CN113574686A - 驱动电路基板、led显示面板及其制作方法、显示装置 - Google Patents

驱动电路基板、led显示面板及其制作方法、显示装置 Download PDF

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CN113574686A
CN113574686A CN201980002750.3A CN201980002750A CN113574686A CN 113574686 A CN113574686 A CN 113574686A CN 201980002750 A CN201980002750 A CN 201980002750A CN 113574686 A CN113574686 A CN 113574686A
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conductive structure
driving electrode
substrate
driving
electrode
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CN201980002750.3A
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CN113574686B (zh
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王珂
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种驱动电路基板、LED显示面板及其制作方法、显示装置，属于显示技术领域。其中，驱动电路基板，包括衬底基板(1)和设置在衬底基板(1)一侧表面上多个阵列排布的驱动电极(2)，每一驱动电极(2)远离衬底基板(1)的一侧表面上设置有至少一个导电结构(8)，导电结构(8)与对应的驱动电极(2)电连接，驱动电极(2)包括第一驱动电极(21)和第二驱动电极(22)，第一驱动电极(21)的水平高度大于第二驱动电极(22)的水平高度，导电结构(8)包括位于第一驱动电极(21)远离衬底基板(1)一侧表面上的第一导电结构(81)和位于第二驱动电极(22)远离衬底基板(1)一侧表面上的第二导电结构(82)，第二导电结构(82)的高度大于第一导电结构(81)的高度。能够提高LED显示面板的绑定良率。

Description

PCT国内申请，说明书已公开。

Claims (20)

  1. PCT国内申请，权利要求书已公开。
CN201980002750.3A 2019-12-02 2019-12-02 驱动电路基板、led显示面板及其制作方法、显示装置 Active CN113574686B (zh)

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WO2022056925A1 (zh) * 2020-09-21 2022-03-24 重庆康佳光电技术研究院有限公司 转移系统和转移方法
CN113571543B (zh) * 2021-07-14 2023-12-19 深圳市华星光电半导体显示技术有限公司 微发光二极管显示面板及其制备方法、显示装置
CN115295706B (zh) * 2022-09-29 2022-12-06 惠科股份有限公司 Led芯片转移方法及显示面板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027933A (ja) * 2006-07-18 2008-02-07 Sony Corp 素子、素子の製造方法、基板、基板の製造方法、実装構造体、実装方法、発光ダイオードディスプレイ、発光ダイオードバックライトおよび電子機器
CN208014728U (zh) * 2018-03-29 2018-10-26 昆山工研院新型平板显示技术中心有限公司 显示装置及其发光二极管芯片
CN110100309A (zh) * 2016-12-23 2019-08-06 株式会社流明斯 微型led模块及其制造方法
CN110299377A (zh) * 2019-07-03 2019-10-01 京东方科技集团股份有限公司 显示基板及制造方法、显示装置
CN110957411A (zh) * 2018-09-27 2020-04-03 昆山工研院新型平板显示技术中心有限公司 一种Micro-LED芯片及其制备方法、显示装置
CN110970457A (zh) * 2018-09-27 2020-04-07 昆山工研院新型平板显示技术中心有限公司 一种Micro-LED芯片及其制备方法、显示装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3336624B1 (de) * 2016-12-19 2019-02-06 Siemens Aktiengesellschaft Anordnung mit zwei redundanten baugruppen die sich gegenseitig überwachen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027933A (ja) * 2006-07-18 2008-02-07 Sony Corp 素子、素子の製造方法、基板、基板の製造方法、実装構造体、実装方法、発光ダイオードディスプレイ、発光ダイオードバックライトおよび電子機器
CN110100309A (zh) * 2016-12-23 2019-08-06 株式会社流明斯 微型led模块及其制造方法
CN208014728U (zh) * 2018-03-29 2018-10-26 昆山工研院新型平板显示技术中心有限公司 显示装置及其发光二极管芯片
CN110957411A (zh) * 2018-09-27 2020-04-03 昆山工研院新型平板显示技术中心有限公司 一种Micro-LED芯片及其制备方法、显示装置
CN110970457A (zh) * 2018-09-27 2020-04-07 昆山工研院新型平板显示技术中心有限公司 一种Micro-LED芯片及其制备方法、显示装置
CN110299377A (zh) * 2019-07-03 2019-10-01 京东方科技集团股份有限公司 显示基板及制造方法、显示装置

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US20210367120A1 (en) 2021-11-25
CN113574686B (zh) 2023-01-31
WO2021108951A1 (zh) 2021-06-10
US20240063360A1 (en) 2024-02-22
US11848408B2 (en) 2023-12-19

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