JP3119357B2 - Liquid crystal display - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a liquid crystal display device, and more particularly to an active matrix type using a thin film transistor (TFT) and a COG mounting type in which a TFT driving IC chip is mounted on a transparent glass substrate. The present invention relates to a technique suitable for application to a liquid crystal display device.

[0002]

2. Description of the Related Art For example, an active matrix type liquid crystal display device has a nonlinear element (switching element) corresponding to each of a plurality of pixel electrodes arranged in a matrix.
Is provided. Since the liquid crystal in each pixel is theoretically always driven (duty ratio 1.0), the active system has a better contrast than the so-called simple matrix system that employs the time-division driving system, and particularly in the case of color. It is becoming an indispensable technology. A typical example of the switching element is a thin film transistor.

[0003] For example, an active matrix type color liquid crystal display device using a thin film transistor and a pixel electrode as one component of a pixel has a liquid crystal display panel (LCD) in which a plurality of pixels are arranged in a matrix. Each pixel of the display unit includes a TFT driving line, that is, two adjacent scanning signal lines (also referred to as gate signal lines or horizontal signal lines) and two adjacent video signal lines (drain signal lines or vertical signal lines). Signal line). The scanning signal lines extend in the column direction (horizontal direction) and are arranged in a row direction (vertical direction). On the other hand, a plurality of video signal lines extend in a row direction intersecting with the scanning signal lines, and a plurality of video signal lines are arranged in a column direction.

A liquid crystal display panel has a display section and a wiring area. The display section includes a lower substrate in which a thin film transistor, a transparent pixel electrode, an alignment film and the like are sequentially provided on a lower transparent glass substrate, and an upper transparent glass substrate. An upper substrate on which a color filter, a common transparent pixel electrode, an alignment film and the like are sequentially provided, a liquid crystal sealed between the alignment films of both substrates, and a sealing of the liquid crystal provided on a peripheral portion of the panel. And a stop member. The transparent pixel electrode and the thin film transistor are provided for each pixel. The lower transparent glass substrate is larger in size than the upper transparent glass substrate, and has a wiring region for driving the TFT on the outer peripheral portion of the upper transparent glass substrate stacked on the lower transparent glass substrate. One of a source electrode and a drain electrode of the thin film transistor is connected to a transparent pixel electrode,
The other electrode is connected to a video signal line, and the gate electrode is connected to a scanning signal line.

A method of directly mounting a drive IC chip on a glass substrate is called a COG (chip-on-glass) mounting method.

In the wiring area of the liquid crystal display panel, for example, TFT driving wiring, an IC chip directly mounted on the lower transparent glass substrate, and wiring outside the lower transparent glass substrate are provided. FPC (flexible printed circuit board) to be connected to the signal transmission means is provided.

Incidentally, an active matrix liquid crystal display device using a TFT is described in, for example, "1.
2.5-inch active matrix color liquid crystal display ", Nikkei Electronics, pp. 193-210,
Known on December 15, 1986, published by Nikkei McGraw-Hill.

An example in which a driving IC chip is directly mounted on a glass substrate, and an FPC is connected to the glass substrate and bent on the back surface of the glass substrate is described in JP-A-64-37533.

However, Japanese Patent Application Laid-Open No. 64-37533 does not consider at all the prevention of electrostatic breakdown by short-circuiting the liquid crystal drive wiring, and connects each terminal under an IC chip. There was no description of the wiring for short circuit.
Accordingly, the technique disclosed in Japanese Patent Application Laid-Open No. 64-37533 has a problem that static electricity enters in a manufacturing process of a liquid crystal display device and the liquid crystal panel is destroyed.

Japanese Patent Application Laid-Open No. 64-37533 discloses that
There is no description that the connection pads to be connected to the drive IC chip are arranged in a staggered arrangement. Therefore, the technique disclosed in JP-A-64-37533 has a problem that the bonding area between the driving IC chip and the liquid crystal driving wiring cannot be made sufficiently large.

