CN113583761A - High-protection corrosion-resistant hydrocarbon cleaning agent for semiconductor cleaning and preparation method thereof - Google Patents
High-protection corrosion-resistant hydrocarbon cleaning agent for semiconductor cleaning and preparation method thereof Download PDFInfo
- Publication number
- CN113583761A CN113583761A CN202110916785.7A CN202110916785A CN113583761A CN 113583761 A CN113583761 A CN 113583761A CN 202110916785 A CN202110916785 A CN 202110916785A CN 113583761 A CN113583761 A CN 113583761A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- hydrocarbon
- parts
- cleaning agent
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004215 Carbon black (E152) Substances 0.000 title claims abstract description 45
- 229930195733 hydrocarbon Natural products 0.000 title claims abstract description 45
- 150000002430 hydrocarbons Chemical class 0.000 title claims abstract description 45
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 43
- 238000004140 cleaning Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 230000007797 corrosion Effects 0.000 title claims abstract description 36
- 238000005260 corrosion Methods 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 239000008139 complexing agent Substances 0.000 claims abstract description 9
- 239000003112 inhibitor Substances 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 9
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 7
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical group C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 28
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical group CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 20
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 20
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 20
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 18
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 9
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical group [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000005303 weighing Methods 0.000 claims description 9
- 229910052708 sodium Inorganic materials 0.000 claims description 7
- 239000011734 sodium Substances 0.000 claims description 7
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 6
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 6
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 6
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 6
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims description 6
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 6
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 6
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 2
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 230000000536 complexating effect Effects 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 2
- 230000004907 flux Effects 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012224 working solution Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000839 emulsion Substances 0.000 description 7
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 6
- 238000005457 optimization Methods 0.000 description 6
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 4
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- -1 AEO-7 Chemical compound 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 241000016649 Copaifera officinalis Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UDIPTWFVPPPURJ-UHFFFAOYSA-M Cyclamate Chemical compound [Na+].[O-]S(=O)(=O)NC1CCCCC1 UDIPTWFVPPPURJ-UHFFFAOYSA-M 0.000 description 1
- 239000004868 Kauri gum Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229940109275 cyclamate Drugs 0.000 description 1
- 239000000625 cyclamic acid and its Na and Ca salt Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229960001462 sodium cyclamate Drugs 0.000 description 1
- BRPNNYXZQLLLSN-UHFFFAOYSA-N sodium;dodecane Chemical compound [Na+].CCCCCCCCCCC[CH2-] BRPNNYXZQLLLSN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/18—Hydrocarbons
- C11D3/181—Hydrocarbons linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/18—Hydrocarbons
- C11D3/182—Hydrocarbons branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2096—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3418—Toluene -, xylene -, cumene -, benzene - or naphthalene sulfonates or sulfates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning a semiconductor and a preparation method thereof, wherein the high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning the semiconductor comprises, by weight, 40-50 parts of hydrocarbon, 3-8 parts of nonionic surfactant, 0.5-3 parts of dispersing agent, 2-5 parts of complexing agent, 1-3 parts of solubilizer and 1.5-4 parts of corrosion inhibitor. The solubilizer can have good solubility on natural rosin and the like in the soldering flux, dissolved impurities are quickly dispersed in working solution from a semiconductor device by virtue of the dispersant, the impurities and the like form polymers through the complexing action of the complexing agent, and the polymers are rinsed through the washing action of the nonionic surfactant, so that the cleaning efficiency and the cleaning quality are improved through the synergistic action of all the components; the corrosion inhibitor is added, so that the high compatibility of the components is maintained, the semiconductor device is prevented from being corroded, and the product quality is not influenced.
Description
Technical Field
The invention relates to the technical field of hydrocarbon cleaning agents, in particular to a high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning a semiconductor and a preparation method thereof.
Background
Most used in the industrial cleaning field are halogenated hydrocarbon cleaning agents, but the halogenated hydrocarbon cleaning agents cause a lot of harm to human bodies and environment during the use process. With the improvement of environmental awareness of people, various substitute products and substitute technologies come into play, and the hydrocarbon cleaning agent not only has good environmental protection characteristic, but also has good cleaning performance, low toxicity, can be thoroughly volatilized without leaving any residue, and is safe to cleaned materials, so that the hydrocarbon cleaning agent gradually becomes an important industrial cleaning agent and is widely applied to industries such as electronics, electricity, semiconductors and the like.
