CN102680497A - Device for detecting pattern defects - Google Patents

Device for detecting pattern defects Download PDF

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Publication number
CN102680497A
CN102680497A CN2011101323478A CN201110132347A CN102680497A CN 102680497 A CN102680497 A CN 102680497A CN 2011101323478 A CN2011101323478 A CN 2011101323478A CN 201110132347 A CN201110132347 A CN 201110132347A CN 102680497 A CN102680497 A CN 102680497A
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CN
China
Prior art keywords
image
detecting device
scattered light
equipment
light image
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Pending
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CN2011101323478A
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Chinese (zh)
Inventor
金泽兼
朴首雄
朴珍远
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication of CN102680497A publication Critical patent/CN102680497A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64Fluorescence; Phosphorescence
    • G01N2021/6491Measuring fluorescence and transmission; Correcting inner filter effect

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

The invention discloses a device for detecting pattern defects, comprising: a light source for generating and emitting light; a scanning lens for scanning light from the light source on a plate; a fluorescence image detector for detecting a fluorescence image on the plate; and a scattered light image detector for detecting a scattered light image on the plate, thereby the pattern defects are easily detected during the exposure process.

Description

The equipment that is used for the check pattern defective
The cross reference of related application
The application requires in rights and interests that submit to, that be entitled as the korean patent application No.10-2011-0022049 of " Apparatus For Detecting Pattern Defects (equipment that is used for the check pattern defective) " on March 11st, 2011, and its integral body is integrated among the application as a reference.
Technical field
The present invention relates to be used for the equipment of check pattern defective.
Background technology
As the method for making printed circuit board (PCB), the method for the main formation circuit that uses is through copper facing thickness of coating to be formed into predetermined height; Pile up dry film; Remove a part of dry film through exposure process and developing process, the copper coating of etching openings part, and slough dry film.
According to prior art, use dry film when forming pattern, to have number of drawbacks as the method for the manufacturing printed circuit board (PCB) of corrosion-inhibiting coating.Cause the reason of defective to comprise; The for example damage of mask and stain the cut on the dry film, the dissimilar materials on the dry film in exposure process; Owing to excite (excitation) of bonding reduction between dry film and the plate, and exciting owing to the dissimilar materials between dry film and the plate.
Cause the damage of circuit pattern on the plate because of development and etching process in the defective that causes during the exposure process.
Therefore, can prevent that through detecting and remove the number of drawbacks that in exposure process, causes circuit pattern is damaged on the plate.
Relevant therewith, according to prior art, can use automatic optical check equipment to be used as the equipment of check pattern defective on printed circuit board (PCB).Yet this automatic optical check equipment is applicable to the image that has big reflection differences each other, but it is difficult to exposure layer and non-exposure layer, and the exposure process that is difficult to use material with little reflection differences (for example, dissimilar materials, stain).
In addition, since the scattered reflection effect that produces between exposure layer and non-exposure layer, the very difficult image that obtains high-quality, and the result just is difficult to detect defective.
Summary of the invention
Be used for the equipment of check pattern defective and make the present invention in order to provide a kind of; This equipment can detect the number of drawbacks that causes during the exposure process at an easy rate through detecting fluoroscopic image, scattered light image and the reflected light image that piles up on it on plate that dry film is arranged.
According to preferred implementation of the present invention, a kind of equipment that is used for the check pattern defective is provided, comprising: light source produces and emission light; Scanning mirror will be from the photoscanning of light emitted to plate; The fluoroscopic image detecting device detects fluorescigenic onboard fluoroscopic image; And the scattered light image detecting device, detect scattering scattered light image onboard.
Light source can produce and launch has 500 light to the wavelength of 600nm.
Light source can produce and launch the light of the wavelength with 594nm.
The equipment that is used for the check pattern defective can also comprise the reflected light image detecting device, is used to detect the reflected light image of slave plate reflection.