Further, Japanese Patent Application Laid-Open No. 64-37533 has no description of providing an inspection terminal on the liquid crystal drive wiring. Therefore, the technique disclosed in Japanese Patent Application Laid-Open No. 64-37533 has a problem that after bonding the IC chip, it is not possible to inspect the defect and the connection state of the IC chip.

Japanese Patent Laid-Open No. 2-8817 discloses a prior art in which a drive IC chip is directly mounted on a glass substrate and a liquid crystal drive wiring is short-circuited to prevent electrostatic breakdown.

However, in the above-mentioned prior art, the short circuit is removed by etching, so that the liquid crystal drive wirings are insulated from each other.
It was difficult to reduce the size of the liquid crystal display device.

In the above prior art, there is no description that the connection pads to be connected to the drive IC chip are arranged in a staggered arrangement. Therefore, even in the above prior art, there is a problem that the bonding area between the driving IC chip and the liquid crystal driving wiring cannot be made sufficiently large.

[0015]

Conventionally, TFT driving wirings (ie, gate signal lines and drain signal lines) are
Since it is cut off at the connection point to electrically connect to the IC chip directly mounted on the glass substrate, static electricity enters from this connection point during the manufacturing process, and the TFT is destroyed or the threshold voltage of the TFT is reduced. There is a problem that the voltage fluctuates and the yield decreases. Further, conventionally, there has been no means for inspecting an IC defect or a connection state of wire bonding after connecting an IC chip and wiring.

Conventionally, there has been a problem that the interval between the output pads of the driving IC chip is narrow and the bonding area between the driving IC chip and the liquid crystal driving wiring cannot be made sufficiently large.

A first object of the present invention is to provide a method for manufacturing a liquid crystal display device which can eliminate the adverse effects of static electricity.

A second object of the present invention is to provide a liquid crystal display device capable of easily inspecting an IC failure and a connection state of wire bonding after bonding an IC chip.

A third object of the present invention is to secure a sufficiently large bonding area between the driving IC chip and the liquid crystal driving wiring to facilitate bonding.

[0020]

In order to solve the above-mentioned problems, a liquid crystal display device according to the present invention comprises a TFT on a glass substrate.
Drive IC connected to multiple input wirings
A wiring connected to each of the input wirings exists below the chip.

Further, the liquid crystal display device of the present invention is characterized in that an inspection electrode is provided below the IC chip and the other end of the short-circuit wire having one end connected to each of the input wires. I do.

Further, in the method of manufacturing a liquid crystal display device according to the present invention, a TFT driving wire and a short-circuit wire to which each terminal of the above-mentioned wire is connected are provided on a glass substrate.
In the FT process, static electricity easily penetrates, so this short-circuit wiring is left. After the TFT substrate (lower substrate) is completed,
The connection between each terminal of the wiring and the wiring for short-circuiting is made insulated by glass cutting or the like in an appropriate process of a CD and a module process. The wiring for short-circuiting is indispensable in the TFT process where a large amount of static electricity enters, but after that, it is preferable to leave the wiring for short-circuiting until the process where static electricity easily enters, such as a rubbing step. IC chip mounting
It is basically performed after cutting the short-circuit wiring. Alternatively, an IC chip for driving a TFT is first mounted on the glass substrate, the electrodes of the IC chip are electrically connected to the wiring, and then each terminal of the wiring is connected to the shorting wiring. Can be insulated. The choice depends on the rationalization and reliability of the process.

In the liquid crystal display device of the present invention, the wiring connected to each of the above-mentioned input wirings also exists below the IC chip, and there is no place where static electricity enters. Therefore, the adverse effect of static electricity during the manufacturing process can be eliminated. .

Further, since the liquid crystal display device of the present invention has the inspection electrodes, it is possible to easily inspect the defect of the IC and the connection state of the wire bonding using the probe immediately after the bonding of the IC.

Further, the liquid crystal display device of the present invention comprises a driving IC
Since the connection pads for connection to are connected in a staggered manner, a bonding area can be secured to facilitate bonding.

