CN206691695U - Electronic component packaging unit - Google Patents

Electronic component packaging unit Download PDF

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Publication number
CN206691695U
CN206691695U CN201720547690.1U CN201720547690U CN206691695U CN 206691695 U CN206691695 U CN 206691695U CN 201720547690 U CN201720547690 U CN 201720547690U CN 206691695 U CN206691695 U CN 206691695U
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China
Prior art keywords
electronic component
packaging unit
component packaging
unit
temperature
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Expired - Fee Related
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CN201720547690.1U
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Chinese (zh)
Inventor
李天俊
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Individual
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Individual
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Priority to CN201720547690.1U priority Critical patent/CN206691695U/en
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Abstract

Electronic equipment and packaging field are the utility model is related to, in particular to a kind of electronic component packaging unit, it is intended to solve the problems, such as electronic component aging in the prior art (such as weathering, corrosion oxidation).Electronic component packaging unit possesses closed receiving space;Electronic component encapsulation is full of the protective gas of preset vol in the receiving space of electronic component packaging unit, and in receiving space.Such electronic component packaging unit has simple in construction, reliable and stable, substantially improves the problem of electronic component is easy to aging in the prior art.

Description

Electronic component packaging unit
Technical field
Electronic equipment and packaging field are the utility model is related to, in particular to a kind of electronic component packaging unit.
Background technology
Important component of the electronic component as the third time industrial revolution, production in modernization, life side in terms of Face all has the function that important.With the adjustment of Industry Reform, increasing product uses electronic component.Electronic component has The features such as precision, intelligent integration degree are high, use range is wide, while electronic component generally can all have metal parts, due to metal The characteristics of, electronic component has the problem of (such as weathering, corrosion oxidation) easy to aging, this substantially reduces electronic component and including The service life of the equipment of the electronic component, it can further cause to include the production of the electronic component, the use shape of lifestyle device Condition, serious meeting cause big potential safety hazard;On the other hand, according to the use occasion of electronic component, technology content and cost into This difference causes the value of some electronic components very high, and the protection to this kind of electronic component is more important.
But the method for not preventing electronic component aging (such as weathering, corrosion oxidation) effectively but in the prior art.
Utility model content
The purpose of this utility model is to provide a kind of electronic component packaging unit, such electronic component packaging unit tool There is the characteristic of good anti-aging (anticorrosive, anti-oxidant).
What embodiment of the present utility model was realized in:
Electronic component packaging unit possesses closed receiving space;Appearance of the electronic component encapsulation in electronic component packaging unit Receive in space, and the protective gas of preset vol is full of in receiving space.
Such electronic component is placed in the electronic component packaging unit full of protective gas, electronic component packaging unit Closed space and the protective gas that fills in electronic component packaging unit for electronic component provide isolation well so that Obtain the perishable materials such as oxygen with electronic component to separate, so as to ensure the good performance of electronic component and longer use longevity Life.To sum up, such electronic component packaging unit has simple in construction, reliable and stable, substantially improves electronics in the prior art The problem of element is easy to aging.
In a kind of embodiment of the present utility model:
Above-mentioned protective gas is inert gas.
In a kind of embodiment of the present utility model:
Above-mentioned electronic component packaging unit also includes temperature reducing unit, and temperature reducing unit is connected with electronic component packaging unit to drop Temperature in low receiving space.
In a kind of embodiment of the present utility model:
Above-mentioned temperature reducing unit is by water cooling refrigeration plant to reduce the temperature inside electronic component packaging unit.
In a kind of embodiment of the present utility model:
Above-mentioned temperature reducing unit is by chiller refrigeration equipment to reduce the temperature inside electronic component packaging unit.
In a kind of embodiment of the present utility model:
Above-mentioned temperature reducing unit is by semiconductor chilling plate to reduce the temperature inside electronic component packaging unit.
In a kind of embodiment of the present utility model:
Above-mentioned electronic component packaging unit also includes radiator fan;
Temperature reducing unit is connected with radiator fan.
In a kind of embodiment of the present utility model:
Above-mentioned electronic component packaging unit also includes temperature sensor and control unit;
