JP4506169B2 - Electro-optical device substrate, electro-optical device substrate inspection method, electro-optical device, electro-optical device inspection method, and electronic apparatus - Google Patents

Description

  The present invention relates to a substrate for an electro-optical device, an electro-optical device, a method for manufacturing the electro-optical device, an inspection method for the electro-optical device, and an electronic apparatus using the electro-optical device.

  Conventionally, electro-optical devices such as liquid crystal devices have been widely used as display devices for electronic devices such as personal computers and cellular phones. However, advanced thin film formation technology and fine wiring technology are required in the manufacturing process. Since it is not easy to completely eliminate the disconnection or short-circuit in the wiring, etc., the electrical inspection of these wirings and the like was performed before mounting the driver for driving the liquid crystal.

However, as the pitch of wiring and terminals for inspection becomes smaller due to the higher display resolution of liquid crystal devices as in recent years, electrical inspection such as accurate short inspection has become difficult. Measures to remedy various problems have been proposed. (For example, refer to Patent Document 1).
Japanese Patent Laid-Open No. 10-253980 (paragraphs [0014] to [0019], FIG. 1)

  However, as the display resolution of the liquid crystal device becomes higher and the pitch of the wiring and inspection terminals becomes smaller, the placement of the inspection terminals and the routing of the wiring up to that becomes more difficult, which is a big problem. It has become.

  Further, not only the electrical inspection of the liquid crystal device is complicated, but also the probe terminal becomes more expensive as the inspection terminal and the like become higher in definition, and it is desired to facilitate the inspection method and reduce the cost. .

  The present invention has been made in view of the above-described problems, and makes an electrical inspection easier and reduces the cost required for the inspection. Electro-optical device substrate, electro-optical device, and method of manufacturing the electro-optical device An object of the present invention is to provide an inspection method for the electro-optical device and an electronic apparatus using the electro-optical device.

In order to achieve the above object, an electro-optical device substrate according to a main aspect of the present invention includes a substrate and a first connection terminal formed on the substrate and arranged with a plurality of terminals arranged at intervals. A second connection terminal group having a group, a plurality of terminals formed on the substrate and arranged in a direction intersecting with a direction in which the first connection terminal groups are arranged, and the first connection terminal One electrode group electrically connected to the group via a first wiring; the other electrode group electrically connected to the second connection terminal group via a second wiring; The mounting surface has a first connection terminal group and a third connection terminal group electrically connected to the second connection terminal group, and the first connection terminal group and the first connection terminal group An electronic component mounted on the substrate so as to overlap with the two connection terminal groups, and the electronic component is mounted Formed in a region, electrically connected to the one electrode group via the first connection terminal group, arranged in the direction in which the first connection terminals are arranged, and spaced apart from each other, and An inspection terminal group having a plurality of inspection terminals provided extending in a strip shape in the direction in which the second connection terminal group is arranged, and outside the area where the electronic component is mounted, the second is formed as a part of the wiring, it is formed to extend in parallel to the direction extending in the strip of the terminals for inspection, and the inspection region each are arrayed at predetermined intervals And the inspection region is provided on the same line as the inspection terminal group, and the second wiring between the second connection terminal group and the inspection region is In the direction extending from the first connection terminal group side of the inspection terminal, the planar view End of査用terminals, and characterized by having a portion that is routed to protrude from an end of the inspection region. Here, the “substrate for the electro-optical device” refers to, for example, a glass substrate on which an EL device substrate, a group of inspection terminals, electric wiring, and the like are arranged.
Further, the extension length of the inspection region is different from the first connection terminal group side from the end on the first connection terminal group side of the inspection terminals provided extending in the strip shape. It is the same as the extension length to the opposite end.

According to the present invention , it is possible to easily inspect and inspect a probe terminal for electrical inspection not only in the inspection terminal group but also in a parallel inspection region.

As a result, for example , it is not necessary to arrange inspection terminals corresponding to the first and second connection terminal groups in the mounting region of the electronic component mounted on the substrate, and the arrangement of the inspection terminals and wiring It can be easily routed and the cost can be reduced.

Further, since the inspection area is provided side by side with the inspection terminal group, alignment with the inspection probe terminal becomes easier, and the cost of electrical inspection can be reduced. .
In addition, since the other is an integer multiple of the interval between the wirings and the interval between the inspection terminals, the other is an integral multiple. Therefore, if the pitch of the inspection probe terminals is adjusted to the narrower interval, all inspections are performed. This enables accurate alignment with the object and increases the degree of freedom of routing wiring. Furthermore, even if the inspection terminal and the inspection area are separated from each other, for example, by adjusting the pitch of the inspection probe terminal to the narrower interval, both the inspection terminal and the inspection area can be reliably inspected, and the probe Terminals can be manufactured easily and can be shared. Further, since the inspection terminal group corresponding to the wiring group is used, there may be a part of the inspection terminals that do not have the above-described relationship, and the application range can be expanded, and a wider variety of substrates for electro-optical devices. Applicable to. Further, since the distance between the wirings and the distance between the inspection terminals are set to be narrower, it is possible to cope with a case where the distance between the wirings is narrower, and to cope with a wider variety of substrates for electro-optical devices.

The method for inspecting a substrate for an electro-optical device according to the present invention includes the step of aligning a probe terminal for inspection with the inspection terminal and the inspection region of the second wiring before mounting the electronic component on the substrate. Abutting the aligned probe terminal with the inspection terminal and the inspection region of the second wiring, and applying a predetermined voltage to the probe terminal to at least electrically connect the electrode And a step of detecting pass / fail. According to the present invention, not only inspection terminals but also inspection areas which are part of a group of wirings arranged in the same direction can be easily brought into contact with inspection terminals for inspection. In addition, it is possible to arrange inspection areas that are part of the inspection terminals and wiring groups, for example, on the same straight line, so that the electro-optical device can be easily inspected using the probe terminals, and the probe terminals Can be shared more easily.

An electro-optical device according to another aspect of the present invention is provided on the first substrate, the first substrate, the second substrate, and the first substrate that are arranged to face each other and sandwich the electro-optical material. A first connection terminal group in which a plurality of terminals are arranged side by side, and a plurality of terminals provided in the first substrate and arranged in a direction intersecting with the direction in which the first connection terminal groups are arranged. A second connection terminal group having a plurality of terminals, a first electrode electrically connected to the first connection terminal group via a first wiring, and the second connection terminal group A second electrode electrically connected via a second wiring, the first connection terminal group, and a third connection terminal electrically connected to the second connection terminal group Having a group on the mounting surface, the first connection terminal group, and the second connection terminal group so as to overlap with the first group. And an electronic component mounted on the first substrate, and is electrically connected to the first electrode through the first connection terminal group. , Having a plurality of inspection terminals arranged in the direction in which the first connection terminals are arranged at an interval and extending in a strip shape in the arrangement direction of the second connection terminals. The inspection terminal group and the first substrate are formed outside the region where the electronic component is mounted, and formed as a part of each of the second wirings, and in the strip shape of the inspection terminal. is formed to extend in the extending direction and parallel rows, and each provided with a test area consisting are arranged at predetermined intervals, wherein the examination area of the second wiring, the terminals for inspection group and provided side by side on the same straight line, said analyzing and said second connecting terminal groups The second wiring to and from the region extends from the end of the inspection terminal and the end of the inspection region in a plan view in a direction extending from the first connection terminal group side of the inspection terminal. Is also characterized in that it has a portion that protrudes around .
Further, the extension length of the inspection region is different from the first connection terminal group side from the end on the first connection terminal group side of the inspection terminals provided extending in the strip shape. It is the same as the extension length to the opposite end.

