CN113597260B - Method and device for detecting SMT (surface mount technology) mounting pressure - Google Patents

Method and device for detecting SMT (surface mount technology) mounting pressure Download PDF

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Publication number
CN113597260B
CN113597260B CN202110875493.3A CN202110875493A CN113597260B CN 113597260 B CN113597260 B CN 113597260B CN 202110875493 A CN202110875493 A CN 202110875493A CN 113597260 B CN113597260 B CN 113597260B
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rod
smt
electronic component
fixed
spring
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CN113597260A (en
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杨永锋
张道华
徐�明
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Shenzhen Juxin Shidai Industrial Co ltd
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Shenzhen Juxin Shidai Industrial Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/082Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses a method and a device for detecting SMT (surface mount technology) mounting pressure, and relates to the technical field of electronic component mounting. Including the locating plate, be provided with supplementary SMT installation on the locating plate and fix a position the location auxiliary device that prevents SMT from taking place the skew to mounted position, auxiliary device includes clamping mechanism, prevents the damaged mechanism of SMT, pressure test mechanism, stop gear and positioning mechanism, clamping mechanism includes splint, a fixed block, slider, horizontal pole, a spring, No. two fixed blocks and movable rod, splint are fixed with a fixed block, it has the horizontal pole to run through in the fixed block, and slidable mounting has the horizontal pole in the fixed block. Can guarantee through stop gear when the staff is pasting dress electronic component, when the power of pressing was enough to install electronic component on the circuit board, can indicate the staff with the installation success through stop gear, the locating plate of this moment can not be at downstream to improve holistic installation effectiveness.

Description

Method and device for detecting SMT (surface mount technology) mounting pressure
Technical Field
The invention relates to the technical field of electronic component installation, in particular to a method and a device for detecting SMT (surface mount technology) mounting pressure.
Background
SMT is a surface assembly technique, the most popular technique and process in the electronic assembly industry. Electronic circuit surface assembly techniques, known as surface mount or surface mount techniques. The surface-mounted component without pins or short leads is mounted on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.
The common SMT mounting method is mounted on a circuit board through mounting equipment, but the equipment can only be used in a large-scale software company, but the small-scale maintenance shop does not have the SMT mounting equipment which is convenient to use and does not occupy space, so that the problem that the electronic element mounting is deviated easily occurs in the small-scale maintenance shop due to the fact that the electronic element mounting is carried out on the circuit board manually and the circuit board cannot work normally, and loss is brought to storefronts.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a method and a device for detecting SMT (surface mount technology) mounting pressure, which solve the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a detect device of SMT dress pressure, includes the locating plate, be provided with on the locating plate and assist the SMT installation and fix a position the location auxiliary device that prevents SMT emergence skew to mounted position, auxiliary device includes clamping mechanism, prevents that SMT damage mechanism, pressure test mechanism, stop gear and positioning mechanism.
Preferably, clamping mechanism includes splint, fixed block, slider, horizontal pole, spring, No. two fixed blocks and movable rod, splint are fixed with a fixed block, it has the horizontal pole to run through in the fixed block, and slidable mounting has the horizontal pole in the fixed block, the other end of horizontal pole runs through No. two fixed blocks and slidable mounting in No. two fixed blocks, a spring has been cup jointed on the horizontal pole, it has slider and a fixed block slidable mounting to run through in the fixed block has the slider, it has the movable rod and fixed with the movable rod to run through in No. two fixed blocks, the triangle-shaped draw-in groove has been seted up on the movable rod.
Preferably, prevent that SMT damage mechanism includes slide, a support, No. two springs, transmission piece and transfer line, slide slidable mounting is on splint, the surface of slide is articulated with the one end of a support, the other end of a support is articulated with the surface of transmission piece, transmission piece slidable mounting is in splint, it has the transfer line and fixes with the one end of transfer line to run through in the transmission piece, No. two springs have been cup jointed on the transfer line, the transfer line runs through splint and slidable mounting in splint.
Preferably, the pressure test mechanism includes test rod, No. three springs and L type pole, the one end cross sectional shape that test rod is close to the movable rod is "triangle-shaped" and slides and pegs graft in the triangle-shaped draw-in groove that the movable rod was seted up, the last No. three springs that have cup jointed of test rod, the other end and the L type pole of test rod are fixed, L type pole runs through locating plate and slidable mounting on the locating plate.
