CN113619904B - Cooling unit for electronic component packaging unit and electronic component packaging unit - Google Patents

Cooling unit for electronic component packaging unit and electronic component packaging unit Download PDF

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Publication number
CN113619904B
CN113619904B CN202110822947.0A CN202110822947A CN113619904B CN 113619904 B CN113619904 B CN 113619904B CN 202110822947 A CN202110822947 A CN 202110822947A CN 113619904 B CN113619904 B CN 113619904B
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Prior art keywords
electronic component
packaging unit
unit
electronic element
cooling
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CN202110822947.0A
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CN113619904A (en
Inventor
李天俊
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Suining Best Packaging Materials Co ltd
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Suining Best Packaging Materials Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
    • B65D81/2069—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Abstract

The invention relates to the field of electronic equipment and packaging, in particular to an electronic element packaging unit, which aims to solve the problems of ageing (such as weathering and corrosion oxidation) of electronic elements in the prior art. The electronic component packaging unit is provided with a closed accommodating space; the electronic component is sealed in the accommodating space of the electronic component packaging unit, and the accommodating space is filled with a preset volume of protective gas. The electronic element packaging unit has the advantages of simple structure, stability and reliability, and greatly improves the problem of easy aging of electronic elements in the prior art.

Description

Cooling unit for electronic component packaging unit and electronic component packaging unit
The application is a divisional application, the application number of the original application is 201710349673.1, and the application date is: 5.17 days 2017; the invention creates the name: an electronic component packaging unit.
Technical Field
The invention relates to the field of electronic equipment and packaging, in particular to an electronic element packaging unit.
Background
Electronic components, which are an important component of the third industrial revolution, play an important role in the aspects of modern production and life. With industry reform adjustments, more and more products use electronic components. The electronic element has the characteristics of high precision, high intelligent integration level, wide application range and the like, meanwhile, the electronic element usually has metal parts, and the electronic element has the problem of easy aging (such as weathering, corrosion and oxidation) due to the characteristics of metal, so that the service lives of the electronic element and equipment comprising the electronic element are greatly shortened, the use conditions of production and living equipment comprising the electronic element are further caused, and great potential safety hazards are seriously caused; on the other hand, depending on the application, technical content and manufacturing cost of the electronic components, the value of some electronic components is high, and the protection of such electronic components is more important.
However, there is no method for effectively preventing the electronic components from aging (e.g., weathering, corrosion oxidation) in the prior art.
Disclosure of Invention
The invention aims to provide an electronic component packaging unit which has good anti-aging (corrosion resistance and oxidation resistance) characteristics.
Embodiments of the present invention are implemented as follows:
the electronic component packaging unit is provided with a closed accommodating space; the electronic component is sealed in the accommodating space of the electronic component packaging unit, and the accommodating space is filled with a preset volume of protective gas.
Such electronic components are placed in an electronic component packaging unit filled with a shielding gas, and a sealed space of the electronic component packaging unit and the shielding gas filled in the electronic component packaging unit provide good insulation for the electronic components so as to separate corrosive substances such as oxygen from the electronic components, thereby ensuring good performance and long service life of the electronic components. In conclusion, the electronic element packaging unit has the advantages of simple structure, stability and reliability, and the problem of easy aging of the electronic element in the prior art is greatly improved.
In one embodiment of the invention:
the shielding gas is an inert gas.
In one embodiment of the invention:
the electronic element packaging unit further comprises a cooling unit, and the cooling unit is connected with the electronic element packaging unit to reduce the temperature in the accommodating space.
In one embodiment of the invention:
the cooling unit is used for reducing the temperature inside the electronic element packaging unit through the water-cooling refrigeration equipment.
In one embodiment of the invention:
the cooling unit is used for reducing the temperature inside the electronic element packaging unit through the refrigerant refrigerating equipment.
In one embodiment of the invention:
the cooling unit is used for reducing the temperature inside the electronic element packaging unit through the semiconductor refrigerating sheet.
In one embodiment of the invention:
the electronic component packaging unit further comprises a cooling fan;
the cooling unit is connected with the cooling fan.
In one embodiment of the invention:
the electronic element packaging unit further comprises a temperature sensor and a control unit;
the temperature sensor is arranged in the electronic element packaging unit, and the control unit is respectively connected with the temperature sensor and the cooling unit.
In one embodiment of the invention:
the electronic component packaging unit further comprises a first connecting piece and a second connecting piece;
the first connecting piece is provided with a through channel, and one end of the channel of the first connecting piece is communicated with the inside of the electronic element packaging unit;
the other end of the passageway is detachably connected to the second connector to selectively seal the passageway.
