball and a test pad in frame glue, and improve the curing degree and the curing efficiency of the frame glue, thereby improving the yield.

In order to achieve the above objective, the display device of an embodiment of the present invention includes a first substrate, a first switch module, a second switch module, a test pad, a second substrate, and a frame adhesive, where the first substrate has a peripheral area and a display area that are adjacently disposed, and the display area is provided with a plurality of pixel units; the first switch module is arranged in the peripheral area and is electrically connected to the pixel units; the second switch module is arranged in the peripheral area and is electrically connected to the first switch module; the test pad is arranged in the peripheral area and is electrically connected to the second switch module; the second substrate is arranged opposite to the first substrate; the frame glue is arranged between the first substrate and the second substrate; the projection of the frame glue perpendicular to the first substrate is not overlapped with the projection of the test pad perpendicular to the first substrate.

In the display device, the projection of the sealant perpendicular to the first substrate and the projection of the second switch module perpendicular to the first substrate at least partially overlap.

In the display device, the second switch module has a second switch, the second switch is electrically connected to the first switch module, and the projection of the sealant perpendicular to the first substrate and the projection of the second switch perpendicular to the first substrate are at least partially overlapped.

In the display device, the second switch module further has a wiring structure, the wiring structure is electrically connected to the second switch, and a projection of the frame glue perpendicular to the first substrate and a projection of the wiring structure perpendicular to the first substrate at least partially overlap.

The display device comprises a first switch module, a second switch module, a test pad and a display area, wherein the first switch module is arranged adjacent to the display area, and the test pad is arranged between the first switch module and the second switch module.

The display device, wherein the wiring structure is arranged adjacent to the test pad, and the wiring structure is arranged between the second switch and the test pad; alternatively, the second switch is disposed adjacent to the test pad, and the second switch is disposed between the wiring structure and the test pad.

The display device comprises a first switch module, a second switch module and a first switch module, wherein the first switch module comprises a first number of first switches, the second switch module comprises a second number of second switches, the first number and the second number are positive integers, and the first number is integral multiples of the second number.

The display device further comprises a third switch module, and the second switch module is electrically connected with the first switch module through the third switch module.

The display device further comprises a first metal layer, a first insulating layer and a second metal layer, wherein the first metal layer is arranged on the first substrate; the first insulating layer is arranged on the first metal layer; the second metal layer is disposed on the first insulating layer and electrically connected to the first metal layer.

The display device further comprises a second insulating layer and a transparent conductive layer, wherein the second insulating layer is arranged on the second metal layer; the transparent conductive layer is arranged on the second insulating layer and is electrically connected to the second metal layer.

The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto.

Drawings

Fig. 1 is a schematic structural view of a prior art display device.

Fig. 2 is a schematic structural diagram of a display device according to an embodiment of the invention.

Fig. 3 is an enlarged view of the area Q of the display device 2 according to an embodiment of the present invention.

Fig. 4 is an enlarged view of the area Q shown in fig. 2 in a display device according to another embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a test pad according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a test pad according to another embodiment of the present invention.

Wherein, the reference numerals:

100: display device

101: first substrate

102: test pad

103: switch module

104: frame glue

200: display device

201: first substrate

202: test pad

203: switch module

2031: first switch module

2032: second switch module

205: wiring structure

206: a first insulating layer

207: second insulating layer

AA: display area

BA: peripheral region

ITO: transparent conductive layer

M1: a first metal layer

M2: second metal layer

PX: pixel arrangement

Q: region(s)

SW1, SW2: first switch, second switch

Detailed Description

The structural and operational principles of the present invention are described in detail below with reference to the accompanying drawings:

referring to fig. 2, fig. 2 is a schematic structural diagram of a display device according to an embodiment of the invention. As shown in fig. 2, the display device 200 of the present invention includes a first substrate 201, a second substrate (not shown), a test pad 202, a switch module 203, and a sealant (not shown) disposed opposite to each other. The first substrate 201 has a peripheral area BA and a display area AA, which are adjacently disposed, and a plurality of pixel units are disposed in the display area AA, and the plurality of pixel units may be arranged in an array.

