CN205232600U - Bock press special mould in high density laminated board production technology - Google Patents
Bock press special mould in high density laminated board production technology Download PDFInfo
- Publication number
- CN205232600U CN205232600U CN201520880913.7U CN201520880913U CN205232600U CN 205232600 U CN205232600 U CN 205232600U CN 201520880913 U CN201520880913 U CN 201520880913U CN 205232600 U CN205232600 U CN 205232600U
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- bock
- production technology
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- board production
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Abstract
The utility model relates to a bock press special mould in high density laminated board production technology, including bottom plate, dog and positioning die, square groove is made to the bottom plate up end, installs a dog on the bottom plate of square groove four corners department respectively, and the crimping is at the recessed wall of homonymy respectively for flange outer fringe that this dog extends to both sides, and the contained angle internalization that forms between these two flanges inlays the dress positioning die. The utility model discloses in, the width of the gulde edge of positioning die both sides can be adjusted, confirms according to the size of core, can place the not core of equidimension from this, then carry out the pressfitting after covering the steel sheet, has solved among the prior art pressfitting that the press used pin positioning can only process the circuit board that has pinhole and specific size, also need not to pull down the pin behind the pressfitting, has not only improved production efficiency, has increased operating personnel's safety in addition, operates very portably.
Description
Technical field
The utility model belongs to the mould applications of Bock press compacting multilayer circuit board, the Bock press particular manufacturing craft in especially a kind of high-density lamination board production technology.
Background technology
Bock press can be used in high-density lamination board production technology, aligning accuracy between multilayer circuit board during compacting requires very high, so need when lamination to use pin, make the contraposition of each layer central layer consistent, therefore the central layer used during compacting, steel plate, Copper Foil, brown paper all need to punch, and the pcb board that Bock is processed has certain limitation.At present, the Bock press steel plate that here uses is of a size of 24*21,24*18,21*16, and the central layer of other size cannot be processed on this Bock press.Technique when existing Bock press uses is: according to product quantity and setting requirement, select the pin of different length, insert in the pin hole of base plate, corresponding steel plate is selected to carry out lamination in the size by pcb board size, also the central layer of having joined cover is needed to overlap pin one by one in lamination process, carry out a whole set of pressing, although the method processes high multi-layered product (>=10 layers) can meet contraposition requirement, and interlayer alignment precision is high, if but process common multi-layer sheet, operation just shows slightly loaded down with trivial details, the pin that will put also is needed after pressing, use is unloaded pin machine and is swept away, also there is certain danger in its operating process, and be subject to the impact of size, there is serious limitation.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides easy to use, ensures the Bock press particular manufacturing craft that stacks in a kind of high-density lamination board production technology of rear compacting precision.
The technical scheme that the utility model is taked is:
Bock press particular manufacturing craft in a kind of high-density lamination board production technology, it is characterized in that: comprise base plate, block and jig, square groove is made in base plate upper surface, the base plate at square groove corner place installs a block respectively, the rib outer rim that this block extends to both sides is crimped on the groove inner wall of homonymy respectively, jig described in movable setting-in in the angle formed between these two ribs; Described groove is for holding the multiple central layer and steel plate topmost that stack successively, and described central layer is placed by described jig location, and described steel plate is placed on the central layer under it by described block location.
And each block is fixed by the bolt that it is installed.
And handle portion is made in described base plate both sides.
And the width of the ambilateral gulde edge of positioning module is determined according to the size of central layer.
Advantage of the present utility model and good effect are:
In the utility model, the groove that base plate is made is for holding the multiple central layer and steel plate topmost that stack successively, each central layer is placed by the jig location of movable setting-in in block, each steel plate is placed on the central layer under it by block location, the width of the ambilateral gulde edge of positioning module can adjust, size according to central layer is determined, the central layer of different size can be placed thus, then pressing is carried out after covering steel plate, solving press in prior art uses pin location can only process the pressing of the circuit board with pin-and-hole and specific dimensions, also without the need to pulling down pin after pressing, not only increase production efficiency, and add the safety of operating personnel, operate very easy.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model places a central layer;
Fig. 2 is that the A-A of Fig. 1 is to sectional view;
Fig. 3 is the I portion enlarged drawing of Fig. 2;
Fig. 4 is the schematic diagram after Fig. 1 places central layer and steel plate;
Fig. 5 is that the B-B of Fig. 4 is to sectional view;
Fig. 6 is the II portion enlarged drawing of Fig. 5.