  Here, the “first electrode” refers to a segment electrode, for example, and the “second electrode” refers to a common electrode, for example. The “third connection terminal group” refers to, for example, a bump, and the “electronic component” refers to, for example, a liquid crystal driving IC.

According to the present invention, an electrical inspection probe terminal can be easily brought into contact with the inspection area of the second wiring lined up in the same direction as well as the inspection terminal.

  As a result, for example, it is not necessary to arrange inspection terminals corresponding to all of the first and second electrodes in the mounting region of the electronic component on the first substrate. Etc., and the cost can be reduced.

Furthermore, the inspection area of the second wiring, because it being provided side by side in the inspection terminal collinear, second at least is part inspection area inspection terminal wiring Therefore, it is easier to align the inspection terminal and at least a part of the second wiring with the inspection probe terminal, and the cost of electrical inspection can be reduced.

According to the aspect related to the present invention , a part of the second wiring is provided side by side on a straight line parallel to the inspection terminal. Thereby, the freedom degree of selection of the place which arranges 2nd wiring in a predetermined direction is high, and routing of wiring becomes easier.

According to an aspect of the present invention, the inspection area of the second wiring is provided at a pitch that is an integral multiple of the pitch of the inspection terminals. Thereby, for example, even if the second wiring is longer than the first wiring from the first electrode and the wiring resistance is increased, it is easy to increase the width of the wiring. For this reason, even if the pitch of the inspection area of the second wiring is different from the pitch of the inspection terminal, if the pitch of the inspection area of the second wiring is an integral multiple of the pitch of the inspection terminal, The probe terminals can be accurately aligned with all inspection objects.

According to an embodiment related to the present invention , an integer multiple of the pitch of the inspection terminals is 1. As a result, the pitch of the arrangement of the inspection terminals and the inspection area of the second wiring are all the same, the inspection probe terminals can be shared, and the cost of the probe terminals can be reduced. Further, the contact of the probe terminal with the inspection terminal or the like is extremely easy because the positioning and the like are all the same pitch.

According to an aspect of the present invention, a distance between a part of the inspection region of the second wiring and the inspection terminal of the inspection terminal group adjacent to the inspection region of the second wiring is the inspection terminal. It is an integral multiple of the pitch. As a result, even when the inspection terminal and the inspection area of the second wiring are separated from each other, for example, the inspection probe terminals can all be aligned with the pitch of the inspection terminals, and the probe terminals can be easily manufactured. As a result, it becomes possible to further share.

An electro-optical device manufacturing method related to the present invention is an electro-optical device manufacturing method in which an electro-optical material is sandwiched between first and second substrates, and the electro-optical device is formed on each of the first and second substrates. A step of providing first and second electrodes, a step of providing a first wiring electrically connected to the first electrode on the first substrate, and a step of providing the first wiring on the first substrate. A step of providing a second wiring so that at least a portion electrically connected to the two electrodes is arranged in a predetermined direction, and the first wiring and the second wiring are electrically connected to the first substrate, respectively. A step of providing first and second connection terminal groups connected to each other, and an electron having a third connection terminal group electrically connected to the first and second connection terminal groups on the mounting surface. In a region on the first board corresponding to the mounting surface of the component, the parts are arranged in the same direction as the predetermined direction and are small. At least a step of providing an inspection terminal electrically connected to the first group of connection terminals, and at least the inspection probe terminal and a part of the second wiring abutting the inspection probe terminal A step of performing an electrical inspection of the first and second electrodes, and a step of mounting the electronic component on a region on the first substrate corresponding to the mounting surface.

The method of manufacturing an electro-optical device related to the present invention includes a step of providing a second wiring so that at least a portion electrically connected to the second electrode is arranged in a predetermined direction, and the first and second A step of providing first and second connection terminal groups that are electrically connected to the wiring, and a third connection terminal group that is electrically connected to the first and second connection terminal groups are mounted. A step of providing inspection terminals arranged in the same direction as the predetermined direction and electrically connected to at least the first connection terminal group in a region corresponding to the mounting surface of the electronic component on the surface; Since a test probe terminal is brought into contact with a part of the terminal and the second wiring and at least the first and second electrodes are electrically inspected, the process includes not only the inspection terminal. A part of the second wiring lined up in the same direction is also used for electrical inspection. The chromatography Bed terminals can be inspected by easily contact, it is possible to manufacture an electro-optical device with improved quality at lower cost.

In the inspection method according to another aspect of the present invention, before mounting the electronic component on the first substrate,
The step of aligning the probe terminals for inspection in the inspection region of the inspection terminal group and the second wiring, and the probe terminals aligned by the alignment step are connected to the inspection terminal group and the first wiring a step in contact with the test area of the second wiring, by applying a predetermined voltage to the probe terminal, by comprising a step of detecting an electrical quality of the at least the first and second electrodes, the Features.

According to the present invention , not only the inspection terminal but also the inspection area of the second wiring lined up in the same direction can be easily inspected by bringing the probe terminal for electrical inspection into contact therewith.

In addition, the inspection terminal and the inspection area of the second wiring can be arranged on the same straight line, for example, and the electro-optical device can be easily inspected using the probe terminal, and the probe terminal can be shared. It becomes easier.

Electronic device according to another aspect of the present invention is characterized by comprising an electro-optical device manufactured by the electro-optical device according to the above.

  Since the present invention includes an electro-optical device that makes electrical inspection easier and reduces the cost required for the inspection, the reliability of the performance of the electronic apparatus can be easily increased.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a liquid crystal device as an example of an electro-optical device, specifically, a reflective transflective passive matrix liquid crystal device and an electronic apparatus using the liquid crystal device will be described. It is not limited to. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

(First embodiment)

  1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 (a liquid crystal driving IC is not cut), and FIG. FIG. 4 is a cross-sectional view taken along the line CC of FIG. 3 and FIG. 5 is a partially enlarged view of the inspection terminal and the like in FIG. 3. .

  (Configuration of liquid crystal device)

  The liquid crystal device 1 includes, for example, a liquid crystal panel 2 and a circuit board 3 connected to the liquid crystal panel 2 as shown in FIG. Here, in addition to the circuit board 3, the liquid crystal device 1 is provided with an illumination device such as a backlight and other incidental mechanisms as necessary (not shown).

  The liquid crystal panel 2 is enclosed in a gap between the first substrate 5 and the second substrate 6 which are a pair of substrates bonded together via a sealing material 4 as shown in FIGS. And an electro-optical material such as STN (Super Twisted Nematic) type liquid crystal 7.

