CN113588679A - Method for checking incomplete film removal - Google Patents
Method for checking incomplete film removal Download PDFInfo
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- CN113588679A CN113588679A CN202110654255.XA CN202110654255A CN113588679A CN 113588679 A CN113588679 A CN 113588679A CN 202110654255 A CN202110654255 A CN 202110654255A CN 113588679 A CN113588679 A CN 113588679A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/91—Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- Analytical Chemistry (AREA)
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- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The invention discloses a method for detecting incomplete film removal, which comprises the following steps: carrying out film stripping treatment on the PCB to generate a plate to be detected; placing a plate to be detected in a darkroom; turning on a UV lamp to irradiate the plate to be detected; and observing whether a mark emitting fluorescent color or blue-violet appears on the plate to be detected, if so, judging that the film fading is not clean, and if not, judging that the film fading meets the requirements and performing subsequent treatment. The fluorescent dye in the dry film is excited by the light waves irradiated by the UV lamp through the absorption of the dry film, so that visible light is emitted by naked eyes, and whether the mark emitting fluorescent color or blue-violet is observed through the naked eyes to judge whether the film is not completely removed or not is easily observed in a darkroom, so that the problems of incomplete detection of the film removal with small line distance and short circuit quality defect are solved.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a method for detecting incomplete film removal.
Background
At present, with the rapid development of technology, the PCB process is continuously developed to a fine circuit. Since printed circuit boards are not typical end products, they are somewhat confusing in the definition of names such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry. For another example: because of the integrated circuit components mounted on the circuit board, the news media is called an IC board, but it is not substantially identical to a printed circuit board. By printed circuit board we generally say bare board-i.e. a circuit board without upper components. The fabrication of high-order lines is increasingly difficult, with the requirements for inspection technology increasing. The common PCB process flow comprises a film removing process flow, products after film removing can be inspected in a visual spot inspection mode, and due to the fact that the circuit grade is low, the line width and the line distance (more than 35um/35 um) of films after compensation are large, blue dry films can be found only through naked eyes.
However, the existing film removing process flow has the following defects:
with the continuous improvement of technical requirements, when the mSAP process flow is developed, a film stripping flow also exists, but the circuit manufacturing level is higher, the line width and the line distance are generally designed to be below 30um/30um, the distance is generally smaller than 20um after the line width film compensation, meanwhile, an unclean dry film presents slight light blue or transparent package, visual and AOI detection cannot be found at all, the film stripping at a small line distance cannot be detected clearly, and the short-circuit quality defect is caused.
Disclosure of Invention
In order to overcome the defects of the prior art, one of the objectives of the present invention is to provide a method for detecting incomplete film removal, which can solve the problems of incomplete film removal detection at small line pitches and short circuit quality defects.
One of the purposes of the invention is realized by adopting the following technical scheme:
a method of detecting incomplete film removal, comprising the steps of:
and (3) film stripping: carrying out film stripping treatment on the PCB to generate a plate to be detected;
a transfer step: placing a plate to be detected in a darkroom;
an irradiation step: turning on a UV lamp to irradiate the plate to be detected;
and (3) checking: and observing whether a mark emitting fluorescent color or blue-violet appears on the plate to be detected, if so, judging that the film fading is not clean, and if not, judging that the film fading meets the requirements and performing subsequent treatment.
Further, in the step of film removal, whether the plate to be detected has the problem of incomplete film removal is visually observed, if so, the plate is judged to have incomplete film removal, and if not, the next step is executed.
Further, in the transferring step, after the plate to be detected is placed in the darkroom, whether the darkroom conditions meet requirements is detected, if yes, the next step is executed, and if not, the light leakage position is detected and sealed.
Further, between the transfer step and the irradiation step, a detection and confirmation step is provided: and confirming whether the dry film can absorb the most sensitive wavelength in the light of the UV lamp, and if so, executing an irradiation step.
Further, in the detection confirmation step, the films cannot absorb the most sensitive wavelength in the light of the UV lamp, and the UV lamp type is replaced again until the type meeting the requirement is selected.
Further, between the transfer step and the irradiation step, a detection and confirmation step is provided: and analyzing various light waves of the current UV lamp, selecting the light wave with the most sensitive wave band, and detecting whether the light wave with the most sensitive wave band can excite the fluorescent material in the dry film.
Further, in the detection and confirmation step, if the light wave most sensitive to the current waveband is detected, the fluorescent material in the dry film can be excited, the irradiation step is executed, and if not, the light wave is selected again.
Further, in the detection and confirmation step, if the most sensitive light wave in the current waveband is detected to be incapable of exciting the fluorescent material in the dry film, and no light wave meeting the requirement is found after the light wave is selected again, the UV lamps with other specifications are replaced for detection.
Further, in the inspecting step, observation is performed in a darkroom by a camera.
Further, in the checking step, if the film is judged not to be completely removed, the plate to be detected is marked.
