CN113619249A - Manufacturing method of mica plate with blind holes - Google Patents
Manufacturing method of mica plate with blind holes Download PDFInfo
- Publication number
- CN113619249A CN113619249A CN202110753918.3A CN202110753918A CN113619249A CN 113619249 A CN113619249 A CN 113619249A CN 202110753918 A CN202110753918 A CN 202110753918A CN 113619249 A CN113619249 A CN 113619249A
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- CN
- China
- Prior art keywords
- mica
- raw material
- paper raw
- mica paper
- hot pressing
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Links
- 239000010445 mica Substances 0.000 title claims abstract description 117
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 117
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000002994 raw material Substances 0.000 claims description 46
- 238000007731 hot pressing Methods 0.000 claims description 23
- 238000003754 machining Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000003698 laser cutting Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000003892 spreading Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 description 6
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 238000003672 processing method Methods 0.000 description 2
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
- B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
- B31D1/0075—Multiple-step processes for making flat articles ; Making flat articles by assembling, e.g. by laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31F—MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31F5/00—Attaching together sheets, strips or webs; Reinforcing edges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/30—Multi-ply
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/658—Means for temperature control structurally associated with the cells by thermal insulation or shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The invention relates to the field of mica material processing, and provides a manufacturing method of a mica plate with blind holes. The method is simple and reliable, is suitable for batch production, and can effectively meet market requirements.
Description
Technical Field
The invention relates to the field of mica material processing, in particular to a method for manufacturing a mica plate with blind holes.
Background
At present, a core component of a new energy electric automobile developed in China is a lithium battery pack, a lithium battery can emit a large amount of heat in the working process, and can generate high temperature under extreme conditions to cause potential safety hazards to vehicles and people, so that a mica plate taking mica as a material is often assembled on the surface of the lithium battery. The mica plate is mainly characterized by super high temperature resistance and excellent insulating property. The electric automobile can generate high temperature when working abnormally, and the mica plate can effectively prevent the high temperature from directly acting on a cab and a rear seat of the automobile, so that the sufficient escape time is provided for people in the automobile. At present, the manufacturing industry of mica plates rarely relates to the mica plate with blind holes, and the processing and manufacturing methods are rare, so that the mica plate with the novel structure needs to be researched to meet the changing requirements of the new energy electric automobile market.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a method for manufacturing a mica plate with blind holes, which is simple and reliable and can effectively meet the production requirements of the market.
The purpose of the invention is realized by the following technical scheme.
The manufacturing method of the mica plate with the blind holes comprises the following steps:
(1) cutting a large mica paper raw material into a plurality of small-sized mica papers according to the size requirement according to the length and width of the appearance of a mica plate product, and then stacking the mica papers according to the thickness requirement of the mica plate product to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material are determined according to the specification of a finished product;
(2) machining the second mica paper raw material, manufacturing a through hole by machining according to the shape and the size of the blind hole of the mica plate product and the position requirement, wherein the front projection shape and the position requirement of the through hole are the same as those of the blind hole, and forming a third mica paper raw material with the through hole after the machining is finished;
(3) stacking the first mica paper raw material and the third mica paper raw material according to the size requirement of a mica plate product, putting the mica paper raw material and the third mica paper raw material into a hot press for hot pressing, wherein the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, and the hot pressing time is set to be between 0.1 and 20 hours, and the first mica paper raw material and the third mica paper raw material are hot pressed to form a whole plate, so that the first mica plate with blind holes is obtained;
(4) and processing the appearance of the first mica plate to obtain the required mica plate product with the blind holes.
In the above technical solution, the manner of processing the through hole by the second mica paper raw material includes, but is not limited to, cutting with a knife die, punching, laser cutting, and the like.
In the above technical scheme, during the hot pressing in step (3), the hot press may process a first mica plate in one lamination, or process a plurality of first mica plates in a tiled manner, and the hot press may use one lamination at a time, or use a plurality of laminations at a time.
In the technical scheme, when hot pressing is carried out in the step (3), the support is plugged into the through hole of the third mica paper raw material for hot pressing, and the support is removed after the hot pressing is finished.
