CN210637332U - High-precision pressure-maintaining mounting device - Google Patents

High-precision pressure-maintaining mounting device Download PDF

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Publication number
CN210637332U
CN210637332U CN201921671902.2U CN201921671902U CN210637332U CN 210637332 U CN210637332 U CN 210637332U CN 201921671902 U CN201921671902 U CN 201921671902U CN 210637332 U CN210637332 U CN 210637332U
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China
Prior art keywords
pressure
pressure head
seat
guide
profiling
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CN201921671902.2U
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Chinese (zh)
Inventor
黎君
蔡振波
刘现
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Shenzhen Tianyi Intelligent Technology Co ltd
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Shenzhen Tianyi Intelligent Technology Co ltd
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Priority to CN201921671902.2U priority Critical patent/CN210637332U/en
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Abstract

The utility model discloses a high-precision pressure maintaining and mounting device, which comprises a pressure head mechanism, a base, a material pressing driving mechanism and a material placing plate, wherein the material pressing driving mechanism and the material placing plate are arranged on the base; the material placing plate is used for fixing a material to be processed; the pressure head mechanism comprises a profiling pressure head, an elastic sliding module, a pressure sensor and a fixed seat; the profiling pressure head is positioned below the fixed seat and is connected with the fixed seat in a sliding manner through the elastic sliding module; the pressure sensor is arranged on the fixed seat, and the detection end of the pressure sensor faces the direction of the profiling pressure head and is used for sensing the pressure applied to the profiling pressure head; the fixing seat is in driving connection with the material pressing driving mechanism, and the material pressing driving mechanism is used for driving the pressure head mechanism to be close to or far away from the material placing plate. The utility model discloses can realize lasting pressurize pastes dress function, the mechanism is inseparable, the operation is smooth and easy, and the production yield is high, and need not precision finishing, saves the processing cost.