Temperature sensor is arranged in electronic component packaging unit, control unit respectively with temperature sensor and temperature reducing unit Connection.
In a kind of embodiment of the present utility model:
Above-mentioned electronic component packaging unit also includes the first connector and the second connector;
First connector has the passage that runs through, and one end of the passage of the first connector is interior with electronic component packaging unit Portion connects;
The other end of passage and the second connector are detachably connected, optionally to seal passage.
In a kind of embodiment of the present utility model:
The above-mentioned power-off protection step for also including controlling temperature by power-off protection apparatus;
Power-off protection apparatus includes the first power supply and relay, and temperature reducing unit passes through relay and the first power electric connection; Relay is also connected electrical connection with second source;
Control unit is connected with relay.
The beneficial effect of the utility model embodiment is:
A kind of electronic component packaging unit, it possesses closed receiving space;Electronic component encapsulation is in electronic component packaging The protective gas of preset vol is full of in the receiving space of unit, and in receiving space.Electronic component is placed on full of protection gas In the electronic component packaging unit of body, space in electronic component packaging unit and the protection in electronic component packaging unit is filled Gas provides isolation well to cause the perishable material such as oxygen and electronic component cut-off for electronic component, so as to ensure The good performance and longer service life of electronic component.
Brief description of the drawings
, below will be to required use in embodiment in order to illustrate more clearly of the technical scheme of the utility model embodiment Accompanying drawing be briefly described, it will be appreciated that the following drawings illustrate only some embodiments of the present utility model, therefore should not be by Regard the restriction to scope as, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also To obtain other related accompanying drawings according to these accompanying drawings.
Fig. 1 is a kind of structural representation of electronic component packaging unit in the utility model embodiment;
Fig. 2 is another structural representation of electronic component packaging unit in the utility model embodiment;
Fig. 3 is the third structural representation of electronic component packaging unit in the utility model embodiment;
Fig. 4 is the 4th kind of structural representation of electronic component packaging unit in the utility model embodiment;
Fig. 5 is the 5th kind of structural representation of electronic component packaging unit in the utility model embodiment.
Icon:100- package components;110- electronic component packaging units;111- packaging bags;112- packing boxes;120- electronics Element;121- pins;130- protective gas;140- temperature reducing units;150- radiator fans;161- temperature sensors;162- is controlled Unit;The connectors of 171- first;The connectors of 172- second;180- relays;The power supplys of 181- first;182- second sources.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer Accompanying drawing in type embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model part of the embodiment, rather than whole embodiments.Generally here described in accompanying drawing and The component of the utility model embodiment shown can be configured to arrange and design with a variety of.
Therefore, the detailed description of the embodiment of the present utility model to providing in the accompanying drawings is not intended to limit requirement below The scope of the utility model of protection, but it is merely representative of selected embodiment of the present utility model.Based in the utility model Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all Belong to the scope of the utility model protection.
It should be noted that:Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi It is defined, then it further need not be defined and explained in subsequent accompanying drawing in individual accompanying drawing.
, it is necessary to explanation in description of the present utility model, if occur term " on ", " interior ", the side of the instruction such as " outer " Position or position relationship be based on orientation shown in the drawings or position relationship, or the utility model product using when usually put Orientation or position relationship, be for only for ease of description the utility model and simplify and describe, rather than instruction or imply signified Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that new to this practicality The limitation of type.
In description of the present utility model, it is also necessary to explanation, unless otherwise clearly defined and limited, if there is art Language " setting ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or integratedly be connected Connect;Can be mechanical connection or electrical connection;Can be joined directly together, can also intermediary be indirectly connected, Ke Yishi The connection of two element internals.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this Concrete meaning in utility model.
Embodiment
