CN113574130A - 电路连接用黏合剂膜、电路连接结构体的制造方法及黏合剂膜收纳套组 - Google Patents

电路连接用黏合剂膜、电路连接结构体的制造方法及黏合剂膜收纳套组 Download PDF

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Publication number
CN113574130A
CN113574130A CN202080019596.3A CN202080019596A CN113574130A CN 113574130 A CN113574130 A CN 113574130A CN 202080019596 A CN202080019596 A CN 202080019596A CN 113574130 A CN113574130 A CN 113574130A
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CN
China
Prior art keywords
adhesive layer
circuit
adhesive film
conductive particles
adhesive
Prior art date
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Pending
Application number
CN202080019596.3A
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English (en)
Chinese (zh)
Inventor
伊藤彰浩
大当友美子
工藤直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
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Showa Denko KK
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Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN113574130A publication Critical patent/CN113574130A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
CN202080019596.3A 2019-03-13 2020-03-11 电路连接用黏合剂膜、电路连接结构体的制造方法及黏合剂膜收纳套组 Pending CN113574130A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-046548 2019-03-13
JP2019046548 2019-03-13
PCT/JP2020/010657 WO2020184636A1 (ja) 2019-03-13 2020-03-11 回路接続用接着剤フィルム、回路接続構造体の製造方法及び接着剤フィルム収容セット

Publications (1)

Publication Number Publication Date
CN113574130A true CN113574130A (zh) 2021-10-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080019596.3A Pending CN113574130A (zh) 2019-03-13 2020-03-11 电路连接用黏合剂膜、电路连接结构体的制造方法及黏合剂膜收纳套组

Country Status (5)

Country Link
JP (1) JPWO2020184636A1 (ko)
KR (1) KR20210141955A (ko)
CN (1) CN113574130A (ko)
TW (1) TW202039764A (ko)
WO (1) WO2020184636A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220178857A1 (en) * 2019-04-26 2022-06-09 Nabtesco Corporation Sensor
US20230035518A1 (en) * 2019-04-26 2023-02-02 Nabtesco Corporation Sensor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7124948B1 (ja) * 2021-12-15 2022-08-24 株式会社リコー 活性エネルギー線硬化型組成物、活性エネルギー線硬化型インク組成物、インクジェット用インク組成物、組成物収容容器、２次元又は３次元の像形成装置、２次元又は３次元の像形成方法、硬化物、加飾体、積層体、フレキシブルデバイス用部材、及びフレキシブルデバイス
JP2024025090A (ja) * 2022-08-10 2024-02-26 株式会社レゾナック 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007290269A (ja) * 2006-04-26 2007-11-08 Dainippon Printing Co Ltd 包装材料、およびそれを使用した栄養剤用包装容器
JP2011192651A (ja) * 2011-04-28 2011-09-29 Sony Chemical & Information Device Corp 異方性導電フィルム、接続方法及び接続構造体
JP2016033021A (ja) * 2014-07-31 2016-03-10 株式会社Adeka 紫外線遮光容器
CN111094486A (zh) * 2017-09-11 2020-05-01 日立化成株式会社 粘接剂膜收纳组件及其制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3959247B2 (ja) 2001-02-16 2007-08-15 ソニーケミカル＆インフォメーションデバイス株式会社 リール部材及びフィルムの巻取方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007290269A (ja) * 2006-04-26 2007-11-08 Dainippon Printing Co Ltd 包装材料、およびそれを使用した栄養剤用包装容器
JP2011192651A (ja) * 2011-04-28 2011-09-29 Sony Chemical & Information Device Corp 異方性導電フィルム、接続方法及び接続構造体
JP2016033021A (ja) * 2014-07-31 2016-03-10 株式会社Adeka 紫外線遮光容器
CN111094486A (zh) * 2017-09-11 2020-05-01 日立化成株式会社 粘接剂膜收纳组件及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张开: "粘合与密封材料", vol. 1, 化学工业出版社, pages: 198 - 199 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220178857A1 (en) * 2019-04-26 2022-06-09 Nabtesco Corporation Sensor
US20230035518A1 (en) * 2019-04-26 2023-02-02 Nabtesco Corporation Sensor

Also Published As

Publication number Publication date
TW202039764A (zh) 2020-11-01
KR20210141955A (ko) 2021-11-23
JPWO2020184636A1 (ko) 2020-09-17
WO2020184636A1 (ja) 2020-09-17

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Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.