The equipment that is used for the check pattern defective can also comprise the detected image processor; Be used for the digital phosphor image is changed and saved as to the detected fluoroscopic image of fluoroscopic image detecting device; Digital scattered light image is changed and saved as to detected scattered light image in the scattered light image detecting device, and show fluoroscopic image and the scattered light image that stores according to user's needs.
The detected image processor can and store digital phosphor image and scattered light image binaryzation.
The detected image processor can comprise: first analog to digital converter, and detected fluoroscopic image is the digital phosphor image in the conversion fluorescence visual detector; First memory stores the fluoroscopic image of changing in first analog to digital converter; Second analog to digital converter, detected scattered light image is digital scattered light image in the conversion scattered light image detecting device; Second memory stores the scattered light image of changing in second analog to digital converter; Display device shows fluoroscopic image and scattered light image; And controller, be stored in the fluoroscopic image of first memory and be stored in scattered light image in the second memory according to user's needs output to display device.
The equipment that is used for the check pattern defective can further comprise: dichronic mirror, will be sent to scanning mirror from the light of light emitted and the fluorescence that produces when slave plate during through scanning mirror incident, and the fluorescence that the reflection slave plate produces is to the fluoroscopic image detecting device.
The equipment that is used for the check pattern defective can further comprise: be placed in the fluorescence filters of fluoroscopic image detecting device front portion with the fluorescence that forms on the transfer plate.
Description of drawings
Fig. 1 is the configuration of devices figure that is used for the check pattern defective of first preferred implementation according to the present invention;
Fig. 2 shows the synoptic diagram that dry film exposure front and back absorptance changes;
Fig. 3 A shows detected fluoroscopic image in the fluoroscopic image detecting device;
Fig. 3 B shows detected scattered light image in the scattered light image detecting device;
Fig. 4 is the configuration of devices figure that is used for the check pattern defective of second preferred implementation according to the present invention; And
Fig. 5 is the detailed configuration block diagram of the detected image processor of Fig. 1 and Fig. 3.
Embodiment
Term that in this instructions and claims, uses and word should not be construed as limited to typical implication or dictionary definition, carry out the best approach of the present invention with being used to of more suitably being known he or she and describe this principle and be interpreted as and have implication and the notion relevant with technical scope of the present invention but should can be suitably define term concepts based on the inventor.
Through detailed description, can more clearly understand above-mentioned and other purposes, characteristic and advantage of the present invention below in conjunction with accompanying drawing.In instructions, it should be noted that when the assembly in the accompanying drawing was added Reference numeral, similarly reference marker referred to similar assembly, even this assembly comes across in the different accompanying drawings.Further, when confirming to blur purport of the present invention, can omit detailed description to it to the detailed description of the known technology relevant with the present invention.
Below, will be described in detail preferred implementation of the present invention with reference to accompanying drawing.
Fig. 1 is the configuration of devices figure that is used for the check pattern defective of first preferred implementation according to the present invention.
With reference to figure 1, the equipment that is used for the check pattern defective of first preferred implementation is configured to comprise according to the present invention: light source 11, autofocus controller 12; Dichronic mirror 13, scanning mirror 14, the first collector lenses 15; Fluorescence filters 16; Fluoroscopic image detecting device 17, the second collector lenses 18, scattered light image detecting device 19 and detected image processor 30.
Light source 11, this light source 11 is LASER Light Sources, uses semiconductor laser (for example, He-Ne) also preferably to have the wavelength of 500nm to 700nm, most preferably have the wavelength of 594nm.
Usually, during exposure process, the light source of use uses has the UV light source of about 350nm to the 400nm wavelength coverage, and as shown in Figure 2, and the dry film that is exposed under the UV light source has increased the absorptance in the 600nm scope greatly.Reason is that dry film is doped with chemicals with because the UV light that shines on it changes color.
Therefore, in this preferred implementation according to the present invention, light source 11 uses near the laser the 600nm, and in other words, absorptance has the very scope of about-face before and after exposure.
Secondly; Autofocus controller 12; It is configured to comprise at least two lens; Come gated sweep light to pass through the focal length that scanning mirror 14 scans on plate 20 to light source 11 mobile lens or away from light source 11 mobile lens, thereby detect the image of high-quality through fluoroscopic image detecting device 17 or scattered light image detecting device 19.
