JP2004341216A - Substrate for optoelectronic device and its manufacturing method and optoelectronic device and electronic equipment having the substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inspect an optoelectronic device substrate, which is used for an optoelectronic device such as a liquid crystal device or the like, using test element groups (TEG) even though after the produce is completed or mounted. <P>SOLUTION: An optoelectronic device substrate (200) is provided with a substrate (210), at least one of the wiring, electrodes and electronic elements for image display formed in an image display region (10a), a plurality of external circuit connection terminals (102) which are arranged within a first region (401) that is located and arranged at the center of the side in the peripheral region of the substrate and TEG (300) which are arranged within second regions (402) located in the peripheral region along the first region. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
INDUSTRIAL APPLICABILITY The present invention is used for an electro-optical device such as a liquid crystal device, an organic EL (Electro-Luminescence) device, an electrophoresis device, and a substrate for an electro-optical device on which a test element group (hereinafter appropriately referred to as “TEG”) is formed. The invention also belongs to the technical field of electro-optical devices and electronic apparatuses provided with the same, and to the technical field of a method of manufacturing a substrate for such an electro-optical device.
[0002]
[Background Art]
Conventionally, on an electro-optical device substrate of this type, for example, a data line, a scanning line, a pixel electrode, a thin film transistor (hereinafter, appropriately referred to as “TFT”) and a thin film diode (hereinafter, referred to as “TFT”) for pixel switching are provided in an image display area. Various wirings, electrodes, electronic elements, and the like for image display, such as “TFD” as appropriate, are manufactured. In the peripheral area, peripheral circuits or drive circuits such as a data line drive circuit, a sampling circuit, and a scan line drive circuit are formed.
[0003]
On such an electro-optical device substrate, the various electrodes and electronic elements formed in the image display area are electrically connected, electrically insulated, electrically operated, electrically operated, and have an electrical resistance or electrical conductivity. For example, a TEG is provided to inspect various electrical states, or alternatively or additionally, to simulate various electrical states in a peripheral circuit or the like formed in a peripheral region. It is common. For example, as a TEG, when manufacturing a pixel switching TFT, a TFT having the same laminated structure may be formed in the same step as the TEG. Further, for example, when a contact hole for wiring connection is formed in an image display area or a peripheral area, a contact hole having the same laminated structure is formed in the same step. Therefore, during the manufacture or at the time of completion of the manufacture, the TEG can be used to simulate the electrical states of various wirings, electrodes, electronic elements, etc., such as pixel switching TFTs and contact holes (see Patent Document 1). ).
[0004]
[Patent Document 1]
JP-A-2002-124554
[0005]
[Problems to be solved by the invention]
However, according to the TEG disclosed in Patent Document 1 as the related art, the TEG is formed further on the peripheral side of the scanning line driving circuit built in the peripheral area or near the edge of the substrate, so that the peripheral area is reduced. There is a problem in that the device is enlarged, which leads to enlargement of the entire device.
[0006]
Further, according to the TEG disclosed as the invention in Patent Document 1, since the TEG is formed on the scribe line, it is possible to suppress the expansion of the peripheral region. However, there is a technical problem that such an inspection using the TEG becomes impossible after the scribing process. In addition, the presence of the TEG on the scribe line makes the scribing process itself difficult, losing the uniformity of the scribe, and causing technical problems such as damage to the blade or shortening of the life of the blade.
[0007]
The present invention has been made in view of the above-described problems, and has an electro-optic device provided with a TEG so that an inspection object such as various wirings, electrodes, and electronic elements can be inspected after a product is completed or mounted. It is an object of the present invention to provide an apparatus substrate, an electro-optical device and an electronic device including the same, and a method for manufacturing such an electro-optical device substrate.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, the substrate for an electro-optical device according to the present invention includes a substrate, at least one of an image display wiring, an electrode, and an electronic element formed in an image display area on the substrate; And arranged in a first region located near a center of the one side along one side of the substrate in a peripheral region located around the image display region, and at least one of the wiring, the electrode, and the electronic element A plurality of terminals for external circuit connection that are electrically connected directly or indirectly to each other, and a plurality of terminals arranged in a second region located alongside the first region in a direction along the one side in the peripheral region. And a test element group for simulating an electrical state of at least a part of at least one of the wiring, the electrode, and the electronic element.
[0009]
According to the electro-optical device substrate of the present invention, in the image display area, for example, various lines for image display, such as data lines, scanning lines, capacitor lines, pixel electrodes, TFTs for pixel switching, organic EL light emitting layers, Electrodes, electronic elements and the like are formed. On the other hand, a plurality of terminals for external circuit connection, which are directly connected to these wirings or the like via, for example, routing wirings or indirectly via a peripheral circuit or the like such as a data line driving circuit, It is arranged in the first area in the peripheral area. Here, the “first region” refers to a region extending along one side of the substrate and located near the center of the one side. Therefore, the plurality of terminals are arranged in a line or a plurality of lines along one side, for example, in the first region near the edge of the substrate. When the electro-optical device substrate is mounted, the substrate has a plurality of connection electrodes corresponding to a plurality of terminals provided thereon, such as a flexible printed circuit (hereinafter, appropriately referred to as “FPC”), a COG (Chip On Glass). ) Is connected. Alternatively, wire bonding is performed on a plurality of terminals provided on the electro-optical device substrate.
[0010]
Here, in particular, the TEG for simulating the electrical state of at least a part of the wiring or the like provided in the image display area is arranged in the second area. Here, the “second region” refers to a region located along the first side and in line with the first region. For example, the second region may be on both sides of the first region in the center along the one side, or may be on one side of the first region. Therefore, in view of the existence of the plurality of terminals provided in the first region and the existence of the routing wiring extending from the terminal toward the image display region or the peripheral circuit, etc., near the edge of the substrate, Since the first region needs a certain amount of width in a direction intersecting the one side because a certain size is essentially required for connecting an external circuit, it can be said that the first region is a "dead space". The TEG can be formed by effectively using the region on the substrate. In other words, the first region having a width equal to or less than the first region, which necessarily has a width equal to or more than a certain value according to the width of the terminal in the direction intersecting the one side, which is the minimum required to function as a terminal. The two regions do not cause an increase in the area on the substrate, and the existence of the second region or the presence of the TEG hardly or never leads to an increase in the size of the substrate or the entire device. In such a second region, a TEG that simulates a TFT, a contact hole, various wirings, electrodes, or the like that is practically sufficient as a TEG, for example, to which about several tens of inspection probes can be applied, is provided. It has been found that it can be formed. Conversely, by forming the TEG in the second region which can be said to be a dead space in such a peripheral region, there is a great advantage that no design change is required for the size of the substrate, the planar layout of the peripheral circuits and wiring, and the like. Is also obtained.
[0011]
Therefore, for example, the TEG is formed further on the peripheral side of the scanning line driving circuit built in the peripheral area or near the edge of the substrate as in the TEG disclosed in Patent Document 1 as the prior art, thereby enlarging the peripheral area. According to the present invention, a situation in which the entire apparatus is enlarged can be effectively avoided.