  On the first substrate 5, for example, as shown in FIG. 2, a plurality of segment electrodes 8 as first electrodes are formed in a predetermined pattern on the liquid crystal side surface.

  An overcoat layer 9 is formed on the segment electrode 8, and an alignment film 10 is further formed thereon. A polarizing plate 11 and the like are disposed outside the first substrate 5 (on the side opposite to the liquid crystal 7).

  On the other hand, on the second substrate 6, for example, as shown in FIG. 2, a plurality of common electrodes 12 as second electrodes are formed in a predetermined pattern on the liquid crystal side surface, and on the common electrode 12, An overcoat layer 13 is formed, and an alignment film 14 is further formed thereon. Further, a polarizing plate 15 and the like are disposed outside the second substrate 6 (on the side opposite to the liquid crystal 7).

  Although not shown, an underlayer, a reflective layer, a colored layer, a light shielding layer, and the like are formed on the inner surface of one of the first substrate 5 and the second substrate 6 as necessary.

  Here, the first substrate 5 and the second substrate 6 are plate-like members made of a light-transmitting material such as glass or synthetic resin as shown in FIGS. The substrate 5 has an overhanging region 16 (hereinafter referred to as an “overhang portion”) that protrudes outward with respect to the other substrate.

  The segment electrode 8 is made of a transparent conductive material such as ITO (Indium Tin Oxide), for example, and is parallel in one direction (Y-axis direction in the figure) as shown in FIGS. A plurality of stripes are formed.

  The common electrode 12 is formed in a plurality of stripes with a transparent conductive material such as ITO like the segment electrode 8, but the common electrode 12 crosses the segment electrode 8 as shown in FIGS. 1, 2, and 3. It is formed in the X-axis direction inside. The intersection of the segment electrode 8 and the common electrode 12 is a pixel for displaying an image.

  In FIG. 1 and FIG. 3, the interval between each electrode and the like is schematically shown wider than the actual in order to make the segment electrode 8 and the common electrode 12 easy to understand. Yes.

  The overcoat layers 9 and 13 are made of, for example, silicon oxide, titanium oxide, or a mixture thereof, and the alignment films 10 and 14 are made of, for example, a polyimide resin.

  Next, as shown in FIGS. 1, 2, and 3, the projecting portion 16 extends from the region where the segment electrode 8 and the common electrode 12 are surrounded by the sealing material 4 (hereinafter referred to as “liquid crystal region”) to the projecting portion 16. For example, a liquid crystal driving current is supplied to the segment electrode wiring 17 as the first wiring, the common electrode wiring 18 (18a, 18b) as the second wiring (or wiring group), and the respective electrode wirings. A liquid crystal driving IC 19 that is an electronic component is included.

  Further, the overhanging portion 16 includes first and second portions provided in a mounting region B (region surrounded by a dotted line near the center in FIG. 3) on the first substrate 5 corresponding to the mounting surface of the liquid crystal driving IC 19. As the second connection terminal group, a plurality of segment connection terminals 20 and common connection terminals 21 (21a, 21b) are electrically connected to the segment connection terminals 20 and some common connection terminals 21. A plurality of inspection terminals 22 and a plurality of input connection terminals 23 for inputting current from the circuit board 3 to the liquid crystal driving IC 19 are provided.

  Further, the overhang portion 16 includes an external connection terminal 24 that receives a current from the circuit board 3, an input wiring 25 that supplies a current from the outside to the input connection terminal 23, and the like.

  Here, when the liquid crystal driving IC 19 receives various signals related to a display image or the like via, for example, the circuit board 3 and the input wiring 25, the liquid crystal driving IC 19 generates a driving signal corresponding to the signal. Is supplied to the segment electrode wiring 17 and the common electrode wiring 18.

  Further, the liquid crystal driving IC 19 has a substantially rectangular outer shape with long sides in the X-axis direction as shown in FIG. 1, for example, and a segment connection terminal on the back surface that is a mounting surface to the projecting portion 16. 20 and a bump 27 for electrically connecting to the common connection terminal 21 and the input connection terminal 23.

  Further, as shown in FIG. 3, for example, as shown in FIG. 3, a plurality of segment connection terminals 20 are arranged on the first substrate 5 on the liquid crystal region side and in the vicinity of the peripheral edge of the long side of the mounting region B. They are arranged side by side in the axial direction. Further, common connection terminals 21a are provided in the X-axis direction at regular intervals in the vicinity of the left and right peripheral edges of the long side of the mounting region B so as to sandwich the plurality of segment connection terminals 20 therebetween. Further, a plurality of common connection terminals 21b are provided in the vicinity of the peripheral edges of the left and right short sides, arranged in the Y-axis direction at regular intervals.

  As a result, a signal current from the liquid crystal driving IC 19 is output to the segment connection terminal 20 and the common connection terminal 21 via each bump 27 and supplied to the segment electrode 8 and the common electrode 12.

  The segment connection terminal 20 and the common connection terminal 21 are electrically connected to the segment electrode wiring 17 and the common electrode wiring 18, respectively. Further, the segment connection terminal 20, the common connection terminal 21, the segment electrode wiring 17, the common electrode wiring 18 and the like shown in FIG. 3 schematically show some of them. Many are provided.

  Although omitted in FIG. 3, for example, as shown in FIG. 2, an ACF (Anisotropic Conductive Film) 28 is provided between each bump 27 and the segment connection terminal 20, the common connection terminal 21, and the input connection terminal 23. Electrical conduction is achieved by interposing and crimping.

  Further, the inspection terminal 22 is in contact with a probe terminal for inspection, which will be described later, in a straight line in the X-axis direction in the figure in the mounting region B, as shown in FIG. A plurality are arranged at the same pitch so that the portions are located. This facilitates the positioning of the probe terminals and the manufacture of the probe terminals themselves.

  For example, as shown in FIG. 4, the inspection terminal 22 is formed by forming a Ta layer 29 made of tantalum on the first substrate 5 as a base layer, and a Cr layer 30 made of chromium as a main body of the inspection terminal. In addition, the structure is further covered with an ITO layer 31 made of indium tin oxide. By forming the Ta layer 29, the Cr layer 30 can be formed more stably, and by covering with the ITO layer 31, the contact of the probe terminal for inspection can be improved, and the Cr layer 30 can be prevented from being damaged. it can. Of course, the inspection terminal 22 is not limited to this configuration.

  In addition, a plurality of inspection terminals 22 arranged side by side, for example, as shown in FIG. 3, inspection terminals 22 that are electrically connected to the segment connection terminals 20 by wiring are arranged in the center portion, and both outer sides thereof. The inspection terminals 22 are arranged on the (left and right) side where the common connection terminals 21a are electrically connected by the lead wiring.

  Next, for example, as shown in FIG. 3, the segment electrode wiring 17 is electrically connected to the segment electrode 8 in the vicinity of the boundary between the projecting portion 16 and the liquid crystal region and extends toward the liquid crystal driving IC 19. In FIG. 3, it is wired at the substantially central portion, and is electrically connected to the segment connecting terminal 20 at its end.