Further, in the method of manufacturing a liquid crystal display device according to the present invention, all the wirings have the same potential by providing a shorting wiring to which each terminal of the wiring is drawn out and connected, thereby eliminating the adverse effect of static electricity during the manufacturing process. be able to.

Other objects and features of the present invention will become apparent from the following description with reference to the drawings.

[0028]

FIG. 6 is a sectional view of a liquid crystal display portion of an active matrix type color liquid crystal display device according to an embodiment to which the present invention is applied, and FIG. 7 is an equivalent circuit diagram of the liquid crystal display portion.

<< Overall Structure of Panel Section >> As shown in FIG. 6, the liquid crystal display panel has a thin film transistor TFT1, a transparent pixel electrode ITO1, a protective film PSV1 of the thin film transistor TFT and a liquid crystal on a lower transparent glass substrate SUB1 based on a liquid crystal layer LC. Lower alignment film OR for setting the direction of molecules
A first substrate on which I1 is sequentially provided, and a black matrix BM, a protective film PSV2 for a color filter FIL, a common transparent pixel electrode ITO2, and an upper alignment film ORI2 sequentially provided on an upper transparent glass substrate SUB2. And a liquid crystal LC sealed between the respective alignment films ORI1 and ORI2 of the two substrates SUB1 and SUB2.
A seal member (sealing member) SL is provided around the two substrates and seals the liquid crystal LC between the two substrates. The thickness of the lower transparent glass substrate SUB1 is, for example, about 1.1 mm.

The center part of FIG. 6 shows a cross section of one pixel part, while the left side shows transparent glass substrates SUB1 and SUB2.
2 shows a cross section of a portion where the external lead-out wiring exists at the left edge portion of FIG. On the right are transparent glass substrates SUB1 and SU
The cross section of the right edge portion of B2 where there is no external lead-out wiring is shown.

In the method of manufacturing a liquid crystal display panel, the first
And the second substrate are separately formed, and a spacer material (not shown) is interposed between the two substrates so that the alignment films ORI1 and ORI2 of the two substrates face each other. It is assembled by overlapping at predetermined intervals, sealing the liquid crystal LC between the two substrates, and sealing with a sealing material SL provided around the two substrates. The backlight BL is arranged on the lower transparent glass substrate SUB1 side.

The sealing materials SL shown on the left and right sides of FIG. 6 are configured to seal the liquid crystal LC.
Transparent glass substrate S excluding liquid crystal filling port (not shown)
Provided along the entire periphery of the edges of UB1 and SUB2,
For example, it is made of an epoxy resin.

The common transparent electrode ITO2 on the upper transparent glass substrate SUB2 side is connected to an external lead wire provided on the lower transparent glass substrate SUB1 side by a silver paste material SIL at at least one place. This external lead-out wiring is formed of the transparent pixel electrode layer ITO1.

The alignment films ORI1 and ORI2, the transparent pixel electrode ITO1, and the common transparent electrode ITO2 are made of a sealing material SL.
It is provided inside. The polarizing plate POL is provided on the outer surface of each of the lower transparent glass substrate SUB1 and the upper transparent glass substrate SUB2.

The transparent pixel electrode ITO1 and the thin film transistor TFT are provided for each pixel.

<< Thin Film Transistor >> The thin film transistor TFT of each pixel is divided into three (a plurality) in the pixel, and the thin film transistor (divided thin film transistor)
It is composed of TFT1, TFT2 and TFT3.
Each of the thin film transistors TFT1 to TFT3 has substantially the same dimensions (the same channel length and width). The divided thin film transistors TFT1 to T
Each of FT3 is mainly composed of a gate electrode GT, a gate insulating film GI, an i-type semiconductor layer AS made of an i-type (intrinsic, intrinsic, not doped with a conductivity type determining impurity) amorphous silicon (Si) semiconductor, , And a source electrode SD1 and a drain electrode SD2. It should be understood that the source and the drain are originally determined by the bias polarity between them, and the polarity is inverted during the operation in the circuit of the liquid crystal display device, so that the source and the drain are interchanged during the operation. However, in the following description, for convenience, one is source,
The other is fixedly expressed as a drain. The source electrode SD1 of the thin film transistor TFT is connected to the transparent pixel electrode ITO1, the drain electrode SD2 is connected to the video signal line DL, and the gate electrode GT is connected to the scanning signal line GL.