However, the existing hydrocarbon cleaning agent also has the defects of low cleaning force, few types of cleaning dirt and the like, and if the cleaning capability of the hydrocarbon cleaning agent is simply enhanced for improving the cleaning effect, certain damage is possibly caused to products (semiconductor devices and the like).
Disclosure of Invention
The invention aims to provide a high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning a semiconductor and a preparation method thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that: a high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning semiconductors comprises the following components in parts by weight,
as a further optimization, the hydrocarbon is one or more of n-nonane, isomeric nonane, n-decane, isomeric decane, n-undecane or isomeric undecane.
As a further optimization, the nonionic surfactant is one or more of fatty alcohol-polyoxyethylene ether, alkylphenol ethoxylates or polyether surfactants.
As a further optimization, the dispersant is sodium dodecyl benzene sulfonate or sodium dodecyl cyclamate.
Preferably, the complexing agent is one or more of sodium tripolyphosphate, sodium hexametaphosphate or disodium ethylenediamine tetraacetate.
As a further optimization, the solubilizer is N-ethyl-2-pyrrolidone and/or tetrahydrofurfuryl alcohol; preferably, the solubilizer is N-ethyl-2-pyrrolidone and tetrahydrofurfuryl alcohol, and the mass ratio of the N-ethyl-2-pyrrolidone to the tetrahydrofurfuryl alcohol is (1-1.5): 1.
As a further optimization, the corrosion inhibitor is mercaptobenzothiazole.
The invention also provides a preparation method of the high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning the semiconductor, which comprises the following steps,
s1) accurately weighing each component;
s2) adding hydrocarbon, nonionic surfactant, dispersant, complexing agent, solubilizer, corrosion inhibitor and water into a reaction kettle, heating and stirring for 2.5-3 h;
s3) cooling and discharging to obtain the emulsified hydrocarbon cleaning agent.
As a further optimization, the temperature in S2 is 80-85 ℃, and the temperature in S3 is 20-25 ℃.
Compared with the prior art, the invention has the beneficial effects that:
1. the solubilizer is added, so that the natural rosin and the like in the soldering flux can be well dissolved, the dissolved impurities and the like are quickly dispersed in the working solution from a semiconductor device by virtue of the dispersing action of the dispersant, the impurities and the like form polymers by virtue of the complexing action of the complexing agent, and the polymers are rinsed by virtue of the washing action of the nonionic surfactant, so that the cleaning efficiency and the cleaning quality are improved by virtue of the synergistic action of all the components;
2. by adding the corrosion inhibitor, the high compatibility of the components is kept, the semiconductor device is prevented from being corroded, the protective property and the corrosion resistance are better, and the quality of the product is not influenced.
Detailed Description
The following are specific examples of the present invention and further describe the technical solutions of the present invention, but the present invention is not limited to these examples.
Example 1
The high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning the semiconductor comprises, by weight, 45 parts of N-nonane, 96 parts of AEO-96 parts, 2 parts of sodium dodecyl benzene sulfonate, 3 parts of sodium tripolyphosphate, 0.8 part of N-ethyl-2-pyrrolidone, 0.7 part of tetrahydrofurfuryl alcohol, 3 parts of mercaptobenzothiazole and 45 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding N-nonane, AEO-9, sodium dodecyl benzene sulfonate, sodium tripolyphosphate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol, mercaptobenzothiazole and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Example 2
A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning a semiconductor comprises, by weight, 42 parts of isomeric nonane, 97 parts of AEO-97 parts, 2.5 parts of sodium dodecyl cyclic sulfate, 4 parts of sodium tripolyphosphate, 1.2 parts of N-ethyl-2-pyrrolidone, 0.8 part of tetrahydrofurfuryl alcohol, 2 parts of mercaptobenzothiazole and 45 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding isomeric nonane, AEO-9, sodium dodecyl naphthenate, sodium tripolyphosphate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol, mercaptobenzothiazole and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Example 3
A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning semiconductors comprises, by weight, 40 parts of isomeric nonane, 95 parts of AEO-sodium dodecyl benzene sulfonate, 4 parts of sodium hexametaphosphate, 1 part of N-ethyl-2-pyrrolidone, 1 part of tetrahydrofurfuryl alcohol, 2.5 parts of mercaptobenzothiazole and 40 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding isomeric nonane, AEO-9, sodium dodecyl benzene sulfonate, sodium hexametaphosphate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol, mercaptobenzothiazole and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Example 4