Preferably, stop gear includes No. two supports and flexible gag lever post, the one end of No. two supports is articulated with the surface of L type pole, the other end of No. two supports is articulated with the surface of flexible gag lever post, flexible gag lever post is fixed on the locating plate with the one end that is close to the movable rod.
Preferably, positioning mechanism trapezoidal pole, No. three supports, No. four supports, No. three fixed blocks, connecting rod, stopper, spacing knot, the pole and the torsional spring that link through, trapezoidal pole passes through transmission shaft slidable mounting on No. three fixed blocks, trapezoidal pole is articulated with the one end of No. three supports, No. three fixed blocks are articulated with the one end of No. four supports, the other end of No. three supports and the other end of No. four supports all articulate with the surface of connecting rod, the other end slidable mounting of connecting rod is on linking through the pole, it is fixed with No. three fixed blocks to link through the pole, it is fixed with the stopper to link through on the pole, it has spacing knot to articulate on the connecting rod, the both ends of torsional spring are fixed respectively on connecting rod and spacing knot.
Preferably, positioning mechanism still includes sleeve, gear, rotary rod, rotatory sleeve, the sleeve runs through the locating plate and is fixed with the locating plate, rotatory sleeve is installed to the sleeve internal rotation, the arc spout has been seted up on rotatory telescopic inner wall, slidable mounting has the rotary rod in the arc spout that rotatory sleeve was seted up, the rotary rod is kept away from rotatory telescopic one end and is link up the pole fixedly.
Preferably, the auxiliary device is provided with four groups and all arranged on the positioning plate.
The invention also provides a method for detecting SMT mounting pressure, which comprises the following steps:
s1, compressing the first spring to adjust the distance between the clamp plate and the SMT electronic component according to the width and length of the SMT electronic component to be pasted, and clamping the SMT electronic component through the first spring;
s2, holding the positioning plate to press downwards at a position needing to be pasted, moving the trapezoidal rod in the direction after being extruded by the mounting position through the special design of the trapezoidal rod shape, extruding the third bracket and the fourth bracket in the moving process of the trapezoidal rod, driving the connecting rod to ascend on the through rod, continuously extruding the limit buckle through the limit block when the connecting rod ascends, recovering the limit buckle after being extruded through the torsion spring, and blocking the limit buckle in the gap of the limit block again to ensure that the trapezoidal rod cannot deviate due to hand shaking after positioning the mounting position;
s3, the whole device positions the installation position and presses down the positioning plate after the SMT electronic component is clamped, the positioning plate moves downwards, the SMT electronic component is extruded, the movable rod is driven to move upwards, and the triangular clamping groove formed in the movable rod is matched with the detection rod, so that when the SMT electronic component is subjected to pasting pressure, the detection rod can synchronously move leftwards along with the SMT electronic component, and a worker can visually know the pressure applied to the SMT electronic component by observing the scale marked on the L-shaped rod;
s4, after the SMT electronic component is installed, the worker pulls the clamping plates around the SMT electronic component to separate outwards from the positioning plate, so that the SMT electronic component is installed, the situation that the SMT electronic component is not deviated when being installed is ensured, and meanwhile, the device can be used for the SMT electronic components with different sizes.
(III) advantageous effects
The invention provides a device and a method for detecting SMT (surface mount technology) mounting pressure. The method has the following beneficial effects:
(1) the device passes through clamping mechanism can adapt to when the electronic component of equidimension not to improve the functionality of whole device, guarantee that the electronic component of arbitrary size can both install fast, improve the installation effectiveness of whole device when installing electronic component.
(2) The positioning mechanism that the device set up can guarantee that electronic component can not lead to electronic component to take place the skew because the staff hand is trembled when the installation when installing electronic component, improves the efficiency that electronic component installed on the circuit board.
(3) The SMT damage prevention mechanism arranged by the device can prevent the damage to the electronic element due to the matching of the first spring and the clamping plate when the electronic element is clamped, and the service life of the electronic element is prolonged.