In one embodiment of the invention:
the method further comprises a power-off protection step of controlling the temperature through a power-off protection device;
the power-off protection device comprises a first power supply and a relay, and the cooling unit is electrically connected with the first power supply through the relay; the relay is also electrically connected with a second power supply;
the control unit is connected with the relay.
The embodiment of the invention has the beneficial effects that:
an electronic component packaging unit is provided with a closed accommodating space; the electronic component is sealed in the accommodating space of the electronic component packaging unit, and the accommodating space is filled with a preset volume of protective gas. The electronic component is placed in the electronic component packaging unit filled with the protective gas, and the space in the electronic component packaging unit and the protective gas filled in the electronic component packaging unit provide good isolation for the electronic component so as to separate the electronic component from the easily-corrodible substances such as oxygen and the like, thereby ensuring good performance and long service life of the electronic component.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a package unit for electronic components according to an embodiment of the present invention;
FIG. 2 is a schematic view of another structure of an electronic component packaging unit according to an embodiment of the present invention;
FIG. 3 is a schematic view of a third structure of an electronic component packaging unit according to an embodiment of the present invention;
fig. 4 is a schematic view of a fourth structure of an electronic component packaging unit according to an embodiment of the invention.
Icon: 100-packaging assembly; 110-an electronic component packaging unit; 111-packaging bags; 112-packaging box; 120-electronic components; 121-pins; 130-shielding gas; 140-a cooling unit; 150-a heat radiation fan; 161-a temperature sensor; 162-a control unit; 171-first connection; 172-a second connector; 180-relay; 181-a first power supply; 182-a second power source.
Drawings
With the objects, technical solutions and advantages of the embodiments of the present invention made more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples
Next, in order to more intuitively and more specifically describe the structure and operation of the electronic component packaging unit 110, we next introduce the concept of the packaging assembly 100. Specifically, the package assembly 100 includes an electronic component packaging unit 110 and an electronic component 120 sealed in an accommodating space of the electronic component packaging unit 110, and the accommodating space is filled with a predetermined volume of a shielding gas 130. It should be noted that, in one implementation of filling the preset volume of the shielding gas 130, the accommodating space is completely evacuated, and then the preset volume of the shielding gas 130 is filled into the accommodating space, so that the entire accommodating space is filled with the shielding gas 130.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic component packaging unit 110 according to the present embodiment. As can be seen from the figures, the package assembly 100 includes an electronic component package unit 110 and an electronic component 120; the electronic component 120 is sealed in the electronic component packaging unit 110, and the electronic component packaging unit 110 is filled with a predetermined volume of the shielding gas 130.
The electronic component packaging unit 110 serves as a carrier for protecting the electronic component 120, while the protective gas 130 filled in the electronic component packaging unit 110 balances the pressure difference between the inside and the outside of the electronic component packaging unit 110 on the one hand and provides a microenvironment for the electronic component 120 that prevents aging on the other hand. Further, in the present embodiment of the present invention, the shielding gas 130 is an inert gas.
The inert gas is selected for the shielding gas 130 because of its excellent physicochemical properties. Tests and comparison show that compared with the common protective gas 130, the inert gas has stable chemical property, does not react with the material of the electronic component 120, and is very suitable for being used as the protective gas 130 of the electronic component 120.
Inert gas (or rare gas) refers to group 18 elements of the periodic table (IUPAC new definition, i.e. original group 0). At normal temperature and pressure, they are colorless and odorless monoatomic gases, and chemical reactions are difficult to carry out. There are six naturally occurring rare gases, namely helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and radioactive radon (Rn). In the atoms of the inert gas element, the arrangement of electrons in the respective electron layers is just to a stable number. Atoms are therefore not prone to losing or getting electrons, and are therefore difficult to chemically react with other substances, and these elements are therefore referred to as "inert gas elements". Rare gases are commonly used as shielding gases in the production sector by their extremely inert chemical nature. This is also why inert gas is used as the inflation raw material in the inflation step. Here, since Og is a rare gas artificially synthesized, the nucleus is very unstable and the half-life is short (5 ms). According to the periodic law of elements, og is estimated to be more reactive than radon and theoretical calculations show that it may be very reactive and not necessarily called inert gas. The inert gases mentioned in the embodiments of the present invention refer to six naturally occurring rare gases, namely helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and radon (Rn) having radioactivity.
As can also be seen from fig. 1, the electronic component packaging unit 110 further comprises a cooling unit 140, the cooling unit 140 being connected with the electronic component packaging unit 110 for reducing the temperature inside the electronic component packaging unit 110.