Embodiment
Below in conjunction with embodiment, further illustrate the utility model, following embodiment is illustrative, is not determinate, can not limit protection range of the present utility model with following embodiment.
Bock press particular manufacturing craft in a kind of high-density lamination board production technology, as shown in figs. 1 to 6, innovation of the present utility model is: comprise base plate 6, block 2 and jig 3, square groove 10 is made in base plate upper surface, the base plate at square groove corner place installs a block respectively, rib 8 outer rim that this block extends to both sides is crimped on the groove inner wall 5 of homonymy respectively, jig described in movable setting-in in the angle formed between these two ribs; Described groove is for holding the multiple central layers 7 and steel plate 11 topmost that stack successively, and described central layer is placed by described jig location, and described steel plate is placed on the central layer under it by described block location.
In the present embodiment, each block is fixed by the bolt 4 that it is installed.Handle portion 1 is made in described base plate both sides.The width of the ambilateral gulde edge 9 of positioning module is determined according to the size of central layer.
When the utility model uses:
1. the jig of suitable size is chosen according to the size of central layer, size refers to length and the width of central layer, and jig two gulde edges width select according to be four jigs all central layers can be made stable be placed in groove, but be free to after new edition has stacked take out;
2 angles jig being placed on block, after stacking multi-layer coreboard, take out jig, central layer topmost place steel plate, makes steel plate be positioned in four blocks;
3. start press pressing;
4. after completing, finished product good for lamination is taken out;
5. repeat step (2) ~ (4), complete the pressing of all circuit boards.
In the utility model, the groove that base plate is made is for holding the multiple central layer and steel plate topmost that stack successively, each central layer is placed by the jig location of movable setting-in in block, each steel plate is placed on the central layer under it by block location, the width of the ambilateral gulde edge of positioning module can adjust, size according to central layer is determined, the central layer of different size can be placed thus, then pressing is carried out after covering steel plate, solving press in prior art uses pin location can only process the pressing of the circuit board with pin-and-hole and specific dimensions, also without the need to pulling down pin after pressing, not only increase production efficiency, and add the safety of operating personnel, operate very easy.
Claims (4)
1. the Bock press particular manufacturing craft in a high-density lamination board production technology, it is characterized in that: comprise base plate, block and jig, square groove is made in base plate upper surface, the base plate at square groove corner place installs a block respectively, the rib outer rim that this block extends to both sides is crimped on the groove inner wall of homonymy respectively, jig described in movable setting-in in the angle formed between these two ribs; Described groove is for holding the multiple central layer and steel plate topmost that stack successively, and described central layer is placed by described jig location, and described steel plate is placed on the central layer under it by described block location.
2. the Bock press particular manufacturing craft in a kind of high-density lamination board production technology according to claim 1, is characterized in that: each block is fixed by the bolt that it is installed.
3. the Bock press particular manufacturing craft in a kind of high-density lamination board production technology according to claim 1 and 2, is characterized in that: handle portion is made in described base plate both sides.
4. the Bock press particular manufacturing craft in a kind of high-density lamination board production technology according to claim 3, is characterized in that: the width of the ambilateral gulde edge of positioning module is determined according to the size of central layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520880913.7U CN205232600U (en) | 2015-11-06 | 2015-11-06 | Bock press special mould in high density laminated board production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520880913.7U CN205232600U (en) | 2015-11-06 | 2015-11-06 | Bock press special mould in high density laminated board production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205232600U true CN205232600U (en) | 2016-05-11 |
Family
ID=55907637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520880913.7U Expired - Fee Related CN205232600U (en) | 2015-11-06 | 2015-11-06 | Bock press special mould in high density laminated board production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205232600U (en) |
-
2015
- 2015-11-06 CN CN201520880913.7U patent/CN205232600U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20171106 |