Auto focus control controller 12 is driven by the autofocus controlling apparatus (not shown) and carries out focus control.
Further, dichronic mirror 13 transmits incident light from light source 11 emissions to plate 20, and reflection comprises that slave plate 20 is input to the reflected light of the fluorescence of fluoroscopic image detecting device 17.
So; 13 pairs of incident lights from light source 11 inputs of dichronic mirror are taked different action with the reflected light of the fluorescence that comprises slave plate 20 inputs; Comprise the reflected light of fluorescence with change, thereby dichronic mirror is propagated the reflected light that changes to fluoroscopic image detecting device 17, rather than propagate into light source 11.
Simultaneously, scanning mirror 14 scannings are transmitted into the incident light of plate 20 from light source 11.
In this situation, the incident light that scanning mirror 14 is launched from light source 11 with the scanning of zigzag formula with raster fashion.
Scanning mirror 14 can use current mirror (galvano mirror), optics polygonal mirror (polygon mirror), resonant mirror (resonant mirror), Acousto-Optic Deflector (AOD), electric light deflector (EOD) etc.
First collector lens 15 is placed between scanning mirror 14 and the plate 20, converging to Target Board 20 from the light of light source 11 emissions.It all is the convex lens of convex surface that first collector lens 15 uses both sides usually.
Secondly, fluorescence filters 16 is positioned in the front portion of fluoroscopic image detecting device 17, and this fluorescence filters 16 stops the reflected light of the fluorescence that comprises slave plate 20 inputs and transmits fluorescence.
Therefore, when removing fluorescence filters 16, reflected light image is imaged on the fluoroscopic image detecting device 17 through dichronic mirror 13, and fluorescence detector 17 can detect reflected light image.
Simultaneously, second collector lens 18 from light source 11 emission and converge slave plate 20 scatterings scatter light to scattered light image detecting device 19.
Scattered light image detecting device 19 detects and exports the scattered light image from the scattered light of importing through second collector lens 18.
Scattered light image detecting device 19 relative plates 20 are obliquely installed, and scattered light image detecting device 19 can easily be discerned the scattered light that step (step) that the dry film pattern by plate 20 forms is produced like this.
The plate 20 that is used for the equipment of check pattern defective can comprise, for example, and galley, ceramic wafer.
Galley or ceramic wafer are through copper facing the copper coating on the insulation course to be formed into predetermined height, to pile up dry film, removes the plate that the copper coating of a part of dry film and etching openings part forms through exposure process and developing process.
Therefore; Shown in Fig. 3 A; Fluoroscopic image detecting device 17 detects and exports the fluoroscopic image of the fluorescence that is produced by the incident light on the dry film of plate 20; And shown in Fig. 3 B, scattered light image detecting device 19 detect and output from because the pattern step (step) that forms at the dry film of plate 20 and scattered light image that the scattered light of scatter incident light obtains.
The defective of dry film can be measured in the fluoroscopic image of Fig. 3 A to be detected as stated, and the dissimilar materials in the dry film can be to be detected in the scattered light image of Fig. 3 B.
Simultaneously, detected image processor 30 converts detected simulation fluoroscopic image in fluoroscopic image detecting device 17 and the scattered light image detecting device 19 and SIMULATED SCATTERING light image into digital phosphor image and digital scattered light image and with its binaryzation and storage.
Further, if necessary, when the user wanted to see fluoroscopic image or scattered light image, detected image processor 30 showed fluoroscopic image or the scattered light image that stores.
When on dry film, existing dissimilar materials when (like, etch residue), use the pattern detection of above-mentioned fluoroscopic examination to show very big effect.
Yet, when the defective that detects on the circuit pattern upper strata, carry out detection together through using reflected light, can be with higher Performance Detection pattern.
Fig. 4 is the configuration of devices figure that is used for the check pattern defective of second preferred implementation according to the present invention.
With reference to figure 4, the equipment that is used for the check pattern defective of second preferred implementation is configured to comprise according to the present invention: light source 11, autofocus controller 12; Dichronic mirror 13, scanning mirror 14, the first collector lenses 15; Fluorescence filters 16, fluoroscopic image detecting device 17, the second collector lenses 18; Scattered light image detecting device 19, half transflective reflection horizon 21, reflected light image detecting device 22 and detected image processor 30.
In this configuration, because similar to scattered light image detecting device 19, will omit its detailed description with first preferred implementation from light source 11, and will double transflective reflection horizon 21, reflected light image detecting device 22 and detected image processor 30 detailed descriptions.