  The common electrode wiring 18 is electrically connected from the vicinity of the boundary between the overhanging portion 16 and the liquid crystal region to the common electrode 12 routed separately in the right and left in the liquid crystal region, and extends toward the liquid crystal driving IC 19. It has been done. Further, a part of the wiring is formed so as to be aligned in a predetermined direction, for example, and becomes a region 32 (hereinafter referred to as “inspection region”) for electrical inspection with a probe terminal described later. In FIG. 3, for easy understanding, the inspection region 32 is wider than the common electrode wiring 18 and the like, but actually has the same width as the common electrode wiring 18, for example. The same applies to the inspection terminal 22.

  The right side of the overhang 16 in FIG. 3 will be described in detail with reference to FIG. Of course, the left side of the overhanging portion 16 is similarly configured.

  For example, as shown in FIG. 5, the common electrode wiring 18 is connected to the common electrode wiring 18a electrically connected to the common connection terminal 21a on the long side of the mounting region B and the common connection terminal 21b on the short side. The common electrode wiring 18b is electrically connected.

  Here, the plurality of common electrode wires 18b electrically connected to the common connection terminal 21b on the short side are electrically connected to the common electrode 12 at the overhanging portion 16, and are substantially omitted as shown in FIG. A predetermined length is linearly extended.

  The common electrode wiring 18b is formed as an inspection region 32 on the way from substantially the same position (in the Y-axis direction) as the upper end 22a of the inspection terminal 22 to the same position as the lower end 22b of the inspection terminal 22. ing. Further, the inspection region 32 is formed so as to be aligned on the DD line in the direction of the DD line in FIG. 5 in the direction in which the inspection terminals 22 are arranged in each common electrode wiring 18b. This facilitates the alignment of the probe terminal for inspection described later, and the cost of the probe terminal itself can be reduced.

  Further, as shown in FIG. 5, the pitch P1 of the inspection terminals 22 arranged on the same line and the pitch P2 of the inspection region 32 of the common electrode wiring 18b are formed to be the same pitch.

  Further, for example, as shown in FIG. 5, the common electrode wiring 18 b is routed in a semicircular shape at the tip of the inspection region 32 (downward in the drawing) so as to return upward in the drawing.

  At this time, the common electrode wiring 18b is routed so that, for example, several inspection probe terminals are inserted into the return common electrode wiring 18b which is closest to the inspection area 32 even when the wiring is closest to the inspection area 32. As a result, even if there are more probe terminals than the plurality of inspection regions 32, the probe terminals can be prevented from coming into contact with wires other than the inspection region 32 of the common electrode wiring 18b, and unreasonable routing can be prevented. it can.

  The common electrode wiring 18b is finally electrically connected to the common connection terminal 21b on the short side.

  In the above description, a state in which a part of the common connection terminal 21 is provided as the common connection terminal 21a on the long side of the mounting region B has been described. However, the present invention is not limited to this. All 21 may be provided on the short side. In this case, the common electrode wirings 18 are naturally all electrically connected to the common connection terminal 21 on the short side, and all the common electrode wirings 18 have the inspection region 32 outside the mounting region B. It will be.

  Next, as shown in FIG. 3, for example, a plurality of input connection terminals 23 are provided at the periphery of the long side on the circuit board side in the mounting region B in order to input a signal from the circuit board 3 to the liquid crystal driving IC 19. They are arranged in a substantially straight line in the X-axis direction.

  Further, as shown in FIG. 2, a wiring pattern 34 and the like are formed and mounted on the base substrate 33 on the circuit board 3.

  Here, the base substrate 33 is a flexible film-like member, and the wiring pattern 34 is formed of, for example, copper or the like, and a connection terminal (not shown) is formed at the end on the overhanging portion 16 side. Yes. The connection terminal is electrically connected to the external connection terminal 24 via the external connection ACF 35.

  (Liquid crystal device manufacturing method and inspection method)

  Next, a manufacturing method and an inspection method of the liquid crystal device 1 will be briefly described focusing on the overhang portion 16.

  FIG. 6 is a flowchart of a method for manufacturing a liquid crystal device, FIG. 7 is an explanatory view showing a state in which the probe terminal is in contact with an inspection terminal, and FIG. 8 is an explanatory view of another inspection probe terminal.

  First, as shown in FIG. 6, ITO or the like, which is a material of the segment electrode 8, is deposited on the first substrate 5 (liquid crystal side) by sputtering, and patterned by photolithography to obtain FIGS. As shown in FIG. 3, the segment electrodes 8 are formed in stripes in the Y-axis direction. Further, an overcoat layer 9 is formed thereon, an alignment film 10 is further formed thereon, and a rubbing process is performed to form the first substrate side (ST101). When the segment electrode 8 is formed, the segment electrode wiring 17, the common electrode wiring 18, the segment connection terminal 20, the common connection terminal 21, the inspection terminal 22, the input connection terminal 23, Similarly, the external connection terminal 24 and the input wiring 25 may be formed by sputtering, and may be formed by photolithography. Further, as shown in FIG. 4, the inspection terminal 22 is formed by first forming a tantalum Ta layer 29 on the overhanging portion 16 as a base layer, and further laminating a chromium Cr layer 30 on the inspection terminal main body, It is covered with an ITO layer 31 made of indium tin oxide.

  Next, the common electrode 12 is formed in a stripe shape in the X-axis direction as shown in FIGS. 1, 2 and 3 in the same manner on the second substrate 6 (liquid crystal side), and the overcoat layer 13 and the alignment are further formed. The film 14 is formed, and the gap material 36 is sprayed on the second substrate by dry spraying or the like, and the first substrate side and the second substrate side are bonded through the seal material 4. After that, for example, liquid crystal 7 is injected from the openings of the sealing material 4 of the first substrate 5 and the second substrate 6 divided through the scribe and break process, and the opening of the sealing material 4 is made of UV curable resin or the like. Sealing is performed with a sealing material (ST103). Furthermore, the polarizing plates 11, 15 and the like are attached to the outer surfaces (the side opposite to the liquid crystal side) of the first substrate 5 and the second substrate 6 by a method such as sticking.

  Since the segment electrode 8 and the common electrode 12, the segment electrode wiring 17, the common electrode wiring 18, the segment connection terminal 20, the common connection terminal 21, the inspection terminal 22 and the like are formed by the steps so far. For example, an electrical test such as a lighting test of the segment electrode 8 and the common electrode 12 or a disconnection and short test can be performed. The following steps are substantially the steps of the inspection method.

  First, an inspection probe terminal of the inspection device 37, for example, an inspection pin 38, is moved onto the overhanging portion 16 by a moving device (not shown) under the control of the control unit 39, and further, a plurality of inspection terminals 22 and a plurality of commons. The inspection pin 38 is accurately aligned with the inspection terminal or the like by using an alignment mark or the like so as to contact the inspection region 32 of the electrode wiring 18b (ST104).

