CN113595625A - Test board applied to optical module core optical device and using method thereof - Google Patents

Test board applied to optical module core optical device and using method thereof Download PDF

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CN113595625A
CN113595625A CN202110770201.XA CN202110770201A CN113595625A CN 113595625 A CN113595625 A CN 113595625A CN 202110770201 A CN202110770201 A CN 202110770201A CN 113595625 A CN113595625 A CN 113595625A
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optical device
test
testing
preheating
configuration file
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CN113595625B (en
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黄勇
高小燕
廖静
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Sichuan Tianyi Comheart Telecom Co Ltd
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Sichuan Tianyi Comheart Telecom Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/07Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
    • H04B10/073Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an out-of-service signal
    • H04B10/0731Testing or characterisation of optical devices, e.g. amplifiers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The invention relates to the technical field of optical device testing, in particular to a method for using a test board applied to an optical module core optical device, which comprises the following steps: s1, building an optical device testing system, S2, preheating the T time of the optical device testing system, testing preheating parameters of the optical device, outputting the preheating parameters, S3, executing S2 when the preheating parameters do not meet set values, and executing S4 when the testing result meets the set values; step S4, calibrating the optical device test system, and setting a test parameter configuration file according to the calibration result; and step S5, performing performance test on the device to be tested according to the test parameter configuration file, and outputting a test result. The influence of the preheating time on the performance of the optical device is considered, the accurate calibration of the RX end and the TX end is realized, and the test error is reduced.