Description

High-precision pressure-maintaining mounting device
Technical Field
The utility model relates to a pressurize pastes dress equipment technical field, especially relates to a high accuracy pressurize pastes dress device.
Background
Along with the rapid development of electronic industry technology, the functions of electronic products are more and more powerful, the precision of internal elements is more and more high, and the requirements on an assembly process are more and more high, in particular to the fields of semi-automatic surface mounting of flat cables, gum and sealing rings of mobile phones, tablet computers and intelligent bracelets; paste dress pressurize structure in the past and adopt the dovetail structure as pressure conduction mechanism, the defect that the dovetail structure exists has:
1) the dovetail groove is difficult to machine and high in machining cost;
2) the pressure conduction assembly is easy to shake and clamp, so that the assembly reject ratio of products is high;
3) the volume is large.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high accuracy pressurize pastes dress device can realize lasting pressurize pastes dress function, and the mechanism is inseparable, the operation is smooth and easy, and the production yield is high, and need not precision finishing, saves the processing cost.
In order to realize the purpose, the following technical scheme is adopted:
a high-precision pressure maintaining and mounting device comprises a pressure head mechanism, a base, a material pressing driving mechanism and a material placing plate, wherein the material pressing driving mechanism and the material placing plate are arranged on the base; the material placing plate is used for fixing a material to be processed; the pressure head mechanism comprises a profiling pressure head, an elastic sliding module, a pressure sensor and a fixed seat; the profiling pressure head is positioned below the fixed seat and is connected with the fixed seat in a sliding manner through the elastic sliding module; the pressure sensor is arranged on the fixed seat, and the detection end of the pressure sensor faces the direction of the profiling pressure head and is used for sensing the pressure applied to the profiling pressure head; the fixing seat is in driving connection with the material pressing driving mechanism, and the material pressing driving mechanism is used for driving the pressure head mechanism to be close to or far away from the material placing plate.
Furthermore, the elastic sliding module comprises a plurality of buffer springs, a plurality of miniature ball bush guide assemblies and a pressure plate; the profiling pressure head is connected below the fixed seat in a sliding manner through a plurality of miniature ball bush guide assemblies; the micro ball bush guide assemblies are arranged through the pressure plate, and the pressure plate is positioned below the pressure sensor; each buffer spring is sleeved on a micro ball bush guide assembly, and two ends of each buffer spring are respectively abutted against the bottom of the pressure plate and the top of the profiling pressure head.
Further, the miniature ball bush guide assembly comprises a guide shaft and a ball bush; the ball bearing bush is fixed on the fixed seat, and the guide shaft is arranged by sliding through the ball bearing bush; the bottom of each guide shaft is fixedly connected with the profiling pressure head, the middle of each guide shaft is connected with the pressure plate in a sliding mode, and the buffer spring is sleeved on the guide shafts.
Furthermore, the pressure head mechanism also comprises a limiting block; the limiting blocks are installed at the tops of the guide shafts and movably embedded on the fixed seat and used for limiting the sliding positions of the guide shafts.
Further, the fixed seat comprises a guide component mounting seat and a pressure head mounting plate; the bottom of the pressure head mounting plate is fixedly connected with the top of the guide component mounting seat, and the top of the pressure head mounting plate is in driving connection with the material pressing driving mechanism; the ball bush is sleeved on the guide assembly mounting seat; and the pressure sensor is embedded at the bottom of the guide component mounting seat.
Furthermore, the pressing driving mechanism comprises a pressing head connecting seat, a pressing driving cylinder and a sliding module; the sliding module is arranged on the base, one end of the pressure head connecting seat is connected with the sliding module, and the other end of the pressure head connecting seat is fixedly connected with the top of the pressure head mounting plate; the pressing driving cylinder is used for driving the pressure head connecting seat to drive the pressure head mechanism to press materials in a sliding mode through the sliding module.
Furthermore, the high-precision pressure maintaining mounting device also comprises a pressure display screen; the pressure display screen is installed on one side of the base and used for displaying the pressure value detected by the pressure sensor.
Furthermore, a plurality of material fixing blocks for clamping materials are arranged on the material placing plate; the material fixed block is provided with a waist-shaped hole and is detachably connected with the material placing plate through the waist-shaped hole.
Adopt above-mentioned scheme, the beneficial effects of the utility model are that:
1) the micro ball bush guide assembly is compact in structure and small in friction force, and provides high-precision pressure conduction for the pressure head mechanism; the operation is smooth, the clamping is not easy to occur, and the assembly yield is effectively improved;
2) in the process of pressing the material by the pressing driving mechanism driving the pressure head mechanism, the profiling pressure head continuously conducts pressure through the buffer spring, so that the pressure maintaining and mounting functions are realized;
3) the pressure sensor senses the pressure applied to the profiling pressure head in real time and displays the pressure through the pressure display screen, so that the pressure of the pressure head can be known more intuitively.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is an exploded view of the ram mechanism of the present invention;
fig. 3 is a schematic structural view of the pressing head mechanism (omitting the fixing base and the spring protection base);
fig. 4 is a perspective view of the material placing plate of the present invention;
wherein the figures identify the description:
1-a base, 2-a pressure head mechanism,
3-a material pressing driving mechanism, 4-a material placing plate,
5-a pressure display screen, 21-a profiling pressure head,
22-elastic sliding module, 23-pressure sensor,
24-a fixed seat, 25-a limited block,
26-spring protection seat, 221-buffer spring,
222-a miniature ball bushing guide assembly, 223-a pressure plate,
2221-guide shaft, 2222-ball bush,
241-a guide component mounting seat, 242-a pressure head mounting plate,
31-pressure head connecting seat, 32-material pressing driving cylinder,