  When the inspection pin 38 can be aligned with each inspection terminal or the like, for example, the control unit 39 lowers the inspection pin 38 to the inspection terminal 22 and the inspection region 32 by the moving device and makes contact as shown in FIG. (ST105). For example, as shown in FIG. 7, the inspection pin 38 is in contact with the inspection terminal 22 and the inspection region so as not to come into contact with a wiring portion other than the inspection region 32 of the common electrode wiring 18b. No inspection pins are provided between the inspection pins 38 abutting on the pins 32 except for several spare ones.

  Further, the control unit 39 applies a predetermined voltage to the inspection pin 38 by the voltage application unit 40 (ST106). At this time, for example, as shown in FIG. 7, the inspection pins 38 that are in contact with the respective inspection terminals 22 skip the E1 inspection pins 38 and the three inspection pins 38 in the figure, and then E5 inspection pins. Similarly, E9 inspection pins 38 and the like are grouped together. Similarly, E2 inspection pins 38 are grouped together with inspection pins 38 such as E6, and E3 inspection pins 38 are grouped together with inspection pins 38 such as E7. . Similarly, the E4 inspection pins 38 are combined with the E8 inspection pins 38 by skipping the three inspection pins 38. Of course, the inspection pin 38 also comes into contact with the inspection region 32 as described above.

  Thus, for example, it is possible to perform a short inspection of at least four inspection terminals 22 adjacent to each other and the inspection region 32 of the common electrode wiring 18b, and this is usually sufficient. The cost can be reduced compared with the inspection device to be inspected. Of course, an inspection apparatus that independently inspects all inspection terminals that cannot be grouped by four may be used, or the inspection pins 38 may be grouped by three or two instead of four.

  The wiring from the inspection pins 38, which are grouped together, is connected to the voltage application unit 40 as F1 to F4 as shown in FIG. Here, since a predetermined voltage is applied between F1 and F2, the segment electrode 8 or the like is short-circuited between the inspection terminals 22 that are in contact with, for example, E1 and E2 of the inspection pin 38. The current flows and the voltage application unit 40 transmits the information to the control unit 39. The control unit 39 determines electrical quality (in this case, the presence or absence of a short circuit) from the information or the like (ST107), and displays it on, for example, a lamp or the like (not shown).

  The electrical inspection of the electro-optical device (explanation of the inspection method) is substantially completed as described above, and the liquid crystal device 1 is completed by the following steps for the first substrate and the second substrates 5 and 6 that are normal as a result of the inspection. Let

  Specifically, first, the ACF 28 is arranged so as to cover the segment connection terminal 20, the common connection terminal 21 (21a, 21b), the input connection terminal 23, etc. of the overhanging portion 16 as shown in FIG. The liquid crystal driving IC 19 is disposed on the segment connecting terminals 20 and the like so that the bumps 27 of the liquid crystal driving IC 19 correspond to the segment connecting terminals 20 and the like. Thereby, it is possible to connect the bumps 27 and the segment connection terminals 20 with the conductivity in a single direction.

  Further, necessary electronic components are mounted on the circuit board 3, and connection terminals (not shown) formed at one end of the wiring pattern 34 of the circuit board 3 are connected via an external connection ACF 35 as shown in FIG. Electrical connection is made to the external connection terminal 24, and the circuit board 3 is connected to the liquid crystal panel 2 (ST108).

  Finally, the other illumination device, the case body and the like are attached to complete the liquid crystal device 1 which is an electro-optical device (ST109).

  The inspection probe terminal is not limited to the above-described inspection pin 38. For example, as shown in FIG. 8, the inspection terminal is placed on a film 41 such as a flexible substrate (on the inspection terminal 22 side in FIG. 8). Wirings 42 are formed at the same pitch as the pitch of 22 and the inspection region 32, and probe terminal bumps 43, which are probe terminals, are formed thereon. In addition, an insulating layer 44 made of polyimide or the like is formed between the one wiring 42 and the probe terminal bump 43 and the adjacent wiring 42 and the probe terminal bump 43.

  As shown in FIG. 8, the probe terminal bump 43 is applied to the inspection terminal 22 and the common electrode wiring 18b on the inspection region 22 as shown in FIG. Electrical inspection is also possible by contact. In particular, in the case of a fine inspection terminal 22 or inspection region 32, it is easier and lower cost to form the probe terminal bump 43 on the film 41.

  As described above, according to the present embodiment, a part of the common electrode wiring 18 b electrically connected to the common electrode 12 is provided so as to be aligned in a predetermined direction as the inspection region 32, and further, the first substrate 5. Since the inspection terminals 22 are provided side by side in the same direction as the predetermined direction of the inspection region 32 in the mounting region B of the upper liquid crystal driving IC 19, the inspection terminals 22 are aligned in the same direction as well as the inspection terminals 22. The inspection pin 38 can be easily brought into contact with the inspection region 32 of the common electrode wiring 18b for inspection.

  Further, for example, the inspection terminals 22 corresponding to all of the segment electrodes 8 and the common electrodes 12 do not have to be disposed in the mounting region B of the liquid crystal driving IC 19 on the first substrate 5. Wiring and wiring can be facilitated, and costs can be reduced.

  Further, since the inspection area 32 of the common electrode wiring 18b is provided on the same straight line as the inspection terminal 22, the alignment between the inspection terminal 22 and the inspection area 32 and the inspection pin 38 becomes easier. Also, the cost of electrical inspection can be reduced.

  Further, since the pitch of the inspection terminals 22 and the pitch of the inspection regions 32 are the same, the inspection pins 38 can be shared, and the cost of electrical inspection can be reduced.

  (Second Embodiment)

  Next, a second embodiment of the liquid crystal device according to the present invention will be described. In the present embodiment, since the distance between the first embodiment and the inspection terminal 22 and the inspection region 32 provided adjacent thereto is an integer multiple of the pitch of the inspection terminal 22, the point is the center. explain. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 9 is a partially enlarged view of the protruding portion before the liquid crystal driving IC of the liquid crystal device according to the second embodiment of the present invention is mounted.

  (Configuration of liquid crystal device)

  For example, as shown in FIG. 9, the inspection region 32 of the common electrode wiring 18b is similarly arranged on a straight line in which a plurality of inspection terminals 22 are arranged at a predetermined pitch. The inspection region 32 of the common electrode wiring 18b is formed such that the distance between the inspection terminal 22 and the inspection region 32 of the common electrode wiring 18b is an integral multiple of the pitch of the inspection terminal 22.

  Specifically, for example, as shown in FIG. 9, the inspection terminal 22 electrically connected to the common connection terminal 21a is the inspection terminal closest to the inspection region 32 (the rightmost end of the inspection terminal in the figure). ) And the inspection region 32 closest to the inspection terminal 22 in the inspection region 32 of the common electrode wiring 18b (the one at the leftmost in the inspection region in the figure) is a distance P4. The pitch P3 is an integral multiple of the pitch P3.

  (Liquid crystal device manufacturing method and inspection method)

  The manufacturing method and the inspection method of the liquid crystal device according to this embodiment are substantially the same as those of the first embodiment, but the distance between the inspection terminal and the inspection region 32 of the common electrode wiring 18b is an integer of the pitch of the inspection terminal. Since it is different in that it is doubled, the description will focus on the point where the inspection pin comes into contact with the inspection terminal and the inspection region.

  FIG. 10 is an explanatory diagram of a state in which the inspection pin is in contact with the inspection terminal and the inspection region.

  First, an inspection probe terminal of the inspection device 37, for example, an inspection pin 38, is moved onto the overhanging portion 16 by a moving device (not shown) under the control of the control unit 39, and is further applied to the inspection terminal 22 and the inspection region 32. The inspection pin 38 is accurately aligned with the inspection terminal or the like using an alignment mark or the like so as to come into contact (ST104).

  When the inspection pins 38 can be aligned with the respective inspection terminals 22 and the respective inspection regions 32, the control unit 39 lowers the inspection pins 38 to the inspection terminals and the like by a moving device, as shown in FIG. Contact (ST105). At this time, as shown in FIG. 10, since the equal pitch of the test pins 38 is matched with the pitch of the test terminals, any one of the test pins 38 comes into contact with all the test terminals 22 and the test area 32. Will be.

  Thus, according to the present embodiment, since the distance between the inspection region 32 of the common electrode wiring 18b and the inspection terminal 22 adjacent to the inspection region 32 is set to an integer multiple of the pitch of the inspection terminals 22, Even when the inspection terminal 22 and the inspection region 32 of the common electrode wiring 18 b are provided apart from each other, the inspection pins 38 can be reliably brought into contact with the inspection terminal 22 and the inspection region 32.

  In addition, since the pitch of the inspection pins 38 is aligned with the pitch of the inspection terminals 22, the probe terminals can be easily manufactured and can be shared. Furthermore, the degree of freedom in routing the common electrode wiring 18 and the like is increased, and the manufacture of the liquid crystal device is facilitated.

  (Third embodiment)

  Next, a third embodiment of the liquid crystal device according to the present invention will be described. In the present embodiment, the inspection terminals and inspection areas of the first embodiment are all arranged at an equal pitch, whereas the pitch of the inspection areas is an integer multiple of the pitch of the inspection terminals. This will be mainly described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 11 is a partially enlarged view of the protruding portion before the liquid crystal driving IC of the liquid crystal device according to the third embodiment of the present invention is mounted.

  (Configuration of liquid crystal device)

  As shown in FIG. 11, the pitch P6 of the inspection region 32 of the common electrode wiring 18b is an integral multiple of the pitch P5 of the inspection terminal 22 electrically connected to the segment connection terminal 20 and the common connection terminal 21a. So that they are arranged on the same straight line.

  For example, in FIG. 11, the pitch P <b> 6 of the inspection region 32 is twice the pitch P <b> 5 of the inspection terminals 22. Of course, the pitch P6 of the inspection region 32 may be an integral multiple of the pitch P5 of the inspection terminal 22 regardless of whether the pitch P6 of the inspection region 32 is 3 or 4 times. However, if it is 1 time, it becomes the same as in the first embodiment, so in practice it is an integer multiple except 1.

  (Liquid crystal device manufacturing method and inspection method)

  The manufacturing method and the inspection method of the liquid crystal device according to this embodiment are substantially the same as those of the first embodiment, but the pitch between the inspection terminal and the inspection region 32 of the common electrode wiring 18b is different. The description will focus on the point of contact with the inspection terminal and the inspection region.

  FIG. 12 is an explanatory diagram of a state in which the inspection pin is in contact with the inspection terminal and the inspection region.

  First, an inspection probe terminal of the inspection device 37, for example, an inspection pin 38, is moved onto the overhanging portion 16 by a moving device (not shown) under the control of the control unit 39, and is further applied to the inspection terminal 22 and the inspection region 32. The inspection pin 38 is accurately aligned with the inspection terminal or the like using an alignment mark or the like so as to come into contact (ST104).

  When the inspection pins 38 can be aligned with the respective inspection terminals 22 and the respective inspection regions 32, the control unit 39 lowers the inspection pins 38 to the inspection terminals or the like by a moving device, and as shown in FIG. In the region 32, every other inspection pin 38 comes into contact (ST105).

  As described above, according to the present embodiment, the inspection regions 32 of the common electrode wiring 18b are arranged side by side with a pitch that is an integral multiple of the pitch of the inspection terminals 22, so that, for example, for the segment electrode from the segment electrode 8 Even if the wiring of the common electrode wiring 18b becomes longer than the wiring 17 and the wiring resistance increases, it is easy to increase the width of the wiring. Therefore, even if the pitch of the inspection region 32 of the common electrode wiring 18b and the pitch of the inspection terminal 22 are different, the pitch of the inspection region 32 of the common electrode wiring 18b is an integer of the pitch of the inspection terminal 22. Thus, for example, the inspection pin 38 can be easily and accurately aligned with all inspection objects.

  (Fourth embodiment)

  Next, a fourth embodiment of the liquid crystal device according to the present invention will be described. In the present embodiment, the inspection terminals and the inspection area of the first embodiment are arranged on the same straight line, but differ in that they are arranged on different straight lines. Therefore, this point will be mainly described. . In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 13 is a partially enlarged view of the protruding portion before the liquid crystal driving IC of the liquid crystal device according to the fourth embodiment of the present invention is mounted.

  (Configuration of liquid crystal device)

  For example, as shown in FIG. 13, the common electrode wiring 18a is formed so that a part of the common electrode wiring 18a and the common electrode wiring 18b are aligned on a straight line in a predetermined direction at the same pitch and become the inspection region 32. The inspection terminals 22 electrically connected to the segment connection terminals 20 are formed at the same pitch on a straight line in a direction parallel to the straight line in the predetermined direction.

  Specifically, as shown in FIG. 13, the plurality of segment electrode wirings 17 are electrically connected to the segment connection terminals 20 provided in the mounting region B, and the segment connection terminals 20 are on the DD line. Are electrically connected to the respective inspection terminals 22 arranged at equal pitches.

  On the other hand, the common electrode wiring 18 is electrically connected to the common electrode 12 and the common electrode wiring 18a and the common electrode wiring 18b extending to the overhanging portion 16 extend substantially in a straight line downward in the figure, respectively. The common electrode wiring 18a is bent into the common connection terminal 21a on the long side and the common electrode wiring 18b is connected to the common connection on the short side. Each is electrically connected to the terminal 21b.

  Here, a part of each wiring of the common electrode wiring 18a and the common electrode wiring 18b is formed so as to be arranged at an equal pitch on the HH line in FIG. Among them, the distance between the inspection region upper end 32a close to the liquid crystal region and the inspection region lower end 32b far from the liquid crystal region is formed to be substantially the same as the distance between the upper end 22a and the lower end 22b of the inspection terminal 22, for example. As a result, the inspection pin 38 can be shared by the inspection terminal 22 and the inspection region 32, and the cost can be further reduced.

  At this time, the inspection region 32 of the common electrode wiring 18a is provided, for example, adjacent to the inspection region 32 of the common electrode wiring 18b in a straight line, but the inspection region 32 of the common electrode wiring 18a is shown in FIG. As shown, the common electrode wiring 18b is disposed closer to the inspection terminal 22 than the inspection region 32. As a result, the wirings can be routed more efficiently without crossing each other.

  Further, the straight line DD line in which the inspection terminals 22 are arranged and the straight line HH line in which the inspection area 32 are arranged are parallel to each other, for example, the straight line HH line in which the inspection area 32 is arranged is closer to the liquid crystal area. Is formed. As a result, the wiring resistance from the common connection terminal 21a and the like can be shortened, and the wiring resistance can be reduced. Of course, the present invention is not limited to this, and the straight HH line may be formed farther from the liquid crystal region than the straight DD line.

  (Liquid crystal device manufacturing method and inspection method)

  The manufacturing method and the inspection method of the liquid crystal device according to this embodiment are substantially the same as those of the first embodiment, but the inspection terminals and the inspection region 32 of the common electrode wiring 18 are not on the same straight line. The description will focus on the point where the pin contacts the inspection terminal and the inspection region.

  For example, first, the inspection pin 38 of the inspection device 37 is moved onto the overhanging portion 16 by the moving device (not shown) under the control of the control unit 39, and either one of the inspection terminal 22 or the inspection region 32, for example, for inspection is used. Accurate alignment is performed using alignment marks or the like so that the inspection pins 38 can be brought into contact with the terminals 22 (ST104).

  When the inspection pins 38 can be aligned with the respective inspection terminals 22, the control unit 39 lowers the inspection pins 38 against the inspection terminals 22 by the moving device and makes contact (ST105). After that, a predetermined voltage is applied to the inspection pin 38, and the control unit 39 determines the electrical quality, and the substantial electrical inspection of the inspection terminal 22, for example, the short inspection is completed.

  Thereafter, in order to perform an electrical inspection of the inspection region 32, the process returns to ST104 again, the inspection pin 38 is aligned with the inspection region 32, and a predetermined voltage is applied to judge the electrical quality. 32 substantial electrical tests, such as a short test, are completed.

  Of course, the inspection pin 38 for the inspection terminal and the inspection pin 38 for the inspection area may be prepared, and both may be inspected at the same time. This can speed up the inspection.

  As described above, according to the present embodiment, the inspection region 32 that is a part of the common electrode wiring 18 is arranged in a straight line parallel to the inspection terminal 22, and therefore, all the electrodes to be inspected are provided. Even when the corresponding inspection terminal 22 cannot be provided, the common electrode wiring 18 can easily perform an electrical inspection. In addition, the degree of freedom in selecting a place where the inspection regions 32 that are part of the common electrode wiring 18 are arranged in a predetermined direction is high, and the wiring can be easily routed.

  Furthermore, since the pitch of the inspection terminal 22 and the inspection area 32 are set to the same pitch, the inspection pin 38 used for the inspection terminal 22 and the inspection pin 38 used for the inspection area 32 can be shared. Reduction and easy inspection can be achieved.

  (Fifth embodiment)

  (Electronics)

  Next, an electronic apparatus according to the fifth embodiment of the present invention including the above-described liquid crystal device 1 will be described.

  FIG. 14: is a schematic block diagram which shows the whole structure of the display control system of the electronic device which concerns on the 5th Embodiment of this invention.

  The electronic device 300 includes a liquid crystal panel 2 and a display control circuit 390 as shown in FIG. 14 as a display control system, for example. The display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

  The liquid crystal panel 2 has a drive circuit 361 for driving the display area G.

  The display information output source 391 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

  The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The driving circuit 361 includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 393 supplies a predetermined voltage to each component described above.

  As described above, according to the present embodiment, the liquid crystal device 1 used in the electronic device 300 has the common electrode wiring 18 electrically connected to the common electrode 12 at least partially as a predetermined inspection region 32. The test terminals 22 are arranged in the same direction as the predetermined direction of the common electrode wiring 18 in the mounting region B of the liquid crystal driving IC 19 on the first substrate 5. Therefore, for example, the inspection pin 38 can be easily brought into contact with the inspection region 32 arranged in the same direction as well as the inspection terminal 22 for inspection.

  As a result, for example, the inspection terminals 22 corresponding to all of the segment electrode 8 and the common electrode 12 do not have to be arranged in the mounting region B on the first substrate 5. Etc., and the cost can be reduced.

  In particular, portable electronic devices are required to be small in size and capable of exhibiting accurate functions, and it can be said that the present invention that can easily perform electrical inspection of electrode wirings and the like at low cost is significant. .

  Specific electronic devices include touch panels equipped with liquid crystal devices in addition to mobile phones and personal computers, projectors, liquid crystal televisions and viewfinder types, video tape recorders with direct view of monitors, car navigation systems, pagers, electronic notebooks, A calculator, a word processor, a workstation, a video phone, a POS terminal, etc. are mentioned. And it cannot be overemphasized that the liquid crystal device 1 mentioned above is applicable as a display part of these various electronic devices, for example.

  Note that the electro-optical device and the electronic apparatus of the present invention are not limited to the above-described examples, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, all of the above-described electro-optical devices are liquid crystal devices having a liquid crystal panel, but inorganic or organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron-emitting devices (Field Emission Display and Surface). -Various electro-optical devices such as a Conduction Electron-Emitter Display) may be used.

  Although the present invention has been described above with the preferred embodiment, the present invention is not limited to any of the above-described embodiments, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention.

  For example, in the above-described embodiment, the passive matrix type liquid crystal device has been described. However, the present invention is not limited to this. For example, a thin film transistor element active matrix type liquid crystal device or a thin film diode element active matrix type liquid crystal device may be used. Furthermore, not only a transflective type but also a reflective type and a transmissive type may be used. As a result, electrical inspection of electrode wirings and the like can be easily performed at a lower cost for a wide variety of liquid crystal devices.

  In the above-described embodiment, for example, the inspection terminal provided in the mounting region of the liquid crystal driving IC 19 mounted on the overhanging portion 16 is described. However, the present invention is not limited to this. The same applies to the implementation of. Furthermore, the present invention can be applied not only to an electro-optical device but also to a semiconductor device. As a result, electrical inspection of more various electro-optical devices and semiconductor devices can be easily performed at a lower cost.

