CN106976648A - Electronic component packaging unit - Google Patents
Electronic component packaging unit Download PDFInfo
- Publication number
- CN106976648A CN106976648A CN201710349673.1A CN201710349673A CN106976648A CN 106976648 A CN106976648 A CN 106976648A CN 201710349673 A CN201710349673 A CN 201710349673A CN 106976648 A CN106976648 A CN 106976648A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- packaging unit
- component packaging
- unit
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
- B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
- B65D81/2069—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Packaging Frangible Articles (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to electronic equipment and packaging field, in particular to a kind of electronic component packaging unit, it is intended to the problem of solving electronic component aging (such as weathering, corrosion oxidation) in the prior art.Electronic component packaging unit possesses closed receiving space；Electronic component encapsulation is full of the protective gas of preset vol in the receiving space of electronic component packaging unit, and in receiving space.Such electronic component packaging unit has simple in construction, reliable and stable, the problem of substantially improving the easy aging of electronic component in the prior art.
Description
Technical field
The present invention relates to electronic equipment and packaging field, in particular to a kind of electronic component packaging unit.
Background technology
Electronic component is used as the important component of the third time industrial revolution, production in modernization, in terms of the side of life
Face all has important effect.With the adjustment of Industry Reform, increasing product uses electronic component.Electronic component has
Precision, intelligent integration degree be high, using scope it is wide the features such as, while electronic component generally can all have metal parts, due to metal
The characteristics of, the problem of electronic component has easy aging (such as weathering, corrosion oxidation), this substantially reduces electronic component and including
The service life of the equipment of the electronic component, can further cause to include the production of the electronic component, the use shape of lifestyle device
Condition, serious meeting causes big potential safety hazard；On the other hand, according to the use occasion of electronic component, technology content and cost into
This difference causes the value of some electronic components very high, and the protection to this kind of electronic component is more important.
But do not prevent the method for electronic component aging (such as weathering, corrosion oxidation) effectively but in the prior art.
The content of the invention
It is an object of the invention to provide a kind of electronic component packaging unit, such electronic component packaging unit has good
The characteristic of good anti-aging (anticorrosive, anti-oxidant).
What embodiments of the invention were realized in：
Electronic component packaging unit possesses closed receiving space；Appearance of the electronic component encapsulation in electronic component packaging unit
Receive in space, and the protective gas of preset vol is full of in receiving space.
Such electronic component is placed in the electronic component packaging unit full of protective gas, electronic component packaging unit
Closed space and fill the protective gas in electronic component packaging unit provide good isolation for electronic component so that
Obtain the perishable materials such as oxygen with electronic component to separate, so as to ensure the good performance of electronic component and longer use longevity
Life.To sum up, such electronic component packaging unit has simple in construction, reliable and stable, substantially improves electronics in the prior art
The problem of element easy aging.
In an embodiment of the present invention：
Above-mentioned protective gas is inert gas.
In an embodiment of the present invention：
Above-mentioned electronic component packaging unit also includes temperature reducing unit, and temperature reducing unit is connected to drop with electronic component packaging unit
Temperature in low receiving space.
In an embodiment of the present invention：
Above-mentioned temperature reducing unit is by water cooling refrigeration plant to reduce the temperature inside electronic component packaging unit.
In an embodiment of the present invention：
Above-mentioned temperature reducing unit is by chiller refrigeration equipment to reduce the temperature inside electronic component packaging unit.
In an embodiment of the present invention：
Above-mentioned temperature reducing unit is by semiconductor chilling plate to reduce the temperature inside electronic component packaging unit.
In an embodiment of the present invention：
Above-mentioned electronic component packaging unit also includes radiator fan；
Temperature reducing unit is connected with radiator fan.
In an embodiment of the present invention：
Above-mentioned electronic component packaging unit also includes temperature sensor and control unit；
Temperature sensor is arranged in electronic component packaging unit, control unit respectively with temperature sensor and temperature reducing unit
Connection.
In an embodiment of the present invention：
Above-mentioned electronic component packaging unit also includes the first connector and the second connector；
First connector has the passage that runs through, and one end of the passage of the first connector is interior with electronic component packaging unit
Portion is connected；
The other end of passage and the second connector are detachably connected, optionally to seal passage.