A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning semiconductors comprises, by weight, 48 parts of isomeric decane, 74 parts of AEO-9 parts, 1.5 parts of sodium dodecyl benzene sulfonate, 3 parts of sodium hexametaphosphate, 1.5 parts of N-ethyl-2-pyrrolidone, 1.5 parts of tetrahydrofurfuryl alcohol, 3 parts of mercaptobenzothiazole and 45 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding isomeric decane, AEO-7, sodium dodecyl benzene sulfonate, sodium hexametaphosphate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol, mercaptobenzothiazole and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Example 5
A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning a semiconductor comprises, by weight, 46 parts of N-decane, 78 parts of AEO-sodium dodecyl cyclic sulfate, 2 parts of disodium ethylene diamine tetraacetate, 3.5 parts of N-ethyl-2-pyrrolidone, 0.9 part of tetrahydrofurfuryl alcohol, 4 parts of mercaptobenzothiazole and 44 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding N-decane, AEO-7, sodium dodecyl naphthenate, disodium ethylene diamine tetraacetate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol, mercaptobenzothiazole and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Comparative example 1
A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning a semiconductor comprises, by weight, 45 parts of N-decane, 76 parts of AEO-76 parts, 2 parts of dodecyl sodium cyclamate, 1.2 parts of N-ethyl-2-pyrrolidone, 0.8 part of tetrahydrofurfuryl alcohol, 3 parts of mercaptobenzothiazole and 42 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding N-decane, AEO-7, sodium dodecyl naphthenate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol, mercaptobenzothiazole and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Comparative example 2
A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning semiconductors comprises, by weight, 45 parts of N-decane, 76 parts of AEO-76 parts, 3 parts of sodium dodecyl benzene sulfonate, 4 parts of disodium ethylene diamine tetraacetate, 1.5 parts of N-ethyl-2-pyrrolidone, 1.5 parts of tetrahydrofurfuryl alcohol and 45 parts of water.
The preparation method comprises the following steps: s1) accurately weighing each component; s2) adding N-decane, AEO-7, sodium dodecyl benzene sulfonate, disodium ethylene diamine tetraacetate, N-ethyl-2-pyrrolidone, tetrahydrofurfuryl alcohol and water into a reaction kettle, heating to 80-85 ℃, and stirring for 2.5-3 h; s3) cooling to 20-25 ℃, and discharging to obtain the emulsified hydrocarbon cleaning agent.
Application examples
Indexes of the hydrocarbon cleaning agent prepared in the examples 1 to 5 and the comparative examples 1 to 2 are detected, and the detection method comprises the following steps: the appearance was visually observed; the KB value is the number of ml of diluent required to extract kaurigum from 120g of a standard kaurigum-butanol solution at 25 ℃ and higher KB values indicate better solubility.
| Appearance of the product | KB value | Soil-removing power | |
| Example 1 | Transparent clear emulsion | 39 | Complete removal of semiconductorSurface stains on devices |
| Example 2 | Transparent clear emulsion | 41 | Complete removal of stains on semiconductor device surface |
| Example 3 | Transparent clear emulsion | 41 | Complete removal of stains on semiconductor device surface |
| Example 4 | Transparent clear emulsion | 42 | Complete removal of stains on semiconductor device surface |
| Example 5 | Transparent clear emulsion | 40 | Complete removal of stains on semiconductor device surface |
| Comparative example 1 | Transparent clear emulsion | 34 | Residual stain on the surface of semiconductor device |
| Comparative example 2 | Transparent clear emulsion | 36 | Residual stain on the surface of semiconductor device |
It can be known from experimental data that, compared with comparative example 1 in which no complexing agent is added, examples 1 to 5 and comparative example 2 can form polymers of impurities and the like by the complexing action of the complexing agent, and rinse by the washing action of the nonionic surfactant, the cleaning efficiency and the cleaning quality are improved; the corrosion inhibitor is not added in the comparative example 2, and compared with the semiconductor device (copper) cleaned by the comparative example 2 which does not change color after 4-5 days of cleaning in the examples 1-5 and the comparative example 1, the semiconductor device cleaned by the comparative example 2 can generate certain color change within about 3 days after cleaning, so that the corrosion inhibitor can prevent the semiconductor device from being oxidized after cleaning while preventing corrosion in the cleaning process of the semiconductor device, has better corrosion resistance and protection performance, and can improve the cleaning quality.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. A high-protection corrosion-resistant hydrocarbon cleaning agent for cleaning semiconductors is characterized by comprising the following components in parts by weight,
2. the hydrocarbon cleaning agent with high protection and corrosion resistance for cleaning semiconductors as claimed in claim 1, wherein the hydrocarbon is one or more of n-nonane, isomeric nonane, n-decane, isomeric decane, n-undecane or isomeric undecane.