<< Light shielding film BM >> Upper transparent glass substrate SUB
A black matrix BM made of a chrome layer or the like is provided on portions of the substrate SUB2 corresponding to the scanning signal lines GL, the video signal lines DL, and the thin film transistors TFT in order to shield the thin film transistors TFT1 to 3 from the second side. Thereby, the contour of each pixel is made clear by the light shielding film BM, and the contrast is improved. That is, the light shielding film BM
Has two functions, that is, light shielding for the semiconductor AS and black matrix.

It should be noted that the backlight may be attached to the SUB2 side and the SUB1 may be the observation side (externally exposed side).

<< Common electrode ITO2 >> Common transparent electrode ITO
Numeral 2 is arranged to face a transparent pixel electrode ITO1 provided for each pixel on the lower transparent glass substrate SUB1 side, and is configured to be common to a plurality of pixel electrodes ITO. A common voltage is applied to the common transparent electrode ITO2.

<< Equivalent Circuit of Entire Display Panel >> FIG. 7 shows an equivalent circuit of this liquid crystal display device. A plurality of pixels of the liquid crystal display unit are arranged in the same column direction as the direction in which the scanning signal lines Yi, Yi + 1,... Extend, and the pixel columns XiG, XiB, Xi
+ 1R,... The color filter FIL is formed in a dot shape for each pixel at a position facing the pixel, and is dyed separately. XiG, Xi + 1
G are video signal lines DL connected to the pixels on which the green filter G is formed. XiB, Xi + 1B, ...
This is a video signal line DL connected to a pixel on which a blue filter B is formed. Xi + 1R, Xi + 2R,... Are video signal lines DL connected to the pixels where the red filter R is formed.
It is.

These video signal lines DL are selected by video signal drive circuits provided above and below the liquid crystal display panel.
Yi is a scanning signal line GL for selecting a pixel column. Similarly, each of Yi + 1, Yi + 2,...
2, X3,... Are scanning signal lines GL for selecting each of the scanning signal lines. These scanning signal lines GL are connected to a vertical scanning circuit provided on the left side of the liquid crystal display panel. On the right side of the LCD panel is a power supply circuit and a host (upper processing unit)
There is provided a circuit for converting the information for CRT from the CRT into the information for TFT liquid crystal display panel.

FIG. 1 is a plan view showing one embodiment of a wiring portion of the liquid crystal display device of the present invention. 1 denotes a lower transparent glass substrate (TFT substrate) of the liquid crystal display device, 2 denotes an input wiring to the TFT, 3a and 3b connect the input wiring 2 to a drive IC electrode (output pads 10a and 10b in FIG. 2). Pads (electrodes), 4a and 4b are test pads, 5 is a short-circuit wiring between the pads connecting the connection pads 3a and 3b and the test pads 4a and 4b, and 6a and 6b are drive ICs.
, The reference numeral 7 denotes a short-circuit wiring for preventing static electricity from which all terminals of the wiring are drawn out and connected, and 8a and 8b denote TFTs provided with the short-circuit wiring 7 for preventing static electricity, respectively.
8a is a cutting line for cutting the substrate 1, 8a is an inspection pad 4a,
4b is a cutting line when leaving the TFT substrate 1, and 8b is a cutting line when cutting the inspection pads 4a and 4b.

That is, the input wiring 2 to the TFT is provided on the TFT substrate 1, and the input wiring 2 is connected to the output (the output pads 10a and 10b in FIG. 2) of the driving IC.
In this embodiment, in order to prevent intrusion of static electricity, a short-circuit wire 7 is provided around the TFT substrate 1, and all wires are connected to the short-circuit wire 7. Therefore, the inter-pad short wiring 5 passes under the driving IC chip. The connection pads 3a and 3b are for connection with the output pads of the drive IC, and are connected by wire bonding. Here, the connection pads 3a and 3b are arranged in a staggered manner, a bonding area is secured to facilitate wire bonding, and re-bonding is also possible. The pulse signal and power supply to the drive IC are supplied through input lines 6a and 6b to the drive IC and input pads of the drive IC (1 in FIG. 2).
1a, 11b) by wire bonding.