Below, for structure and operation principle more directly perceived, more specifically describing electronic component packaging unit 110, connect down Come us and introduce package component 100 this concept.Specifically, package component 100 includes electronic component packaging unit 110 and sealing Electronic component 120 in the receiving space of electronic component packaging unit 110, and the protection gas of preset vol is full of in receiving space Body 130.It should be noted that one kind of the protective gas 130 full of preset vol is achieved in that receiving space is first complete here Vacuumize entirely, then the protective gas 130 of preset vol is filled with toward receiving space, so that protective gas 130 accommodates sky full of whole Between in.
Fig. 1 is refer to, Fig. 1 provides a kind of structural representation of electronic component packaging unit 110 for the present embodiment.From figure As can be seen that package component 100 includes electronic component packaging unit 110 and electronic component 120;Electronic component 120 is sealed in electricity The protective gas 130 of preset vol is full of in subcomponent packaging unit 110, and in electronic component packaging unit 110.
Carrier of the electronic component packaging unit 110 as protection electronic component 120, and fill in electronic component packaging unit Protective gas 130 in the 110 then inside and outside pressure differential of one side balance electronic element packaging unit 110, on the other hand The microenvironment for avoiding aging is provided for electronic component 120.Further, in the present embodiment of the present utility model, protective gas 130 be inert gas.
Explanation is needed exist for, it is because the excellent reason of inert gas that why protective gas 130, which selects inert gas, Change property to determine.Found through overtesting and contrast, compared to general protective gas 130, inert gas has chemical property stabilization, The material with electronic component 120 does not react, and is especially suitable for doing the protective gas 130 of electronic component 120.
(IUPAC newly provides 18 race's elements that inert gas (or being rare gas) refers on the periodic table of elements, i.e., original 0 race).At normal temperatures and pressures, they are all the monoatomic gas of colorless and odorless, it is difficult to be chemically reacted.It is naturally occurring Rare gas has six kinds, i.e. helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and the radioactive radon (Rn) of tool.In inertia In the atom of elemental gas, arrangement of the electronics in each electronic shell, just reach stable number.Therefore atom is not easy to lose Or electronics is obtained, also it is difficult to chemically react with other materials, therefore these elements are referred to as " inert gas elements ".Profit With the extremely inactive chemical property of rare gas, often it is used to make protection gas in production division.This is also to make in aeration step The reason for by the use of inert gas as inflation raw material.Explanation is needed exist for, it is former because Og is with artificial synthesized rare gas Daughter nucleus is highly unstable, and half-life period is very short (5 milliseconds).According to the periodic law of elements, estimation Og it is more active than radon and, theoretical calculation shows Show, it may be very active, might not can be referred to as inert gas.So that is mentioned in embodiment of the present utility model is lazy Property gas refer to naturally occurring six kinds of rare gas, i.e. helium (He), neon (Ne), argon (Ar), krypton (Kr), xenon (Xe) and tool radiation The radon (Rn) of property.
It can further be seen from figure 1 that electronic component packaging unit 110 also includes temperature reducing unit 140, temperature reducing unit 140 with Electronic component packaging unit 110 is connected to reduce the temperature in electronic component packaging unit 110.
In the present embodiment of the present utility model, above-mentioned electronic component packaging unit 110 also includes temperature reducing unit 140, drop Warm unit 140 is connected with electronic component packaging unit 110 to reduce the temperature in electronic component packaging unit 110.Here drop Warm unit 140 can be any one in water cooling refrigeration plant, chiller refrigeration equipment and semiconductor chilling plate.In this practicality In new the present embodiment, using semiconductor chilling plate as temperature reducing unit 140.Semiconductor chilling plate, also it is thermoelectricity system Cold.Its advantages of is no slide unit, can be applicable to some spaces and is restricted, and reliability requirement is high, and no refrigerant is dirty The occasion of dye.Using the Peltier effects of semi-conducting material, when the electricity that direct current is connected into by two kinds of different semi-conducting materials When even, heat can be absorbed respectively at the both ends of galvanic couple and release heat, it is possible to achieve the purpose of refrigeration.It is that a kind of produce is born The Refrigeration Technique of thermal resistance, is characterized in movement-less part, and reliability is also higher.
It can further be seen from figure 1 that in the present embodiment of the present utility model, above-mentioned electronic component packaging unit 110 is also Including radiator fan 150;Temperature reducing unit 140 is connected with radiator fan 150.Radiator fan 150 can speed up electronic component packaging The temperature of unit 110 distributes, and the temperature of electronic component packaging unit 110 is quickly reached preset value.Further, exist Radiator fan 150 is connected with the one end of temperature reducing unit 140 away from electronic component packaging unit 110 in the present embodiment.
With continued reference to Fig. 1, as can be seen from Figure 1 electronic component packaging unit 110 is packing box 112.Packing box 112 has There are predetermined size and hardness, be adapted to the occasion of needs fixed dimension.