The manufacturing method of the mica plate with the blind holes, disclosed by the invention, is characterized in that one pile of mica paper and the other pile of mica paper with the through holes are combined together and are subjected to hot pressing to prepare the mica plate with the blind holes. The method is simple and reliable, is suitable for batch production, and can effectively meet market requirements.
Drawings
FIG. 1 is a schematic structural diagram of a mica board product with blind holes.
FIG. 2 is a flow chart of the method of the present invention.
Fig. 3 is a schematic illustration of the processing of a second mica paper raw material to form a third mica paper raw material.
Fig. 4 is a schematic view of a first mica paper raw material and a third mica paper raw material hot-pressed to form a first mica board.
FIG. 5 is a schematic view of a first mica board being processed to form a mica board product.
Wherein: 1-a first blind hole, 2-a second blind hole, and 3-a third blind hole.
Detailed Description
The present invention will be described in detail with reference to specific examples, but the present invention is not limited to these examples.
Referring to fig. 1, an example of a structure of a mica board product with blind holes is shown, which includes three different types of blind holes, and the manufacturing method provided by the method of the present invention relates to three types of blind hole shapes, including but not limited to blind holes with any geometric shapes. The thickness of the mica plate product is between 0.2 and 30mm, and the depth of the blind hole is between 0.1 and 29.9 mm.
Examples
As shown in fig. 2, the present embodiment provides a method for manufacturing a mica board with blind holes, which includes the following steps:
(1) according to the length and width of the appearance of a mica plate product, a large piece of mica paper raw material (the mica paper contains glue which is dried, and the thickness of the mica paper is between 0.01mm and 0.15 mm) is cut into a plurality of small-sized mica paper according to the size requirement, and the size needs to be kept with a proper allowance, so that the appearance can be conveniently cut by a rear machine. Then, according to the thickness requirement of the mica plate product, a plurality of mica paper are stacked to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material can be the same or different, and are specifically determined according to the specification of the mica plate product.
(2) And machining the second mica paper raw material, and manufacturing a through hole by a machining method according to the shape and the size and the position requirements of the blind hole of the finished mica plate, wherein the front projection shape and the position requirements of the through hole are the same as those of the blind hole. The second mica paper stock is processed to make through holes by means of cutting die punching, stamping, laser cutting and the like, but is not limited to these means. After the machining is completed, a third mica board raw material with through holes is formed, as shown in fig. 3.
(3) The first mica paper raw material and the third mica paper raw material are stacked together according to the size requirement of the mica board product, and are put into a hot press for hot pressing, the hot pressing temperature is set between 100 ℃ and 300 ℃, the pressure is set between 0 and 40MPa, the hot pressing time is set between 0.1 hour and 20 hours, the first mica paper raw material and the third mica paper raw material are hot pressed together to form a whole board, namely a first mica board, and the first mica board has the shape of blind holes, as shown in figure 4. It should be noted that, during hot pressing, the hot press may process a first mica plate in one lamination, or may process a plurality of first mica plates in a tiled manner, and the hot press may use one lamination or may use a plurality of laminations at a time. In addition, because the blind holes are lack of supports during hot pressing, the blind holes in the mica paper can be deformed and bulge badly, so that supports with matched shapes can be stuffed in the through holes of the third mica paper raw material for hot pressing together, the deformation and bulge badly can be avoided, and the supports are removed after the hot pressing is finished.
(4) Because the length and width of the first mica plate after hot pressing is greater than the length and width of the finished product, the shape of the first mica plate needs to be processed. The first mica plate is processed by machining (including but not limited to punching, laser cutting, milling, and the like) or other processing methods, so as to obtain a mica plate product with a desired design, as shown in fig. 5.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the scope of the present invention is not limited thereto, and all equivalent variations made according to the spirit of the present invention should be covered within the scope of the present invention.
Details not described in this specification are within the skill of the art that are well known to those skilled in the art.
