CN1135794A - 不用手持的表面安装电子电路诊断测试的点测头 - Google Patents

不用手持的表面安装电子电路诊断测试的点测头 Download PDF

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CN1135794A
CN1135794A CN95190898A CN95190898A CN1135794A CN 1135794 A CN1135794 A CN 1135794A CN 95190898 A CN95190898 A CN 95190898A CN 95190898 A CN95190898 A CN 95190898A CN 1135794 A CN1135794 A CN 1135794A
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安德鲁·塔尔博特
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • H05K3/4015Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Investigating Or Analysing Biological Materials (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Eye Examination Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本发明涉及一种不用手持来进行电子电路诊断的点测头。本发明的点测头的特征在于,它包括具有两个平面的主体,所述两个平面是至少一基本平行的端面,彼此分开且朝向相反的方向,所述端面通过和至少一个端面呈电接触的腰部彼此相连。

Description

不用手持的表面安装电子电路诊 断测试的点测头
本发明涉及一种不用手持的表面安装电子电路诊断测试的点测头。印刷电路板(PCB)以及其它的电子电路需要测试和调整。为了便于这种测试,已知当测试和调整测试设备时使用不需测试工程师手持的点测头。这种点测头可以使测试工程师固定钩形测针和记录结果而不必握持用于测试的测针。
现在用于这一目的的点测头呈环状,它通过被测PCB上的一个或两个铜焊盘被焊到PCB上。一般来说,环形点测头需要一个穿过PCB的孔(孔可被镀以金属),并在PCB的下侧必须至少有一个焊盘,这将在PCB下侧占用空间,这对表面安装技术来说是不必要的。如果被测试的信号在板的上侧,则需要在PCB的上下两侧具有和电镀通孔相连的焊盘。这种环形的点测头必须用手装配并经常是手焊的,因而成本高并难于对齐。
本发明的目的在于消除上述问题。为达此目的,本发明的点测头的特征在于,它包括具有两个平面的、面向相反方向并被分开的至少基本上平行的端面的主体,所述端面通过腰部彼此连接,所述腰部至少和一个端面呈电接触。腰部直径小于端部直径:选择腰部直径使其能装入普通测头的钩中。主体最好是对称的,并用一件导电金属例如黄铜或铜制成,端面的直径比主体的高度大一些。这使得这种点测头适用于标准型的表面安装器件(SMD)机中。在这种情况下,点测头被放在标准型的表面安装器件(SMD)带中。这种点测头的最佳实施例在所附权利要求2至12中披露了。本发明涉及一种具有本发明的点测头的表面安装器件(SMD)带。
本发明的表面安装点测头的最主要的优点在于,它非常容易地被安装在印刷电路板上,并适合于用机器安装在已涂于点测头焊盘上的焊膏中并可在回流炉中焊接。大约10平方毫米的铜表面足以用作点测头的安装基底。点测头可用标准的8mm宽的表面安装器件带供应并因而可被采用卷盘安装。按照本发明的点测头的扁平端面可使点测头用标准的真空喷嘴吸起。当端部的直径大于端部之间的距离时,点测头是稳定的,并保持直立位置,这使得更可靠地安装。对称的点测头是最好的,因为对称可使点测头不用手操作便可容易地安置在带上并被置于PCB上。
下面将参照附图说明本发明的最佳实施例,其中:
图1是从侧面看的通常使用的安装在印刷电路板上的环形的点测头,
图2是从上方看的图1中的点测头,
图3是从侧面看的本发明的点测头,
图4是图3的沿线IV-IV的截面图,以及
图5和图6是表面安装器件带,在其袋中放着图3所示的点测头。
图1表示公知的环形点测头。环1由具有半圆形截面的铜线制成,从而使线的端部容易地放入印刷电路板(PCB)3的小孔2中,使线的扁平侧彼此相对。孔2可以是镀以金属的通孔。如果使用测头5测量的信号在PCB的下方,则在PCB3的下侧需要铜焊盘4。如果被测信号在PCB的上侧,则还需要另一个铜焊盘6。测头5的钩7夹住环1。图1中的箭头表示测头5可通过180°角与环接触。