In the present embodiment, the switch module 203 is disposed in the peripheral area BA, and the switch module 203 includes a first switch module 2031 and a second switch module 2032. The first switch module 2031 is close to the display area AA and is electrically connected to a plurality of pixel units in the display area AA; the second switch module 2032 is far away from the display area AA relative to the first switch module 2031, and is electrically connected to the first switch module 2031; the test pad 202 is disposed between the first and

second switch modules

2031 and 2032 in the peripheral area BA, and the test pad 202 is electrically connected to the second switch module 2031. A sealant (not shown) is disposed between the first substrate 201 and the second substrate, and due to the arrangement of the test pads 202 and the switch module 203, a projection of the sealant perpendicular to the first substrate 201 and a projection of the test pads 202 perpendicular to the first substrate 201 do not overlap. That is, since the test pad 202 is disposed between the first and

second switch modules

2031 and 2032, the test pad 202 is no longer located under the sealant. In one embodiment, the positions of the test pads that would be under the sealant are replaced by the second switch module 2032. The projection of the sealant perpendicular to the first substrate 201 and the projection of the second switch module 2032 perpendicular to the first substrate 201 at least partially overlap, i.e. may partially overlap or may completely overlap. Thus, in the present invention, the sealant does not cover the test pad 202 (in actual operation, the sealant may partially cover the switch module 203). In this way, shorting of the conductive Ball (e.g. Au Ball) in the sealant to the test pad 202 can be effectively avoided, and shorting of the transparent conductive layer on the second substrate to the test pad 202 can be further avoided, so that normal display of the subsequent display device 200 is ensured.

Specifically, fig. 3 is an enlarged schematic view of the area Q shown in fig. 2 in the display device according to an embodiment of the invention. As shown in fig. 3, a plurality of pixel units PX are disposed in an array in the display area AA. The first switch module 2031 is composed of a plurality of first switches SW1, and each first switch SW1 is electrically connected to a corresponding pixel unit PX. Generally, the pixel units are arranged in a plurality of rows, and each of the first switches SW1 is electrically connected to a corresponding row of pixel units. In actual operation, each column of pixels is connected via a corresponding signal line, and each first switch SW1 is connected to the corresponding signal line. The second switch module 2032 is composed of a plurality of second switches SW2, and each second switch SW2 is electrically connected to a corresponding plurality of first switches SW1. The number of the first switches SW1 in the first switch module 2031 is an integer multiple of the number of the second switches SW2 in the second switch module 2032, that is, the first switch module 2031 includes a first number of the first switches SW1, the second switch module 2032 includes a second number of the second switches SW2, the first number and the second number are both positive integers, and the first number is an integer multiple of the second number. In this embodiment, 3 times is taken as an example, that is, one second switch SW2 is electrically connected to 3 first switches SW1, but the invention is not limited thereto, for example, one second switch SW2 is electrically connected to 9 or 27 first switches SW1, and a user can set the pixel unit PX according to the actual needs, the periodic arrangement of the pixel units PX, and the like. In general, the number of the first switches SW1 and the second switches SW2 may be an integer, and the number of the first switches SW1 may be an integer multiple of the number of the second switches SW2.

As shown in fig. 3, the test pad 202 is disposed between the first switch module 2031 and the second switch module 2032, and the test pad 202 is electrically connected to a corresponding second switch SW2 in the second switch module 2032. The second switch module 2032 is further provided with a wiring structure 205, and the wiring structure 205 is electrically connected to the corresponding second switch SW2, and the second switch SW2 is electrically connected to the test pad 202 through the wiring structure 205. In this embodiment, the wiring structure 205 is disposed outside the second switch module 2032 with respect to the display area AA, i.e., the wiring structure 205 is farther from the display area AA than the second switch SW2. In this embodiment, the sealant at least partially covers the second switch module 2032, more specifically, the sealant at least partially covers the wiring structure 205 in the second switch module 2032, that is, the projection of the sealant perpendicular to the first substrate 201 and the projection of the wiring structure 205 perpendicular to the first substrate 201 at least partially overlap; or the frame glue covers both the wiring structure 205 and at least a portion of the second switch SW2, i.e. the projection of the frame glue perpendicular to the first substrate 201 at least partially overlaps the projection of the second switch SW2 perpendicular to the first substrate 201.