Compared with the prior art, the invention has the beneficial effects that:
a method of detecting incomplete film removal, comprising the steps of: carrying out film stripping treatment on the PCB to generate a plate to be detected; placing a plate to be detected in a darkroom; turning on a UV lamp to irradiate the plate to be detected; and observing whether a mark emitting fluorescent color or blue-violet appears on the plate to be detected, if so, judging that the film fading is not clean, and if not, judging that the film fading meets the requirements and performing subsequent treatment. The fluorescent dye in the dry film is excited by the light waves irradiated by the UV lamp through the absorption of the dry film, so that visible light is emitted by naked eyes, and whether the mark emitting fluorescent color or blue-violet is observed through the naked eyes to judge whether the film is not completely removed or not is easily observed in a darkroom, so that the problems of incomplete detection of the film removal with small line distance and short circuit quality defect are solved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of a method for detecting incomplete film removal according to a preferred embodiment of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that any combination of the embodiments or technical features described below can be used to form a new embodiment without conflict.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a method for detecting incomplete film removal includes the following steps:
and (3) film stripping: carrying out film stripping treatment on the PCB to generate a plate to be detected;
in the step of film removal, visually observing whether the plate to be detected has the problem of incomplete film removal, if so, judging that the film removal is incomplete, and if not, executing the next step;
a transfer step: placing a plate to be detected in a darkroom;
in the transferring step, after the plate to be detected is placed in a darkroom, whether the darkroom conditions meet requirements or not is detected, if yes, the next step is executed, and if not, the light leakage position is detected and sealed.
An irradiation step: turning on a UV lamp to irradiate the plate to be detected;
and (3) checking: and observing whether a mark emitting fluorescent color or blue-violet appears on the plate to be detected, if so, judging that the film fading is not clean, and if not, judging that the film fading meets the requirements and performing subsequent treatment. The fluorescent dye in the dry film is excited by the light waves irradiated by the UV lamp through the absorption of the dry film, so that visible light is emitted by naked eyes, and whether the mark emitting fluorescent color or blue-violet is observed through the naked eyes to judge whether the film is not completely removed or not is easily observed in a darkroom, so that the problems of incomplete detection of the film removal with small line distance and short circuit quality defect are solved.
Specifically, in the inspection step, observation is performed in a darkroom by a camera. And if the film fading is judged to be not clean, processing the mark of the plate to be detected currently.
Specifically, the materials on the surface of the PCB board in the film stripping process section are as follows: copper metal and dry film; absorption wavelength of metallic copper: 330-453 um; dry film general absorption wavelength: 310-; visible wavelength to human eye: 312-; and the following for general UV light wavelength types: vacuum ultraviolet (Vacumm UV) wavelengths are: 10-200um, short wave ultraviolet (UV-C) wavelength 200-280um, medium wave ultraviolet (UV-B) wavelength: 280- & ltSUB & gt 315um, & ltSUB & gt wavelength ultraviolet (UV-A): 315-400 um; therefore, the wavelength to which the absorption band of the dry film is most sensitive needs to be detected and confirmed, and the fluorescent material in the dry film can be excited only after the wave absorbing light wave of the dry film.
The specific detection principle is as follows:
when UV light shines copper and the dry film on the PCB board, the short UV light of wavelength can't see by the naked eye, and the long directness of wavelength is absorbed by copper and can't launch, and the dry film that fades unclean is shone by UV light, and the dry film has absorbed the light wave, has aroused inside fluorescent dye, sends visible light, in the room of dark, is seen the dry film that fades unclean very easily by the naked eye to reach and check whether the PCB surface fades clean dry film.
Specifically, for the dry film of more than 30um width, traditional naked eye and AOI scanning can take place, and to the dry film of 20-30um width, the scanning of naked eye and AOI is difficult to discover, and to the dry film of 5um-20um width, naked eye and AOI scanning can't discover basically, therefore the method in this application has very important meaning to the dry film of 5um-30um width.
In another embodiment, it is preferable that a detection confirming step is further provided between the transferring step and the irradiating step: and confirming whether the dry film can absorb the most sensitive wavelength in the light of the UV lamp, and if so, executing an irradiation step.
Preferably, in the detection confirmation step, the films cannot absorb the most sensitive wavelength in the light of the UV lamp, and the UV lamp type is replaced again until the type meeting the requirement is selected.
In another embodiment, it is preferable that a detection confirming step is further provided between the transferring step and the irradiating step: and analyzing various light waves of the current UV lamp, selecting the light wave with the most sensitive wave band, and detecting whether the light wave with the most sensitive wave band can excite the fluorescent material in the dry film.
Preferably, in the detection and confirmation step, if the light wave most sensitive to the current waveband is detected, the fluorescent material in the dry film can be excited, the irradiation step is executed, and if not, the light wave is selected again.