[0012]
In addition, for example, since the TEG is not formed on the scribe line unlike the TEG disclosed in Patent Document 1 as the invention, according to the present invention, the inspection using the TEG can be performed even after the scribe step. . That is, the TEG can be used to perform a product inspection at the time of completion of manufacture of the electro-optical device substrate, a product inspection after shipment, and a product inspection at the time of failure after use.
[0013]
As described above, according to the electro-optical device substrate of the present invention, by using the TEG provided in parallel with the plurality of terminals in the peripheral region, for example, various wirings, electrodes, and electronic elements can be provided after the product is completed or mounted. It is possible to perform a simulated inspection of an inspection target such as the above.
[0014]
In one aspect of the electro-optical device substrate of the present invention, the substrate further includes a peripheral circuit disposed in the peripheral region and electrically connected to at least one of the wiring, the electrode, and the electronic element. A plurality of terminals are electrically connected to the peripheral circuit instead of or in addition to at least one of the wiring, the electrode, and the electronic element, and the test element group includes the wiring, the electrode, and the electronic element. In place of or in addition to at least one of the above, a portion for simulating an electrical state of at least a part of the peripheral circuit is included.
[0015]
According to this aspect, for example, the TEG for simulating the electrical state of at least a part of the peripheral circuits such as the data line driving circuit, the scanning line driving circuit, the sampling circuit, the precharge circuit, and the inspection circuit includes: It is arranged in two regions. Therefore, a TEG for inspection of peripheral circuits can be formed by effectively using a region on the substrate which can be called a "dead space". In such a second region, a TFT, a contact hole, or various wirings and electrodes, which are practically sufficient as a TEG for inspection of a peripheral circuit, for example, about tens of inspection probes can be applied. It has been found that a TEG that simulates the above can be formed. Therefore, by using the TEG provided in parallel with the plurality of terminals in the peripheral region, a simulated inspection of the peripheral circuit can be performed even after the product is completed or mounted.
[0016]
In another aspect of the electro-optical device substrate of the present invention, the plurality of terminals include a plurality of connection electrodes of a flexible printed circuit having a width corresponding to a width of the first region in a direction along the one side. Connected.
[0017]
According to this aspect, the FPC (flexible printed circuit) connected to the plurality of terminals of the electro-optical device substrate at the plurality of connection electrodes has a width corresponding to the width of the first region in the direction along the one side. Having. Therefore, even after connecting the FPC, it is possible to configure so that the second region where the TEG is formed is not covered with the FPC. This makes it possible to perform a simulated inspection using the TEG without removing the FPC after the completion of manufacture including the connection of the FPC, after the completion of mounting, and even after use, which is very convenient in practical use. It is.
[0018]
In this aspect, the second area may be configured to be located in an area that is not hidden by the flexible printed circuit.
[0019]
With this configuration, even after the FPC is connected, the FPC does not cover the second region in which the TEG is formed. Therefore, the FPC is removed after the completion of manufacture, the completion of mounting, and even after use. A simulated test using TEG can be performed without any problem.
[0020]
In the above aspect of the FPC, the second region is located in a region hidden by the mounting case when the electro-optical device substrate is connected to the flexible printed circuit and mounted in the mounting case. May be configured.
[0021]
With this configuration, the TEG can be covered with the mounting case after the mounting on the mounting case is completed. That is, the TEG can be protected by the mounting case. Therefore, even after completion of manufacturing including connection of the FPC and accommodation in the mounting case, mounting completion, and even after use, if the FPC is taken out of the mounting case, a simulated inspection using the TEG without removing the FPC is performed. Is practically very convenient.
[0022]
In another aspect of the electro-optical device substrate of the present invention, on the substrate, portions extending toward the second region along the one side from portions located on the image display region side of the plurality of terminals, respectively. And a plurality of routing wirings.
[0023]
According to this aspect, the routing wiring is routed from the plurality of terminals from the portions located on the image display area side. Such a routing wiring includes a portion extending along the one side toward the second region. Therefore, it can be said that there is little or no practical necessity or benefit in passing the wiring routed to the image display region or the peripheral circuit basically through the second region. In other words, since the TEG is formed as the second region in a region where the routing wiring cannot be routed meaningfully, the TEG is formed by effectively using the dead space.
[0024]
In this aspect, a width of the test element group in a direction perpendicular to the one side in the second region is equal to or smaller than a width of the terminal in a direction perpendicular to the one side in the first region. May be.
[0025]
According to this structure, the lead-out wiring extends in the left-right direction along one side of the substrate after being drawn out from the terminal. There is no need to bend around. That is, if the width of the test element group is wide, it is necessary to avoid this and bend the routing wiring, and accordingly, the wiring layout in a limited area on the substrate becomes strict. Then, for example, the wiring width must be made relatively narrow or the wiring length must be made relatively long. However, according to the present aspect, even in the vicinity of the test element group, the routing wiring that is not bent to avoid this has a low wiring resistance, and has a high-functionality that employs a simple wiring layout that is hardly disconnected or short-circuited. It can be constructed as wiring.
[0026]
In another aspect of the electro-optical device substrate according to the aspect of the invention, the alignment film formed on the substrate may be rubbed such that the image display area is not located on the downstream side of the test element group when viewed from the rubbing direction. Processing has been applied.
[0027]
According to this aspect, at the time of manufacturing, when rubbing is performed on the alignment film including the region where the TEG is formed, a region where the alignment is poor due to the unevenness of the TEG is seen from the rubbing direction. It is likely to occur downstream of the TEG. However, in the present embodiment, the direction of the rubbing process is defined such that the region where the orientation is poor is deviated from the image display region. Therefore, it is possible to extremely efficiently prevent the adverse effect of the rubbing process on the region where the TEG is formed from affecting the image display performed in the image display region after the completion of the manufacturing. Note that such an alignment film is provided, for example, for the purpose of defining the alignment state of a liquid crystal layer in a liquid crystal device. In this case, a liquid crystal device as an electro-optical device is suitably constructed from the electro-optical device substrate. Will be.
[0028]
In another aspect of the electro-optical device substrate according to the aspect of the invention, two of the second regions are present on both sides of the first region, and the test element groups are each of the two existing second regions. And the test element group formed on one of the two second regions and the test element group formed on the other of the two second regions are mutually Has a different configuration.
[0029]
According to this aspect, two second regions exist on both sides of the first region. For example, one test element group is formed in the second region on the right side, and another test element group is formed in the second region on the left side. Is formed. These two test element groups have mutually different configurations. That is, it is configured to simulate inspection of different circuits, wirings, and the like. Therefore, it is possible to perform relatively various types of inspections by effectively utilizing the space on both sides of the first region.
[0030]
However, two test element groups having the same configuration may be formed in two second regions existing on both sides of the first region. In this case, various tests can be selectively performed using one of the two test element groups. Alternatively, by performing various tests redundantly using both of the two test element groups, the reliability and reliability of the tests can be improved.