Description

Test board applied to optical module core optical device and using method thereof
Technical Field
The invention relates to the technical field of optical device testing, in particular to a test board applied to an optical module core optical device and a using method thereof.
Background
Optical devices (lasers and detectors) are core devices of optical fiber transmission equipment developed for optical fiber communication user environments. The device adopts a large-scale integrated chip, and has the advantages of simple circuit, low power consumption and high reliability. In the era of widespread life of optical fiber communication, the production of optical devices has also improved greatly.
Generally, the higher the temperature of the optical module is, the larger the power value of the light source emitted by the optical module will be. In the testing process, the optical module needs to be preheated for a period of time to enable the transmitted light source power value to reach stability, if a reference value used in measurement is set before the optical module is preheated, a testing result will generate gain along with the rise of the temperature of the light source module, so that the accuracy of the testing result is influenced, and if the reference value is not properly set, the testing result is inaccurate or a negative value is generated.
Therefore, the invention designs the test board applied to the optical module core optical device and the use method thereof.
Disclosure of Invention
The invention aims to provide a test board applied to an optical module core optical device and a using method thereof, which overcome the defects of the prior art;
in order to achieve the purpose, the technical scheme adopted by the invention is as follows:
on one hand, the use method of the test board applied to the optical module core optical device comprises the following steps:
step S1, building the optical device testing system, and executing the step S2
Step S2, preheating the time T of the optical device test system, testing the preheating parameters of the optical device, outputting the preheating parameters, wherein the preheating parameters comprise an RX end preheating power value and a TX end preheating power value, and executing step S3;
step S3, executing step S2 when the preheating parameter does not meet the set value, and executing step S4 when the test result meets the set value;
step S4, calibrating the optical device test system, setting a test parameter configuration file according to the calibration result, wherein the test parameter configuration file comprises test items and reference values corresponding to the test items, and executing step S5;
and step S5, performing performance test on the device to be tested according to the test parameter configuration file, and outputting a test result.
Preferably, in step S1, the optical device testing system includes a PC, a testing board, an optical device testing machine, an optical device to be tested, and a light source, the PC is connected to the optical device testing machine, the optical device testing machine is connected to the testing board, the optical device to be tested is connected to the optical device testing machine, and the light source is connected to the optical device to be tested, where the PC is provided with host computer testing software of the optical device testing machine.
Preferably, in step S2, when testing the preheating parameters of the optical device, an initial parameter configuration file needs to be set, where the initial parameter configuration file is set according to the model of the optical device to be predicted, and a set value is pre-stored in the initial parameter configuration file.
Preferably, in step S3, the formula for calculating the T time is specifically:
Figure BDA0003150441120000021
wherein T is standard time, λ is RX set power value, β is TX set power value, λ isqIs the RX end preheat power value, betaiThe RX end preheating power value is obtained.
Preferably, in step S3, the calibration of the optical device testing system includes an RX calibration and a TX calibration.
Preferably, in step S4, the specific method for performing the performance test on the optical device to be tested and outputting the test result includes: the PC sends a test instruction to the optical device tester, the optical device tester tests and feeds back a test result to the PC, and the PC displays the test result, wherein when the display interface of the PC displays OK and the corresponding parameter position displays green, the optical device is qualified; and when the display interface of the PC displays NG and the corresponding parameter position displays red, the optical device is unqualified.
On the other hand, the test board applied to the optical module core optical device comprises a test board body and a linking seat, wherein the linking seat is arranged on the test board body, and the linking seat is suitable for a 5-core socket with long pins.
Preferably, the test board body adopts a four-layer circuit board structure, the first layer and the fourth layer of the test board body are signal layers, the second layer of the test board body is a ground plane, the third layer of the test board body is a power layer, the second layer and the third layer are located between the first layer and the fourth layer, and the second layer is located between the first layer and the third layer.
The invention has the beneficial effects that:
the invention designs a test board applied to an optical module core optical device, which can be well adapted to RX signal coupling of the short pin optical device, ensures good contact, greatly improves the testability and the test efficiency of the short pin optical device, is suitable for the test of the receiving performance of the optical device with various speeds and packages, and is a use method of the test board applied to the optical module core optical device.
Drawings
FIG. 1 is an overall schematic view of the present invention;
FIG. 2 is a schematic diagram of a testing system for optical devices according to the present invention;
FIG. 3 is a schematic view of a test board according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to fig. 1 to 3 of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other implementations made by those of ordinary skill in the art based on the embodiments of the present invention are obtained without inventive efforts.
In the description of the present invention, it is to be understood that the terms "counterclockwise", "clockwise", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used for convenience of description only, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting.
On one hand, the use method of the test board applied to the optical module core optical device comprises the following steps:
step S1, building the optical device testing system, and executing the step S2
Step S2, preheating the time T of the optical device test system, testing the preheating parameters of the optical device, outputting the preheating parameters, wherein the preheating parameters comprise an RX end preheating power value and a TX end preheating power value, and executing step S3;
step S3, executing step S2 when the preheating parameter does not meet the set value, and executing step S4 when the test result meets the set value;
step S4, calibrating the optical device test system, setting a test parameter configuration file according to the calibration result, wherein the test parameter configuration file comprises test items and reference values corresponding to the test items, and executing step S5;
and step S5, performing performance test on the device to be tested according to the test parameter configuration file, and outputting a test result.
It should be noted that, as shown in fig. 2, the optical device testing system includes a PC, a testing board, an optical device testing machine, an optical device to be tested, and a light source, where the PC is connected to the optical device testing machine, the optical device testing machine is connected to the testing board, the optical device to be tested is connected to the optical device testing machine, and the light source is connected to the optical device to be tested, where the upper computer testing software of the optical device testing machine on the PC is used for providing a light source for the optical device to be tested.
It should be noted that, in step S2, when testing the preheating parameters of the optical device, an initial parameter configuration file needs to be set, where the initial parameter configuration file is set according to the model of the optical device to be predicted, and a set value is prestored in the initial parameter configuration file.
It should be noted that, in step S3, the formula for calculating the T time is specifically:
Figure BDA0003150441120000041
wherein T is standard time, λ is RX set power value, β is TX set power value, λ isqIs the RX end preheat power value, betaiThe RX end preheating power value is obtained.
It should be noted that, in step S3, the calibration of the optical device testing system includes RX calibration and TX calibration.
Specifically, because the RX end preheating power value is the actual measurement power of the RX end, the TX end preheating power value is the actual measurement power of the TX end, when RX calibration is performed, only the RX end preheating power value meeting preheating time needs to be input into the PC, when TX calibration is performed, only the TX end preheating power value meeting preheating time needs to be input into the PC, then RX calibration and TX calibration are completed, the PC can automatically output calibrated data, and a set value in an initial parameter configuration file is modified into the data to generate a measurement parameter configuration file.
It should be noted that, in step S4, the specific method for performing the performance test on the device to be tested according to the test parameter configuration file and outputting the test result includes: the PC machine obtains a test item in the test parameter configuration file, generates a test instruction according to the test item, and sends the test instruction to the optical device tester, the optical device tester starts testing according to the test instruction and feeds back the test parameter to the PC machine, the PC machine compares the test parameter with a reference value corresponding to the test item in the test parameter configuration file, when the test parameter does not meet the reference value, a disqualification signal is output, when the display interface displays NG and the position of the corresponding parameter displays red, when the test parameter meets the reference value, a qualification signal is output, and the display interface of the PC machine displays OK and the position of the corresponding parameter displays green.
On the other hand, the test board applied to the optical module core optical device comprises a test board body and a link seat, wherein the link seat is arranged on the test board body, the link seat is suitable for a 5-core socket with long pins, RX signal coupling of the short-pin optical device can be well adapted, good contact is guaranteed, testability and test efficiency of the short-pin optical device are greatly improved, and the test board is suitable for receiving performance tests of optical devices with various speeds and encapsulation.
It should be noted that the test board body adopts a four-layer circuit board structure, the first layer and the fourth layer of the test board body are signal layers, the second layer of the test board body is a ground plane, and the third layer of the test board body is a power layer, wherein the second layer and the third layer are located between the first layer and the fourth layer, and the second layer is located between the first layer and the third layer.
Specifically, the first layer of survey test panel is shown in fig. 3(a), and it is long to link the seat, can be fine with short-leg optical device coupling, avoids the condition of misdetection and short circuit fabulous, and the fourth layer of survey test panel is shown in fig. 3(b), and the pin arrangement rule that the bottom is outstanding can ensure the test precision, can avoid changing the seat again and lead to surveying the condemned condition of test panel.
In summary, the test board applied to the optical module core optical device is designed, RX signal coupling of the short-leg optical device can be well adapted, good contact is guaranteed, testability and test efficiency of the short-leg optical device are greatly improved, and the test board is suitable for receiving performance tests of optical devices with various speeds and packages.