In an embodiment of the present invention：
The above-mentioned power-off protection step for also including controlling temperature by power-off protection apparatus；
Power-off protection apparatus includes the first power supply and relay, and temperature reducing unit passes through relay and the first power electric connection；
Relay is also connected electrical connection with second source；
Control unit is connected with relay.
The beneficial effect of the embodiment of the present invention is：
A kind of electronic component packaging unit, it possesses closed receiving space；Electronic component encapsulation is in electronic component packaging
The protective gas of preset vol is full of in the receiving space of unit, and in receiving space.Electronic component is placed on full of protection gas
In the electronic component packaging unit of body, space in electronic component packaging unit and the protection in electronic component packaging unit is filled
Gas provides isolation well to cause the perishable material such as oxygen and electronic component cut-off for electronic component, so as to ensure
The good performance and longer service life of electronic component.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be attached to what is used required in embodiment
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore is not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is a kind of structural representation of electronic component packaging unit in the embodiment of the present invention；
Fig. 2 is another structural representation of electronic component packaging unit in the embodiment of the present invention；
Fig. 3 is the third structural representation of electronic component packaging unit in the embodiment of the present invention；
Fig. 4 is the 4th kind of structural representation of electronic component packaging unit in the embodiment of the present invention；
Fig. 5 is the 5th kind of structural representation of electronic component packaging unit in the embodiment of the present invention.
Icon：100- package components；110- electronic component packaging units；111- packaging bags；112- packing boxes；120- electronics
Element；121- pins；130- protective gas；140- temperature reducing units；150- radiator fans；161- temperature sensors；162- is controlled
Unit；The connectors of 171- first；The connectors of 172- second；180- relays；The power supplys of 181- first；182- second sources.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.The present invention implementation being generally described and illustrated herein in the accompanying drawings
The component of example can be arranged and designed with a variety of configurations.
Therefore, the detailed description of embodiments of the invention below to providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it further need not be defined and explained in subsequent accompanying drawing.
In the description of the invention, it is necessary to explanation, if occur term " on ", " interior ", the orientation of instruction such as " outer " or
Position relationship be based on orientation shown in the drawings or position relationship, or the orientation usually put when using of the invention product or
Position relationship, is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device or element of meaning must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the invention, in addition it is also necessary to explanation, unless otherwise clearly defined and limited, if there is term
" setting ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or integratedly be connected
Connect；Can be mechanical connection or electrical connection；Can be joined directly together, can also intermediary be indirectly connected to, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
Embodiment
Below, in order to it is more directly perceived, the structure and operation principle of electronic component packaging unit 110 are more specifically described, connect down
Come us and introduce package component 100 this concept.Specifically, package component 100 includes electronic component packaging unit 110 and sealing
The protection gas of preset vol is full of in electronic component 120 in the receiving space of electronic component packaging unit 110, and receiving space
Body 130.It should be noted that one kind of the protective gas 130 full of preset vol is achieved in that receiving space is first complete here
Vacuumize entirely, then the protective gas 130 of preset vol is filled with toward receiving space, so that protective gas 130 accommodates sky full of whole
Between in.
Fig. 1 is refer to, Fig. 1 provides a kind of structural representation of electronic component packaging unit 110 for the present embodiment.From figure
As can be seen that package component 100 includes electronic component packaging unit 110 and electronic component 120；Electronic component 120 is sealed in electricity
The protective gas 130 of preset vol is full of in subcomponent packaging unit 110, and in electronic component packaging unit 110.
Electronic component packaging unit 110 and is filled in electronic component packaging unit as the carrier of protection electronic component 120
Protective gas 130 in the 110 then inside and outside pressure differential of one side balance electronic element packaging unit 110, on the other hand
The microenvironment for avoiding aging is provided for electronic component 120.Further, in the present embodiment of the present invention, protective gas 130 is
Inert gas.
Explanation is needed exist for, why protective gas 130 selects inert gas to be because the excellent reason of inert gas
Change property to determine.Found through overtesting and contrast, compared to general protective gas 130, inert gas has chemical property stable,
The material with electronic component 120 does not react, and is especially suitable for doing the protective gas 130 of electronic component 120.