Fig. 2 is another structural representation of electronic component packaging unit 110 in the present embodiment.
Electronic component packaging unit 110 is can be seen that with reference to Fig. 1 and Fig. 2 to be substantially the same, unlike, the electronics in Fig. 2 Element packaging unit 110 is packaging bag 111, and there is profile can change for packaging bag 111, can adapt to wanting for varying environment condition Ask, such packaging bag 111 enables package component 100 more easily to transport, use.
Fig. 3 is the third structural representation of electronic component packaging unit 110 in the present embodiment.
Electronic component packaging unit 110 is can be seen that with reference to Fig. 1 and Fig. 3 to be substantially the same, unlike, the electronics in Fig. 3 The pin 121 of element 120 is stretched out outside electronic component packaging unit 110, and such set-up mode is easy to electronic component packaging unit 110 use when electronic component 120 works.Such mode causes electronic component packaging unit 110 to be not only applicable to electricity The transportation and packing of subcomponent 120, it is also suitable the protection to electronic component 120 when electronic component 120 works.
Fig. 4 is the 4th kind of structural representation of electronic component packaging unit 110 in the present embodiment.
Electronic component packaging unit 110 is can be seen that with reference to Fig. 3 and Fig. 4 to be substantially the same, unlike, the electronics in Fig. 4 Element packaging unit 110 also has temperature sensor 161 and control unit 162.Further, temperature sensor 161 is arranged on In electronic component packaging unit 110, control unit 162 is connected with temperature sensor 161 and temperature reducing unit 140 respectively.Need Bright, the purpose for the temperature sensor 161 being arranged in electronic component packaging unit 110 is to monitor electronic component at any time Temperature in packaging unit 110, and obtained feedback of the information will be monitored to control unit 162;Control unit 162 is according to default Mode commands temperature reducing unit 140, and then temperature reducing unit 140 is accelerated, tapers off cooling or stops cooling immediately.In one kind Under service condition, because high temperature caused by work can not be spread so that the work of electronic component 120 in electronic component 120 at work Make unstable, at this time temperature sensor 161 detects that temperature exceedes setting value, will feed back signal to control unit 162, warp After crossing the judgement of control unit 162, control unit 162, which operates temperature reducing unit 140, makes temperature reducing unit 140 accelerate cooling, so as to ensure Electronic component 120 can constantly be protected in electronic component packaging unit 110, and and can enough stably works.
With continued reference to Fig. 4, it can also be seen that above-mentioned electronic component packaging unit 110 also includes the first connector from Fig. 4 171 and second connector 172.Further, the first connector 171 has the passage run through, the passage of the first connector 171 One end connects with the inside of electronic component packaging unit 110;The other end of passage and the second connector 172 are detachably connected, Optionally to seal passage.The purpose of the setting of first connector 171 and the second connector 172 is to work as electronic package The dress needs of unit 110 will be put into electronic component 120 therein and take out, or need to use tool maintenance electronic component packaging unit During electronic component 120 in 110, electronic component 120 is taken out if directly destroying electronic component packaging unit 110, such one Aspect is unfavorable for the recycling of electronic component packaging unit 110, is on the other hand constantly in the electronics of the protection of protective gas 130 Element 120 is exposed in air again, can influence the conservation status of electronic component 120.While the second connector 172 is removably Connection, optionally to seal the other end of passage, such set-up mode, i.e. bag have demonstrate,proved the removable of the second connector 172 Connection is unloaded, bag has demonstrate,proved the convenience that electronic component packaging unit 110 uses, ensured that electronic component packaging unit 110 is enough again Seal, and then ensured the protecting effect of electronic component packaging unit 110.
Fig. 5 is the 5th kind of structural representation of electronic component packaging unit 110.Electronics is can be seen that with reference to Fig. 4 and Fig. 5 Element packaging unit 110 is substantially the same, unlike, the electronic component packaging unit 110 in Fig. 5 also has power-off protection apparatus With second source 182, the power-off protection apparatus includes relay 180, the first power supply 181.Wherein, the first power supply 181 and second Power supply 182 distinguishes the current entry connection of relay 180, and the electricity outlet of relay 180 is connected with temperature reducing unit 140;While after Electrical equipment 180 electrically connects with control unit 162.Need exist for explanation, in the case of default, temperature reducing unit 140 by after Power supply when electrical equipment 180 uses with electronic component 120 is connected, and at this moment the power supply is second source 182.(for example, working as When needing the mainboard that electronic component 120 to be protected is host computer, second source 182 is the power supply of host computer) when After second source 182 powers off, control unit 162 makes the first power supply 181 be connected with temperature reducing unit 140 so as to drop according to pre-set programs Warm unit 140 can work on.Set power-off protection apparatus the reason for be:But electronic component 120 can usually produce when working Substantial amounts of heat, these heats can be filled in the receiving space of electronic component packaging unit 110, and excessive heat can not be effective Ground distributes the service behaviour (or even causing electronic component 120 to work) that can influence electronic component 120, and power-off protection apparatus Purpose be that (even if second source 182 power off situation) ensure the heat in receiving space can effectively dissipate and then Protect electronic component 120.