33-sliding module, 41-material fixing block.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 4, a high-precision pressure maintaining mounting device includes a pressure head mechanism 2, a base 1, a pressing driving mechanism 3 and a material placing plate 4, wherein the pressing driving mechanism 3 and the material placing plate are mounted on the base; the material placing plate 4 is used for fixing a material to be processed; the pressure head mechanism 2 comprises a profiling pressure head 21, an elastic sliding module 22, a pressure sensor 23 and a fixed seat 24; the profiling pressure head 21 is positioned below the fixed seat 24 and is connected with the fixed seat 24 in a sliding way through the elastic sliding module 22; the pressure sensor 23 is mounted on the fixed seat 24, and the detection end of the pressure sensor faces the direction of the copying pressure head 21 and is used for sensing the pressure applied to the copying pressure head 21; the fixing seat 24 is in driving connection with the material pressing driving mechanism 3, and the material pressing driving mechanism 3 is used for driving the pressure head mechanism 2 to be close to or far away from the material placing plate 4.
Wherein, the elastic sliding module 22 comprises a plurality of buffer springs 221, a plurality of micro ball bush guide assemblies 222 and a pressure plate 223; the profiling pressure head 21 is connected below the fixed seat 24 in a sliding way through a plurality of micro ball bush guide assemblies 222; the plurality of micro ball bushing guide assemblies 222 are arranged through the pressure plate 223, and the pressure plate 223 is located below the pressure sensor 23; each buffer spring 221 is sleeved on a micro ball bush guide assembly 222, and both ends of each buffer spring abut against the bottom of the pressure plate 223 and the top of the profiling pressure head 21 respectively. The micro ball bushing guide assembly 222 includes a guide shaft 2221, a ball bushing 2222; the ball bushing 2222 is fixed on the fixed seat 24, and the guide shaft 2221 is slidably arranged through the ball bushing 2222; the bottom of each guide shaft 2221 is fixedly connected with the profiling pressure head 21, the middle part is slidably connected with the pressure plate 223, and the buffer spring 221 is sleeved on the guide shaft 2221.
The pressure head mechanism 2 further comprises a limiting block 25; the limiting blocks 25 are mounted on the tops of the guide shafts 2221 and movably embedded in the fixing base 24, so as to limit the sliding position of the guide shafts 2221. The fixed seat 24 comprises a guide component mounting seat 241 and a pressure head mounting plate 242; the bottom of the pressure head mounting plate 242 is fixedly connected with the top of the guide component mounting base 241, and the top of the pressure head mounting plate is in driving connection with the material pressing driving mechanism 3; the ball bushing 2222 is sleeved on the guide assembly mounting base 241; the pressure sensor 23 is fitted to the bottom of the guide unit mount 241.
The material pressing driving mechanism 3 comprises a pressure head connecting seat 31, a material pressing driving cylinder 32 and a sliding module 33; the sliding module 33 is arranged on the base 1, one end of the pressure head connecting seat 31 is connected with the sliding module 33, and the other end of the pressure head connecting seat is fixedly connected with the top of the pressure head mounting plate 242; the material pressing driving cylinder 32 is used for driving the pressure head connecting seat 31 to drive the pressure head mechanism 2 to slide and press materials through the sliding module 33.
The high-precision pressure maintaining mounting device also comprises a pressure display screen 5; the pressure display screen 5 is installed on one side of the base 1 and used for displaying the pressure value detected by the pressure sensor 23. The material placing plate 4 is provided with a plurality of material fixing blocks 41 for clamping materials; the material fixing block 41 is provided with a waist-shaped hole and is detachably connected with the material placing plate 4 through the waist-shaped hole.
The utility model discloses a theory of operation:
the pressure sensor 23, the pressure display screen 5 and the pressing driving cylinder 32 are connected to the same control circuit, and the pressing driving cylinder 32 is connected with an external finishing gas circuit. Pressing material and driving 2 gliding swage of air cylinder 32 drive ram mechanism, profile modeling pressure head 21 rises at a plurality of miniature ball bush direction subassemblies 222 of contact material back edge and slides, and drive the pressure plate 223 through buffer spring 221 and continue the sense terminal that extrudees pressure sensor 23, at profile modeling pressure head 21 and continue the pressure process of pressing material, buffer spring 221 lasts the shrink, pressure sensor 23 lasts the pressure that feedback profile modeling pressure head 21 received in order to transmit to external system, make things convenient for the outside to make accurate judgement and record to the pressurize result at every turn, and show the result through pressure display screen 5.
The pressure head mechanism 2 further comprises a spring protection seat 26, the top of the spring protection seat is fixedly connected with the guide component mounting seat 241 through the guide of the two positioning pins, a through hole penetrating to the bottom is formed in the top of the spring protection seat, the profiling pressure head 21 penetrates through the through hole through the elastic sliding module 22 to slide for pressing, and the spring protection seat 26 is used for wrapping the buffer spring 221 to enhance safety. The sliding module 33 comprises a sliding rail and a sliding block, one side of the sliding block is connected to the sliding rail in a sliding mode, and the other side of the sliding block is fixedly connected with the pressure head connecting seat 31.
In a specific embodiment, the material placing plate 4 is obliquely arranged relative to the bottom of the base 1, and the pressing direction of the pressing head mechanism 2 is perpendicular to the material placing plate 4. The pressure sensor 23 is embedded in the middle of the bottom of the fixing seat 24, and the number of the micro ball bush guide assemblies 222 and the number of the buffer springs 221 are two and are respectively located on two sides of the pressure sensor 23. Stopper 25 and guiding axle 2221 top fixed connection, the hole of stepping down is seted up to the pressure head mounting panel 242 corresponding fixed block position, when the material was pressed to the profile modeling pressure head 21, stopper 25 follows guiding axle 2221 and slides to go up and down to pass the hole of stepping down, and when the material was not pressed to the profile modeling pressure head 21, stopper 25 butt played limiting displacement to direction subassembly mount pad 241 top.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (8)