In this embodiment of the present invention, the electronic component packaging unit 110 further includes a cooling unit 140, and the cooling unit 140 is connected to the electronic component packaging unit 110 to reduce the temperature in the electronic component packaging unit 110. The cooling unit 140 may be any one of a water-cooled refrigerating apparatus, a refrigerant refrigerating apparatus, and a semiconductor refrigerating sheet. In the present embodiment of the present invention, a semiconductor cooling fin is employed as the cooling unit 140. Semiconductor cooling fins, also known as thermoelectric cooling fins. Its advantages are no slide parts, and high reliability and no pollution to refrigerant. By utilizing the Peltier effect of the semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be realized. The refrigerating technology for producing negative thermal resistance features no moving parts and high reliability.
As can be further seen from fig. 1, in the present embodiment of the present invention, the electronic component packaging unit 110 further includes a heat dissipation fan 150; the cooling unit 140 is connected to a cooling fan 150. The heat radiation fan 150 can accelerate the emission of the temperature of the electronic component packaging unit 110, so that the temperature of the electronic component packaging unit 110 can reach a preset value more quickly. Further, in the present embodiment, the heat dissipation fan 150 is connected to an end of the cooling unit 140 away from the electronic component packaging unit 110.
With continued reference to fig. 1, it can be seen from fig. 1 that the electronic component packaging unit 110 is a package 112. The package 112 has a predetermined size and rigidity suitable for applications requiring a fixed size.
Fig. 2 is a schematic diagram of another structure of the electronic component packaging unit 110 in the present embodiment.
As can be seen in fig. 1 and 2, the electronic component packaging unit 110 is substantially the same, except that the electronic component packaging unit 110 in fig. 2 is a packaging bag 111, and the packaging bag 111 has a shape that can be changed, and can adapt to different environmental conditions, and such packaging bag 111 enables the packaging assembly 100 to be transported and used more conveniently.
Fig. 3 is a schematic diagram of a third structure of the electronic component packaging unit 110 in the present embodiment.
As can be seen in connection with fig. 1 and 3, the electronic component packaging unit 110 is substantially identical, except that the pins 121 of the electronic component 120 in fig. 3 extend outside the electronic component packaging unit 110, which is arranged in a manner that facilitates use of the electronic component packaging unit 110 when the electronic component 120 is in operation. This way, the electronic component packaging unit 110 can be applied not only to the transportation packaging of the electronic component 120 but also to the protection of the electronic component 120 when the electronic component 120 is in operation.
Fig. 4 is a schematic diagram of a fourth structure of the electronic component packaging unit 110 in the present embodiment.
As can be seen in connection with fig. 3 and 4, the electronic component packaging unit 110 is substantially identical, except that the electronic component packaging unit 110 in fig. 4 also has a temperature sensor 161 and a control unit 162. Further, a temperature sensor 161 is provided in the electronic component packaging unit 110, and a control unit 162 is connected to the temperature sensor 161 and the cooling unit 140, respectively. It should be noted that, the purpose of the temperature sensor 161 provided in the electronic component packaging unit 110 is to monitor the temperature in the electronic component packaging unit 110 at any time, and feed back the information obtained by the monitoring to the control unit 162; the control unit 162 directs the cooling unit 140 according to a preset manner, so that the cooling unit 140 accelerates, gradually stops cooling or immediately stops cooling. In a use case, when the electronic component 120 is in operation, the electronic component 120 is unstable due to the fact that the high temperature generated during operation cannot be diffused, and when the temperature sensor 161 detects that the temperature exceeds the set value, a feedback signal is sent to the control unit 162, and after the control unit 162 determines, the control unit 162 operates the cooling unit 140 to accelerate the cooling of the cooling unit 140, so that the electronic component 120 can be protected in the electronic component packaging unit 110 continuously and can operate stably.
With continued reference to fig. 4, it can also be seen from fig. 4 that the above-described electronic component packaging unit 110 further comprises a first connector 171 and a second connector 172. Further, the first connector 171 has a passage therethrough, and one end of the passage of the first connector 171 communicates with the inside of the electronic component packaging unit 110; the other end of the passageway is detachably connected to the second connector 172 to selectively seal the passageway. The first and second connectors 171 and 172 are provided in order to affect the protection condition of the electronic component 120 if the electronic component packaging unit 110 is directly damaged to remove the electronic component 120 when the electronic component packaging unit 110 needs to remove the electronic component 120 placed therein or the electronic component 120 in the electronic component packaging unit 110 needs to be repaired with a tool, which is disadvantageous for recycling of the electronic component packaging unit 110 on the one hand and the electronic component 120 always protected by the protective gas 130 is exposed to the air again on the other hand. Meanwhile, the second connecting piece 172 is detachably connected to selectively seal the other end of the channel, and the arrangement mode is that the detachable connection of the second connecting piece 172 is verified, the convenience of using the electronic element packaging unit 110 is verified, the sufficient tightness of the electronic element packaging unit 110 is ensured, and the protection effect of the electronic element packaging unit 110 is further ensured.
