CN113594340A - Electric connection process of lamp bead bonding pad and glass screen - Google Patents
Electric connection process of lamp bead bonding pad and glass screen Download PDFInfo
- Publication number
- CN113594340A CN113594340A CN202110873355.1A CN202110873355A CN113594340A CN 113594340 A CN113594340 A CN 113594340A CN 202110873355 A CN202110873355 A CN 202110873355A CN 113594340 A CN113594340 A CN 113594340A
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- glass substrate
- glass
- metal alloy
- led lamp
- liquid metal
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- 239000011521 glass Substances 0.000 title claims abstract description 94
- 239000011324 bead Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000008569 process Effects 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 40
- 239000000956 alloy Substances 0.000 claims abstract description 40
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 40
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 238000003848 UV Light-Curing Methods 0.000 claims description 4
- 239000002808 molecular sieve Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses an electrical connection process of a lamp bead pad and a glass screen. According to the invention, the liquid metal alloy is arranged at the position corresponding to the bonding pad of the LED lamp bead and the conducting circuit of the glass substrate, and the liquid metal alloy is in affinity with the glass substrate and can infiltrate the glass substrate, so that the liquid metal alloy can be stably adhered to the glass substrate in the normal work of the LED glass screen, the transmission of electric energy and electric signals to the LED lamp bead is realized, the adsorption force between the liquid metal alloy and the LED lamp bead is ensured through the tension of the liquid metal alloy, the situations of insufficient soldering or falling off and the like are avoided, and the normal use of the LED lamp bead is ensured. Meanwhile, the liquid metal alloy has strong conductive performance, and heat generated during the work of the LED lamp bead can be LED out while the heat is prevented from being generated during the work, so that the service life of the LED lamp bead is prolonged.
Description
Technical Field
The invention relates to the technical field of transparent display, in particular to an electrical connection process of a lamp bead pad and a glass screen.
Background
LED glass screen is the transparent conductive technology of using, with the high-end customization photoelectric glass of LED structural layer veneer between two-layer glass, when having remain advantages such as easy control, low pressure direct current drive, color expression after the combination are abundant, long service life that traditional LED display screen had, provide penetrating feel, no wire outward appearance and bright brilliant shine. And due to the unique advantages of the glass curtain wall, the glass curtain wall is widely applied to urban lighting engineering and large-screen display systems. Meanwhile, the LED glass display screen can be used as an indoor display curtain wall and is widely applied to large-scale square lighting, stage scenery, bars, high-grade dance halls, urban landmark buildings, municipal buildings, airports, automobile 4S stores, hotels, banks, brand chain stores and the like, and the LED glass display screen has the practicability of the display screen and certain attractiveness and concealment. In the existing LED glass screen, a bonding pad of an LED lamp is generally electrically connected with glass in a silver paste mode, so that electric energy or electric signals are transmitted to the LED lamp. However, the size of the bonding pad is small, and the silver adhesive is easy to produce cold joint at high temperature, so that the bonding pad of the LED lamp is separated from the glass, the normal work of the LED lamp is affected, and the normal display effect of the LED glass screen is affected. Moreover, because the silver colloid contains the epoxy resin matrix, the epoxy resin matrix has higher resistance, and a large amount of heat is easily generated in long-term power-on work, so that the service life of the LED lamp bead is influenced to a certain extent.
Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an electrical connection process of a lamp bead pad and a glass screen.
The technical scheme of the invention is as follows: the electric connection process of the lamp bead welding disc and the glass screen comprises the following steps:
step 1: coating the conductive paste on a glass substrate, baking and forming to form a conductive circuit on the glass substrate;
step 2: arranging a plurality of preset positions on the conductive circuit;
and step 3: dripping liquid metal alloy with glass affinity on a welding disc point corresponding to a preset position;
and 4, step 4: attaching the bottom of the LED lamp bead to the glass substrate, so that a bonding pad on the LED lamp bead is in contact with the liquid metal alloy;
and 5: the glass protection plate is arranged on one side, close to the LED lamp beads, of the glass substrate through a hollow process, so that the glass protection plate and the glass substrate are packaged to form the transparent display screen integrally.
Further, the liquid metal alloy contains gallium metal.
Further, the liquid metal alloy contains indium metal.
Further, the liquid metal alloy is liquid at a temperature of 0-2200 ℃.
Further, the conductive paste includes graphene powder and metal particles of two or all of silver, platinum and rhodium.
Further, the specific steps of step 5 are as follows:
step 5.1: forming a hollow gap between the glass substrate and the stripping protection plate, and filling a circle of soft edge strips with molecular sieves between the edges of the glass substrate and the glass protection plate corresponding to the hollow gap;
step 5.2: a circle of structural adhesive is filled at the outer side of the soft edge strip;
step 5.3: inert gas is filled in the hollow gap between the glass substrate and the glass protection plate.
Further, the LED lamp beads are adhered to the glass substrate through UV curing glue.
