CN113580715A - Manufacturing method of mica plate with blind holes - Google Patents
Manufacturing method of mica plate with blind holes Download PDFInfo
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- CN113580715A CN113580715A CN202110753917.9A CN202110753917A CN113580715A CN 113580715 A CN113580715 A CN 113580715A CN 202110753917 A CN202110753917 A CN 202110753917A CN 113580715 A CN113580715 A CN 113580715A
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- mica
- mica plate
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- raw material
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- 239000010445 mica Substances 0.000 title claims abstract description 140
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 140
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000007731 hot pressing Methods 0.000 claims description 34
- 239000002994 raw material Substances 0.000 claims description 23
- 238000003754 machining Methods 0.000 claims description 13
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000003892 spreading Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 description 6
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
- B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
- B31D1/0075—Multiple-step processes for making flat articles ; Making flat articles by assembling, e.g. by laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31F5/00—Attaching together sheets, strips or webs; Reinforcing edges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/30—Multi-ply
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/658—Means for temperature control structurally associated with the cells by thermal insulation or shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the field of mica material processing, and provides a manufacturing method of a mica plate with blind holes. The method is simple and reliable, is suitable for batch production, and can effectively meet market requirements.
Description
Technical Field
The invention relates to the field of mica material processing, in particular to a method for manufacturing a mica plate with blind holes.
Background
At present, a core component of a new energy electric automobile developed in China is a lithium battery pack, a lithium battery can emit a large amount of heat in the working process, and can generate high temperature under extreme conditions to cause potential safety hazards to vehicles and people, so that a mica plate taking mica as a material is often assembled on the surface of the lithium battery. The mica plate is mainly characterized by super high temperature resistance and excellent insulating property. The electric automobile can generate high temperature when working abnormally, and the mica plate can effectively prevent the high temperature from directly acting on a cab and a rear seat of the automobile, so that the sufficient escape time is provided for people in the automobile. At present, the manufacturing industry of mica plates rarely relates to the mica plate with blind holes, and the processing and manufacturing methods are rare, so that the mica plate with the novel structure needs to be researched to meet the changing requirements of the new energy electric automobile market.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a method for manufacturing a mica plate with blind holes, which is simple and reliable and can effectively meet the production requirements of the market.
The purpose of the invention is realized by the following technical scheme.
A manufacturing method of a mica plate with blind holes comprises the following steps:
(1) cutting a large mica paper raw material into a plurality of small-sized mica papers according to the size requirement according to the length and width of the appearance of a mica plate product, and then stacking the mica papers according to the thickness requirement of the mica plate product to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material are determined according to the specification of a finished product;
(2) the first mica paper raw material and the second mica paper raw material are hot-pressed through a hot press, the hot-pressing temperature is set to be between 100 ℃ and 300 ℃, the pressure is set to be between 0MPa and 40MPa, the hot-pressing time is set to be between 0.1 hour and 20 hours, a first mica plate and a second mica plate are formed after the hot pressing is completed, the first mica plate and the second mica plate are plate-shaped structures with certain thicknesses, and the thickness of the second mica plate is equal to the depth of the blind hole;
(3) machining the second mica plate, manufacturing a through hole by machining according to the shape and the size and the position requirements of the blind hole of the mica plate product, wherein the front projection shape and the position requirements of the through hole are the same as those of the blind hole, and forming a third mica plate with the through hole after machining is finished;
(4) stacking the first mica plate and the third mica plate according to the size requirement of the mica plate product, putting the first mica plate and the third mica plate into a hot press for hot pressing, wherein the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, and the hot pressing time is set to be between 0.1 and 20 hours, and the first mica plate and the third mica plate are hot pressed to form a whole plate, namely the fourth mica plate with the blind holes is obtained;
(5) and processing the appearance of the fourth mica plate to obtain the required mica plate product with the blind holes.
In the above technical solution, the second mica plate machine is processed to make the through hole by means of punching, laser cutting, or milling, but not limited to these methods (even non-machining means such as chemical etching may be used).
In the above technical scheme, during the hot pressing in the step (4), the hot press may process one fourth mica plate in one lamination, or process a plurality of fourth mica plates in a tiled manner, and the hot press may use one lamination at a time, or use a plurality of laminations at a time.
In the above technical scheme, during the hot pressing in the step (4), the support is inserted into the through hole of the third mica plate for hot pressing, and the support is removed after the hot pressing is completed.
The manufacturing method of the mica plate with the blind holes combines one mica plate with another mica plate with the through holes and prepares the mica plate with the blind holes through hot pressing. The method is simple and reliable, is suitable for batch production, and can effectively meet market requirements.