In the manufacturing process of the TFT substrate, all the terminals of the wiring are drawn out and connected by the shorting wiring 7, so that all the wirings have the same potential and the TFT is destroyed by static electricity or the threshold voltage of the TFT fluctuates. Problem can be prevented, and the yield can be improved. The short wiring 7 is
An upper transparent glass substrate provided with a color filter;
Combining with the lower transparent glass substrate provided with FT,
After assembling the liquid crystal display panel, cut line 8a or 8b
Is cut off by There are two types of cutting methods. The cutting line 8a is a cutting line for leaving the inspection pads 4a and 4b, and the cutting line 8b is for shorting the inspection pads 4a and 4b to reduce the size of the liquid crystal display module. This is a cutting line when cutting off with the wiring 7.

FIG. 2 is a diagram showing a drive IC showing the arrangement of pads of a drive IC chip to be bonded to the TFT substrate shown in FIG.
It is a top view of C chip. 9 is a drive IC chip, 10
a and 10b are output-side connection pads (hereinafter referred to as output pads), 11a and 11b are input-side connection pads (hereinafter referred to as input pads), and n is the number of outputs of the drive IC chip 9 (the number of output pads). Number), m ₁ and m ₂ are the drive IC chips 9
The number of inputs (the number of input pads), P ₁ is the output pad pitch, P ₂ is the pitch of the input pad, x is the short side of the length of the drive IC chip 9, y is the length of the drive IC chip 9 The length of the side. In the present embodiment, the output pads 10a and 10b provided on the drive IC chip 9 are arranged in a staggered manner in order to increase the margin of wire bonding. The output pads 10a and 10b are connected to the connection pads 3a and 3b on the TFT substrate 1 of FIG. 1 by wire bonding. Assuming that the number of outputs is n, the output pads 10a, 10b
Are n / 2. Therefore, the pitch of the output pads When P _1, the length y of the drive IC chip is approximately P ₁ × n. For driving IC chip clock input,
The power input pads 11a and 11b each have _one m,
m ₂ pieces exist. When the pitch of the input pad and _{P 2,} the length x of the drive IC chip is about _{P 2 × m 1, P 2} × m
The larger of the _two . That is, as is apparent from FIG. 2, in the liquid crystal display device of the present invention, the output pads 10a and 10b of the drive IC chip 9 form a plurality of columns along one long side of the drive IC chip 9, and One output pad 1
The two output pads 10b adjacent to 0a are provided in a different row from the one output pad 10a, that is, in a so-called staggered arrangement, so that two outputs adjacent to 10a are connected to one output pad. There is an effect that the space between the pads 10b is widened and a bonding area is secured to facilitate bonding. TFT substrate wiring pattern and drive I
It is necessary to design corresponding to the pads of the C chip.

FIGS. 3 and 4 are plan views each showing a state in which the driving IC chip is mounted on the TFT substrate. FIG. 3 shows a case where the TFT substrate 1 is cut off along the cutting line 8a in FIG. 1 and the inspection pads 4a and 4b are left on the TFT substrate 1.
Shows a case where the TFT substrate is cut off along with the inspection pads 4a and 4b along the cutting line 8b for the purpose of downsizing the module.

Reference numeral 12 denotes an upper transparent glass substrate provided on the lower transparent glass substrate 1, between which a liquid crystal is sealed and sealed. Reference numeral 13 denotes a chip component of a peripheral circuit such as a capacitor, a resistive element, a passive element and a video signal to a TFT.
The FPC is provided with a controller and the like (not shown) for converting into a driving signal. The FPC 13 and the input wirings 6a and 6b to the IC are electrically connected at 14a and 14b.