Half transflective reflection horizon 21 is transmitted and is comprised a catoptrical part and this catoptrical part of reflection of importing and reflex to the fluorescence of plate 20 from light source.
Simultaneously, the reflected light image that the reflected light that reflected light image detecting device 22 detects and output is reflected from half transflective reflection horizon 21 obtains.
In addition, although fluoroscopic image detecting device 17 can come the detection of reflected light image through removing fluorescence filters 16, when it comprises half transflective reflection horizon 21 with reflected light image detecting device 22, be easy to detection of reflected light image and fluoroscopic image.
So; When the equipment that is used for the check pattern defective of second preferred implementation according to the present invention further comprised reflected light image detecting device 22, detected image processor 30 converted detected simulated reflections light image in the reflected light image detecting device 22 into the digital reflected light image and with its binaryzation and storage.
Detected image processor 30 shows the reflected light image of storage according to user's demand.
Fig. 5 is the detailed configuration block diagram of Fig. 1 to the detected image processor of Fig. 3.
With reference to figure 5, Fig. 1 is configured to comprise first to the 3rd analog to digital converter 31 to 33, first to the 3rd binaryzation converter (binarizers) 34 to 36, first to the 3rd storer 37 to 39, controller 40 and display device 41 to the detected image processor of Fig. 3.
First analog to digital converter 31 is with detected simulation fluoroscopic image conversion in the fluoroscopic image detecting device 17 and be output as the digital phosphor image.
Second analog to digital converter 32 is with detected SIMULATED SCATTERING light image conversion in the scattered light image detecting device 19 and be output as digital scattered light image.
Further, the digital reflected light image is changed and be output as to the 3rd analog to digital converter 33 with detected simulated reflections light image in the reflected light image detecting device 22.
Next, the first binaryzation converter, 34 binaryzations are also exported the fluoroscopic image of conversion in first analog to digital converter 31.
Further, the second binaryzation converter, 35 binaryzations and export in second analog to digital converter 32 scattered light image of conversion.
Then, the 3rd binaryzation converter 36 binaryzations and export in the 3rd analog to digital converter 33 reflected light image of conversion.
When fluoroscopic image, scattered light image or reflected light image are carried out binaryzation, can confirm black and white, minimise data amount and be convenient to data processing as stated.
Simultaneously, first memory 37 stores in the first binaryzation converter 34 by the fluoroscopic image of binaryzation.
Second memory 38 stores in the second binaryzation converter 35 by the scattered light image of binaryzation.
Secondly, the 3rd storer 39 stores in the 3rd binaryzation converter 36 by the reflected light image of binaryzation.Further, first memory 37 to the 3rd storeies 39 can not be configured to the storer of above-mentioned separation, and can be formed single memory.
Controller 40 is according to the element in user's the demand control detection image processor and read the image that is stored in first memory 37 to the 3rd storeies 39, and image is outputed to display device 41.
Further, display device 41 shows that slave controller 40 is by the fluoroscopic image of output, binaryzation and storage, scattered light image or reflected light image.
Although with the data binaryzation, data can be processed in coloured image under the situation that does not comprise binaryzation converter 34 to 36 through the binaryzation converter 34 to 36 of use in detected image processor 30.
As stated, preferred implementation of the present invention can measurement of reflectivity changes the image of the high-quality of little exposure circuit pattern film.
In addition, preferred implementation of the present invention fast measurement of reflectivity change the image on the little exposure circuit pattern film.
Further, according to preferred implementation of the present invention can the measuring exposed circuit pattern in the defect state of copper coating under the dry film.
In addition, preferred implementation of the present invention can be measured fluoroscopic image, scattered light image and reflected light image simultaneously through using three photoelectric detectors
Further, can measure according to preferred implementation of the present invention because little reflection differences and big scattered light cause reflected image to measure the image of the material of difficulty.
Though disclose preferred implementation of the present invention for purpose of explanation, one of skill in the art will appreciate that and do not deviating under the situation of liking the disclosed scope of the invention of claim and spirit enclosed, can carry out various modifications, increase and alternative.Therefore, such modification, increase and alternative being appreciated that fall in the scope of the present invention.