By adopting the scheme, the liquid metal alloy is arranged at the position, corresponding to the bonding pad of the LED lamp bead, of the conducting circuit of the glass substrate, the liquid metal alloy is in affinity with the glass substrate, and the glass substrate can be soaked, so that the liquid metal alloy can be stably adhered to the glass substrate in the normal work of the LED glass screen, the transmission of electric energy and electric signals of the LED lamp bead is realized, the adsorption force between the liquid metal alloy and the LED lamp bead is ensured through the tension of the liquid metal alloy, the situations of insufficient soldering or falling off are avoided, and the normal use of the LED lamp bead is ensured. Meanwhile, the liquid metal alloy has strong conductive performance, and heat generated during the work of the LED lamp bead can be LED out while the heat is prevented from being generated during the work, so that the service life of the LED lamp bead is prolonged.
Drawings
FIG. 1 is a block flow diagram of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and the specific embodiments.
Referring to fig. 1, the invention provides an electrical connection process between a bead pad and a glass screen, which includes the following steps:
step 1: and coating the conductive paste on a glass substrate, baking and forming to form a conductive circuit on the glass substrate.
Step 2: a plurality of preset positions are arranged on the conductive circuit.
And step 3: and dripping the liquid metal alloy with glass affinity on the welding disc point corresponding to the preset position. The liquid metal alloy is compatible with the glass substrate, so that the glass substrate can be soaked, and can be firmly adhered to the glass substrate. And under normal atmospheric temperature and high temperature environment, liquid metal alloy keeps liquid to this stability of guaranteeing between liquid metal alloy and the glass substrate avoids appearing connecting unstable condition because of high temperature, guarantees the normal connection use of LED lamp pearl.
And 4, step 4: the bottom of the LED lamp bead is attached to the glass substrate, so that the bonding pad on the LED lamp bead is in contact with the liquid metal alloy. The liquid metal alloy has good conductive performance, so that electric energy and electric signals are respectively transmitted to the welding pads of the LED lamp beads, and the normal working requirements of the LED lamp beads are met. Simultaneously, the resistance value of liquid metal alloy is less, and heat conductivility is good, and it is less to produce and the heat that accumulates in long-time work, can avoid generating heat and lead to the fact the influence to the life-span of LED lamp pearl to can derive the produced heat of LED lamp pearl during operation, provide certain cooling effect for LED lamp pearl. And the surface of the liquid metal alloy has tension, and can be adhered to a bonding pad of the LED lamp bead, so that the connection effect of the LED lamp bead and the conducting circuit is ensured, the LED lamp bead is prevented from falling off from the conducting circuit, and the stability of the display work of the LED glass screen is improved.
And 5: the glass protection plate is arranged on one side, close to the LED lamp beads, of the glass substrate through a hollow process, so that the glass protection plate and the glass substrate are packaged to form the transparent display screen integrally. The method comprises the following specific steps:
step 5.1: forming a hollow gap between the glass substrate and the stripping protection plate, and filling a circle of soft edge strips with molecular sieves between the edges of the glass substrate and the glass protection plate corresponding to the hollow gap;
step 5.2: a circle of structural adhesive is filled at the outer side of the soft edge strip;
step 5.3: inert gas is filled in the hollow gap between the glass substrate and the glass protection plate.
In this step, the soft strake can absorb the air moisture in the cavity space between glass substrate and the glass protection shield from taking the molecular sieve, guarantees the aridity of cavity space internal environment, and the insulating nature of LED glass screen can be optimized in the use of soft strake moreover to guarantee the security that the display screen used. The structural adhesive used in the step can become soft after being dried, and has strong corrosion resistance, so that the sealing property of the glass substrate and the glass protection plate is ensured, and the service life of the LED glass screen is prolonged.
The liquid metal alloy contains one or two metal components of metal gallium or metal indium. Both gallium metal and indium metal can wet the glass, spread along the glass surface and adhere to each other, so that the adhesion between the glass substrate and the gallium metal can be ensured. Meanwhile, the metal gallium and the metal indium have strong electric conductivity, can meet the transmission of electric energy and electric signals, and avoid the condition of heating and temperature rise caused by larger internal resistance. In addition, the metal gallium and the metal indium have low toxicity to human bodies, and the processing and the use of the metal gallium and the metal indium do not influence the health of the human bodies.
The liquid metal alloy is in a liquid state at the temperature of 0-2200 ℃, and is kept in the liquid state under normal temperature and high temperature environments, so that the surface tension of the liquid metal alloy is kept unchanged, the stability between the liquid metal alloy and the glass substrate is ensured, the condition of unstable connection due to high temperature is avoided, and the normal connection and use of the LED lamp beads are ensured.
The conductive paste comprises graphene powder and metal particles of two or all of silver, platinum and rhodium. Because two or three kinds of metals in silver, platinum, the rhodium have been added to the conductive paste to this fastness that improves LED lamp pearl's pad and conducting wire and be connected avoids LED lamp pearl to drop by on the glass substrate.
The LED lamp beads are adhered to the glass substrate through UV curing adhesive. The UV curing adhesive has the characteristics of high curing speed, no pollution, good bonding effect, high light transmittance and the like, can ensure the attractiveness and bonding stability, and is suitable for the bonding use requirement of the LED glass screen.