(4) The pressure detection mechanism arranged by the device can test the pressure values of the electronic element and the mounting position when the electronic element is mounted, so that the working personnel is prevented from doing too much idle work, and the mounting efficiency of the electronic element is improved.
(5) The limiting mechanism can guarantee that when a worker mounts the electronic element, when the pressing force is enough to mount the electronic element on the circuit board, the limiting mechanism can prompt the worker to successfully mount the electronic element, and the positioning plate cannot move downwards, so that the overall mounting efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of part A of the present invention;
FIG. 3 is a schematic cross-sectional view of a portion of the present invention;
FIG. 4 is a schematic view of part B of the present invention;
FIG. 5 is a schematic view of part C of the present invention;
FIG. 6 is a schematic view of the structure of the position relationship between the rotating sleeve and the sleeve according to the present invention.
In the figure: 1. positioning a plate; 2. an auxiliary device; 21. a splint; 22. a first fixed block; 23. a slider; 24. a cross bar; 25. a first spring; 26. a second fixed block; 27. a movable rod; 28. a slide plate; 29. a first bracket; 210. a second spring; 211. a transmission rod; 212. a transmission block; 213. a detection lever; 214. a third spring; 215. an L-shaped rod; 216. a second bracket; 217. a telescopic limiting rod; 218. a trapezoidal bar; 219. a third bracket; 220. a bracket No. four; 221. a third fixed block; 223. a connecting rod; 224. a limiting block; 225. a limit buckle; 226. a torsion spring; 227. a through rod; 228. a sleeve; 229. a gear; 230. rotating the rod; 231. the sleeve is rotated.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a device for detecting SMT mounting pressure comprises a positioning plate 1, a positioning auxiliary device 2 which is used for assisting SMT mounting and positioning mounting positions to prevent SMT deviation is arranged on the positioning plate 1, the auxiliary device 2 comprises a clamping mechanism, an SMT damage preventing mechanism, a pressure testing mechanism, a limiting mechanism and a positioning mechanism, the clamping mechanism comprises a clamping plate 21, a first fixing block 22, a sliding block 23, a cross rod 24, a first spring 25, a second fixing block 26 and a movable rod 27, the clamping plate 21 is fixed with the first fixing block 22, the cross rod 24 penetrates through the first fixing block 22, the cross rod 24 is slidably mounted in the first fixing block 22, the other end of the cross rod 24 penetrates through the second fixing block 26 and is slidably mounted in the second fixing block 26, the first spring 25 is sleeved on the cross rod 24, the sliding block 23 penetrates through the first fixing block 22, the sliding block 23 is slidably mounted in the first fixing block 22, the movable rod 27 penetrates through the second fixing block 26 and is fixed with the movable rod 27, the movable rod 27 is provided with a triangular clamping groove, the SMT damage prevention mechanism comprises a sliding plate 28, a first bracket 29, a second spring 210, a transmission block 212 and a transmission rod 211, the sliding plate 28 is slidably mounted on the clamping plate 21, one end of the sliding plate 28, which is in contact with the transmission rod 211, is in a triangular shape, when the transmission rod 211 moves upwards, the sliding plate 28 can move leftwards through the design of the shapes of the sliding plate 28 and the transmission rod 211 to counteract part of the elastic force of the first spring 25, so that electronic elements are protected from being damaged due to over-clamping of the clamping plate 21, the surface of the sliding plate 28 is hinged with one end of the first bracket 29, the other end of the first bracket 29 is hinged with the surface of the transmission block 212, the transmission block 212 is slidably mounted in the clamping plate 21, the transmission rod 211 penetrates through the transmission rod 212 and is fixed with one end of the transmission rod 211, the second spring 210 is sleeved on the transmission rod 211, the transmission rod 211 penetrates through the clamping plate 21 and is slidably mounted in the clamping plate 21, the pressure testing mechanism comprises a detecting rod 213, a third spring 214 and an L-shaped rod 215, wherein the cross section of one end, close to the movable rod 27, of the detecting rod 213 is triangular and is inserted in a triangular clamping groove formed in