The electronic component packaging unit 110 is substantially identical except that the electronic component packaging unit 110 also has a power-off protection device including a relay 180, a first power source 181, and a second power source 182. Wherein, the first power supply 181 and the second power supply 182 are respectively connected with the current inlet of the relay 180, and the current outlet of the relay 180 is connected with the cooling unit 140; while relay 180 is electrically connected to control unit 162. Here, in a preset case, the cooling unit 140 is connected to a power supply source of the electronic component 120 through the relay 180, and the power supply source is the second power source 182. (for example, when the electronic component 120 to be protected is a motherboard of a computer host, the second power 182 is a power supply of the computer host), after the second power 182 is powered off, the control unit 162 connects the first power 181 with the cooling unit 140 according to a preset program so that the cooling unit 140 can continue to operate. The reason for setting the power-off protection device is that: however, a large amount of heat is often generated when the electronic component 120 works, and the heat is filled in the accommodating space of the electronic component packaging unit 110, so that the excessive heat cannot be effectively dissipated to affect the working performance of the electronic component 120 (even cause the electronic component 120 to be inoperable), and the purpose of the power-off protection device is to ensure that the heat in the accommodating space can be effectively dissipated to protect the electronic component 120 (even if the second power source 182 is powered off).
In use, the electronic component 120 is placed in the electronic component packaging unit 110 configured with the accommodation space, and the electronic component 120 is positioned in the accommodation space; then, a vacuumizing step is carried out, and all air in the accommodating space of the electronic element packaging unit 110 is vacuumized, so that vacuum is formed in the electronic element packaging unit 110; the step of vacuumizing is followed by the step of inflating, wherein inert gas is inflated; finally, the opening of the electronic component packaging unit 110 is sealed so that the electronic component 120 is placed inside the electronic component packaging unit 110 filled with the preset volume of the shielding gas 130. In this way, the electronic component 120 is placed in the microenvironment filled with the protective gas 130, so that the external conditions that the electronic component 120 is corroded and oxidized are isolated, and the purpose of protecting the electronic component 120 is achieved. Referring to fig. 4, the pins 121 of the electronic component 120 extend out of the electronic component packaging unit 110 in such a manner that, when the electronic component 120 is operated, the electronic component packaging unit 110 and the shielding gas 130 filled in the electronic component packaging unit 110 can effectively isolate the body of the electronic component 120 from the outside of the electronic component packaging unit 110, and the pins 121 are located outside the electronic component packaging unit 110 so that the electronic component 120 is continuously operated while current or signal is obtained through the pins 121. Meanwhile, the cooling unit 140 and the cooling fan 150 can well dissipate heat generated when the electronic component 120 works, so that the electronic component 120 can be well protected from aging no matter in a static state or in a working state.
It should be noted that:
in order to enhance the corrosion and oxidation resistance of the electronic component packaging unit 110, a desiccant may be placed in the electronic component packaging unit 110. The drying agent can better ensure the drying property of the electronic component packaging unit 110, and further improve the anti-aging performance of the electronic component 120.
The material of the electronic component packaging unit 110 may be any one of aluminum foil, nylon composite, and PET film, as long as the electronic component packaging unit 110 can effectively wrap the electronic component 120 and accommodate the shielding gas 130 in the electronic component packaging unit 110.
The opening of the electronic component packaging unit 110 for placing the electronic component 120 may be one or more, as long as the electronic component packaging unit 110 is capable of accommodating the electronic component 120, which is not limited herein.
A filter valve body which is unidirectionally conducted may be provided in the passage of the first connector 171, thereby further enhancing the sealing effect; meanwhile, in order to secure the performance of the electronic component packaging unit 110, a sealing member may be provided on the contact surface of the second connection member 172 and the first connection member 171 to enhance the sealing effect.
The concept of vacuum is generally a gaseous state below one atmosphere pressure in a given space and is a physical phenomenon. In fact, in the vacuum technique, the vacuum is directed to the atmosphere, and a portion of the material within a particular space is evacuated to a pressure less than a standard atmospheric pressure, and we refer to this space as a vacuum or vacuum state. The optimal vacuum state in the present embodiment of the present invention is that the inside of the electronic component packaging unit 110 is completely free of air, but the scheme provided by the present invention can be smoothly implemented and has a desired protective effect even in the vacuum environment in the above-described concept.