(IUPAC newly provides 18 race's elements that inert gas (or for rare gas) refers on the periodic table of elements, i.e., originally
0 race).At normal temperatures and pressures, they are all the monoatomic gas of colorless and odorless, it is difficult to be chemically reacted.It is naturally occurring
Rare gas has six kinds, i.e. helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and has radioactive radon (Rn).In inertia
In the atom of elemental gas, arrangement of the electronics in each electronic shell just reaches stable number.Therefore atom is not easy to lose
Or electronics is obtained, also it is difficult to chemically react with other materials, therefore these elements are referred to as " inert gas elements ".Profit
With rare gas extremely inactive chemical property, often it is used to make protection gas in production division.This is also to make in aeration step
The reason for inert gas as inflation raw material.Explanation is needed exist for, it is former because Og is with artificial synthesized rare gas
Daughter nucleus is highly unstable, and half-life period is very short (5 milliseconds).According to the periodic law of elements, estimation Og it is more active than radon and, theoretical calculation shows
Show, it may be very active, might not can be referred to as inert gas.So the indifferent gas mentioned in an embodiment of the present invention
Body refers to naturally occurring six kinds of rare gas, i.e. helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and had radioactive
Radon (Rn).
It can further be seen from figure 1 that electronic component packaging unit 110 also include temperature reducing unit 140, temperature reducing unit 140 with
Electronic component packaging unit 110 connects to reduce the temperature in electronic component packaging unit 110.
In the present embodiment of the present invention, above-mentioned electronic component packaging unit 110 also includes temperature reducing unit 140, and cooling is single
Member 140 is connected to reduce the temperature in electronic component packaging unit 110 with electronic component packaging unit 110.Here cooling list
Member 140 can be any one in water cooling refrigeration plant, chiller refrigeration equipment and semiconductor chilling plate.In the sheet of the present invention
In embodiment, semiconductor chilling plate is used as temperature reducing unit 140.Semiconductor chilling plate, is also thermoelectric module.It
Advantage is no slide unit, can be applicable to some spaces and is restricted, and reliability requirement is high, the occasion of no refrigerant pollution.
Using the Peltier effects of semi-conducting material, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, in electricity
Even two ends can absorb heat respectively and release heat, it is possible to achieve the purpose of refrigeration.It is a kind of system for producing negative thermal resistance
Refrigeration technique, is characterized in movement-less part, and reliability is also higher.
It can further be seen from figure 1 that in the present embodiment of the present invention, above-mentioned electronic component packaging unit 110 also includes
Radiator fan 150；Temperature reducing unit 140 is connected with radiator fan 150.Radiator fan 150 can speed up electronic component packaging unit
Distributing for 110 temperature, enables the temperature of electronic component packaging unit 110 quickly to reach preset value.Further, in this reality
Radiator fan 150 in example is applied to be connected with the one end of temperature reducing unit 140 away from electronic component packaging unit 110.
With continued reference to Fig. 1, as can be seen from Figure 1 electronic component packaging unit 110 is packing box 112.Packing box 112 has
There is predetermined size and hardness, be adapted to the occasion of needs fixed dimension.
Fig. 2 is another structural representation of electronic component packaging unit 110 in the present embodiment.
Electronic component packaging unit 110 is can be seen that with reference to Fig. 1 and Fig. 2 to be substantially the same, unlike, the electronics in Fig. 2
Element packaging unit 110 is packaging bag 111, and there is profile can change for packaging bag 111, can adapt to wanting for varying environment condition
Ask, such packaging bag 111 enables package component 100 more easily to transport, use.
Fig. 3 is the third structural representation of electronic component packaging unit 110 in the present embodiment.
Electronic component packaging unit 110 is can be seen that with reference to Fig. 1 and Fig. 3 to be substantially the same, unlike, the electronics in Fig. 3
The pin 121 of element 120 is stretched out outside electronic component packaging unit 110, and such set-up mode is easy to electronic component packaging unit
110 use when electronic component 120 works.Such mode causes electronic component packaging unit 110 to be not only applicable to electricity
The transportation and packing of subcomponent 120, are also suitable the protection to electronic component 120 when electronic component 120 works.
Fig. 4 is the 4th kind of structural representation of electronic component packaging unit 110 in the present embodiment.