the movable rod 27 in a sliding manner, the third spring 214 is sleeved on the detecting rod 213, the other end of the detecting rod 213 is fixed with the L-shaped rod 215, the L-shaped rod 215 penetrates through the positioning plate 1 and is mounted on the positioning plate 1 in a sliding manner, the limiting mechanism comprises a second bracket 216 and a telescopic limiting rod 217, one end of the second bracket 216 is hinged with the surface of the L-shaped rod 215, the other end of the second bracket 216 is hinged with the surface of the telescopic limiting rod 217, the telescopic limiting rod 217 and one end, close to the movable rod 27, of the positioning mechanism are fixed on the positioning plate 1, a trapezoidal rod 218, a third bracket 219, a fourth bracket 220, a third fixing block 221, a frame block 222, a connecting rod 223, a limiting block 224, a limiting buckle 225, a through rod 227 and a torsion spring 226, the ladder-shaped rod 218 is slidably mounted on a third fixing block 221 through a transmission shaft, the ladder-shaped rod 218 is hinged with one end of a third bracket 219, the third fixing block 221 is hinged with one end of a fourth bracket 220, the other end of the third bracket 219 and the other end of the fourth bracket 220 are both hinged with the surface of a connecting rod 223, the other end of the connecting rod 223 is slidably mounted on a through rod 227, the through rod 227 is fixed with the third fixing block 221, a limiting block 224 is fixed on the through rod 227, a limiting buckle 225 is hinged on the connecting rod 223, two ends of a torsion spring 226 are respectively fixed on the connecting rod 223 and the limiting buckle 225, the positioning mechanism further comprises a sleeve 228, a gear 229, a rotating rod 230 and a rotating sleeve 231, the sleeve 228 penetrates through the positioning plate 1 and is fixed with the positioning plate 1, the rotating sleeve 231 is rotatably mounted in the sleeve 228, an arc-shaped sliding groove is formed in the inner wall of the rotating sleeve 231, the rotating sleeve 231 is slidably mounted with the rotating rod 230 in the arc-shaped sliding groove, one end of the rotating rod 230 far from the rotating sleeve 231 is fixed with the through rod 227, and the auxiliary devices 2 are provided with four groups and are all arranged on the positioning plate 1.
A method for detecting SMT mounting pressure comprises the following steps:
s1, compressing the first spring 25 to adjust the distance between the clamping plate 21 and the SMT electronic component according to the width and length of the SMT electronic component to be bonded, and clamping the SMT electronic component through the first spring 25;
s2, the positioning plate 1 is held to be pressed downwards at a position needing to be adhered, through the special design of the shape of the trapezoidal rod 218, after being extruded by the installation position, the trapezoidal rod 218 moves in the direction, meanwhile, the trapezoidal rod 218 extrudes the third bracket 219 and the fourth bracket 220 in the moving process, the connecting rod 223 is driven to ascend through the through rod 227, when the connecting rod 223 ascends, the limit buckle 225 is extruded ceaselessly through the limit block 224, meanwhile, the limit buckle 225 is restored after being extruded through the torsion spring 226 and is clamped in the gap of the limit block 224 again, and the situation that the trapezoidal rod 218 deviates due to hand shaking after being positioned at the installation position is guaranteed;
s3, the whole device positions the installation position and simultaneously clamps the SMT electronic component, the positioning plate 1 is pressed downwards, the positioning plate 1 moves downwards, the SMT electronic component is extruded, the movable rod 27 can be driven to move upwards, and the triangular clamping grooves formed in the movable rod 27 are matched with the detection rods 213, so that when the SMT electronic component is subjected to pasting pressure, the detection rods 213 can move leftwards synchronously with the SMT electronic component, and a worker can visually know the pressure applied to the SMT electronic component by observing the scales marked on the L-shaped rod 215;
s4, after the SMT electronic component is installed, the worker pulls the clamping plates 21 around the SMT electronic component to separate from the positioning plate 1, so that the SMT electronic component is installed, the SMT electronic component is guaranteed not to deviate when being installed, and meanwhile, the device can be used for the SMT electronic components with different sizes.