In the present embodiment, the shielding gas 130 is an inert gas, and in other embodiments of the present invention, the shielding gas 130 may be other gases that do not react with the electronic component 120, so long as the shielding gas 130 does not react with the electronic component 120. Further, when the electronic component 120 placed in the accommodating space of the electronic component packaging unit 110 has no element that reacts with nitrogen, then nitrogen may also be used as the shielding gas 130, and further, in a specific case, air may also be used as a kind of shielding gas 130.
As another way of providing the accommodating space with only the shielding gas 130, the shielding gas 130 may be continuously filled in the accommodating space so that the gas in the accommodating space flows out from the opening of the electronic component packaging unit 110.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A cooling unit for an electronic component packaging unit, comprising:
the electronic component packaging unit is provided with a closed accommodating space;
the electronic element is sealed in the accommodating space, and the accommodating space is filled with a preset volume of protective gas;
the pins of the electronic element extend out of the electronic element packaging unit so as to facilitate the electronic element packaging unit to be used when the electronic element works;
the cooling unit is connected with the electronic element packaging unit to reduce the temperature in the accommodating space, so that the high temperature generated during the operation of the electronic element is diffused.
2. The cooling unit of claim 1, wherein:
the cooling unit is used for reducing the temperature inside the electronic element packaging unit through water-cooling refrigeration equipment.
3. The cooling unit of claim 1, wherein:
the cooling unit is used for cooling the inside of the electronic element packaging unit through a refrigerant refrigerating device.
4. The cooling unit of claim 1, wherein:
the cooling unit is used for reducing the temperature inside the electronic element packaging unit through the semiconductor refrigerating sheet.
5. The cooling unit according to any one of claims 1-4, wherein:
the electronic component packaging unit further comprises a cooling fan;
the cooling unit is connected with the cooling fan.
6. An electronic component packaging unit characterized in that:
the electronic component packaging unit is provided with a closed accommodating space;
the electronic element is sealed in the accommodating space, and the accommodating space is filled with a preset volume of protective gas;
the pins of the electronic element extend out of the electronic element packaging unit so as to facilitate the electronic element packaging unit to be used when the electronic element works;
the electronic element packaging unit further comprises a cooling unit, and the cooling unit is connected with the electronic element packaging unit to reduce the temperature in the accommodating space, so that the high temperature generated during the operation of the electronic element is diffused.
7. The electronic component packaging unit according to claim 6, wherein:
the electronic component packaging sheet adopts the cooling unit according to any one of claims 1 to 5.
8. The electronic component packaging unit according to claim 6, wherein:
the electronic element packaging unit further comprises a temperature sensor and a control unit;
the temperature sensor is arranged in the electronic element packaging unit, and the control unit is respectively connected with the temperature sensor and the cooling unit.
9. The electronic component packaging unit according to any one of claims 6 to 8, wherein:
the electronic component packaging unit further comprises a first connecting piece and a second connecting piece;
the first connecting piece is provided with a channel penetrating through the first connecting piece, and one end of the channel of the first connecting piece is communicated with the inside of the electronic element packaging unit;
the other end of the passage is detachably connected to the second connector to selectively seal the passage.
10. The electronic component packaging unit according to claim 6, wherein:
the method also comprises a power-off protection step of controlling the temperature through a power-off protection device;
the power-off protection device comprises a first power supply and a relay, and the cooling unit is electrically connected with the first power supply through the relay; the relay is also electrically connected with a second power supply;
and a control unit in the electronic element packaging unit is connected with the relay.
CN202110822947.0A 2017-05-17 2017-05-17 Cooling unit for electronic component packaging unit and electronic component packaging unit Active CN113619904B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110822947.0A CN113619904B (en) 2017-05-17 2017-05-17 Cooling unit for electronic component packaging unit and electronic component packaging unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110822947.0A CN113619904B (en) 2017-05-17 2017-05-17 Cooling unit for electronic component packaging unit and electronic component packaging unit
CN201710349673.1A CN106976648B (en) 2017-05-17 2017-05-17 Electronic component packaging unit

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201710349673.1A Division CN106976648B (en) 2017-05-17 2017-05-17 Electronic component packaging unit

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Publication Number Publication Date
CN113619904A CN113619904A (en) 2021-11-09
CN113619904B true CN113619904B (en) 2023-05-23

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CN201623935U (en) * 2009-12-09 2010-11-03 珠海格力电器股份有限公司 Electronic device with explosionproof and fireproof functions
CN202977036U (en) * 2012-04-16 2013-06-05 深圳市辰驹电子科技有限公司 Anti-surge protector capable of indicating temperature
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