Drawings
FIG. 1 is a schematic structural diagram of a mica board product with blind holes.
FIG. 2 is a flow chart of the method of the present invention.
Fig. 3 is a schematic diagram of the first mica paper raw material and the second mica paper raw material being hot-pressed to form the first mica board and the second mica board.
FIG. 4 is a schematic view of the second mica board being processed to form a third mica board.
FIG. 5 is a schematic view of the first mica board and the third mica board combined to form a fourth mica board.
FIG. 6 is a schematic view of a fourth mica board being processed to form a mica board product.
Wherein: 1-a first blind hole, 2-a second blind hole, and 3-a third blind hole.
Detailed Description
The present invention will be described in detail with reference to specific examples, but the present invention is not limited to these examples.
Referring to fig. 1, an example of a structure of a mica board product with blind holes is shown, which includes three different types of blind holes, and the manufacturing method provided by the method of the present invention relates to three types of blind hole shapes, including but not limited to blind holes with any geometric shapes. The thickness of the mica plate product is between 0.2 and 30mm, and the depth of the blind hole is between 0.1 and 29.9 mm.
Examples
As shown in fig. 2, the present embodiment provides a method for manufacturing a mica board with blind holes, which includes the following steps:
(1) according to the length and width of the appearance of a mica plate product, a large piece of mica paper raw material (the mica paper contains glue which is dried, and the thickness of the mica paper is between 0.01mm and 0.15 mm) is cut into a plurality of small-sized mica paper according to the size requirement, and the size needs to be kept with a proper allowance, so that the appearance can be conveniently cut by a rear machine. Then, according to the thickness requirement of the mica plate product, a plurality of mica paper are stacked to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material can be the same or different, and are specifically determined according to the specification of the mica plate product.
(2) The first mica paper raw material and the second mica paper raw material are hot-pressed by a hot press, the hot-pressing temperature is set between 100 ℃ and 300 ℃, the pressure is set between 0MPa and 40MPa, the hot-pressing time is set between 0.1 hour and 20 hours (the hot-pressing time is influenced by the hot-pressing product quantity, the strength of the mica plates and other performance requirements), the first mica plate and the second mica plate are formed after the hot pressing is finished, and a plate-shaped structure with a certain thickness is formed, as shown in fig. 3. Wherein the thickness of the second mica plate is equal to the depth of the blind hole.
(3) And machining the second mica plate, and manufacturing a through hole by a machining method according to the shape and the size and the position of the blind hole of the finished mica plate, wherein the front projection shape and the position of the through hole are the same as those of the blind hole. The second mica plate machining method for making the through holes includes but is not limited to stamping, laser cutting, milling, carving and the like (even non-machining methods such as chemical etching can be used). After the machining is completed, a third mica board with through holes is formed, as shown in fig. 4.
(4) The first mica plate and the third mica plate are stacked together according to the size requirement of the mica plate product, and are put into a hot press for hot pressing, the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, the hot pressing time is set to be between 0.1 and 20 hours, the first mica plate and the third mica plate are hot pressed together to form a whole plate, namely a fourth mica plate, and the fourth mica plate has the shape of blind holes, as shown in figure 5. It should be noted that, during hot pressing, the hot press may process one fourth mica plate in one lamination, or may process a plurality of fourth mica plates in a tiled manner, and the hot press may use one lamination or a plurality of laminations at a time. In addition, the blind holes may bulge due to lack of support during hot pressing, so that supports with matched shapes can be plugged into the through holes of the third mica plate for hot pressing, bulging can be avoided, and the supports can be removed after the hot pressing is finished.
(5) Because the length and width of the appearance of the fourth mica plate after hot pressing is greater than the length and width of the finished product, the appearance of the fourth mica plate needs to be processed. The fourth mica plate is processed by machining (including but not limited to punching, laser cutting, milling, and the like) or other processing methods, so as to obtain the mica plate product with the required design, as shown in fig. 6.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the scope of the present invention is not limited thereto, and all equivalent variations made according to the spirit of the present invention should be covered within the scope of the present invention.
Details not described in this specification are within the skill of the art that are well known to those skilled in the art.