When the SMT electronic component mounting device is in operation (or in use), the first spring 25 is compressed to adjust the distance between the clamping plate 21 and the SMT electronic component according to the width and the length of the SMT electronic component to be mounted, the SMT electronic component is clamped through the first spring 25 and the clamping plate 21, when the clamping plate 21 clamps the electronic component, the sliding plate 28 is firstly contacted with the electronic component, after the electronic component is extruded, the sliding plate 28 moves leftwards, the first support 29 drives the transmission block 212 to move upwards, the transmission block 212 drives the transmission rod 211 to move upwards, when the transmission rod 211 moves upwards, the sliding plate 28 can move leftwards through the shape design of the sliding plate 28 and the transmission rod 211, partial elastic force of the first spring 25 is offset, the electronic component is protected from being damaged due to over-clamping of the clamping plate 21, the positioning plate 1 is held to be pressed downwards at the position to be mounted, and through the special design of the shape of the trapezoidal rod 218, after being extruded by the mounting position, the ladder-shaped rod 218 moves in the direction, and meanwhile, the ladder-shaped rod 218 can extrude the third bracket 219 and the fourth bracket 220 and drive the connecting rod 223 to ascend on the through rod 227, when the connecting rod 223 ascends, the limit buckle 225 can be extruded ceaselessly through the limit block 224, and simultaneously the limit buckle 225 can be restored after being extruded through the torsion spring 226 and clamped in the gap of the limit block 224 again, so that after the ladder-shaped rod 218 positions the mounting position, the ladder-shaped rod 218 cannot deviate due to hand shaking, after the whole device positions the mounting position and the SMT electronic component is clamped, the positioning plate 1 is pressed down, after the positioning plate 1 moves downwards, due to the extrusion of the SMT electronic component, the movable rod 27 can be driven to move upwards, and through the mutual matching of the triangular clamping groove formed in the movable rod 27 and the detection rod 213, when the SMT electronic component is subjected to pasting pressure, detect pole 213 can remove left with SMT electronic component in step, the staff can be through observing the audio-visual pressure that SMT electronic component received this moment of the clear of the scale of mark on L type pole 215, after SMT electronic component finishes installing, staff pulling SMT electronic component splint 21 all around to locating plate 1 outer separation, thereby realize SMT electronic component's installation, guarantee that SMT electronic component can not take place the skew when the installation, this device can all use to the SMT electronic component of equidimension not simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (3)

1. The utility model provides a detect device of SMT dress pressure, includes locating plate (1), its characterized in that: the positioning plate (1) is provided with a positioning auxiliary device (2) which assists SMT installation and positions the installation position to prevent deviation of SMT, the auxiliary device (2) comprises a clamping mechanism, an SMT damage prevention mechanism, a pressure testing mechanism, a limiting mechanism and a positioning mechanism, the clamping mechanism comprises a clamping plate (21), a first fixed block (22), a sliding block (23), a cross rod (24), a first spring (25), a second fixed block (26) and a movable rod (27), the clamping plate (21) is fixed with the first fixed block (22), the cross rod (24) penetrates through the first fixed block (22), the cross rod (24) is slidably installed in the first fixed block (22), the other end of the cross rod (24) penetrates through the second fixed block (26) and is slidably installed in the second fixed block (26), the first spring (25) is sleeved on the cross rod (24), run through in No. one fixed block (22) slider (23) and fixed block (22) slidable mounting have slider (23), run through in No. two fixed blocks (26) movable rod (27) and fixed with movable rod (27), the triangle-shaped draw-in groove has been seted up on movable rod (27), prevent that the damaged mechanism of SMT includes slide (28), a support (29), No. two spring (210), transmission piece (212) and transfer line (211), slide (28) slidable mounting is on splint (21), the surface of slide (28) is articulated with the one end of a support (29), the other end of a support (29) is articulated with the surface of transmission piece (212), transmission piece (212) slidable mounting is in splint (21), it has transfer line (211) and is fixed with the one end of transfer line (211) to run through in transmission piece (212), No. two spring (210) have cup jointed on transfer line (211), the pressure testing mechanism comprises a detection rod (213), a third spring (214) and an L-shaped rod (215), the cross section of one end, close to the movable rod (27), of