Electronic component packaging unit 110 is can be seen that with reference to Fig. 3 and Fig. 4 to be substantially the same, unlike, the electronics in Fig. 4
Element packaging unit 110 also has temperature sensor 161 and control unit 162.Further, temperature sensor 161 is arranged on
In electronic component packaging unit 110, control unit 162 is connected with temperature sensor 161 and temperature reducing unit 140 respectively.Need
Bright, the purpose of the temperature sensor 161 being arranged in electronic component packaging unit 110 is to monitor electronic component at any time
Temperature in packaging unit 110, and obtained feedback of the information will be monitored to control unit 162；Control unit 162 is according to default
Mode commands temperature reducing unit 140, and then temperature reducing unit 140 is accelerated, tapers off cooling or stops cooling immediately.In one kind
Under service condition, because the high temperature that work is produced can not be spread so that the work of electronic component 120 in electronic component 120 operationally
Make unstable, at this time temperature sensor 161 detects temperature more than setting value, will feed back signal to control unit 162, passes through
Cross after the judgement of control unit 162, the operation temperature reducing unit 140 of control unit 162 makes temperature reducing unit 140 accelerate cooling, so as to ensure
Electronic component 120 can constantly be protected in electronic component packaging unit 110, can stably be worked again.
With continued reference to Fig. 4, it can also be seen that above-mentioned electronic component packaging unit 110 also includes the first connector from Fig. 4
171 and second connector 172.Further, the first connector 171 has the passage run through, the passage of the first connector 171
One end is connected with the inside of electronic component packaging unit 110；The other end of passage and the second connector 172 are detachably connected,
Optionally to seal passage.The purpose of the setting of first connector 171 and the second connector 172 is to work as electronic package
The dress needs of unit 110 will be put into electronic component 120 therein and take out, or need to use tool maintenance electronic component packaging unit
During electronic component 120 in 110, if directly destruction electronic component packaging unit 110 takes out electronic component 120, such one
Aspect is unfavorable for the recycling of electronic component packaging unit 110, is on the other hand constantly in the electronics of the protection of protective gas 130
Element 120 is exposed in air again, can influence the conservation status of electronic component 120.While the second connector 172 is removably
Connection, optionally to seal the other end of passage, such set-up mode, i.e. bag have demonstrate,proved the removable of the second connector 172
Connection is unloaded, bag has demonstrate,proved the convenience that electronic component packaging unit 110 is used, ensured that electronic component packaging unit 110 is enough again
Seal, and then ensured the protecting effect of electronic component packaging unit 110.
Fig. 5 is the 5th kind of structural representation of electronic component packaging unit 110.Electronics is can be seen that with reference to Fig. 4 and Fig. 5
Element packaging unit 110 is substantially the same, unlike, the electronic component packaging unit 110 in Fig. 5 also has power-off protection apparatus
With second source 182, the power-off protection apparatus includes relay 180, the first power supply 181.Wherein, the first power supply 181 and second
The current entry connection of the difference relay 180 of power supply 182, the electricity outlet of relay 180 is connected with temperature reducing unit 140；While after
Electrical equipment 180 is electrically connected with control unit 162.Need exist for explanation, in the case of default, temperature reducing unit 140 by after
Power supply when electrical equipment 180 is used with electronic component 120 is connected, and at this moment the power supply is second source 182.(for example, working as
When needing the mainboard that electronic component 120 to be protected is host computer, second source 182 is the power supply of host computer) when
After second source 182 is powered off, control unit 162 makes the first power supply 181 be connected with temperature reducing unit 140 so as to drop according to pre-set programs
Warm unit 140 can work on.Set power-off protection apparatus the reason for be：But electronic component 120 can usually be produced when working
Substantial amounts of heat, these heats can be filled in the receiving space of electronic component packaging unit 110, and excessive heat can not be effective
Ground, which is distributed, can influence the service behaviour (or even causing electronic component 120 to work) of electronic component 120, and power-off protection apparatus
Purpose be that (even if second source 182 power off situation) ensure the heat in receiving space can effectively dissipate and then
Protect electronic component 120.