3. The hydrocarbon cleaning agent with high protection and corrosion resistance for cleaning semiconductors as claimed in claim 1, wherein the nonionic surfactant is one or more of fatty alcohol-polyoxyethylene ether, alkylphenol ethoxylate or polyether surfactant.
4. The hydrocarbon cleaning agent with high protection and corrosion resistance for cleaning semiconductors as claimed in claim 1, wherein the dispersant is sodium dodecylbenzene sulfonate or sodium dodecylcyclo-sulfonate.
5. The hydrocarbon cleaning agent with high protection and corrosion resistance for cleaning semiconductors as claimed in claim 1, wherein the complexing agent is one or more of sodium tripolyphosphate, sodium hexametaphosphate or disodium ethylenediamine tetraacetate.
6. The hydrocarbon cleaning agent with high protection and corrosion resistance for semiconductor cleaning according to claim 1, wherein the solubilizer is N-ethyl-2-pyrrolidone and/or tetrahydrofurfuryl alcohol.
7. The hydrocarbon cleaning agent with high protection and corrosion resistance for semiconductor cleaning according to claim 6, wherein the solubilizer is N-ethyl-2-pyrrolidone and tetrahydrofurfuryl alcohol, and the mass ratio of the N-ethyl-2-pyrrolidone to the tetrahydrofurfuryl alcohol is (1-1.5): 1.
8. The hydrocarbon cleaning agent with high protection and corrosion resistance for cleaning semiconductors as claimed in claim 1, wherein the corrosion inhibitor is mercaptobenzothiazole.
9. A method for preparing the hydrocarbon cleaning agent with high protection and corrosion resistance for cleaning the semiconductor according to any one of the claims 1 to 8, which comprises the following steps,
s1) accurately weighing each component;
s2) adding hydrocarbon, nonionic surfactant, dispersant, complexing agent, solubilizer, corrosion inhibitor and water into a reaction kettle, heating and stirring for 2.5-3 h;
s3) cooling and discharging to obtain the emulsified hydrocarbon cleaning agent.
10. The method for preparing an emulsified hydrocarbon cleaning agent according to claim 9, wherein the temperature in S2 is 80-85 ℃ and the temperature in S3 is 20-25 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110916785.7A CN113583761A (en) | 2021-08-11 | 2021-08-11 | High-protection corrosion-resistant hydrocarbon cleaning agent for semiconductor cleaning and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110916785.7A CN113583761A (en) | 2021-08-11 | 2021-08-11 | High-protection corrosion-resistant hydrocarbon cleaning agent for semiconductor cleaning and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113583761A true CN113583761A (en) | 2021-11-02 |
Family
ID=78256966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110916785.7A Pending CN113583761A (en) | 2021-08-11 | 2021-08-11 | High-protection corrosion-resistant hydrocarbon cleaning agent for semiconductor cleaning and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113583761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115537832A (en) * | 2022-08-31 | 2022-12-30 | 深圳市鑫承诺环保产业股份有限公司 | Hydrocarbon cleaning agent for cleaning surface of metal piece and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103468434A (en) * | 2013-09-17 | 2013-12-25 | 华阳新兴科技（天津）集团有限公司 | Environment-friendly safe solvent cleaning agent |
| CN105063650A (en) * | 2015-08-25 | 2015-11-18 | 华阳新兴科技（天津）集团有限公司 | Emulsified type industrial cleaning agent and preparation method thereof |
| CN109694780A (en) * | 2018-12-28 | 2019-04-30 | 诺而曼环保科技（江苏）有限公司 | A kind of environmental protection li battery shell agent for carbon hydrogen detergent and preparation method thereof |
| CN109694785A (en) * | 2017-10-22 | 2019-04-30 | 麦达可尔(烟台)科技有限公司 | A kind of highly effective antirust type ring protects agent for carbon hydrogen detergent and preparation method thereof |
| CN109735860A (en) * | 2018-12-29 | 2019-05-10 | 广东新球清洗科技股份有限公司 | Metal product multiple groups part agent for carbon hydrogen detergent and preparation method thereof and application method |
| CN111139140A (en) * | 2018-11-02 | 2020-05-12 | 依工特种材料（苏州）有限公司 | Water-based semiconductor cleaning agent and preparation method thereof |
-
2021
- 2021-08-11 CN CN202110916785.7A patent/CN113583761A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103468434A (en) * | 2013-09-17 | 2013-12-25 | 华阳新兴科技（天津）集团有限公司 | Environment-friendly safe solvent cleaning agent |
| CN105063650A (en) * | 2015-08-25 | 2015-11-18 | 华阳新兴科技（天津）集团有限公司 | Emulsified type industrial cleaning agent and preparation method thereof |
| CN109694785A (en) * | 2017-10-22 | 2019-04-30 | 麦达可尔(烟台)科技有限公司 | A kind of highly effective antirust type ring protects agent for carbon hydrogen detergent and preparation method thereof |
| CN111139140A (en) * | 2018-11-02 | 2020-05-12 | 依工特种材料（苏州）有限公司 | Water-based semiconductor cleaning agent and preparation method thereof |
| CN109694780A (en) * | 2018-12-28 | 2019-04-30 | 诺而曼环保科技（江苏）有限公司 | A kind of environmental protection li battery shell agent for carbon hydrogen detergent and preparation method thereof |
| CN109735860A (en) * | 2018-12-29 | 2019-05-10 | 广东新球清洗科技股份有限公司 | Metal product multiple groups part agent for carbon hydrogen detergent and preparation method thereof and application method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115537832A (en) * | 2022-08-31 | 2022-12-30 | 深圳市鑫承诺环保产业股份有限公司 | Hydrocarbon cleaning agent for cleaning surface of metal piece and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106893642B (en) | Water-based cleaning agent and application thereof | |
| CN106947979B (en) | Magnesium-aluminum alloy cleaning agent | |
| CN109135945A (en) | Environmentally friendly neutrality rust remover | |
| CN101748003A (en) | Halogen free environment-friendly cleaning agent | |
| CN107130253A (en) | A kind of aluminum alloy cleaning agent | |
| CN108690736B (en) | Environment-friendly aircraft exterior cleaning agent and preparation method thereof | |
| CN108286052A (en) | A kind of biodegradation aqua type metal cleaner and the preparation method and application thereof | |
| CN109456855B (en) | Environment-friendly clean type oil stain cleaning agent and preparation method thereof | |
| CN103834484A (en) | Special cleaning agent of environment-friendly water-based circuit board and preparation method of special cleaning agent | |
| CN108546450A (en) | Environmentally-friendly water-based detergent for ink and preparation method thereof | |
| CN107326375A (en) | One Albatra metal cleaning agent | |
| CN103469237A (en) | Metal oil contamination cleaner | |
| CN107779885A (en) | A kind of Al alloys andMg alloys are anti-oxidation, anticorrosion oil removing brightener | |
| CN106048632A (en) | Neutral non-phosphorus degreasing agent and preparation method thereof | |
| CN110578151A (en) | Alkaline steel rust remover and preparation method thereof | |
| CN111471536A (en) | Water-based cleaning agent used after optical glass screen printing and application thereof | |
| CN112458480A (en) | Water-based silicone grease cleaning agent for multiple metals and preparation method thereof | |
| CN113583761A (en) | High-protection corrosion-resistant hydrocarbon cleaning agent for semiconductor cleaning and preparation method thereof | |
| CN104498971B (en) | Room-temperature non-phosphorus degreasing agent capable of rapidly removing oil putty on surface of metal workpiece | |
| CN110760861A (en) | Copper cleaning agent and preparation method thereof | |
| CN103952246A (en) | Cleaning fluid used in solar silicon wafer manufacturing | |
| CN103469229A (en) | Water-based metal surface cleaner | |
| JP2016196693A (en) | Detergent composition for copper, zinc or alloy including these alloys, method for cleaning the obtect to be cleaned made of copper, zinc or alloy including these metals and method for removing fine particles made of copper, zinc or an alloy including these metals | |
| CN110408481A (en) | A kind of clothing stain removal agent and its preparation process | |
| CN110951546A (en) | Neutral cleaning agent for electronic industry |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211102 |
|
| RJ01 | Rejection of invention patent application after publication |