Claims (8)

1. The use method of the test board applied to the core optical device of the optical module is characterized by comprising the following steps of:
step S1, building a light device testing system and executing the step S2;
step S2, preheating the time T of the optical device test system, testing the preheating parameters of the optical device, outputting the preheating parameters, wherein the preheating parameters comprise an RX end preheating power value and a TX end preheating power value, and executing step S3;
step S3, executing step S2 when the preheating parameter does not meet the set value, and executing step S4 when the test result meets the set value;
step S4, calibrating the optical device test system, setting a test parameter configuration file according to the calibration result, wherein the test parameter configuration file comprises test items and reference values corresponding to the test items, and executing step S5;
and step S5, performing performance test on the device to be tested according to the test parameter configuration file, and outputting a test result.
2. The method as claimed in claim 1, wherein in step S1, the optical device testing system includes a PC, a testing board, an optical device testing machine, an optical device to be tested, and a light source, the PC is connected to the optical device testing machine, the optical device testing machine is connected to the testing board, the optical device to be tested is connected to the optical device testing machine, and the light source is connected to the optical device to be tested, wherein the PC is provided with host computer testing software of the optical device testing machine.
3. The method as claimed in claim 1, wherein in step S2, when testing the preheating parameters of the optical device, an initial parameter configuration file is required to be set, the initial parameter configuration file is set according to the type of the optical device to be predicted, and the initial parameter configuration file has a preset value.
4. The method as claimed in claim 3, wherein in step S3, the formula for calculating the T time is as follows:
Figure FDA0003150441110000011
wherein T is standard time, λ is RX set power value, β is TX set power value, λ isqIs the RX end preheat power value, betaiThe RX end preheating power value is obtained.
5. The method for using the test board applied to the core optical device of the optical module as claimed in claim 1, wherein the calibration of the optical device test system in step S3 includes RX calibration and TX calibration.
6. The method as claimed in claim 3, wherein in step S4, the method for testing the performance of the optical device under test according to the test parameter configuration file and outputting the test result includes: the PC generates a test instruction according to the test parameter configuration file, sends the test instruction to the optical device testing machine, tests the optical device testing machine, feeds a test result back to the PC, and displays the test result, wherein when the display interface of the PC displays OK and the corresponding parameter position displays green, the optical device is qualified; and when the display interface of the PC displays NG and the corresponding parameter position displays red, the optical device is unqualified.
7. The test board applied to the optical module core optical device is characterized by comprising a test board body and a linking seat, wherein the linking seat is arranged on the test board body and is suitable for a 5-core socket with long pins.
8. The test board for an optical module core optical device as claimed in claim 7, wherein the test board body has a four-layer circuit board structure, the first and fourth layers of the test board body are signal layers, the second layer of the test board body is a ground layer, and the third layer of the test board body is a power layer, wherein the second and third layers are located between the first and fourth layers, and the second layer is located between the first and third layers.
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JP2000097994A (en) * 1998-09-18 2000-04-07 Advantest Corp Semiconductor tester
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CN107966269A (en) * 2017-11-14 2018-04-27 东莞铭普光磁股份有限公司 A kind of optical module, optical device condition monitoring system
CN108717161A (en) * 2018-05-31 2018-10-30 昌辉汽车电器(黄山)股份公司 A kind of vehicle switch test device and test method
CN210742336U (en) * 2019-09-27 2020-06-12 无锡普罗卡科技有限公司 Multilayer high density needle card device
CN112629824A (en) * 2020-12-15 2021-04-09 成都新易盛通信技术股份有限公司 Optical module high temperature test frock

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000097994A (en) * 1998-09-18 2000-04-07 Advantest Corp Semiconductor tester
US6990619B1 (en) * 2000-08-31 2006-01-24 Synopsys, Inc. System and method for automatically retargeting test vectors between different tester types
US20020069386A1 (en) * 2000-12-05 2002-06-06 Neeb James E. Joint test action group (JTAG) tester, such as to test integrated circuits in parallel
US20030054683A1 (en) * 2001-08-14 2003-03-20 Bryan Lyle S. Arc prevention circuits
CN107966269A (en) * 2017-11-14 2018-04-27 东莞铭普光磁股份有限公司 A kind of optical module, optical device condition monitoring system
CN108717161A (en) * 2018-05-31 2018-10-30 昌辉汽车电器(黄山)股份公司 A kind of vehicle switch test device and test method
CN210742336U (en) * 2019-09-27 2020-06-12 无锡普罗卡科技有限公司 Multilayer high density needle card device
CN112629824A (en) * 2020-12-15 2021-04-09 成都新易盛通信技术股份有限公司 Optical module high temperature test frock

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