In use, electronic component 120 is put into the electronic component packaging unit 110 for being configured with receiving space, and make
Electronic component 120 is located in receiving space；Then vacuum step is carried out, by the receiving space of electronic component packaging unit 110
Air all detach, make to form vacuum in electronic component packaging unit 110；Aeration step is carried out after vacuum step, here
What is be filled with is inert gas；Finally, the opening of electronic component packaging unit 110 is sealed, such electronic component 120 is just placed into
The inside of electronic component packaging unit 110 of protective gas 130 full of preset vol.It is by electronics member by such mode
Part 120 is placed in the microenvironment full of protective gas 130, so as to completely cut off the extraneous bar that electronic component 120 is corroded, aoxidized
Part, and then play the purpose of protection electronic component 120.Reference picture 4, the pin 121 of electronic component 120 stretches out electronic component packaging
Outside unit 110, when such set-up mode make it that electronic component 120 works, electronic component packaging unit 110 and fill in electronics
Protective gas 130 in element packaging unit 110 can be effectively by the body of electronic component 120 and electronic component packaging unit
110 outer isolations, and pin 121 is located at the outside of electronic component packaging unit 110 so that electronic component 120 still passes through pin 121
Obtain electric current or signal and continuous firing.Temperature reducing unit 140 and radiator fan 150 can be well by electronic components 120 simultaneously
The heat produced during work is shed, it is ensured that electronic component 120 can whether be obtained well in static or work
Protect to avoid aging.
It should be noted that：
, can be in electronic component packaging list for the anticorrosion for strengthening electronic component packaging unit 110, anti-oxidation performance
Drier is placed in member 110.Drier can better ensure that the drying property of electronic component packaging unit 110, further lifting
The age inhibiting performance of electronic component 120.
The material of electronic component packaging unit 110 can be any one in aluminium foil, nylon composite materials, PET film, only
Want electronic component packaging unit 110 effectively to wrap up electronic component 120 and accommodate the guarantor in electronic component packaging unit 110
Protect gas 130.
Electronic component packaging unit 110 be used for place electronic component 120 opening can be one or more than one, only
Want electronic component packaging unit 110 can housing electronic components 120, do not limit here.
The filtering valve body of one-way conduction can be set in the passage of the first connector 171, so as to further enhance sealing effect
Really；, can be in the second connector 172 and the first connector 171 simultaneously in order to ensure the performance of electronic component packaging unit 110
Seal is set to strengthen sealing effectiveness on contact surface.
The concept of vacuum is usually the gaseous state less than an atmospheric pressure in given space, is that a kind of physics shows
As.In fact, in vacuum technique, vacuum system is for air, and the part material inside a particular space is discharged, and makes it
Pressure is less than a standard atmospheric pressure, then we are generally called this space for vacuum or vacuum state.In the present embodiment of the present invention
Optimal vacuum state is completely without air in electronic component packaging unit 110, still, even true in above-mentioned concept
Under Altitude, the scheme provided of the invention also can smoothly be implemented and with expected protecting effect.
In the present embodiment, protective gas 130 is that inert gas is only an example, in the other embodiment of the present invention
In, protective gas 130 can be the gas that other do not react with electronic component 120, as long as the protective gas 130 not with electricity
Subcomponent 120 reacts.Further, when the electronic component being put into the receiving space of electronic component packaging unit 110
120 do not have the element with the reaction of nitrogen, then nitrogen is also can be as protective gas 130, further, in spy
In the case of fixed, air can also be used as a kind of protective gas 130.
As the another way for making receiving space that only there is protective gas 130, can persistently it be filled with receiving space
Protective gas 130 is to cause the gas in receiving space to be flowed out from the opening of electronic component packaging unit 110.
The preferred embodiments of the present invention are these are only, are not intended to limit the invention, for those skilled in the art
For member, the present invention can have various modifications and variations.Any modification within the spirit and principles of the invention, being made,
Equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (10)
1. a kind of electronic component packaging unit, it is characterised in that：
The electronic component packaging unit possesses closed receiving space；
Electronic component encapsulation is full of pre- in the receiving space of the electronic component packaging unit, and in the receiving space
If the protective gas of volume.
2. electronic component packaging unit according to claim 1, it is characterised in that：
The protective gas is inert gas.
3. electronic component packaging unit according to claim 1, it is characterised in that：
The electronic component packaging unit also includes temperature reducing unit, and the temperature reducing unit is connected with the electronic component packaging unit
To reduce the temperature in the receiving space.
4. electronic component packaging unit according to claim 3, it is characterised in that：
The temperature reducing unit is by water cooling refrigeration plant to reduce the temperature inside the electronic component packaging unit.
5. electronic component packaging unit according to claim 3, it is characterised in that：
The temperature reducing unit is by chiller refrigeration equipment to reduce the temperature inside the electronic component packaging unit.