the detection rod (213) is triangular, the cross section of the other end of the detection rod (213) is inserted into a triangular clamping groove formed in the movable rod (27) in a sliding mode, the third spring (214) is sleeved on the detection rod (213), the other end of the detection rod (213) is fixed with the L-shaped rod (215), the L-shaped rod (215) penetrates through the positioning plate (1) and is installed on the positioning plate (1) in a sliding mode, the limiting mechanism comprises a second bracket (216) and a telescopic limiting rod (217), one end of the second bracket (216) is hinged to the surface of the L-shaped rod (215), the other end of the second bracket (216) is hinged to the surface of the telescopic limiting rod (217), the telescopic limiting rod (217) is fixed on the positioning plate (1) with one end close to the movable rod (27), the ladder-shaped rod (218), the third bracket (219), the fourth bracket (220), the third fixing block (221), the connecting rod (223), the limiting block (224), the limiting buckle (225), the through rod (227) and the torsion spring (226) of the positioning mechanism are arranged, the ladder-shaped rod (218) is slidably mounted on the third fixing block (221) through a transmission shaft, the ladder-shaped rod (218) is hinged with one end of the third bracket (219), the other end of the third bracket (219) and the other end of the fourth bracket (220) are hinged with the surface of the connecting rod (223), the other end of the connecting rod (223) is slidably mounted on the through rod (227), the through rod (227) is fixed with the third fixing block (221), the limiting block (224) is fixed on the through rod (227), articulated on connecting rod (223) have spacing knot (225), the both ends of torsional spring (226) are fixed respectively on connecting rod (223) and spacing knot (225), positioning mechanism still includes sleeve (228), gear (229), rotary rod (230), rotatory sleeve (231), sleeve (228) run through locating plate (1) and are fixed with locating plate (1), rotatory sleeve (231) are installed to sleeve (228) internal rotation, the arc spout has been seted up on the inner wall of rotatory sleeve (231), slidable mounting has rotary rod (230) in the arc spout that rotatory sleeve (231) were seted up, rotary rod (230) keep away from the one end of rotatory sleeve (231) and pass through pole (227) fixedly.
2. An apparatus for detecting SMT mounting pressure according to claim 1, wherein: the auxiliary device (2) is provided with four groups and is arranged on the positioning plate (1).
3. A method for detecting SMT mounting pressure, said method comprising the steps of:
s1, compressing the first spring (25) to adjust the distance between the clamping plate (21) and the SMT electronic component according to the width and length of the SMT electronic component to be bonded, and clamping the SMT electronic component through the first spring (25);
s2, the positioning plate (1) is held to press downwards at a position needing to be pasted, through the special design of the shape of the trapezoidal rod (218), after the trapezoidal rod (218) is extruded at the installation position, the trapezoidal rod (218) moves in the direction, meanwhile, the trapezoidal rod (218) can extrude the third bracket (219) and the fourth bracket (220) in the moving process, the connecting rod (223) is driven to ascend on the through rod (227), when the connecting rod (223) ascends, the limiting block (224) can continuously extrude the limiting buckle (225), meanwhile, the limiting buckle (225) can recover after being extruded through the torsion spring (226) and is clamped in the gap of the limiting block (224) again, and after the trapezoidal rod (218) is positioned at the installation position, deviation caused by hand shaking is avoided;
s3, the whole device positions the installation position and simultaneously clamps the SMT electronic component, the positioning plate (1) is pressed down, the positioning plate (1) moves downwards, the SMT electronic component is extruded, the movable rod (27) can be driven to move upwards, and the triangular clamping groove formed in the movable rod (27) is matched with the detection rod (213), so that when the SMT electronic component is subjected to pasting pressure, the detection rod (213) can synchronously move leftwards with the SMT electronic component, and a worker can visually and clearly know the pressure applied to the SMT electronic component at the moment by observing the scale marked on the L-shaped rod (215);
s4, when the SMT electronic element is installed, the worker pulls the clamping plates (21) around the SMT electronic element to separate towards the outside of the positioning plate (1), so that the SMT electronic element is installed, the SMT electronic element is ensured not to shift when being installed, and meanwhile, the device can be used for the SMT electronic elements with different sizes.
CN202110875493.3A 2021-07-30 2021-07-30 Method and device for detecting SMT (surface mount technology) mounting pressure Active CN113597260B (en)

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