As shown in fig. 3, a first switch module 2031, a test pad 202, a second switch SW2, and a wiring structure 205 are sequentially arranged from the display area AA. During testing, the test jig contacts the test pad 202, the test pad 202 transmits the test signal to the wiring structure 205 in a direction away from the display area AA, and then the wiring structure 205 transmits the test signal to the second switch SW2 in a direction close to the display area AA, bypasses the test pad 202, and then transmits the test signal to the first switch module 2031 to enter the display area AA.

Fig. 4 is an enlarged view of the area Q shown in fig. 2 in a display device according to another embodiment of the present invention. As shown in fig. 4, the difference from the embodiment shown in fig. 3 is that in the present embodiment, the wiring structure 205 is disposed on the inner side of the second switch module 2032 with respect to the display area AA, that is, the wiring structure 205 is disposed between the second switch SW2 and the test pad 202, and the wiring structure 205 is closer to the display area AA than the second switch SW2. In this embodiment, the sealant at least partially covers the second switch module 2032, more specifically, the sealant at least partially covers the second switch SW2, so that the projection of the sealant perpendicular to the first substrate 201 and the projection of the second switch SW2 perpendicular to the first substrate 201 at least partially overlap; or the frame glue covers both the second switch SW2 and at least a portion of the wiring structure 205, such that the projection of the frame glue perpendicular to the first substrate 201 at least partially overlaps the projection of the wiring structure 205 perpendicular to the first substrate 201.

As shown in fig. 4, from the display area AA, a first switch module 2031, a test pad 202, a wiring structure 205, and a second switch SW3 are sequentially arranged. During testing, the test jig contacts the test pad 202, the test pad 202 transmits the test signal to the second switch SW2 in a direction away from the display area AA, and then the second switch SW2 transmits the test signal to the wiring structure 205 in a direction close to the display area AA, bypasses the test pad 202, and then transmits the test signal to the first switch module 2031 to enter the display area AA. In addition to ensuring that the test pads 202 do not overlap with the frame glue, the joint is of equal height by virtue of the structural design, so that the drawing of developers is facilitated.

Currently, following the trend of narrow frames, it is necessary to simultaneously set the test pad 202 and the frame glue in a limited space. As shown in fig. 2 to 4, in the present invention, the test pad 202 is moved towards the display area AA, and the second switch SW2 and the wiring structure 205 are moved away from the display area AA, so that the projection of the test pad 202 on the first substrate 201 is not within the projection range of the sealant on the first substrate 201, thereby solving the problems of incomplete curing of the sealant and short circuit between the test pad and the transparent conductive layer on the second substrate in the prior art; further, the switch module 203 may not exceed the edge of the frame glue away from the display area AA, so as to cater for the trend of a narrow frame.

In actual operation, the test pad 202 needs to be in contact with the test fixture, so a larger area is required, and it is generally impossible to directly connect with each row of pixel units one by one. By this design, the area of the test pad 202 can be ensured, and smooth communication with the pixel unit can be realized. In practice, this is not limiting. The switch module 203 may further include a third switch module, which may be disposed between the first switch module and the second switch module, where the second switch module is electrically connected to the first switch module by the third switch module, that is, the second switch module 2032 may be indirectly electrically connected to the first switch module 2031 by other switch modules. This is mainly determined by the size of the display panel or the number of pixel units, and for larger display devices, the fourth, fifth or more switch modules may be included, which is not limited by the present invention.

The invention also provides a specific structure of the test pad. Fig. 5 is a schematic structural diagram of a test pad according to an embodiment of the present invention. As shown in fig. 5, the test pad includes a first metal layer M1, a first insulating layer 206, and a second metal layer M2, where the first metal layer M1 is disposed on the first substrate 201, and the first insulating layer 206 is disposed on the first substrate 201 and covers the first substrate 201 and a portion of the first metal layer M1; the second metal layer M2 is disposed on the first insulating layer 206, and the second metal layer M2 is electrically connected to the first metal layer M1. During testing, the testing jig is in contact with the second metal layer M2 so as to realize transmission of testing signals. After the test is completed, a second insulating layer 207 may be formed, and the second insulating layer 207 covers the first insulating layer 206 and the second metal layer M2. Therefore, the circuit short circuit caused by the follow-up frame glue coating offset can be avoided. In an embodiment, the second insulating layer 207 may also be provided with an opening so that the second metal layer M2 is exposed, and the second insulating layer 207 is formed and then tested in cooperation with a test fixture.