The pad of the driving IC chip and the pad on the TFT substrate are usually made of a material mainly composed of Al.
Wire bonding is performed with a u line or an Al line. The FPC 13 is connected to the wiring patterns 6a and 6b using an anisotropic conductive film or wire bonding. For this reason, the material of the wiring pattern in this portion is an ITO (Nesa) film at least when the connection is made by an anisotropic conductive film, and an Al film at least when the connection is made by wire bonding.

As is apparent from FIGS. 3 and 4, in the liquid crystal display device of the present invention, a plurality of connection pads 3a and 3b connected to one drive IC chip 9 correspond to the corresponding drive IC.
A plurality of rows are formed along one long side of the chip 9, and two adjacent (3a, 3b) of the plurality of connection pads are provided in different rows from each other by performing a so-called staggered arrangement. Therefore, the space between adjacent connection pads (3a, 3b) is widened, and there is an effect that a bonding area is secured and bonding becomes easy.

FIGS. 5A and 5B are cross-sectional views showing a method of inspection after mounting a drive IC chip on a TFT substrate and performing wire bonding. 15 is a TFT substrate 1
Bonding wires for connecting the connection pads of the drive IC chip 9 and the output pads of the drive IC chip 9; a probe 16 for inspection; 17 a chip component of peripheral circuits such as a capacitor, a resistance element, and a passive element mounted on the FPC 13; Peripheral components such as a controller for converting a signal into a TFT driving signal, and a double-sided tape 18 for attaching the FPC 13 to the TFT substrate 1. FIG. 3B is a cross-sectional view taken along line AA in FIG. 3, in which an input is applied from the FPC 13 to the drive IC 9. In an actual test, as shown in FIG. 3A, test pads (4 a, 4 b in FIG. A probe 16 is set up on the board, and an input wiring pattern to the drive IC chip 9 (6a, 6b in FIG. 3)
And an inspection is performed for the IC failure and the connection state of the wire bonding.

The advantage of the inspection according to the present embodiment is that the driving IC can be driven without turning on the liquid crystal display panel only by hitting the probe.
In addition, various inspections can be performed on defects such as defects and connection states of wire bonding, and characteristics can be checked only by signal waveforms. Parts replacement, repair, and process management are easy, and the yield can be improved. As shown in (b), the FPC 13
Folded twice, and a double-sided tape 18
It is adhered by. The peripheral components 17 such as a chip component and a controller are soldered on the FPC 13 before being mounted on the TFT substrate 1.

The embodiments of the present invention have been described above.
The present invention is not limited to the above-described embodiment, and it is needless to say that various changes can be made without departing from the scope of the present invention.

[0053]

As described above, according to the liquid crystal display device of the present invention, the TFT generated by the static electricity generated during the manufacturing process is used.
Can be prevented or the threshold voltage of the TFT fluctuates, and the yield can be improved. Immediately after the bonding of the IC, the defect of the IC and the connection state of the wire bonding can be easily inspected, so that replacement, repair and process management of parts are easy, and the yield can be improved.

Further, the liquid crystal display device of the present invention comprises a driving IC
Since the connection pads for connection with are arranged in a staggered manner, a bonding area can be secured to facilitate bonding.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a wiring section of a liquid crystal display device of the present invention.

FIG. 2 is a plan view of the driving IC chip showing an arrangement of pads of the driving IC chip to be bonded to the TFT substrate shown in FIG.

FIG. 3 is a plan view showing a state where a driving IC chip is mounted on a TFT substrate.

FIG. 4 is a plan view showing a state where a driving IC chip is mounted on a TFT substrate.

5 (a) and 5 (b) each show a driving IC chip with T
It is sectional drawing which shows the inspection method after mounting on an FT board and performing wire bonding.