In use, electronic component 120 is put into the electronic component packaging unit 110 for being configured with receiving space, and make Electronic component 120 is located in receiving space;Then vacuum step is carried out, by the receiving space of electronic component packaging unit 110 Air all detach, make to form vacuum in electronic component packaging unit 110;Aeration step is carried out after vacuum step, here What is be filled with is inert gas;Finally, the opening of electronic component packaging unit 110 is sealed, such electronic component 120 is just placed into The inside of electronic component packaging unit 110 of protective gas 130 full of preset vol.It is by electronics member by such mode Part 120 is placed in the microenvironment full of protective gas 130, the extraneous bar for being corroded, aoxidizing so as to completely cut off electronic component 120 Part, and then play the purpose of protection electronic component 120.Reference picture 4, the pin 121 of electronic component 120 stretch out electronic component packaging Outside unit 110, when such set-up mode make it that electronic component 120 works, electronic component packaging unit 110 and fill in electronics Protective gas 130 in element packaging unit 110 can be effectively by the body of electronic component 120 and electronic component packaging unit Completely cut off outside 110, and pin 121 is located at the outside of electronic component packaging unit 110 and causes electronic component 120 still to pass through pin 121 Obtain electric current or signal and continuous firing.Temperature reducing unit 140 and radiator fan 150 can be well by electronic components 120 simultaneously Heat sheds caused by work, ensure that electronic component 120 can whether be obtained well in static or work Protect to avoid aging.
It should be noted that:
, can be in electronic component packaging list in order to strengthen the anticorrosion of electronic component packaging unit 110, anti-oxidation performance Drier is placed in member 110.Drier can better ensure that the drying property of electronic component packaging unit 110, further lifting The age inhibiting performance of electronic component 120.
The material of electronic component packaging unit 110 can be any one in aluminium foil, nylon composite materials, PET film, only Want electronic component packaging unit 110 effectively to wrap up electronic component 120 and accommodate the guarantor in electronic component packaging unit 110 Protect gas 130.
Electronic component packaging unit 110 be used for place electronic component 120 opening can be one or more than one, only Want electronic component packaging unit 110 can housing electronic components 120, do not limit here.
The filtering valve body of one-way conduction can be set in the passage of the first connector 171, so as to further enhance sealing effect Fruit;, can be in the second connector 172 and the first connector 171 simultaneously in order to ensure the performance of electronic component packaging unit 110 Seal is set to strengthen sealing effectiveness on contact surface.
The concept of vacuum is usually less than the gaseous state of an atmospheric pressure in given space, is that a kind of physics shows As.In fact, in vacuum technique, for air, the part material inside a particular space is discharged, and makes it for vacuum system Pressure is less than a standard atmospheric pressure, then it is vacuum or vacuum state that we, which are generally called this space,.In of the present utility model implementation Optimal vacuum state is that do not have air in electronic component packaging unit 110 completely in example, still, even in above-mentioned concept Vacuum environment under, provided scheme of the present utility model also can smoothly be implemented and with expected protecting effect.
In the present embodiment, protective gas 130 is that inert gas is only an example, in other implementations of the present utility model Example in, protective gas 130 can be the gas that other do not react with electronic component 120, as long as the protective gas 130 not with Electronic component 120 reacts.Further, when the electronics member being put into the receiving space of electronic component packaging unit 110 Part 120 does not have the element with the reaction of nitrogen, then nitrogen be also can as protective gas 130, further, In the case of specific, air can also be used as a kind of protective gas 130.
As the another way for making receiving space that only there is protective gas 130, can be persistently filled with receiving space Protective gas 130 is to cause the gas in receiving space to be flowed out from the opening of electronic component packaging unit 110.
Preferred embodiment of the present utility model is these are only, is not limited to the utility model, for this area Technical staff for, the utility model can have various modifications and variations.It is all within the spirit and principles of the utility model, Any modification, equivalent substitution and improvements made etc., should be included within the scope of protection of the utility model.