Claims (9)

1. equipment that is used for the check pattern defective, this equipment comprises:
Light source, this light source are used for producing and emission light;
Scanning mirror, this scanning mirror be used for from the photoscanning of said light emitted to plate;
Fluoroscopic image detecting device, this fluoroscopic image detecting device are used for detecting fluorescigenic fluoroscopic image on said plate; And
The scattered light image detecting device, this scattered light image detecting device is used to detect the scattered light image of scattering on said plate.
2. the equipment that is used for the check pattern defective according to claim 1, wherein said light source produces and emission has the light of 500nm to the wavelength of 600nm.
3. the equipment that is used for the check pattern defective according to claim 1, wherein said light source produces and launches the light of the wavelength with 594nm.
4. the equipment that is used for the check pattern defective according to claim 1, this equipment further comprises the reflected light image detecting device, this reflected light image detecting device is used to detect the reflected light image from said plate reflection.
5. the equipment that is used for the check pattern defective according to claim 1; This equipment further comprises the detected image processor; This detected image processor is used for the detected said fluoroscopic image conversion of said fluoroscopic image detecting device and saves as the digital phosphor image; With detected said scattered light image conversion in the said scattered light image detecting device and save as digital scattered light image, and show stored fluoroscopic image and said scattered light image according to user's demand.
6. the equipment that is used for the check pattern defective according to claim 5, wherein said detected image processor is with said digital phosphor image and said scattered light image binaryzation and storage.
7. the equipment that is used for the check pattern defective according to claim 5, wherein said detected image processor comprises:
First analog to digital converter, this first analog to digital converter are used for converting the detected fluoroscopic image of said fluoroscopic image detecting device into the digital phosphor image;
First memory, this first memory are used for storing the said fluoroscopic image that said first analog to digital converter is changed;
Second analog to digital converter, this second analog to digital converter are used for converting the detected said scattered light image of said scattered light image detecting device into said digital scattered light image;
Second memory, this second memory are used for storing the said scattered light image that said second analog to digital converter is changed;
Display device, this display device are used to show said fluoroscopic image and said scattered light image; And
Controller, this controller are used for according to user's demand said fluoroscopic image that is stored in said first memory and the said scattered light image that is stored in said second memory being outputed to said display device.
8. the equipment that is used for the check pattern defective according to claim 1; This equipment further comprises dichronic mirror; This dichronic mirror is used for the light from said light emitted is sent to said scanning mirror and when the fluorescence that produces from said plate during through said scanning mirror incident, will be from the said fluorescent emission of said plate generation to said fluoroscopic image detecting device.
9. the equipment that is used for the check pattern defective according to claim 1, this equipment further comprise and are placed in said fluoroscopic image detecting device the place ahead to be transmitted in the fluorescence filters of the fluorescence that forms on the said plate.
CN2011101323478A 2011-03-11 2011-05-20 Device for detecting pattern defects Pending CN102680497A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110022049A KR20120104014A (en) 2011-03-11 2011-03-11 Apparatus for detecting defects of patterns
KR10-2011-0022049 2011-03-11