[0031]
In order to solve the above-described problems, an electro-optical device according to the present invention includes the above-described electro-optical device substrate (including various aspects thereof) according to the present invention.
[0032]
According to the electro-optical device of the present invention, since the electro-optical device includes the above-described substrate for the electro-optical device of the present invention (including various aspects thereof), it is possible to easily perform a simulated inspection using a TEG and appropriately It becomes executable. As such an electro-optical device, for example, a TFT active matrix driving type liquid crystal device having the electro-optical device substrate as one of a pair of substrates, for example, an organic EL device having the electro-optical device substrate as a single substrate And so on.
[0033]
An electro-optical device according to the present invention includes, in order to solve the above-described problems, an aspect according to the above-described mounting case of the electro-optical device substrate of the present invention, and the mounting case includes the electro-optical device substrate. A mounting hole is formed in a region that is separated from the one side in the perpendicular direction in the mounted state and faces the second region.
[0034]
According to the electro-optical device of the present invention, the FPC does not have a width to reach the second region in order not to spatially conflict with the mounting hole. Therefore, the second area is an area where a plurality of terminals cannot be provided in order to connect the FPC and perform mounting by the mounting case. Conversely, a TEG is formed as a second region in a peripheral region where it is difficult or practically impossible to provide a plurality of terminals in relation to mounting, so that dead space is effectively used. This means that the TEG has been formed.
[0035]
In order to solve the above problems, an electro-optical device according to the present invention includes a substrate for an electro-optical device according to the present invention described above (including its various aspects), which includes a pair of substrates arranged to face each other via an electro-optical material. The first and second regions are not covered by the other of the pair of substrates.
[0036]
According to the electro-optical device of the present invention, the above-described electro-optical device substrate of the present invention (including the various aspects thereof) is provided as one substrate, and the first and second regions are formed of the other. Not covered by substrate. Therefore, even after a pair of substrates are bonded at the time of manufacturing, the FPC can be connected to a plurality of terminals, and furthermore, there is no need to peel off the pair of substrates, and a simulated inspection using a TEG can be facilitated. It becomes possible to execute as appropriate. Furthermore, it is not necessary to peel off the pair of substrates at the time of failure after completion of manufacture, shipping, or use, and a simulated inspection using TEG can be easily and appropriately performed.
[0037]
According to another aspect of the invention, an electronic apparatus includes the above-described electro-optical device.
[0038]
Since the electronic apparatus of the present invention includes the above-described electro-optical device of the present invention, the inspection using the TEG can be easily performed and appropriately performed. A television, a mobile phone, an electronic organizer, a word processor, and a viewfinder type Alternatively, various electronic devices such as a monitor direct-view video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized. Further, as the electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper can be realized.
[0039]
In order to solve the above-mentioned problems, a method of manufacturing a substrate for an electro-optical device according to the present invention includes, in an image display area on a substrate, forming at least one of a wiring for image display, an electrode, and an electronic element; In a peripheral region located around the image display region on the substrate, the wiring, the electrode, and the electronic element are arranged along a side of the substrate in a first region located near the center of the side. Forming a plurality of terminals for external circuit connection electrically connected directly or indirectly to at least one of the plurality of terminals; and positioning the plurality of terminals in the peripheral region in a direction along the one side in the first region. Forming a test element group arranged in the second region for performing a test for simulating an electrical state of at least a part of at least one of the wiring, the electrode, and the electronic element. Wherein the door, the wiring step of forming a test element group, takes place at least partially simultaneously with the step of forming at least one of the electrodes and the electronic device.
[0040]
According to this aspect, it is possible to manufacture the electro-optical device substrate of the present invention in which the plurality of terminals are provided in the first region and the TEG is provided in the second region in the peripheral region as described above. Therefore, by using the TEG provided in parallel with the plurality of terminals in the peripheral region, it is possible to perform a simulated inspection of an inspection target such as various wirings, electrodes, and electronic elements even after the product is completed or mounted. Become.
[0041]
In one aspect of the method for manufacturing an electro-optical device substrate of the present invention, the method further includes a step of forming a peripheral circuit electrically connected to at least one of the wiring, the electrode, and the electronic element in the peripheral region, The plurality of terminals are electrically connected to the peripheral circuit in place of or in addition to at least one of the wiring, the electrode, and the electronic element, and the test element group includes the wiring, the electrode, and the electronic element. A step of simulating an electrical state of at least a part of the peripheral circuit instead of or in addition to at least one of the peripheral circuits, the step of forming the test element group and the step of forming the peripheral circuit Are performed at least partially simultaneously.
[0042]
According to this aspect, for the electro-optical device according to the present invention, the plurality of terminals are provided in the first region in the peripheral region as described above, and the TEG including the portion for simulating the peripheral circuit is provided in the second region. One embodiment of the substrate can be manufactured. Therefore, by using the TEG provided in parallel with the plurality of terminals in the peripheral region, a simulated inspection of the peripheral circuit can be performed even after the product is completed or mounted.
[0043]
In another aspect of the method for manufacturing an electro-optical device substrate according to the present invention, the electro-optical device substrates are arranged in a plurality on a mother substrate, and the test element group is separated from a scribe line when dividing the mother substrate. The method further includes a step of separating the mother substrate along the scribe line, being arranged at a deviated position and on the electro-optical device substrate.
[0044]
According to this aspect, when the mother substrate is divided, scribing is performed along the scribe line located outside the test element group, so that the inspection using the TEG can be performed without any problem even after the division. In addition, the presence of the TEG on the scribe line makes the scribing process itself difficult, losing the uniformity of the scribe, and avoiding damage to the blade or shortening the life of the blade. For example, the life of the blade is extended about twice or several times. That is, according to the present invention, it is also possible to facilitate the scribing process and extend the life of the blade used for the scribing process.
[0045]
In another aspect of the method of manufacturing a substrate for an electro-optical device according to the present invention, the image display region is not positioned downstream of the test element group when viewed from a rubbing direction with respect to an alignment film formed on the substrate. Performing a rubbing process.
[0046]
According to this aspect, in the step of performing the rubbing treatment, for example, a rubbing streak due to a rubbing cloth is easily formed along the rubbing direction, and a region in which misalignment due to unevenness of the TEG is likely to occur tends to occur. The direction of the rubbing process is defined so that the image display area is out of the downstream side. Therefore, the adverse effect of the rubbing process on the region where the TEG is formed can be prevented very efficiently from affecting the image display.
[0047]
The operation and other advantages of the present invention will become more apparent from the embodiments explained below.
[0048]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a substrate for an electro-optical device according to the present invention is applied to a substrate device with a built-in drive circuit for an electro-optical device such as a liquid crystal device and an organic EL device.
[0049]
(First Embodiment of Electro-Optical Device Substrate)
A first embodiment of a substrate for an electro-optical device according to the present invention will be described with reference to FIGS. FIG. 1 is a plan view of an electro-optical device substrate according to the present embodiment, and FIG. 2 is a specific example of the TEG shown in FIG. FIG. 3 is a plan view showing a state in which the substrate for an electro-optical device is connected to an FPC and housed in a mounting case after being assembled in the electro-optical device.