图2所示为从上方看的环形点测头。为简化起见,在此图中未示出测头5。
这种公知的环形点测头的问题已在上面讨论过了。
图3和图4表示本发明的表面安装点测头。点测头由呈线轴状的主体10构成,它具有两个截头锥体部20和30,每个分别具有平的端面40和50。端面40,50彼此平行或接近平行。在锥体部20,30之间有一腰部60。图3和图4所示的点测头对于平面S-S对称,平面S-S平行于端面40,50并离开各端面的距离相等。点测头10被固定在PCB3的铜表面上。边长/直径为3mm的方的或圆的铜焊盘便足以使点测头牢固地焊在PCB上。甚至更小的表面也是足够用于安装的。端面40的直径D最好为2至4mm。端面40和50之间的距离L接近2mm。距离L最好为直径D的0.5到0.8倍,以便保持点测头10当放在PCB上的焊膏中时以及在承载带中稳定且定向正确。腰部直径大约为1mm。
如图3可见,截头锥体部的斜面相对于端面40,50的角度α约为20°。角α在0和40°之间较好,在10和30°之间最好。当点测头的端部呈锥形时,点测头比α很小时具有较好的刚性。端面和腰部之间的倒角倒圆(fillet radius)也是允许的。当点测头10具有图3所示的几何形状时,测头5可以0到大约30°角连接到点测头上。测头5可绕点测头10转动360°。
图4是沿图3的线IV-IV取的点测头的截面图。如图所示,腰部60具有圆的截面。
表面安装点测头可由一块实心黄铜制成。它最好镀以锡/金或某种材料,以保持其可焊寿命并阻止氧化产生。
图5和图6分别表示标准的8mm宽的表面安装器件(SMD)带的俯视图和侧视图,它具有用于电子元件例如电阻、二极管和电容的袋100。标号200表示带驱动孔。在图5和图6中,袋内装有固定于其端面上的表面安装点测头10,从而为SMD放置机的真空喷嘴提供按照本发明的扁平端面。按照本发明的点测头可以被圈轴固定(reel mounted),使其可由SMD机放置。
上面只是以举例的方式对本发明进行了说明,因此必须指出,本发明可以在权利要求的范围内以多种方式修改。这样,主体10未必是对称的,尽管这是理想的;并且端/腰部可以有任意的截面形状,例如截头棱锥形。点测头可以不用黄铜而用铜或某些具有良好导电性的材料制造。为了节省材料成本,原则上可以用在焊接温度下具有足够的刚度和韧性的任何材料制造点测头,从而仅把其表面作成导电的。在原理上,只要一个端面和腰部呈良好的电接触就足够了。不过,这将要求点测头的正确定向,使得导电的端面对着PCB。
权利要求书
按照条约第19条的修改
1.一种不用手持的用于电子电路诊断的点测头,其特征在于,它包括具有两个平面的主体,两个平面是基本上平行的端面,所述端面被分开且面向相反的方向,所述端面通过和至少一个所述端面呈电接触的腰部互相连接。
2.如权利要求1的点测头,其特征在于,所述腰部和两个端面呈电接触。
3.如权利要求1或2的点测头,其特征在于所述主体具有类似于线轴的形状,从而在腰部和端面之间的两端具有截头圆锥部。
4.如权利要求3的点测头,其特征在于端面和腰部的相交处是一倒角倒圆。
5.如权利要求3的点测头,其特征在于所述截头圆锥部相对于端面的角α在0°和40°之间。
6.如权利要求1或2的点测头,其特征在于所述主体具有类似于线轴的形状,从而在腰部和端面之间的两端是一截头棱锥部。
7.如权利要求6的点测头,其特征在于所述截头棱锥部相对于所述端面的角在0°和40°之间。
8.如前面任一权利要求的点测头,其特征在于所述主体相对于一个平面S-S基本上是对称的,所述平面S-S平行于所述端面,并离开所述端面的距离相等。
9.如前面任一权利要求的点测头,其特征在于所述主体由一实心金属制成。
10.如前面任一权利要求的点测头,其特征在于所述主体由黄铜制成并被镀上锡。
11.如前面任一权利要求的点测头,其特征在于所述端面的直径D相等,端面之间的距离L为端面直径的0.5到0.8倍。
12.如权利要求11的点测头,其特征在于所述端面的直径(D)是2至4mm。
13.一种用于表面安装器件(SMD)机的表面安装器件(SMD)带,其特征在于所述带具有按照前面任一权利要求的点测头。
14.如前面任一权利要求的点测头,其中所述端面之一适合于用导电材料连结在印刷电路板的线路上。
15.如前面任一权利要求的点测头,其中所述腰部适合于接收具有环或钩的测头,从而使所述腰部保持所述测头,不用手持进行印刷电路板的测试。