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103105400A (en) * 2013-01-29 2013-05-15 合肥知常光电科技有限公司 Method and device for detecting and classifying surface defects of large-aperture optical element
CN104614384A (en) * 2015-02-06 2015-05-13 北京印刷学院 Quality detecting method of printing product character
CN105783719A (en) * 2016-03-31 2016-07-20 浙江工业大学 Device for detecting mounting holes of shelf beam by use of plane mirrors
CN112284285A (en) * 2019-07-25 2021-01-29 东和株式会社 Inspection system, inspection method, cutting device, and resin molding device
CN113588679A (en) * 2021-06-11 2021-11-02 广州美维电子有限公司 Method for checking incomplete film removal

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105841613B (en) * 2016-03-31 2018-06-29 浙江工业大学 It is a kind of to judge the whether qualified device of guard frame rail using plane microscope group

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556903A (en) * 1983-12-20 1985-12-03 At&T Technologies, Inc. Inspection scanning system
JPH0526821A (en) * 1991-07-26 1993-02-02 Fujitsu Ltd Visual inspecting device
JPH07234464A (en) * 1994-07-28 1995-09-05 Konica Corp Radiograph information reader
CN1496478A (en) * 2001-02-14 2004-05-12 Ӧ�ò��Ϲ�˾ Laser scanning wafer inspection using nonlinear optical phenomena
JP2008164399A (en) * 2006-12-27 2008-07-17 Horiba Ltd Device for inspecting abnormality

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122573B2 (en) * 1986-06-27 1995-12-25 株式会社ニコン Pattern detection device
JPH01314953A (en) * 1988-06-16 1989-12-20 Fuji Electric Co Ltd Optical surface inspection apparatus
JPH0915134A (en) * 1995-06-29 1997-01-17 Matsushita Electron Corp Method and equipment for inspecting particle
JP3820806B2 (en) * 1999-07-21 2006-09-13 三菱電機株式会社 Laser inspection equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556903A (en) * 1983-12-20 1985-12-03 At&T Technologies, Inc. Inspection scanning system
JPH0526821A (en) * 1991-07-26 1993-02-02 Fujitsu Ltd Visual inspecting device
JPH07234464A (en) * 1994-07-28 1995-09-05 Konica Corp Radiograph information reader
CN1496478A (en) * 2001-02-14 2004-05-12 Ӧ�ò��Ϲ�˾ Laser scanning wafer inspection using nonlinear optical phenomena
JP2008164399A (en) * 2006-12-27 2008-07-17 Horiba Ltd Device for inspecting abnormality

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103105400A (en) * 2013-01-29 2013-05-15 合肥知常光电科技有限公司 Method and device for detecting and classifying surface defects of large-aperture optical element
CN103105400B (en) * 2013-01-29 2015-08-26 合肥知常光电科技有限公司 The detection sorting technique of optical elements of large caliber surface imperfection
CN104614384A (en) * 2015-02-06 2015-05-13 北京印刷学院 Quality detecting method of printing product character
CN104614384B (en) * 2015-02-06 2017-05-03 北京印刷学院 Quality detecting method of printing product character
CN105783719A (en) * 2016-03-31 2016-07-20 浙江工业大学 Device for detecting mounting holes of shelf beam by use of plane mirrors
CN105783719B (en) * 2016-03-31 2018-07-03 浙江工业大学 A kind of device that guard frame rail mounting hole detection is carried out using plane mirror
CN112284285A (en) * 2019-07-25 2021-01-29 东和株式会社 Inspection system, inspection method, cutting device, and resin molding device
CN113588679A (en) * 2021-06-11 2021-11-02 广州美维电子有限公司 Method for checking incomplete film removal

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JP2012189567A (en) 2012-10-04

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Application publication date: 20120919