Claims (10)

  1. A kind of 1. electronic component packaging unit, it is characterised in that:
    The electronic component packaging unit possesses closed receiving space;
    Electronic component encapsulation is full of pre- in the receiving space of the electronic component packaging unit, and in the receiving space If the protective gas of volume.
  2. 2. electronic component packaging unit according to claim 1, it is characterised in that:
    The protective gas is inert gas.
  3. 3. electronic component packaging unit according to claim 1, it is characterised in that:
    The electronic component packaging unit also includes temperature reducing unit, and the temperature reducing unit is connected with the electronic component packaging unit To reduce the temperature in the receiving space.
  4. 4. electronic component packaging unit according to claim 3, it is characterised in that:
    The temperature reducing unit is by water cooling refrigeration plant to reduce the temperature inside the electronic component packaging unit.
  5. 5. electronic component packaging unit according to claim 3, it is characterised in that:
    The temperature reducing unit is by chiller refrigeration equipment to reduce the temperature inside the electronic component packaging unit.
  6. 6. electronic component packaging unit according to claim 3, it is characterised in that:
    The temperature reducing unit is by semiconductor chilling plate to reduce the temperature inside the electronic component packaging unit.
  7. 7. the electronic component packaging unit according to any one in claim 3-6, it is characterised in that:
    The electronic component packaging unit also includes radiator fan;
    The temperature reducing unit is connected with the radiator fan.
  8. 8. the electronic component packaging unit according to any one in claim 3-6, it is characterised in that:
    The electronic component packaging unit also includes temperature sensor and control unit;
    The temperature sensor is arranged in the electronic component packaging unit, described control unit respectively with the TEMP Device connects with the temperature reducing unit.
  9. 9. according to the electronic component packaging unit described in claim 8, it is characterised in that:
    The electronic component packaging unit also includes the first connector and the second connector;
    First connector has the passage run through, one end and the electronic component of the passage of first connector The inside connection of packaging unit;
    The other end of the passage and second connector are detachably connected, optionally to seal the passage.
  10. 10. electronic component packaging unit according to claim 8, it is characterised in that:
    Also include the power-off protection step that temperature is controlled by power-off protection apparatus;
    The power-off protection apparatus includes the first power supply and relay, and the temperature reducing unit passes through relay and first power supply Electrical connection;The relay is also connected electrical connection with second source;
    Described control unit is connected with the relay.
CN201720547690.1U 2017-05-17 2017-05-17 Electronic component packaging unit Expired - Fee Related CN206691695U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720547690.1U CN206691695U (en) 2017-05-17 2017-05-17 Electronic component packaging unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720547690.1U CN206691695U (en) 2017-05-17 2017-05-17 Electronic component packaging unit

Publications (1)

Publication Number Publication Date
CN206691695U true CN206691695U (en) 2017-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720547690.1U Expired - Fee Related CN206691695U (en) 2017-05-17 2017-05-17 Electronic component packaging unit

Country Status (1)

Country Link
CN (1) CN206691695U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106976648A (en) * 2017-05-17 2017-07-25 李天俊 Electronic component packaging unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106976648A (en) * 2017-05-17 2017-07-25 李天俊 Electronic component packaging unit

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Granted publication date: 20171201