FIG. 6 is a sectional view of a liquid crystal display section of an active matrix type color liquid crystal display device according to an embodiment to which the present invention is applied;

FIG. 7 is an equivalent circuit diagram of a liquid crystal display unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Lower transparent glass substrate (TFT substrate) 2 ... Input wiring to TFT 3a, 3b ... Connection pad 4a, 4b ... Inspection pad 5 ... Short wiring between pads 6a, 6b ... Input wiring to drive IC chip 7 ... Short-circuit wiring for static electricity countermeasures 8a, 8b. Cut line of TFT substrate 9. Drive IC chip 10a, 10b. Output pad 11a, 11b. Input pad 12. Upper transparent glass substrate 13. FPC 15. Bonding wire 16. Probe 17: Peripheral parts 18: Double-sided tape

Continuation of front page (56) References JP-A-64-55581 (JP, A) JP-A-52-77744 (JP, A) JP-A-60-130721 (JP, A) JP-A-64-37533 (JP) JP-A-63-179395 (JP, A) JP-A-64-77025 (JP, A) JP-A-2-8817 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB Name) G02F 1/1345 G09F 9/00 346

Claims (7)

(57) [Claims] 1. A liquid crystal panel comprising an upper transparent glass substrate, a lower transparent glass substrate larger in size than the upper transparent glass substrate, and a liquid crystal sealed between the upper transparent glass substrate and the lower transparent glass substrate. A plurality of first input wirings to the liquid crystal panel provided on the lower transparent glass substrate outside the upper transparent glass substrate; and electrically connected to the first input wiring and directly to the lower transparent glass substrate. A mounted drive IC chip for driving a liquid crystal panel, the drive IC chip has a plurality of input pads and a plurality of output pads, and the lower transparent glass substrate has a plurality of output pads of the drive IC chip. A plurality of connection pads which are electrically connected to each other and are formed on a part of the plurality of first input wirings, and wherein the drive IC is provided on the lower transparent glass substrate. A second input wiring electrically connected to a plurality of input pads of the chip, wherein the plurality of output pads are formed in a plurality of rows along one long side of the driving IC chip, and two adjacent The pads are provided in a staggered manner in different rows, and the plurality of connection pads connected to one drive IC chip form a plurality of rows along one long side of the drive IC chip. The two adjacent connection pads are provided in a staggered manner in mutually different rows, and the plurality of input pads of the drive IC chip are connected to the drive I
The second input wiring is provided along at least one short side of the C chip, the second input wiring extends in a long side direction of the drive IC chip from a portion electrically connected to the input pad, and the second input wiring extends along the lower transparent side. A liquid crystal display device extending to a connection point with an external signal transmitting means provided near an end of a glass substrate. 2. A liquid crystal panel comprising: an upper transparent glass substrate; a lower transparent glass substrate larger in size than the upper transparent glass substrate; and a liquid crystal sealed between the upper transparent glass substrate and the lower transparent glass substrate. A plurality of first input wirings to the liquid crystal panel provided on the lower transparent glass substrate outside the upper transparent glass substrate; and electrically connected to the first input wiring and directly to the lower transparent glass substrate. A driving IC chip for driving the liquid crystal panel mounted thereon; and a second input wiring formed on the lower transparent glass substrate and electrically connected to an input pad of the driving IC chip. Has a rectangular shape elongated in a direction in which an end of the lower transparent glass substrate closest to the drive IC chip is mounted, and has a plurality of output pads. A plurality of connection pads electrically connected to the plurality of output pads of the drive IC chip and formed on a part of the plurality of first input wirings are formed on the lower transparent glass substrate. The plurality of connection pads connected to one drive IC chip form at least one row along one long side of the drive IC chip, and the second input wiring and the drive IC chip The connection portion with the input pad is provided along at least one short side of the driving IC chip, and the second input wiring is connected to an external signal provided near the end of the lower transparent glass substrate from the connection portion. It extends to a connection point with the input supply means connected to the transmission means, and the connection point is sandwiched by two extension lines extending from two short sides of the drive IC chip to an end of the lower transparent glass substrate. Part The liquid crystal display device characterized by being formed in the longitudinal direction outside of the drive IC. 3. A liquid crystal panel comprising an upper transparent glass substrate, a lower transparent glass substrate having a size larger than the upper transparent glass substrate, and