1. A high-precision pressure-maintaining mounting device is characterized by comprising a pressure head mechanism, a base, a material pressing driving mechanism and a material placing plate, wherein the material pressing driving mechanism and the material placing plate are arranged on the base; the material placing plate is used for fixing a material to be processed; the pressure head mechanism comprises a profiling pressure head, an elastic sliding module, a pressure sensor and a fixed seat; the profiling pressure head is positioned below the fixed seat and is connected with the fixed seat in a sliding manner through the elastic sliding module; the pressure sensor is arranged on the fixed seat, and the detection end of the pressure sensor faces the direction of the profiling pressure head and is used for sensing the pressure applied to the profiling pressure head; the fixing seat is in driving connection with the material pressing driving mechanism, and the material pressing driving mechanism is used for driving the pressure head mechanism to be close to or far away from the material placing plate.
2. The high-precision pressure-maintaining mounting device according to claim 1, wherein the elastic sliding module comprises a plurality of buffer springs, a plurality of micro ball bush guide assemblies and a pressure plate; the profiling pressure head is connected below the fixed seat in a sliding manner through a plurality of miniature ball bush guide assemblies; the micro ball bush guide assemblies are arranged through the pressure plate, and the pressure plate is positioned below the pressure sensor; each buffer spring is sleeved on a micro ball bush guide assembly, and two ends of each buffer spring are respectively abutted against the bottom of the pressure plate and the top of the profiling pressure head.
3. The high-precision pressure maintaining mounting device according to claim 2, wherein the micro ball bush guide assembly comprises a guide shaft and a ball bush; the ball bearing bush is fixed on the fixed seat, and the guide shaft is arranged by sliding through the ball bearing bush; the bottom of each guide shaft is fixedly connected with the profiling pressure head, the middle of each guide shaft is connected with the pressure plate in a sliding mode, and the buffer spring is sleeved on the guide shafts.
4. The high-precision pressure maintaining mounting device according to claim 3, wherein the pressing head mechanism further comprises a limiting block; the limiting blocks are installed at the tops of the guide shafts and movably embedded on the fixed seat and used for limiting the sliding positions of the guide shafts.
5. The high-precision pressure maintaining mounting device according to claim 3, wherein the fixing seat comprises a guide component mounting seat and a pressure head mounting plate; the bottom of the pressure head mounting plate is fixedly connected with the top of the guide component mounting seat, and the top of the pressure head mounting plate is in driving connection with the material pressing driving mechanism; the ball bush is sleeved on the guide assembly mounting seat; and the pressure sensor is embedded at the bottom of the guide component mounting seat.
6. The high-precision pressure maintaining mounting device according to claim 5, wherein the pressing driving mechanism comprises a pressing head connecting seat, a pressing driving cylinder and a sliding module; the sliding module is arranged on the base, one end of the pressure head connecting seat is connected with the sliding module, and the other end of the pressure head connecting seat is fixedly connected with the top of the pressure head mounting plate; the pressing driving cylinder is used for driving the pressure head connecting seat to drive the pressure head mechanism to press materials in a sliding mode through the sliding module.
7. The high-precision pressure maintaining mounting device according to claim 1, further comprising a pressure display screen; the pressure display screen is installed on one side of the base and used for displaying the pressure value detected by the pressure sensor.
8. The high-precision pressure maintaining mounting device according to claim 1, wherein a plurality of material fixing blocks for clamping materials are arranged on the material placing plate; the material fixed block is provided with a waist-shaped hole and is detachably connected with the material placing plate through the waist-shaped hole.
CN201921671902.2U 2019-09-29 2019-09-29 High-precision pressure-maintaining mounting device Active CN210637332U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921671902.2U CN210637332U (en) 2019-09-29 2019-09-29 High-precision pressure-maintaining mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921671902.2U CN210637332U (en) 2019-09-29 2019-09-29 High-precision pressure-maintaining mounting device

Publications (1)

Publication Number Publication Date
CN210637332U true CN210637332U (en) 2020-05-29

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ID=70793729

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921671902.2U Active CN210637332U (en) 2019-09-29 2019-09-29 High-precision pressure-maintaining mounting device

Country Status (1)

Country Link
CN (1) CN210637332U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113597260A (en) * 2021-07-30 2021-11-02 深圳聚信时代实业有限公司 Method and device for detecting SMT (surface mount technology) mounting pressure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113597260A (en) * 2021-07-30 2021-11-02 深圳聚信时代实业有限公司 Method and device for detecting SMT (surface mount technology) mounting pressure
CN113597260B (en) * 2021-07-30 2022-05-31 深圳聚信时代实业有限公司 Method and device for detecting SMT (surface mount technology) mounting pressure

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