Preferably, in the detection and confirmation step, if it is detected that the most sensitive light wave of the current waveband cannot excite the fluorescent material in the dry film, and no light wave meeting the requirement is found after the light wave is selected again, the UV lamp of other specifications is replaced for detection.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. A method for detecting incomplete film fading is characterized by comprising the following steps:
and (3) film stripping: carrying out film stripping treatment on the PCB to generate a plate to be detected;
a transfer step: placing a plate to be detected in a darkroom;
an irradiation step: turning on a UV lamp to irradiate the plate to be detected;
and (3) checking: and observing whether a mark emitting fluorescent color or blue-violet appears on the plate to be detected, if so, judging that the film fading is not clean, and if not, judging that the film fading meets the requirements and performing subsequent treatment.
2. The method of detecting film fading non-net as claimed in claim 1, wherein: and in the step of film removal, visually observing whether the plate to be detected has the problem of incomplete film removal, if so, judging that the film removal is incomplete, and if not, executing the next step.
3. The method of detecting film fading non-net as claimed in claim 1, wherein: in the transferring step, after the plate to be detected is placed in a darkroom, whether the darkroom conditions meet requirements or not is detected, if yes, the next step is executed, and if not, the light leakage position is detected and sealed.
4. The method of detecting film fading non-net as claimed in claim 1, wherein: between the transfer step and the irradiation step, a detection and confirmation step is further provided: and confirming whether the dry film can absorb the most sensitive wavelength in the light of the UV lamp, and if so, executing an irradiation step.
5. The method of detecting film fading non-net as claimed in claim 4, wherein: in the detection confirmation step, the films cannot absorb the most sensitive wavelength in the light of the UV lamp, and the type of the UV lamp is replaced again until the type meeting the requirement is selected.
6. The method of detecting film fading non-net as claimed in claim 1, wherein: between the transfer step and the irradiation step, a detection and confirmation step is further provided: and analyzing various light waves of the current UV lamp, selecting the light wave with the most sensitive wave band, and detecting whether the light wave with the most sensitive wave band can excite the fluorescent material in the dry film.
7. The method of detecting film fading non-net as claimed in claim 6, wherein: in the detection and confirmation step, if the light wave which is most sensitive to the current wave band is detected, the fluorescent material in the dry film can be excited, the irradiation step is executed, and if not, the light wave is selected again.
8. The method of detecting film fading non-net as claimed in claim 7, wherein: in the detection and confirmation step, if the most sensitive light wave of the current wave band is detected not to excite the fluorescent material in the dry film, and no light wave meeting the requirement is found after the light wave is selected again, the UV lamps of other specifications are replaced for detection.
9. The method of detecting film fading non-net as claimed in claim 1, wherein: in the inspection step, observation is performed in a darkroom by a camera.
10. The method of detecting film fading non-net as claimed in claim 9, wherein: in the checking step, if the film is judged not to be completely removed, the plate to be detected is marked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110654255.XA CN113588679A (en) | 2021-06-11 | 2021-06-11 | Method for checking incomplete film removal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110654255.XA CN113588679A (en) | 2021-06-11 | 2021-06-11 | Method for checking incomplete film removal |
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| CN113588679A true CN113588679A (en) | 2021-11-02 |
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| CN202110654255.XA Pending CN113588679A (en) | 2021-06-11 | 2021-06-11 | Method for checking incomplete film removal |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05223748A (en) * | 1992-02-10 | 1993-08-31 | Nec Corp | Measuring method for flux residue on fluorescent printed board |
| CN202204770U (en) * | 2011-07-14 | 2012-04-25 | 镇新科技股份有限公司 | System for detecting residual glue refuse after printed circuit board (PCB) laser drilling |
| CN102680497A (en) * | 2011-03-11 | 2012-09-19 | 三星电机株式会社 | Device for detecting pattern defects |
| JP2020085482A (en) * | 2018-11-16 | 2020-06-04 | イビデン株式会社 | Remaining film detection device and detection method |
-
2021
- 2021-06-11 CN CN202110654255.XA patent/CN113588679A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05223748A (en) * | 1992-02-10 | 1993-08-31 | Nec Corp | Measuring method for flux residue on fluorescent printed board |
| CN102680497A (en) * | 2011-03-11 | 2012-09-19 | 三星电机株式会社 | Device for detecting pattern defects |
| JP2012189567A (en) * | 2011-03-11 | 2012-10-04 | Samsung Electro-Mechanics Co Ltd | Pattern defect detection device |
| CN202204770U (en) * | 2011-07-14 | 2012-04-25 | 镇新科技股份有限公司 | System for detecting residual glue refuse after printed circuit board (PCB) laser drilling |
| JP2020085482A (en) * | 2018-11-16 | 2020-06-04 | イビデン株式会社 | Remaining film detection device and detection method |
Non-Patent Citations (1)
| Title |
|---|
| 成都地质学院三系矿物组编: "塑料注射成型实用技术", 成都地质学院三系矿物组, pages: 24 - 25 * |
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