Claims (4)
1. A manufacturing method of a mica plate with blind holes is characterized by comprising the following steps:
(1) cutting a large mica paper raw material into a plurality of small-sized mica papers according to the size requirement according to the length and width of the appearance of a mica plate product, and then stacking the mica papers according to the thickness requirement of the mica plate product to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material are determined according to the specification of a finished product;
(2) the first mica paper raw material and the second mica paper raw material are hot-pressed through a hot press, the hot-pressing temperature is set to be between 100 ℃ and 300 ℃, the pressure is set to be between 0MPa and 40MPa, the hot-pressing time is set to be between 0.1 hour and 20 hours, a first mica plate and a second mica plate are formed after the hot pressing is completed, the first mica plate and the second mica plate are plate-shaped structures with certain thicknesses, and the thickness of the second mica plate is equal to the depth of the blind hole;
(3) machining the second mica plate, manufacturing a through hole by machining according to the shape and the size and the position requirements of the blind hole of the mica plate product, wherein the front projection shape and the position requirements of the through hole are the same as those of the blind hole, and forming a third mica plate with the through hole after machining is finished;
(4) stacking the first mica plate and the third mica plate according to the size requirement of the mica plate product, putting the first mica plate and the third mica plate into a hot press for hot pressing, wherein the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, and the hot pressing time is set to be between 0.1 and 20 hours, and the first mica plate and the third mica plate are hot pressed to form a whole plate, namely the fourth mica plate with the blind holes is obtained;
(5) and processing the appearance of the fourth mica plate to obtain the required mica plate product with the blind holes.
2. The method for manufacturing a mica board with blind holes according to claim 1, wherein: the second mica plate machine process through-hole mode includes punching, laser cutting, or milling machine carving.
3. The method for manufacturing a mica board with blind holes according to claim 1, wherein: and (4) when hot pressing is carried out in the step (4), the hot press processes a fourth mica plate on a laminated layer, or processes a plurality of fourth mica plates in a flat spreading mode.
4. The method for manufacturing a mica board with blind holes according to claim 1, wherein: and (4) during hot pressing in the step (4), filling the support into the through hole of the third mica plate for hot pressing, and removing the support after the hot pressing is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110753917.9A CN113580715A (en) | 2021-07-04 | 2021-07-04 | Manufacturing method of mica plate with blind holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110753917.9A CN113580715A (en) | 2021-07-04 | 2021-07-04 | Manufacturing method of mica plate with blind holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113580715A true CN113580715A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110753917.9A Pending CN113580715A (en) | 2021-07-04 | 2021-07-04 | Manufacturing method of mica plate with blind holes |
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| CN (1) | CN113580715A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203103362U (en) * | 2013-03-07 | 2013-07-31 | 上海电气钠硫储能技术有限公司 | Sodium-sulfur cell protecting jacket |
| CN103231558A (en) * | 2013-05-02 | 2013-08-07 | 江苏亚电新材料有限公司 | Production process of moisture-resistant high-temperature-resistant mica plate |
| CN106358386A (en) * | 2016-10-10 | 2017-01-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of blind hole of backboard plugin |
| CN108520925A (en) * | 2018-04-16 | 2018-09-11 | 合肥国轩高科动力能源有限公司 | A kind of high life power battery pack and power battery pack |
| CN209324504U (en) * | 2018-12-11 | 2019-08-30 | 天津中腐科技发展有限公司 | A kind of turbocharger anti-corrosion structure gasket |
| CN112165742A (en) * | 2020-09-14 | 2021-01-01 | 湖北平安电工股份有限公司 | Mica heating film and manufacturing method thereof |
| CN112701393A (en) * | 2020-12-29 | 2021-04-23 | 长城汽车股份有限公司 | Battery module and have its vehicle |
| CN213280133U (en) * | 2020-09-18 | 2021-05-25 | 湖北平安电工股份有限公司 | Mica heating film |
-
2021
- 2021-07-04 CN CN202110753917.9A patent/CN113580715A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203103362U (en) * | 2013-03-07 | 2013-07-31 | 上海电气钠硫储能技术有限公司 | Sodium-sulfur cell protecting jacket |
| CN103231558A (en) * | 2013-05-02 | 2013-08-07 | 江苏亚电新材料有限公司 | Production process of moisture-resistant high-temperature-resistant mica plate |
| CN106358386A (en) * | 2016-10-10 | 2017-01-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of blind hole of backboard plugin |
| CN108520925A (en) * | 2018-04-16 | 2018-09-11 | 合肥国轩高科动力能源有限公司 | A kind of high life power battery pack and power battery pack |
| CN209324504U (en) * | 2018-12-11 | 2019-08-30 | 天津中腐科技发展有限公司 | A kind of turbocharger anti-corrosion structure gasket |
| CN112165742A (en) * | 2020-09-14 | 2021-01-01 | 湖北平安电工股份有限公司 | Mica heating film and manufacturing method thereof |
| CN213280133U (en) * | 2020-09-18 | 2021-05-25 | 湖北平安电工股份有限公司 | Mica heating film |
| CN112701393A (en) * | 2020-12-29 | 2021-04-23 | 长城汽车股份有限公司 | Battery module and have its vehicle |
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Application publication date: 20211102 |
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