Fig. 6 is a schematic structural diagram of a test pad according to another embodiment of the present invention. As shown in fig. 6, it differs from the test pad of the embodiment shown in fig. 5 only in that the test pad further comprises a transparent conductive layer ITO. In this embodiment, the second insulating layer 207 covers the first insulating layer 206 and a portion of the second metal layer M2, the transparent conductive layer ITO is disposed on the second insulating layer 207 and electrically connected to the second metal layer M2, and the second insulating layer 207 is provided with an opening so that the second metal layer M2 is electrically connected to the transparent conductive layer ITO. The test fixture can perform a test when the transparent conductive layer ITO is not formed, specifically, the test fixture contacts the second metal layer M2, so as to understand the condition of the first substrate 201; the test fixture may further perform a test after the transparent conductive layer ITO is formed, and specifically, the test fixture may contact the transparent conductive layer ITO, so as to know the overall situation of the first substrate 201 when the manufacturing is completed. By applying the laminated structure, the test can be performed both during and after the manufacture of the first substrate 201, and the situation of the first substrate 201 can be known comprehensively.

In summary, according to the embodiment of the invention, the plurality of switch modules are provided, and the test pads are arranged between the switch modules, so that the test pads are close to the display area, the frame glue is prevented from covering and contacting the test pads, the short circuit between the conductive balls and the test pads in the frame glue is effectively avoided, the curing degree and the curing efficiency of the frame glue are improved, and the yield is further improved. Furthermore, the switch module does not exceed the edge of one side of the frame glue away from the display area, so that the trend of a narrow frame is met.

Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention, as will be apparent to those skilled in the art, without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A display device, comprising:

the display device comprises a first substrate, a second substrate and a display unit, wherein the first substrate is provided with a peripheral area and a display area which are adjacently arranged, and the display area is provided with a plurality of pixel units;

the first switch module is arranged in the peripheral area and is electrically connected to the pixel units;

the second switch module is arranged in the peripheral area and is electrically connected to the first switch module;

the test pad is arranged in the peripheral area and is electrically connected to the second switch module, the first switch module is arranged between the test pad and the display area, and the test pad is arranged between the first switch module and the second switch module;

the second substrate is arranged opposite to the first substrate; and

the frame glue is arranged between the first substrate and the second substrate;

the projection of the frame glue perpendicular to the first substrate is not overlapped with the projection of the test pad perpendicular to the first substrate;

the first switch module comprises a first number of first switches, the second switch module comprises a second number of second switches, the first number and the second number are positive integers, and the first number is an integer multiple of the second number.

2. The display device of claim 1, wherein a projection of the frame glue perpendicular to the first substrate at least partially overlaps a projection of the second switch module perpendicular to the first substrate.

3. The display device of claim 2, wherein a projection of the frame glue perpendicular to the first substrate at least partially overlaps a projection of the second switch perpendicular to the first substrate.

4. The display device of claim 3, wherein the second switch module further has a wiring structure electrically connected to the second switch, a projection of the frame glue perpendicular to the first substrate at least partially overlapping a projection of the wiring structure perpendicular to the first substrate.

5. The display device of claim 4, wherein the first switch module is disposed adjacent to the display area.

6. The display device according to claim 5, wherein the wiring structure is provided adjacent to the test pad, and the wiring structure is provided between the second switch and the test pad; alternatively, the second switch is disposed adjacent to the test pad, and the second switch is disposed between the wiring structure and the test pad.

7. The display device of claim 1, further comprising a third switch module, wherein the second switch module is electrically connected to the first switch module via the third switch module.

8. The display device of claim 1, wherein the test pad further comprises:

the first metal layer is arranged on the first substrate;

a first insulating layer arranged on the first metal layer; and

the second metal layer is arranged on the first insulating layer and is electrically connected to the first metal layer.

9. The display device of claim 8, wherein the test pad further comprises:

the second insulating layer is arranged on the second metal layer; and

and the transparent conducting layer is arranged on the second insulating layer and is electrically connected to the second metal layer.