Claims (4)
1. The manufacturing method of the mica plate with the blind holes is characterized by comprising the following steps:
(1) cutting a large mica paper raw material into a plurality of small-sized mica papers according to the size requirement according to the length and width of the appearance of a mica plate product, and then stacking the mica papers according to the thickness requirement of the mica plate product to form a first mica paper raw material and a second mica paper raw material, wherein the thicknesses of the first mica paper raw material and the second mica paper raw material are determined according to the specification of a finished product;
(2) machining the second mica paper raw material, manufacturing a through hole by machining according to the shape and the size of the blind hole of the mica plate product and the position requirement, wherein the front projection shape and the position requirement of the through hole are the same as those of the blind hole, and forming a third mica paper raw material with the through hole after the machining is finished;
(3) stacking the first mica paper raw material and the third mica paper raw material according to the size requirement of a mica plate product, putting the mica paper raw material and the third mica paper raw material into a hot press for hot pressing, wherein the hot pressing temperature is set to be between 100 and 300 ℃, the pressure is set to be between 0 and 40MPa, and the hot pressing time is set to be between 0.1 and 20 hours, and the first mica paper raw material and the third mica paper raw material are hot pressed to form a whole plate, so that the first mica plate with blind holes is obtained;
(4) and processing the appearance of the first mica plate to obtain the required mica plate product with the blind holes.
2. The method for manufacturing a mica board with blind holes according to claim 1, wherein: the mode of processing the through hole by the second mica paper raw material machine comprises cutting die punching, stamping or laser cutting.
3. The method for manufacturing a mica board with blind holes according to claim 1, wherein: and (4) when hot pressing is carried out in the step (3), processing a first mica plate by the hot press in a laminated layer, or processing a plurality of first mica plates in a flat spreading mode.
4. The method for manufacturing a mica board with blind holes according to claim 1, wherein: and (4) during hot pressing in the step (3), filling a support into the through holes of the third mica paper raw material, and hot pressing together, and removing the support after the hot pressing is finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110753918.3A CN113619249A (en) | 2021-07-04 | 2021-07-04 | Manufacturing method of mica plate with blind holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110753918.3A CN113619249A (en) | 2021-07-04 | 2021-07-04 | Manufacturing method of mica plate with blind holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113619249A true CN113619249A (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110753918.3A Pending CN113619249A (en) | 2021-07-04 | 2021-07-04 | Manufacturing method of mica plate with blind holes |
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| Country | Link |
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| CN (1) | CN113619249A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969097A (en) * | 2012-12-04 | 2013-03-13 | 湖北平安电工材料有限公司 | Manufacturing method of mica plate |
| CN203103362U (en) * | 2013-03-07 | 2013-07-31 | 上海电气钠硫储能技术有限公司 | Sodium-sulfur cell protecting jacket |
| CN103231558A (en) * | 2013-05-02 | 2013-08-07 | 江苏亚电新材料有限公司 | Production process of moisture-resistant high-temperature-resistant mica plate |
| CN106358386A (en) * | 2016-10-10 | 2017-01-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of blind hole of backboard plugin |
| CN209324504U (en) * | 2018-12-11 | 2019-08-30 | 天津中腐科技发展有限公司 | A kind of turbocharger anti-corrosion structure gasket |
| CN112701393A (en) * | 2020-12-29 | 2021-04-23 | 长城汽车股份有限公司 | Battery module and have its vehicle |
-
2021
- 2021-07-04 CN CN202110753918.3A patent/CN113619249A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102969097A (en) * | 2012-12-04 | 2013-03-13 | 湖北平安电工材料有限公司 | Manufacturing method of mica plate |
| CN203103362U (en) * | 2013-03-07 | 2013-07-31 | 上海电气钠硫储能技术有限公司 | Sodium-sulfur cell protecting jacket |
| CN103231558A (en) * | 2013-05-02 | 2013-08-07 | 江苏亚电新材料有限公司 | Production process of moisture-resistant high-temperature-resistant mica plate |
| CN106358386A (en) * | 2016-10-10 | 2017-01-25 | 深圳崇达多层线路板有限公司 | Manufacturing method of blind hole of backboard plugin |
| CN209324504U (en) * | 2018-12-11 | 2019-08-30 | 天津中腐科技发展有限公司 | A kind of turbocharger anti-corrosion structure gasket |
| CN112701393A (en) * | 2020-12-29 | 2021-04-23 | 长城汽车股份有限公司 | Battery module and have its vehicle |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20211109 |