6. electronic component packaging unit according to claim 3, it is characterised in that：
The temperature reducing unit is by semiconductor chilling plate to reduce the temperature inside the electronic component packaging unit.
7. the electronic component packaging unit according to any one in claim 3-6, it is characterised in that：
The electronic component packaging unit also includes radiator fan；
The temperature reducing unit is connected with the radiator fan.
8. the electronic component packaging unit according to any one in claim 3-6, it is characterised in that：
The electronic component packaging unit also includes temperature sensor and control unit；
The temperature sensor is arranged in the electronic component packaging unit, described control unit respectively with the TEMP
Device and temperature reducing unit connection.
9. the electronic component packaging unit according to claim 8, it is characterised in that：
The electronic component packaging unit also includes the first connector and the second connector；
First connector has the passage run through, one end and the electronic component of the passage of first connector
The inside connection of packaging unit；
The other end of the passage and second connector are detachably connected, optionally to seal the passage.
10. electronic component packaging unit according to claim 8, it is characterised in that：
Also include the power-off protection step that temperature is controlled by power-off protection apparatus；
The power-off protection apparatus includes the first power supply and relay, and the temperature reducing unit passes through relay and first power supply
Electrical connection；The relay is also connected electrical connection with second source；
Described control unit is connected with the relay.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110822947.0A CN113619904B (en) | 2017-05-17 | 2017-05-17 | Cooling unit for electronic component packaging unit and electronic component packaging unit |
| CN201710349673.1A CN106976648B (en) | 2017-05-17 | 2017-05-17 | Electronic component packaging unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710349673.1A CN106976648B (en) | 2017-05-17 | 2017-05-17 | Electronic component packaging unit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110822947.0A Division CN113619904B (en) | 2017-05-17 | 2017-05-17 | Cooling unit for electronic component packaging unit and electronic component packaging unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106976648A true CN106976648A (en) | 2017-07-25 |
| CN106976648B CN106976648B (en) | 2021-07-02 |
Family
ID=59342984
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710349673.1A Active CN106976648B (en) | 2017-05-17 | 2017-05-17 | Electronic component packaging unit |
| CN202110822947.0A Active CN113619904B (en) | 2017-05-17 | 2017-05-17 | Cooling unit for electronic component packaging unit and electronic component packaging unit |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110822947.0A Active CN113619904B (en) | 2017-05-17 | 2017-05-17 | Cooling unit for electronic component packaging unit and electronic component packaging unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106976648B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1388678A (en) * | 1971-10-14 | 1975-03-26 | Victor Metal Products Corp | Collapsible containers and a method and apparatus for manufac turing them |
| FR2272950A1 (en) * | 1974-05-31 | 1975-12-26 | Carnaud Total Interplastic | Flexible container sealing process - uses cap with vent and distorting membrane inside and inert gas |
| CN2700268Y (en) * | 2004-03-13 | 2005-05-18 | 曾福春 | Electronic component package |
| GB2447665A (en) * | 2007-03-19 | 2008-09-24 | Angus Burnett Ewart | Complete cryo encapsualtion device for biological specimen vials |
| CN202977036U (en) * | 2012-04-16 | 2013-06-05 | 深圳市辰驹电子科技有限公司 | Anti-surge protector capable of indicating temperature |
| CN204416084U (en) * | 2015-01-26 | 2015-06-24 | 耿亮 | A kind of precision instrument storage and conveying box |
| CN204751033U (en) * | 2015-07-02 | 2015-11-11 | 依顿科技有限公司 | Dustless case of high low -temperature constant -temperature |
| CN204957357U (en) * | 2015-09-30 | 2016-01-13 | 华南理工大学广州学院 | Meter box with automatic temperature adjustment |
| CN205594348U (en) * | 2016-04-19 | 2016-09-21 | 天津飞越宏图科技有限公司 | Insulating processing system of communication device |
| CN205906474U (en) * | 2016-06-29 | 2017-01-25 | 周红兵 | Novel portable intelligent control constant temperature medical case |