  Furthermore, in the above-described embodiment, for example, when the inspection pin 38 is brought into contact with the inspection region 32 of the common electrode wiring 18, electrical inspection is performed in a state where each wiring is exposed without being molded with an insulating material. However, the present invention is not limited to this. For example, only the portion where the inspection pin 38 abuts may be exposed, and other wiring portions may be molded with an insulating material. Thereby, it is possible to eliminate the possibility that the wiring portion that is not the inspection region 32 is deteriorated due to oxidation or the like until finally molded with an insulating material. In addition, the inspection pins 38 can be continuously arranged between the inspection terminal and the inspection region, so that more common use can be achieved.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment. It is the sectional view on the AA line of FIG. FIG. 3 is a plan view before the liquid crystal driving IC according to the first embodiment is mounted. It is CC sectional view taken on the line of FIG. FIG. 4 is a partially enlarged view of the inspection terminal and the like of FIG. 3. It is a flowchart figure of the manufacturing method of the liquid crystal device which concerns on 1st Embodiment. It is explanatory drawing of the state which contact | abutted the probe terminal of 1st Embodiment to the terminal for a test | inspection. It is explanatory drawing of the probe terminal for another test | inspection. It is the elements on larger scale before the liquid crystal drive IC which concerns on 2nd Embodiment is mounted. It is explanatory drawing which the test | inspection pin which concerns on 2nd Embodiment contact | abuts to the terminal for a test | inspection. It is the elements on larger scale before the liquid crystal drive IC which concerns on 3rd Embodiment is mounted. It is explanatory drawing which the test | inspection pin which concerns on 3rd Embodiment contact | abuts to the terminal for a test | inspection. It is the elements on larger scale before the liquid crystal drive IC which concerns on 4th Embodiment is mounted. It is a schematic block diagram of the display control system of the electronic device which concerns on 5th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Liquid crystal device, 2 Liquid crystal panel, 3 Circuit board, 4 Seal material, 5 1st board | substrate, 6 2nd board | substrate, 7 Liquid crystal, 8 Segment electrode, 9,13 Overcoat layer, 10,14 Alignment film, 11, 15 polarizing plate, 12 common electrode, 16 overhang, 17 segment electrode wiring, 18 (18a, 18b) common electrode wiring, 19 liquid crystal driving IC, 20 segment connection terminal, 21 (21a, 21b) common connection Terminal, 22 Inspection terminal, 22a Upper end, 22b Lower end, 23 Input connection terminal, 24 External connection terminal, 25 Input wiring, 27 Bump, 28 ACF, 29 Ta layer, 30 Cr layer, 31 ITO layer, 32 Inspection Area, 32a upper end of inspection area, 32b lower end of inspection area, 33 base substrate, 4 Wiring pattern, 35 ACF for external connection, 36 Gap material, 37 Inspection device, 38 Inspection pin, 39 Control unit, 40 Voltage application unit, 41 Film, 42 Wiring, 43 Probe terminal bump, 44 Insulating layer, 300 Electronic equipment 361 Drive circuit, 390 Display control circuit

Claims (10)

A substrate,
A first connection terminal group formed on the substrate and arranged with a plurality of terminals arranged at intervals;
A second connection terminal group having a plurality of terminals formed on the substrate and arranged in a direction intersecting the direction in which the first connection terminal groups are arranged;
One electrode group electrically connected to the first connection terminal group via a first wiring;
The other electrode group electrically connected to the second connection terminal group via a second wiring;
The mounting surface includes a first connection terminal group and a third connection terminal group electrically connected to the second connection terminal group, the first connection terminal group, and the An electronic component mounted on the substrate so as to overlap the second connection terminal group in a plane;
Formed in a region where the electronic component is mounted, electrically connected to the one electrode group via the first connection terminal group, and the interval in the direction in which the first connection terminals are arranged. An inspection terminal group having a plurality of inspection terminals provided in a strip shape in the direction in which the second connection terminal group is arranged, and arranged in a vacant manner;
Forming said an area outside the electronic component is mounted, extends is formed as a part of each of the second wiring, parallel to the direction extending in the strip of the terminals for inspection It is, and each and an inspection region made are arranged at predetermined intervals,
The inspection region is provided side by side on the same line as the inspection terminal group ,
The second wiring between the second connection terminal group and the inspection region is in the direction extending from the first connection terminal group side of the inspection terminal in the plan view. A substrate for an electro-optical device , comprising: an end of a terminal; and a portion that protrudes from an end of the inspection region . The inspection terminal group and the inspection region are arranged to be spaced apart from each other, and the separated distance is relative to one of the interval between the inspection regions and the interval between the inspection terminal groups. 2. The electro-optical device substrate according to claim 1, wherein the other interval is an integral multiple, and the separated interval is an integral multiple of the one interval. The extension length of the inspection region is opposite to the first connection terminal group side from the end on the first connection terminal group side of the inspection terminals provided extending in the strip shape. The substrate for an electro-optical device according to claim 1, wherein the extension length is the same as an extension length to the end of the electro-optical device. An inspection method for an electro-optical device using the substrate for an electro-optical device according to any one of claims 1 to 3,
Before mounting the electronic component on the substrate,
A step of aligning a probe terminal for inspection with the inspection region of the inspection terminal and the second wiring;
Abutting the aligned probe terminal with the inspection terminal and the inspection region of the second wiring; and
And a step of detecting at least the electrical quality of the electrode by applying a predetermined voltage to the probe terminal. A first substrate disposed opposite to each other and sandwiching an electro-optic material; and a second substrate;
A first connection terminal group provided on the first substrate and arranged with a plurality of terminals arranged at intervals;
A second connection terminal group having a plurality of terminals provided on the first substrate and arranged in a direction intersecting the direction in which the first connection terminal groups are arranged;
A first electrode electrically connected to the first connection terminal group via a first wiring;
A second electrode electrically connected to the second connection terminal group via a second wiring;
The mounting surface includes a first connection terminal group and a third connection terminal group electrically connected to the second connection terminal group, the first connection terminal group, and the An electronic component mounted on the first substrate so as to overlap the second connection terminal group in a plane;
The first substrate is formed in a region where the electronic component is mounted on the first substrate, and is electrically connected to the first electrode via the first connection terminal group, and the first connection terminal. aligned is spaced the distance in the direction, and and the second testing terminal group having a plurality of test terminals provided to extend in a strip shape in the arrangement direction of the connection terminals of,
The first board is formed outside the area where the electronic component is mounted, is formed as a part of each of the second wirings, and is parallel to the direction of the inspection terminal extending in the strip shape. An inspection area formed extending in rows and arranged at predetermined intervals, and
The inspection area of the second wiring is provided on the same straight line as the inspection terminal group ,
The second wiring between the second connection terminal group and the inspection region is in the direction extending from the first connection terminal group side of the inspection terminal in the plan view. An electro-optical device comprising: an end of a terminal; and a portion that is led out from an end of the inspection region . 6. The electro-optical device according to claim 5 , wherein the inspection area of the second wiring is provided at a pitch that is an integral multiple of the pitch of the inspection terminal group. The extension length of the inspection region is opposite to the first connection terminal group side from the end on the first connection terminal group side of the inspection terminals provided extending in the strip shape. The electro-optical device according to claim 5, wherein the length of the electro-optical device is the same as the extension length to the end of the electro-optical device. The distance between the inspection area of the second wiring and the inspection terminal of the inspection terminal group adjacent to the inspection area of the second wiring is an integer multiple of the pitch of the inspection terminals. The electro-optical device according to claim 5 , wherein the electro-optical device is any one of claims 5 to 7 . The inspection method for an electro-optical device according to any one of claims 5 to 8 ,
Before mounting the electronic component on the first substrate,
Aligning an inspection probe terminal with the inspection region of the inspection terminal group and the second wiring;
Abutting the probe terminals aligned in the alignment step with the inspection terminal group and the inspection region of the second wiring; and
Detecting at least electrical quality of the first and second electrodes by applying a predetermined voltage to the probe terminal; and
An inspection method for an electro-optical device, comprising: An electronic apparatus comprising the electro-optical device according to any one of claims 4 to 8 .

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