Claims (17)

1.一种不用手持的用于电子电路诊断测试的点测头,其特征在于,它包括具有两个平面的主体,两个平面是基本上平行的端面,它们被分开并面向相反的方向,所述端面通过和至少一个端面呈电接触的腰部彼此相连。
2.如权利要求1的点测头,其特征在于所述腰部和两个端面呈电接触。
3.如权利要求1或2的点测头,其特征在于所述主体具有类似于线轴的形状,从而在腰部和端面之间的两端具有截头圆锥部。
4.如权利要求3的点测头,其特征在于端面和腰的交界部是一倒角倒圆。
5.如权利要求3的点测头,其特征在于截头圆锥部相对于端面的角α在0°和40°之间。
6.如权利要求1或2的点测头,其特征在于所述主体具有类似于线轴的形状,从而使在腰部和端面之间的两端具有一截头棱锥部。
7.如权利要求6的点测头,其特征在于所述截头棱锥部相对于端面的角在0°和40°之间。
8.如前面任一权利要求的点测头,其特征在于所述主体相对于一个平面S-S基本上是对称的,所述平面S-S平行于端面,并离开各端面的距离相等。
9.如前面任一权利要求的点测头,其特征在于所述主体由一件实心金属制成。
10.如前面任一权利要求的点测头,其特征在于所述主体由黄铜制成并镀锡。
11.如前面任一权利要求的点测头,其特征在于所述端面的直径D相等,在端面之间的距离L是端面直径的0.5到0.8倍。
12.如权利要求11的点测头,其特征在于端面的直径(D)是2至4mm。
13.一种用于表面安装器件(SMD)机的表面安装器件(SMD)带,其特征在于所述的带具有按照前面任一权利要求的点测头。
14.如前面任一权利要求的点测头,其中所述端面之一适合于用导电材料连结在印刷电路板的线路上。
15.如前面任一权利要求的点测头,其中所述腰部适合于接收具有环或钩的测头,从而使所述腰部保持所述测头,使得不用手持便可进行印刷电路板的测试。
16.一种基本上如上参照附图3至6所述的点测头。
17.一种用于表面安装器件(SMD)机的表面安装器件(SMD)带,基本上如上参照附图3至6所述。
CN95190898A 1994-09-15 1995-09-13 不用手持的表面安装电子电路诊断测试的点测头 Pending CN1135794A (zh)

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GB9418639A GB2293697B (en) 1994-09-15 1994-09-15 Surface mount test point enabling hands free diagnostic testing of electronic circuits
GB9418639.2 1994-09-15

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NO961965D0 (no) 1996-05-14
ATE190401T1 (de) 2000-03-15
GB2293697B (en) 1998-11-18
EP0729585A1 (en) 1996-09-04
WO1996008728A1 (en) 1996-03-21
DE69515460T2 (de) 2000-08-03
DE69515460D1 (de) 2000-04-13
AU687239B2 (en) 1998-02-19
US5833479A (en) 1998-11-10
EP0729585B1 (en) 2000-03-08
GB9418639D0 (en) 1994-11-02
NO961965L (no) 1996-05-14

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