a liquid crystal sealed between the upper transparent glass substrate and the lower transparent glass substrate. A plurality of first input lines to the liquid crystal panel provided on the lower transparent glass substrate outside the upper transparent glass substrate; and electrically connected to the first input lines and directly mounted on the lower transparent glass substrate. A driving IC chip for driving a liquid crystal panel, the driving IC chip has a plurality of input pads and a plurality of output pads, and a plurality of outputs of the driving IC chip are provided on the lower transparent glass substrate. are electrically connected in correspondence with the pads have a plurality of connection pads formed on a part of the plurality of first input lines, said driving IC switch from the plurality of connection pads A plurality of short-circuit wirings extending to an end of the lower transparent glass substrate below the chip and electrically connected to each of the plurality of first input wirings. A plurality of connection pads connected to the plurality of output pads, the plurality of connection pads being connected to the plurality of output pads; Forming at least one column along one of the long sides, wherein the plurality of shorting wires are formed adjacent to each other;
The drive IC chip extends in the two short side directions, and outside the drive IC chip is surrounded by two extension lines extending from the two short sides of the drive IC chip to the end of the lower transparent glass substrate. A liquid crystal display device, wherein the liquid crystal display device is formed in a region that is separated. 4. A liquid crystal panel comprising an upper transparent glass substrate, a lower transparent glass substrate larger in size than the upper transparent glass substrate, and a liquid crystal sealed between the upper transparent glass substrate and the lower transparent glass substrate. A plurality of first input lines to the liquid crystal panel provided on the lower transparent glass substrate outside the upper transparent glass substrate; and electrically connected to the first input lines and directly mounted on the lower transparent glass substrate. A driving IC chip for driving a liquid crystal panel, the driving IC chip has a plurality of input pads and a plurality of output pads, and a plurality of outputs of the driving IC chip are provided on the lower transparent glass substrate. are electrically connected in correspondence with the pads have a plurality of connection pads formed on a part of the plurality of first input lines, said driving IC switch from the plurality of connection pads A plurality of short-circuit wirings extending to an end of the lower transparent glass substrate below the socket and electrically connected to each of the plurality of first input wirings; A second input wiring formed thereon and electrically connected to an input pad of the driving IC chip, wherein the driving IC chip has an end portion of the lower transparent glass substrate closest to the mounting surface extending thereon; The plurality of connection pads connected to the plurality of output pads form at least one row along one long side of the drive IC chip; A connecting portion between the wiring and the input pad of the driving IC chip is provided along at least one short side of the driving IC chip, and the second input wiring extends from the connecting portion to the vicinity of an end of the lower transparent glass substrate. Set in And is connected to an external signal transmitting means extends to the connection locations between the input supply means, said plurality of short-circuiting lines are formed adjacent to each other,
The drive IC extends in the short side direction of the drive IC chip,
Outside the chip, it is formed in a region surrounded by two extended lines extending from two short sides of the driving IC chip to an end of the lower transparent glass substrate, and the connection portion is formed in the long side direction. A liquid crystal display device formed outside the plurality of shorting wires. 5. The connecting portion is located outside a long side direction of the driving IC at a portion sandwiched between two extended lines extending from two short sides of the driving IC chip to an end of the lower transparent glass substrate. The liquid crystal display device according to claim 4, wherein the liquid crystal display device is formed. 6. The input supply means comprises a flexible substrate, the electrical connection with the connection location is made via an anisotropic conductive film, and the end of the flexible substrate is
In the short side direction of the drive IC chip, outside the long side direction of the drive IC between two extended lines extending from the two short sides of the drive IC chip to the end of the lower transparent glass substrate. 5. The projection according to claim 2, wherein the projection is provided.
Or the liquid crystal display device according to 5. 7. A plurality of output pads of the driving IC chip are formed in a plurality of rows along the one long side, and two adjacent pads are provided in a staggered pattern different from each other. The liquid crystal display device according to claim 2, 3, or 4.