[0050]
In FIG. 1, an electro-optical device substrate 200 includes a substrate 210, a scanning line 203, a data line 206, a scanning line driving circuit 104, a data line driving circuit 101, and a plurality of external circuit connection terminals 102 formed on the substrate 210. And TEG300.
[0051]
An image display area 10a in which an image is displayed during operation is defined in the center of the substrate 210, and peripheral circuits such as the scanning line driving circuit 104 and the data line driving circuit 101 and a plurality of external circuits are formed around the image display area 10a. A peripheral area where the circuit connection terminal 102 and the like are formed and an image is not displayed is defined. In the image display area 10a, depending on the type of the electro-optical device substrate 200, in addition to the data line 206 and the scanning line 203, a capacitor line, a capacitor electrode, a pixel electrode, a pixel switching TFT, a TFD, Various image display wirings, electrodes, electronic elements, and the like, such as a striped or segmented display electrode, an organic EL light emitting layer, and an inorganic EL light emitting layer are formed.
[0052]
The plurality of scanning lines 203 are formed on the substrate 210 so as to extend from the scanning line driving circuit 104 in the image display area 10a in the X direction in the drawing. For example, a scanning signal is supplied to the scanning line 203 from the scanning line driving circuit 104. The scanning line 203 is connected to, for example, a control terminal such as a TFT or TFD for pixel switching or pixel portion control formed for each pixel in the image display area 10a. Is supplied at a predetermined timing.
[0053]
The plurality of data lines 206 are formed on the substrate 210 so as to extend from the data line driving circuit 101 in the image display area 10a in the Y direction in the drawing. For example, an image signal or a data signal is supplied to the data line 206 from the data line driving circuit 101. The data line 206 is connected to, for example, an image signal input terminal such as a TFT for pixel switching or pixel portion control, a TFD, or a pixel electrode or a display electrode formed in the image display region 10a for each pixel. In response, an image signal or a data signal is supplied at a predetermined timing.
[0054]
The scanning line driving circuit 104 is divided and arranged in a peripheral area located on both left and right sides of the image display area 10a, and drives a plurality of scanning lines 203. For example, a scanning signal is supplied to the plurality of scanning lines 203 in a line-sequential manner. The scanning line driving circuit 104 includes, for example, various circuits such as a shift register, a level shifter, a buffer, and an inverter, and includes a large number of TFTs, wirings, and the like.
[0055]
The data line driving circuit 101 is disposed in a peripheral area located below the image display area 10a, and drives a plurality of data lines 206. For example, an image signal or a data signal is supplied to the plurality of data lines 206 in accordance with the timing of the scanning signal. The data line driving circuit 101 includes, for example, various circuits such as a shift register, a level shifter, a buffer, and an inverter, and includes a large number of TFTs, wirings, and the like.
[0056]
The plurality of external circuit connection terminals 102 are arranged in the first region 401 located near the center of the lower side along the lower side of the substrate 210 in the peripheral region. The plurality of external circuit connection terminals 102 are connected to the scanning line driving circuit 104, the data line driving circuit 101, and the like via the routing wiring 108. When the electro-optical device substrate 200 is mounted, a surface-mount type circuit such as an FPC or COG or a connection cable having a plurality of connection electrodes corresponding to the plurality of external circuit connection terminals 102 is connected to a plurality of external circuits. Connected to connection terminal 102. Alternatively, when the electro-optical device substrate 200 is mounted, wire bonding is performed on the plurality of external circuit connection terminals 102.
[0057]
The TEG 300 is arranged in a second region 402 located alongside the first region 401 in a direction along a lower side of the peripheral region. In the present embodiment, the second regions 402 exist on the left and right sides of the first region 401, and the TEG 300 is provided in each of the second regions 402. The TEG 300 includes electronic elements such as various TFTs constituting the scanning line driving circuit 104 and the data line driving circuit 101, electrodes, wirings, the scanning lines 203 and the data lines 206, and an image constructed in the image display area 10a. It is configured to include patterns of various electronic elements, electrodes, wirings, and the like for simulating an electrical state of at least a part of various electrodes and electronic elements for display. Preferably, such a TEG 300 is simultaneously formed with the various electronic elements, electrodes, wirings, and the like to be inspected for the simulated inspection during the manufacturing of the electro-optical device substrate 200 by the same process. As a result, the degree of simulation can be effectively increased. For example, in the case of a TEG portion for simulating a pixel switching TFT, transistor characteristics similar to those of the TFT can be simulated by the TEG portion.
[0058]
As illustrated in FIG. 2, a TEG for measuring a portion such as a circuit and a wiring mainly related to an N-channel TFT includes, for example, TEG portions N-7 to N-10 for measuring a contact hole resistance. And various TEG portions N-1 to N-20 such as TEG portions N-11 to N-16 for measuring N-channel type TFT characteristics and TEG portions N-17 to N-18 for measuring sheet resistance. It becomes. These are arranged along the lower side of the substrate 210 in FIG. 1 and have a width W in the vertical direction in FIG. 1 perpendicular to the lower side (that is, so as not to protrude from the width W. ) Is provided.
[0059]
Incidentally, the TEG portions N-11 to N-16 for measuring such TFT characteristics may be used for evaluating a TFT for pixel switching or for evaluating a TFT of a peripheral driving circuit. Good.
[0060]
In addition, FIG. 2 illustrates the TEG related to the N-channel TFT, but the TEG related to the P-channel TFT similarly includes various TEG portions. The TEG related to such an N-channel TFT and the TEG related to a P-channel TFT may be mixed in the left and right second regions 402 (see FIG. 1) of the first region 401. , May be separately provided in the left and right second regions 402. In addition, the two TEGs 300 provided in the left and right second regions 402 as described above may be the same or different from each other.
[0061]
As shown in FIG. 2, in this embodiment, in particular, the TEGs 300 are arranged in a region within a width W along the lower side of the substrate 210, and the width W is set in a vertical direction perpendicular to the lower side of the substrate 210 in FIG. Is smaller than the width of the external circuit connection terminal 102 in FIG. If the TEG 300 is formed narrower than the external circuit connection terminal 102 in this manner, as shown in FIG. 1, the lead-out wiring 108 is drawn out from the side of the external circuit connection terminal 102 closer to the image display area 10a. After that, it may extend straight in the left-right direction along the lower side of the substrate 210 in FIG. That is, it is not necessary to bend around the TEG 300 when passing near the TEG 300. For this reason, the routing wiring 108 has a margin in the wiring layout near the TEG 300, so that the wiring width can be made relatively large and the wiring length can be made relatively short. As a result, due to the presence of the TEG 300, the leading wiring 108 does not have a complicated wiring layout in which the wiring resistance is increased or the wiring is easily broken or short-circuited, and can maintain a high function as the wiring.
[0062]
Next, the relationship between the electro-optical device substrate 200 configured as described above, the FPC, and the mounting case will be described with reference to FIG.
[0063]
As shown in FIG. 3, the electro-optical device substrate 200 shown in FIG. 1 is used as one substrate of an electro-optical device (see FIGS. 7 and 8) such as a liquid crystal device and an organic EL device as described later. At the time of mounting, the FPC 310 is connected to the electro-optical device substrate 200. Further, with the FPC 310 connected to the electro-optical device substrate 200 in this manner, the electro-optical device is accommodated in the mounting case 320.
[0064]
The FPC 310 has a plurality of connection electrodes corresponding to the plurality of external circuit connection terminals 102, and has a width Wc corresponding to the width of the first region 401 in a direction along the lower side of the substrate 210. The FPC 310 is a circuit in which wirings and circuits are mounted on a tape substrate such as a resin, and has an elongated shape from one end having a plurality of connection electrodes connected to the plurality of external circuit connection terminals 102 toward the other end. Extending. The width Wc of the FPC 310 is substantially equal to the width of the first region 401 in a direction along the lower side of the substrate 210.
[0065]
During mounting, the electro-optical device substrate 200 is housed in the mounting case 320 while being connected to the FPC 310 after being incorporated into the electro-optical device. Then, the holes 325 formed in the mounting case 320 are used as holes for mounting or mounting on various electronic devices such as a projector, for example, so that they are mounted inside the various electronic devices. In addition, such a hole 325 has a role of fixing a plurality of members to each other when the mounting case 320 is formed of a plurality of members, in addition to or instead of a role of attachment to various electronic devices. Good.
[0066]
According to the present embodiment, since the FPC 310 has the width Wc corresponding to the width of the first region 401 in the direction along the lower side of the substrate 210, the second region where the TEG 300 is formed even after the FPC 310 is connected. The 402 is not covered with the FPC 310. For this reason, a simulated inspection using the TEG 300 can be performed without removing the FPC 310 even after completion of manufacture including connection of the FPC 310, completion of mounting, and even after use.
[0067]
Further, in the present embodiment, the second region 402 is located in a region hidden by the mounting case 320 when the electro-optical device substrate 200 is connected to the FPC 310 and housed in the mounting case 320. Therefore, after the housing in the mounting case 320 is completed, the TEG 300 can be protected by covering the TEG 300 with the mounting case 320. In addition, even after the completion of manufacture or after the completion of mounting, if the electro-optical device is taken out of the mounting case 320, a simulated inspection using the TEG 300 can be performed without removing the FPC 310.
[0068]
In addition, in this embodiment, the FPC 310 does not have a width to reach the second region 402 in order not to spatially conflict with the mounting hole 325 of the mounting case 320. That is, the FPC 310 having the width Wc enough to avoid the hole 325 does not exist up to the position facing the second region 402. As described above, the second region 402 is a region where the plurality of external circuit connection terminals 102 cannot be provided in order to connect the FPC 310 and perform mounting by the mounting case 320.
[0069]
As described above with reference to FIGS. 1 to 3, according to the present embodiment, near the lower edge of the substrate 210, the second region 402 where the TEG 300 is formed is provided in the first region 401. Due to the existence of the plurality of external circuit connection terminals 102 and the existence of the routing wiring 108 extending toward the image display area 10a or the scanning line driving circuit 104 and the data line driving circuit 101 from the terminal 102, a dead space exists. In particular, since each of the plurality of external circuit connection terminals 102 essentially requires a certain size for external circuit connection, the first region 401 needs a certain width in the Y direction. That is, in the present embodiment, the TEG 300 is formed by effectively utilizing the dead space having a certain width in the Y direction.
[0070]
As described with reference to FIG. 3, according to the present embodiment, near the lower edge of the substrate 210, the second region 402 where the TEG 300 is formed includes a plurality of external regions provided in the first region 401. Given the presence of the FPC 310 connected to the circuit connection terminal 102 and the presence of the mounting case 320, a dead space having a certain width in the X direction from the corner of the substrate 210 is formed. In particular, the electro-optical device substrate 200 must be able to be accommodated in the mounting case 320 with the FPC 310 connected, and the mounting case 320 itself holds the electro-optical device substrate 200 therein and has a hole for mounting. Given the constraint that 325 must be open, the first area 401 must be somewhat centered from the corner of the substrate 210. That is, in this embodiment, the TEG 300 is formed by effectively utilizing a dead space having a certain width in the X direction.
[0071]
In addition, from the plurality of external circuit connection terminals 102, the wirings 108 are respectively routed from the portions located on the image display region 10 a side, that is, from the upper edge side of each rectangular external circuit connection terminal 102 in FIG. 1. Have been. The routing wiring 108 extends to the second region 402 side along the lower side of the substrate 210 and includes a portion reaching the scanning line driving circuit 104 through the upper side. As can be seen from FIG. 1, such a layout of the routing wiring 108 is generally along the shortest path from each external circuit connection terminal 102 to the scanning line driving circuit 104. Therefore, as the second region 402 in which the TEG 300 is formed, a region in which the leading wiring 108 cannot be meaningfully routed is adopted as the second region 402 even in relation to the leading wiring 108. That is, in the present embodiment, the TEG 300 is formed by effectively utilizing the dead space in which the routing wiring 108 is difficult to route efficiently.
[0072]
As described in detail above, according to the present embodiment, the second region 402 which is a region on the substrate which can be generally called a dead space due to the relationship with the plurality of external circuit connection terminals 102 and the like. Can be used to form the TEG 300. In other words, securing the second region 402 for forming the TEG 300 does not cause an increase in the area on the substrate 210, and the existence of the second region 402 or the presence of the TEG 300 indicates that There is little or no increase in the size of the optical device substrate 200 and the entire electro-optical device including the same.
[0073]
Conversely, in the second region 402, which can have a certain width in each of the X direction and the Y direction, for example, a TFT, a contact hole, The TEG 300 that simulates various wirings and electrodes can be formed. As described above, the present embodiment is very advantageous in manufacturing the TEG 300 while reducing the size. Moreover, as can be seen from FIGS. 1 and 3, by forming the TEG 300 in the second region 402, the size of the substrate 210, the scanning line driving circuit 104, the data line driving circuit 101, and the routing wiring 108 on the substrate 210. No design change is required for the planar layout or the like. In addition, as can be seen from FIGS. 1 and 3, product inspection at the time of completion of the manufacture of the electro-optical device substrate 200, such as after the scribing process, product inspection after shipping, and further, product inspection at the time of failure after use, etc. , TEG300 can be used for inspection.
[0074]
Although FIGS. 1 and 3 illustrate only the scanning line driving circuit 104 and the data line driving circuit 101 as the peripheral circuits, depending on the type of the electro-optical device substrate 200, the peripheral circuit or the peripheral region may be used. The provided driving circuit may be, for example, a sampling circuit, a precharge circuit, an inspection circuit, or the like. Further, they may be entirely formed on the substrate 210, or may be partially post-installed as an external IC (Integrated Circuit).
[0075]
(Second embodiment of substrate for electro-optical device)
A second embodiment of the electro-optical device substrate according to the present invention will be described with reference to FIG. FIG. 4 is a schematic perspective view showing "a plurality of electro-optical device substrates formed on a mother substrate".
[0076]
As shown in FIG. 4, in the present embodiment, a plurality of electro-optical device substrates 200 are arranged on a mother substrate 500. The TEG 300 is configured to be located off the scribe line 502 when the mother substrate 500 is divided. Other configurations are the same as those in the first embodiment.
[0077]
According to the second embodiment, at the time of manufacture, for example, about several tens of the electro-optical device substrates 200 are formed on the mother substrate 500. In particular, since the TEG 300 is located off the scribe line 502, the inspection using the TEG 300 can be performed without any problem even after the division by the scribe process. In addition, after the division by the scribe process, the inspection using the TEG 300 can be individually performed on the plurality of electro-optical device substrates 200.
[0078]
(Third Embodiment of Electro-Optical Device Substrate)
A third embodiment of the substrate for an electro-optical device according to the present invention will be described with reference to FIG. FIG. 5 is a plan view schematically showing the relationship between a substrate for an electro-optical device and a rubbing direction in a rubbing process performed during the manufacturing process.
[0079]
As shown in FIG. 5, in the present embodiment, a rubbing process is performed on the alignment film formed on the 210 substrate such that the image display area 10a is not located downstream of the TEG 300 in the rubbing direction DR. . Other configurations are the same as those in the first embodiment.
[0080]
As already illustrated in FIG. 2, the TEG 300 includes TEG portions N-1 to N-20 and TEG portions P-1 to P-20 having various patterns of a planar structure and a cross-sectional structure depending on the measurement object. Comprising. Therefore, when the rubbing treatment is performed by forming an alignment film on the TEG 300, rubbing spots are likely to be generated on the downstream side in the rubbing direction in accordance with such irregular and various uneven patterns. .
[0081]
However, according to the present embodiment, if used as the image display area 10a, the area 520 of the rubbing defect (the area indicated by cross-hatching in the drawing) where the alignment defect according to the unevenness of the TEG 300 is likely to occur is actually an image. The rubbing direction DR is defined so as to deviate from the display area 10a.
[0082]
Therefore, it is possible to extremely efficiently prevent the adverse effect of the rubbing process on the region where the TEG 300 is formed from affecting the image display performed in the image display region 10a after the completion of the manufacturing.
[0083]
Note that such an alignment film is provided for the purpose of defining the alignment state of a liquid crystal layer in a liquid crystal device (see FIGS. 7 and 8), for example.
[0084]
(Manufacturing process)
Next, the manufacturing process of the electro-optical device substrate 200 according to the embodiment described above with reference to FIG. 6 in addition to FIGS. FIG. 6 is a process chart showing the present manufacturing process.
[0085]
6, first, on a plurality of substrates 210 included on the mother substrate 500 (see FIG. 4), in addition to the wiring such as the scanning lines 203 and the data lines 206, the electro-optical device substrate 200 Various electronic elements, wirings, electrodes, etc. are formed according to the type of. In the same step or before and after this, peripheral circuits such as the scanning line driving circuit 104 and the data line driving circuit 101 and various wirings related thereto are formed in the peripheral region. Then, the TEG 300 is formed in the second region 402 in the peripheral region by the same process as the process of forming various electronic elements, wirings, electrodes, and the like in the image display region 10a and the peripheral region (step S101).
[0086]
Next, a plurality of external circuit connection terminals 102 are formed in the first region 401 on the substrate 210. Such an external circuit connection terminal 102 is formed, for example, by patterning a metal, an alloy, or the like having a single layer structure or a multilayer structure with high conductivity (step S102). Note that part or all of the step S102 can be performed simultaneously with or before the step S103 described above.
[0087]
Next, an alignment film is formed on the uppermost layer of the substrate 210 on which various electronic elements, wirings, electrodes, and the like are formed. Here, for example, an alignment film is formed by spin-coating a transparent organic film such as a polyimide film (Step S103).
[0088]
Subsequently, a rubbing treatment is performed on the alignment film thus formed. At this time, rubbing is particularly performed in the rubbing direction DR such that the image display area 10a is not located downstream of the TEG 300 as shown in FIG. 5 (step S104). Incidentally, such a rubbing process is performed so as to have a predetermined pretilt angle, for example, several degrees.
[0089]
In the rubbing process in step S104, a region in which misalignment occurs due to unevenness of the TEG 300, such as a rubbing line easily formed by a rubbing cloth along the rubbing direction DR, is likely to occur. The rubbing direction DR is defined so that the image display area 10a is off. Therefore, the adverse effect of the rubbing process on the region where the TEG 300 is formed can be extremely efficiently prevented from affecting the image display.
[0090]
Next, the method includes bonding the electro-optical device substrate 200 to, for example, an opposing substrate as one of a pair of substrates, and injecting liquid crystal between the pair of substrates thus bonded. The optical device is assembled (Step S105).
[0091]
Next, as shown in FIG. 4, scribing along the scribe line 502 is performed on the mother substrate 500 (step S106).
[0092]
In the scribing process of step S106, the scribing is performed along the scribe line 502 located off the TEG 300, so that the inspection using the TEG 300 can be performed without any problem even after the division. In addition, during the scribe, which is basically a cutting process in which the blade is rotated at a high speed, the presence of the TEG 300 on the scribe line 502 causes loss of uniformity of the scribe and damage of the blade or damage of the blade. It is also possible to avoid shortening the life.
[0093]
Next, as shown in FIG. 3, a process of connecting the FPC 310 to the plurality of external circuit connection terminals 102 is performed (Step S107). Such a connection is made using, for example, a conductive adhesive such as a photocurable or thermosetting adhesive. Alternatively, thermocompression bonding or the like may be used.
[0094]
Next, as shown in FIG. 3, with the FPC 310 connected, the electro-optical device substrate 200 incorporated in the electro-optical device is housed in the mounting case 320 (step S108). At this time, the TEG 300 is preferably hidden and protected by the mounting case 320.
[0095]
Thereafter, mounting or mounting inside various electronic devices such as a liquid crystal projector (see FIG. 9) using the holes 325 formed in the mounting case 320 is performed.
[0096]
As described above, according to the manufacturing process of the present embodiment, the plurality of external circuit connection terminals 102 are provided in the first region 401 and the TEG 300 is provided in the second region 402 in the peripheral region as described above. The substrate 200 can be manufactured. Therefore, by using the TEGs 300 provided side by side with the plurality of external circuit connection terminals 102 in the peripheral region, a simulated test using the TEGs 300 can be performed at any stage after step S102 shown in FIG. It becomes possible. Further, a simulated inspection using the TEG 300 is possible even after the product is completed or mounted.
[0097]
(Overall configuration of electro-optical device)
Hereinafter, the overall configuration of the electro-optical device incorporating the respective embodiments of the electro-optical device substrate configured as described above will be described with reference to FIGS. 7 and 8. FIG. 7 is a plan view of the TFT array substrate together with the components formed thereon as viewed from the counter substrate 20, and FIG. 8 is a cross-sectional view taken along the line HH 'of FIG.
[0098]
In particular, the present embodiment uses a TFT array substrate as an example of the above-described substrate 200 for an electro-optical device (see FIGS. 1 to 6) as one of a pair of substrates, and a liquid crystal device as an example of an electro-optical device. Is constructed.
[0099]
7 and 8, in the electro-optical device according to the present embodiment, the TFT array substrate 10 and the opposing substrate 20 are arranged to face each other. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the opposing substrate 20, and the TFT array substrate 10 and the opposing substrate 20 are separated from each other by a seal provided in a sealing area located around the image display area 10a. The members 52 are bonded to each other.
[0100]
The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or the like, and is hardened by ultraviolet light, heating, or the like in order to bond the two substrates together. In addition, if the electro-optical device according to the present embodiment is applied to a liquid crystal device that performs a small-sized enlarged display such as a projector, the distance between the two substrates (the distance between the substrates) A gap material (spacer) such as glass fiber or glass beads for setting the gap to a predetermined value is dispersed. Alternatively, such a gap material may be included in the liquid crystal layer 50 if the electro-optical device is applied to a large-sized liquid crystal device such as a liquid crystal display or a liquid crystal television that displays images at the same magnification.
[0101]
In an area outside the sealing material 52, a data line driving circuit 101 for driving the data line by supplying an image signal to the data line at a predetermined timing and an external circuit connection terminal 102 are arranged along one side of the TFT array substrate 10. It is provided. A scanning line driving circuit 104 that drives a scanning line by supplying a scanning signal to the scanning line at a predetermined timing is provided along two sides adjacent to the one side.
[0102]
If the delay of the scanning signal supplied to the scanning line does not matter, it goes without saying that the scanning line driving circuit 104 may be provided on only one side. Further, the data line driving circuits 101 may be arranged on both sides along the side of the image display area 10a.
[0103]
On one remaining side of the TFT array substrate 10, a plurality of wirings 105 for connecting between the scanning line driving circuits 104 provided on both sides of the image display area 10a are provided. In at least one of the corners of the counter substrate 20, a conductive material 106 for electrically connecting the TFT array substrate 10 and the counter substrate 20 is provided.
[0104]
In FIG. 8, an alignment film 16 is formed on a pixel electrode 9a after a TFT for pixel switching and a wiring such as a scanning line and a data line are formed on a TFT array substrate 10. The pixel electrodes 9a are arranged in a matrix in each pixel, and the alignment film 16 is formed so as to cover one surface of the plurality of pixel electrodes 9a. On the other hand, on the counter substrate 20, an alignment film is formed on the uppermost layer in addition to the counter electrode 21. The liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several kinds of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.
[0105]
On the opposing substrate 20, light-shielding films 23 for at least partially defining an opening region of each pixel or in place of or in addition to this, in order to avoid high temperature of the substrate 20 due to incident light, are arranged in a matrix. It is formed in a lattice shape or a stripe shape corresponding to the gap between the plurality of pixel electrodes 9a. Further, a light-shielding film 53 that defines a frame of the image display area 10a is formed on the counter substrate 20. These light-shielding films 23 and 53 are formed including the same or different light-shielding materials such as metals, alloys, and resins.
[0106]
In this embodiment, in particular, the TEGs 300 are provided on the left and right sides of the external circuit connection terminals 102 in the figure near the lower side on the TFT array substrate 10. The lead wiring 108 from the external circuit connection terminal 102 is configured to include a portion that passes through the upper side of the TEG 300 in the drawing and reaches the scanning line driving circuit 104.
[0107]
In the present embodiment, the scanning line driving circuit 104 is formed in a plane area where the liquid crystal layer 50 is surrounded by the sealing material 52. Similarly, a sampling circuit 301 that samples an image signal in accordance with a driving signal from the data line driving circuit 101 is also formed in a plane area where the liquid crystal layer 50 surrounded by the sealing material 52 exists. On the other hand, the data line driving circuit 101 is formed in a peripheral region located on the outer peripheral side of the seal material 52. However, a part or all of these peripheral circuits may be formed in a peripheral area located on the outer peripheral side of the sealing material 52, or a part or all of these peripheral circuits may be located inside the sealing material 52. May be formed in the peripheral region. Such an arrangement may be determined in consideration of the adverse effect of the potential fluctuation of each circuit on the liquid crystal layer 50 and the like. When the potential fluctuation due to the electric field generated from the data line driving circuit 101 is larger than that of the scanning line driving circuit 104 or the sampling circuit 301, the planar layout illustrated in FIGS. 7 and 8 is generally advantageous.
[0108]
On the TFT array substrate 10, in addition to the data line driving circuit 101 and the scanning line driving circuit 104, a precharge signal of a predetermined voltage level is supplied to a plurality of data lines prior to the image signal. A precharge circuit, an inspection circuit for inspecting the quality, defects, and the like of the electro-optical device during manufacturing or shipping may be formed.
[0109]
Further, in each of the above-described embodiments, instead of providing the data line driving circuit 101 and the scanning line driving circuit 104 on the TFT array substrate 10, for example, a driving LSI mounted on a TAB (Tape Automated Bonding) substrate is used. The connection may be made electrically and mechanically via an anisotropic conductive film provided on the periphery of the TFT array substrate 10. Further, on the side of the counter substrate 20 where the projected light is incident and on the side where the emitted light of the TFT array substrate 10 is emitted, for example, a TN (Twisted Nematic) mode, a VA (Vertically Aligned) mode, and a PDLC (Polymer Dispersed Liquid Crystal), respectively. A polarizing film, a retardation film, a polarizing plate, and the like are arranged in a predetermined direction according to an operation mode such as a) mode or a normally white mode or a normally black mode.
[0110]
(Electronics)
Next, an overall configuration, particularly an optical configuration, of an embodiment of a projection type color display device as an example of an electronic apparatus using the electro-optical device described above in detail as a light valve will be described. FIG. 9 is a schematic cross-sectional view of the projection type color display device.
[0111]
In FIG. 9, a liquid crystal projector 1100, which is an example of a projection type color display device according to the present embodiment, prepares three liquid crystal modules each including a liquid crystal device in which a driving circuit is mounted on a TFT array substrate, and each of them has a light valve for RGB. The projector is used as 100R, 100G, and 100B. In the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, three mirrors 1106 and two dichroic mirrors 1108 emit light components R, G and R corresponding to the three primary colors RGB. B, and are led to light valves 100R, 100G, and 100B corresponding to each color. In this case, in particular, the B light is guided through a relay lens system 1121 including an entrance lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are combined again by the dichroic prism 1112, and then projected as a color image on the screen 1120 via the projection lens 1114.
[0112]
The present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope of the invention or the idea that can be read from the entirety of the claims and the specification, and an electro-optical device with such a change. Also, the manufacturing method thereof and the electronic device are also included in the technical scope of the present invention.
[0113]
Further, the electro-optical device of the present invention can be applied to an active matrix type liquid crystal display panel (for example, a liquid crystal display panel including a TFT (thin film transistor) or a TFD (thin film diode) as a switching element). The present invention is applicable not only to a liquid crystal display panel but also to various electro-optical devices such as an electroluminescence device, an organic electroluminescence device, a plasma display device, an electrophoretic display device, and a field emission display (field emission display device). The same can be applied.
[Brief description of the drawings]
FIG. 1 is a plan view of an electro-optical device substrate according to an embodiment.
FIG. 2 is a specific example of a TEG shown in FIG.
FIG. 3 is a plan view showing a state in which the substrate for an electro-optical device of FIG. 1 is connected to an FPC and accommodated in a mounting case after being assembled in the electro-optical device.
FIG. 4 is a schematic perspective view showing a plurality of electro-optical device substrates formed on a mother substrate according to the embodiment.
FIG. 5 is a plan view schematically showing a relationship between a substrate for an electro-optical device according to the embodiment and a rubbing direction in a rubbing process performed in a manufacturing process thereof.
FIG. 6 is a process chart showing a manufacturing process according to the embodiment.
FIG. 7 is a plan view of the TFT array substrate in the electro-optical device according to the embodiment of the present invention, together with the components formed thereon, viewed from the counter substrate side.
FIG. 8 is a sectional view taken along line HH ′ of FIG. 7;
FIG. 9 is a schematic sectional view showing a color liquid crystal projector as an example of a projection type color display device which is an embodiment of the electronic apparatus of the invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 ... Data line drive circuit, 102 ... External circuit connection terminal, 104 ... Scanning line drive circuit, 108 ... Routing wiring, 200 ... Electro-optical device substrate, 210 ... Substrate, 210a ... Image display area, 300 ... TEG, 310 ... FPC, 320: mounting case, 325: hole, 401: first area, 402: second area, 500: mother board, 502: scribe line

Claims (17)

Wiring for image display formed in the image display area on the substrate, at least one of the electrode and the electronic element,
Along a side of the substrate in a peripheral region located around the image display region on the substrate, the substrate is arranged in a first region located near a center of the one side, and among the wiring, the electrode, and the electronic element. A plurality of terminals for external circuit connection electrically connected directly or indirectly to at least one each,
An electric state of at least a part of at least one of the wiring, the electrode, and the electronic element, which is arranged in a second region located alongside the first region in a direction along the one side in the peripheral region and A test element group for simulated inspection; and a substrate for an electro-optical device. A peripheral circuit disposed in the peripheral region and electrically connected to at least one of the wiring, the electrode, and the electronic element;
The plurality of terminals are electrically connected to the peripheral circuit instead of or in addition to at least one of the wiring, the electrode, and the electronic element,
The test element group may include a portion for simulating an electrical state of at least a part of the peripheral circuit in place of or in addition to at least one of the wiring, the electrode, and the electronic element. The substrate for an electro-optical device according to claim 1. The plurality of connection electrodes of a flexible printed circuit having a width corresponding to a width of the first region in a direction along the one side are connected to the plurality of terminals. A substrate for an electro-optical device according to the above. The electro-optical device substrate according to claim 3, wherein the second area is located in an area that is not hidden by the flexible printed circuit. The said 2nd area | region is located in the area hidden by the said mounting case, when the said electro-optical device board | substrate is connected to the said flexible printed circuit and mounted in the mounting case, The said 3rd area | region, or characterized by the above-mentioned. 5. The substrate for an electro-optical device according to 4. On the substrate, a plurality of lead-out wirings including portions extending to the second area side along the one side from the locations of the plurality of terminals located on the image display area side are further provided. The electro-optical device substrate according to claim 1. The width of the test element group in a direction perpendicular to the one side in the second region is less than or equal to a width of the terminal in a direction perpendicular to the one side in the first region. 7. The substrate for an electro-optical device according to 6. The rubbing process is performed on the alignment film formed on the substrate so that the image display area is not located downstream of the test element group when viewed from a rubbing direction. 8. The substrate for an electro-optical device according to any one of items 1 to 7. The second region is provided two on both sides of the first region,
The test element group is formed in each of the two existing second regions,
The test element group formed in one of the two existing second regions and the test element group formed in the other of the two existing second regions have different configurations. The electro-optical device substrate according to any one of claims 1 to 8, wherein: An electro-optical device comprising the electro-optical device substrate according to any one of claims 1 to 9. An electro-optical device substrate according to claim 5, comprising:
In the mounting case, mounting holes are formed in a region that is separated from the one side in a perpendicular direction and that faces the second region in a state where the electro-optical device substrate is mounted. Electro-optical device. An electro-optical device substrate according to any one of claims 1 to 9, wherein the electro-optical device substrate is provided as one of a pair of substrates opposed to each other via an electro-optical material,
The electro-optical device according to claim 1, wherein the first and second regions are not covered by the other of the pair of substrates. An electronic apparatus comprising the electro-optical device according to claim 10. A step of forming at least one of an image display wiring, an electrode, and an electronic element in an image display area on the substrate,
In a peripheral area located on the periphery of the image display area on the substrate, arranged along a side of the substrate in a first area located near the center of the side, and the wiring, the electrode, and the electronic element. A step of forming a plurality of terminals for external circuit connection electrically connected directly or indirectly to at least one of them,
An electrical state of at least a part of at least one of the wiring, the electrode, and the electronic element, which is disposed in a second region located in the peripheral region in a direction along the one side along the first region; Forming a test element group for simulating inspection of
The method of manufacturing a substrate for an electro-optical device, wherein the step of forming the test element group and the step of forming at least one of a wiring, an electrode, and an electronic element are performed at least partially at the same time. In the peripheral region, further includes a step of forming a peripheral circuit electrically connected to at least one of the wiring, the electrode, and the electronic element,
The plurality of terminals are electrically connected to the peripheral circuit instead of or in addition to at least one of the wiring, the electrode, and the electronic element,
The test element group includes, in place of or in addition to at least one of the wiring, the electrode, and the electronic element, a portion for simulating an electrical state in at least a part of the peripheral circuit,
14. The method according to claim 13, wherein the step of forming the test element group and the step of forming the peripheral circuit are performed at least partially at the same time. A plurality of the electro-optical device substrates are arranged on a mother substrate,
The test element group is arranged at a position deviated from a scribe line when dividing the mother substrate, and is positioned on the electro-optical device substrate,
The method of manufacturing an electro-optical device substrate according to claim 14, further comprising a step of dividing the mother substrate along the scribe line. Rubbing the alignment film formed on the substrate so that the image display area is not located downstream of the test element group when viewed from the rubbing direction. 17. The substrate for an electro-optical device according to any one of 14 to 16.

Images