In summary, the liquid metal alloy is arranged at the position, corresponding to the pad of the LED lamp bead, of the conductive circuit of the glass substrate, and the liquid metal alloy is in contact with the glass substrate, so that the glass substrate can be infiltrated, and therefore, the liquid metal alloy can be stably adhered to the glass substrate in the normal work of the LED glass screen, the transmission of electric energy and electric signals to the LED lamp bead is realized, the adsorption force between the liquid metal alloy and the LED lamp bead is ensured by the tension of the liquid metal alloy, the situations of insufficient soldering or falling off are avoided, and the normal use of the LED lamp bead is ensured. Meanwhile, the liquid metal alloy has strong conductive performance, and heat generated during the work of the LED lamp bead can be LED out while the heat is prevented from being generated during the work, so that the service life of the LED lamp bead is prolonged.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides an electric connection technology of lamp pearl pad and glass screen which characterized in that includes following step:
step 1: coating the conductive paste on a glass substrate, baking and forming to form a conductive circuit on the glass substrate;
step 2: arranging a plurality of preset positions on the conductive circuit;
and step 3: dripping liquid metal alloy with glass affinity on a welding disc point corresponding to a preset position;
and 4, step 4: attaching the bottom of the LED lamp bead to the glass substrate, so that a bonding pad on the LED lamp bead is in contact with the liquid metal alloy;
and 5: the glass protection plate is arranged on one side, close to the LED lamp beads, of the glass substrate through a hollow process, so that the glass protection plate and the glass substrate are packaged to form the transparent display screen integrally.
2. The process of claim 1, wherein the liquid metal alloy contains gallium.
3. The process of claim 1, wherein the liquid metal alloy contains indium.
4. The process of claim 1, wherein the liquid metal alloy is liquid at a temperature of 0-2200 ℃.
5. The process of claim 1, wherein the conductive paste comprises graphene powder and two or all of silver, platinum and rhodium metal particles.
6. The process for electrically connecting the bead pad and the glass screen according to claim 1, wherein the step 5 comprises the following steps:
step 5.1: forming a hollow gap between the glass substrate and the stripping protection plate, and filling a circle of soft edge strips with molecular sieves between the edges of the glass substrate and the glass protection plate corresponding to the hollow gap;
step 5.2: a circle of structural adhesive is filled at the outer side of the soft edge strip;
step 5.3: inert gas is filled in the hollow gap between the glass substrate and the glass protection plate.
7. The process of claim 1, wherein the LED lamp beads are adhered to the glass substrate by UV curing adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110873355.1A CN113594340A (en) | 2021-07-30 | 2021-07-30 | Electric connection process of lamp bead bonding pad and glass screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110873355.1A CN113594340A (en) | 2021-07-30 | 2021-07-30 | Electric connection process of lamp bead bonding pad and glass screen |
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| Publication Number | Publication Date |
|---|---|
| CN113594340A true CN113594340A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110873355.1A Pending CN113594340A (en) | 2021-07-30 | 2021-07-30 | Electric connection process of lamp bead bonding pad and glass screen |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038606A (en) * | 2021-11-05 | 2022-02-11 | 巨晶(广东)光电科技有限公司 | Liquid metal graphene composite conductive paste for transparent display screen |
| CN114828401A (en) * | 2022-04-08 | 2022-07-29 | 百为智能科技(广州)有限公司 | Lamp bead circuit preparation method based on large-size hollow glass substrate and display device |
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| CN101984510A (en) * | 2010-08-20 | 2011-03-09 | 符建 | Flexibly connected light-emitting diode (LED) device based on liquid metal base |
| CN106097913A (en) * | 2016-08-18 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | A kind of clear glass base display screen and preparation technology thereof |
| CN106927698A (en) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
| US20190327839A1 (en) * | 2016-02-03 | 2019-10-24 | Wuhan Huashang Green Technology Co., Ltd. | Highly conductive transparent glass-based circuit board |
| CN112530306A (en) * | 2020-12-24 | 2021-03-19 | 赵泽宇 | Transparent glass display screen |
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2021
- 2021-07-30 CN CN202110873355.1A patent/CN113594340A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101984510A (en) * | 2010-08-20 | 2011-03-09 | 符建 | Flexibly connected light-emitting diode (LED) device based on liquid metal base |
| US20190327839A1 (en) * | 2016-02-03 | 2019-10-24 | Wuhan Huashang Green Technology Co., Ltd. | Highly conductive transparent glass-based circuit board |
| CN106097913A (en) * | 2016-08-18 | 2016-11-09 | 武汉华尚绿能科技股份有限公司 | A kind of clear glass base display screen and preparation technology thereof |
| CN106927698A (en) * | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114038606A (en) * | 2021-11-05 | 2022-02-11 | 巨晶(广东)光电科技有限公司 | Liquid metal graphene composite conductive paste for transparent display screen |
| CN114828401A (en) * | 2022-04-08 | 2022-07-29 | 百为智能科技(广州)有限公司 | Lamp bead circuit preparation method based on large-size hollow glass substrate and display device |
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Application publication date: 20211102 |
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