| CN206691695U (en) * | 2017-05-17 | 2017-12-01 | 李天俊 | Electronic component packaging unit |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365743C (en) * | 2005-09-07 | 2008-01-30 | 李炬 | Electronic component possessing fire retardant function |
| CN201623935U (en) * | 2009-12-09 | 2010-11-03 | 珠海格力电器股份有限公司 | Electronic device with explosionproof and fireproof functions |
| CN204021445U (en) * | 2014-09-16 | 2014-12-17 | 韩鹏 | Electronic package intelligent storage cabinet |
| CN205931896U (en) * | 2016-07-13 | 2017-02-08 | 国家电网公司 | Relay protection plug -in components intelligence storing compartment |
-
2017
- 2017-05-17 CN CN201710349673.1A patent/CN106976648B/en active Active
- 2017-05-17 CN CN202110822947.0A patent/CN113619904B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1388678A (en) * | 1971-10-14 | 1975-03-26 | Victor Metal Products Corp | Collapsible containers and a method and apparatus for manufac turing them |
| FR2272950A1 (en) * | 1974-05-31 | 1975-12-26 | Carnaud Total Interplastic | Flexible container sealing process - uses cap with vent and distorting membrane inside and inert gas |
| CN2700268Y (en) * | 2004-03-13 | 2005-05-18 | 曾福春 | Electronic component package |
| GB2447665A (en) * | 2007-03-19 | 2008-09-24 | Angus Burnett Ewart | Complete cryo encapsualtion device for biological specimen vials |
| CN202977036U (en) * | 2012-04-16 | 2013-06-05 | 深圳市辰驹电子科技有限公司 | Anti-surge protector capable of indicating temperature |
| CN204416084U (en) * | 2015-01-26 | 2015-06-24 | 耿亮 | A kind of precision instrument storage and conveying box |
| CN204751033U (en) * | 2015-07-02 | 2015-11-11 | 依顿科技有限公司 | Dustless case of high low -temperature constant -temperature |
| CN204957357U (en) * | 2015-09-30 | 2016-01-13 | 华南理工大学广州学院 | Meter box with automatic temperature adjustment |
| CN205594348U (en) * | 2016-04-19 | 2016-09-21 | 天津飞越宏图科技有限公司 | Insulating processing system of communication device |
| CN205906474U (en) * | 2016-06-29 | 2017-01-25 | 周红兵 | Novel portable intelligent control constant temperature medical case |
| CN206691695U (en) * | 2017-05-17 | 2017-12-01 | 李天俊 | Electronic component packaging unit |
Non-Patent Citations (1)
| Title |
|---|
| 郭桂叶: "《电工线路：从识读到检修》", 30 September 2012, 河南科学技术出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113619904A (en) | 2021-11-09 |
| CN106976648B (en) | 2021-07-02 |
| CN113619904B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107235178A (en) | Electronic component packaging guard method | |
| WO1999057335A1 (en) | Hydrogen electrochemical system environment | |
| US20160226044A1 (en) | Battery pack for electric power tool | |
| US20100143165A1 (en) | Electric compressor with integral inverter | |
| CN206691695U (en) | Electronic component packaging unit | |
| US20200127346A1 (en) | Vehicle battery cooling device and battery module | |
| WO2023035607A1 (en) | Anti-explosion smart temperature-controlled tank-type container | |
| CN211077048U (en) | Intelligent monitoring constant temperature thing flow box | |
| CN106976648A (en) | Electronic component packaging unit | |
| US20130032237A1 (en) | Mobile compressed gas dispensing device | |
| CN117308511A (en) | Self-cooling device for beverages | |
| CN206533652U (en) | Electronic and electrical equipment storing apparatus and electronic and electrical equipment | |
| CN108493792A (en) | A kind of explosion-proof power distribution cabinet | |
| EP4091033A1 (en) | Systems and methods for cooling a computing system | |
| CN208622806U (en) | A kind of power battery pack cooling system and electric car with safeguard construction | |
| CN102437300A (en) | Novel dynamic power supply | |
| CN215246587U (en) | Thing flow box based on thing networked control | |
| TWI655401B (en) | Refrigeration device and temperature control module thereof | |
| CN111406313A (en) | Method and system for cooling electronic equipment using carbon dioxide compressed gas | |
| CN105246284A (en) | Sealing cabinet capable of balancing pressure in self-manner | |
| JPH06201202A (en) | Refrigerating plant | |
| CN112178982B (en) | Compressor, control method thereof and air conditioning unit | |
| CN113864170A (en) | System and method for protecting sealed compressor electrical feedthroughs | |
| CN213621500U (en) | Adjustable container structure | |
| CN106960928B (en) | Battery case and power supply device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |