CN113572337A - Air floatation platform for wafer cutting machine - Google Patents
Air floatation platform for wafer cutting machine Download PDFInfo
- Publication number
- CN113572337A CN113572337A CN202111028407.1A CN202111028407A CN113572337A CN 113572337 A CN113572337 A CN 113572337A CN 202111028407 A CN202111028407 A CN 202111028407A CN 113572337 A CN113572337 A CN 113572337A
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- Prior art keywords
- air
- shaft
- drive
- air floating
- double
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- 238000005520 cutting process Methods 0.000 title claims abstract description 14
- 239000013078 crystal Substances 0.000 claims abstract description 4
- 239000004579 marble Substances 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 3
- 238000005188 flotation Methods 0.000 claims 7
- 230000033001 locomotion Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 5
- 230000009191 jumping Effects 0.000 abstract description 3
- 238000005299 abrasion Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/14—Structural association with mechanical loads, e.g. with hand-held machine tools or fans
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combustion & Propulsion (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Machine Tool Units (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Abstract
The invention provides an air floating platform for a crystal element cutting machine, which comprises a base, wherein symmetrical double-drive axial linear guide rails are arranged on an upper base surface of the base, a double-drive shaft stator is arranged on one side of the double-drive axial linear guide rails, a double-drive shaft rotor is connected to the double-drive shaft stator, an air floating shaft cross beam is erected on the double-drive axial linear guide rails, an air floating block is arranged on the air floating shaft cross beam and comprises a bottom air floating block arranged on the lower portion of the air floating shaft cross beam and side air floating blocks arranged on the bottom air floating block and on two sides of the air floating shaft cross beam, a turntable mounting table is arranged above the air floating shaft cross beam and on the upper portions of the side air floating blocks, a DD rotary table is arranged on the turntable mounting table, an air floating shaft stator and an air floating shaft rotor are arranged on the lower portion of the turntable mounting table and in the side air floating blocks on two sides, and Z-direction jumping in the movement process and long-time movement of a screw rod caused by microcosmic concave-convex part on the surface of the linear guide rails can be effectively avoided Thermal deformation and wear problems.
Description
Technical Field
The invention relates to the technical field of air floatation platforms of cutting machines, in particular to an air floatation platform for a crystal element cutting machine.
Background
Traditional XY motion platform comprises linear guide and ball screw etc. and linear guide and ball screw self precision are limited, and long-time motion can lead to linear guide wearing and tearing to influence the direction precision, and the long-time motion of lead screw can lead to the lead screw to produce the heat altered shape because of generating heat, influences the positioning accuracy of whole platform, just.
Disclosure of Invention
In view of this, the invention provides an air floating platform for a wafer cutting machine, which can effectively avoid the problems of Z-direction jumping in the moving process caused by microscopic unevenness on the surface of a linear guide rail and thermal deformation and abrasion caused by long-time movement of a screw rod.
In order to solve the above technical problems, the present invention provides an air floating platform for a wafer dicing machine, which comprises a base, the upper base surface of the base is provided with symmetrical double-drive axial linear guide rails, one side of the double-drive axial linear guide rails is provided with a double-drive axial stator, the double-drive-shaft stator is connected with a double-drive-shaft rotor, an air-bearing shaft beam is erected on the double-drive-shaft linear guide rail, the air floating block is arranged on the air floating shaft beam and comprises a bottom air floating block arranged at the lower part of the air floating shaft beam and side air floating blocks arranged on the bottom air floating block and at two sides of the air floating shaft beam, a turntable mounting table is arranged above the air floating shaft beam and above the side air floating block, a DD turntable is arranged on the turntable mounting table, and an air floating shaft stator and an air floating shaft rotor are arranged in the side air floating blocks at the two sides of the lower part of the turntable mounting table.
Further, the base is marble material, the linear guide rail fixed connection of two driving axles is at the last base face of base.
Furthermore, two groups of double-drive-shaft linear guide rails are symmetrically arranged on the base, linear motors are arranged inside the double-drive-shaft linear guide rails, and the two groups of double-drive-shaft linear guide rails and the linear motors in the double-drive-shaft linear guide rails form a gantry double drive.
Furthermore, the air floatation shaft beam is fixed on the double-drive-shaft linear guide rail, the double-drive-shaft rotor is fixed on the air floatation shaft beam, the linear motor in the double-drive-shaft linear guide rail drives the air floatation shaft beam to reciprocate, the lower part of the bottom air floatation block is provided with a plurality of air holes for air blowing, and a pressure equalizing groove matched with the bottom air floatation block is arranged on the base correspondingly.
Furthermore, the bottom air floating blocks, the side air floating blocks and the rotary table mounting seat form a closed quadrilateral structure, the closed quadrilateral structure is sleeved in an air floating shaft cross beam and keeps a certain gap with the cross beam, the air floating shaft cross beam is supported by a plurality of groups of air floating blocks, and an output shaft of the linear motor is connected with the air floating shaft cross beam.
Furthermore, a plurality of air holes are formed in the side wall of the side air floating block, and the upper end and the lower end of the side air floating block are respectively connected with the rotary table mounting table and the DD rotary table.
Furthermore, a mounting seat matched with the DD rotary table is arranged on the rotary table mounting plate, the DD rotary table is arranged and connected in the mounting seat, and a DD motor is arranged in the DD rotary table.
Furthermore, the turntable mounting plate is connected with the air floatation block and is driven by an air floatation shaft stator arranged in the air floatation block.
The technical scheme of the invention has the following beneficial effects:
the air floatation platform for the wafer cutting machine is driven by adopting an air floatation guide rail and a linear motor. The air-float guide rail is a non-contact guide rail, so that the abrasion problem caused by long-time movement of the platform is avoided, and the air-float guide rail can avoid Z-direction jumping in the movement process caused by microcosmic concave-convex on the surface of the guide rail. The linear motor is used for replacing a screw rod and servo mode for transmission, the positioning and repeated positioning precision is higher, and the problems of thermal deformation and abrasion caused by long-time movement of the screw rod are solved.
Drawings
Fig. 1 is a front view of the present invention.
1. A base; 2. a dual drive shaft linear guide; 3. a dual drive shaft stator; 4. a double-drive-shaft rotor; 5. an air bearing shaft beam; 6. a bottom air-bearing block; 7. side air floating blocks; 8. an air bearing shaft stator; 9. an air-float shaft rotor; 10. a turntable mounting base; 11. and (5) a DD rotary table.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to fig. 1 of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
As shown in fig. 1, the air floating platform for the wafer cutting machine comprises a base 1, wherein a symmetrical double-drive axial linear guide rail 2 is arranged on an upper base surface of the base 1, a double-drive axial stator 3 is arranged on one side of the double-drive axial linear guide rail 2, a double-drive axial mover 4 is connected to the double-drive axial stator 3, an air floating axial beam 5 is erected on the double-drive axial linear guide rail 2, an air floating block is arranged on the air floating axial beam 5, the air floating block comprises a bottom air floating block 6 arranged on the lower portion of the air floating axial beam 5 and side air floating blocks 7 arranged on the bottom air floating block 6 and on two sides of the air floating axial beam 5, a turntable mounting table is arranged above the air floating axial beam 5 and on the upper portions of the side air floating blocks 7, a turntable 11 is arranged on the turntable mounting table, an air floating axial stator 8 and an air floating axial mover 9 are arranged on the lower portion of the turntable mounting table and in the side air floating blocks 7 on two sides, specifically, the double-drive-shaft linear guide rails of the base are fixedly connected to the upper base surface of the base, two groups of linear motors are arranged in the double drive shafts, the air floating shaft cross beam is erected through the double drive-shaft linear guide rails, the bottom air floating block, the side air floating blocks and the turntable mounting seat form a sealed air floating block, the air floating block is sleeved on the air floating shaft cross beam, air flow is output to a pressure equalizing groove arranged on the base through air holes arranged on the bottom air floating block, the air floating shaft cross beam is supported by the bottom air floating blocks by utilizing the principle that acting force and reacting force are the same, the linear motors arranged in the double drive-shaft linear guide rails are connected with two sides of the air floating shaft cross beam, the air floating shafts are driven by the linear motors to reciprocate along the double drive-shaft linear guide rails, the upper parts of the side air floating blocks are connected with the turntable mounting plate at the lower parts of the side air floating blocks and connected with the bottom air floating blocks, air jetting is carried out through the air holes arranged on the side air floating blocks to ensure the straightness of the air floating shafts, the DD rotary table is connected to the rotary table mounting plate, the rotary table mounting plate is connected with the air floatation block, the rotary table mounting plate is driven by the air floatation shaft stator connected with the rotary table mounting plate to move in a reciprocating mode, the air floatation block drives the DD rotary table to move, the DD rotary table is internally provided with the DD motor, and the DD rotary table is rotated through the DD motor.
According to an embodiment of the present invention, as shown in fig. 1, the base 1 is made of marble, and the dual-drive-axis linear guide 2 is fixedly connected to the upper base surface of the base 1, specifically, a marble platform is used as a carrier to support the whole motion platform, which has lower cost and sufficient hardness of marble.
According to an embodiment of the invention, as shown in fig. 1, two sets of the dual-drive-shaft linear guide rails 2 are symmetrically arranged on the base 1, linear motors are arranged inside the dual-drive-shaft linear guide rails 2, two sets of the dual-drive-shaft linear guide rails 2 form a gantry dual drive with the linear motors inside the dual-drive-shaft linear guide rails, and specifically, two sets of the linear guide rails are correspondingly connected to two sides of the air bearing shaft beam, so that the linear guide rails are more stable and effective when being used for driving the air bearing shaft beam.
According to an embodiment of the present invention, as shown in fig. 1, the air-bearing shaft beam 5 is fixed on the dual-drive shaft linear guide rail 2, the dual-drive shaft mover 4 is fixed on the air-bearing shaft beam 5, the linear motor in the dual-drive shaft linear guide rail 2 drives the air-bearing shaft beam 5 to reciprocate, the lower portion of the bottom air-bearing block 6 is provided with a plurality of air holes for blowing air, the base 1 is provided with a pressure equalizing groove adapted to the bottom air-bearing block 6, specifically, the linear motor is matched with the linear guide rail to serve as the dual-drive shaft air-bearing block, and the linear motor is matched with the air-bearing platform to reciprocate during the cutting process.
According to an embodiment of the present invention, as shown in fig. 1, the bottom air-bearing block 6, the side air-bearing blocks 7 and the turntable mounting base 10 form a closed quadrilateral structure, and are sleeved in the air-bearing shaft beam 5, and keep a certain gap with the beam, the air-bearing shaft beam 5 is supported by multiple sets of air-bearing blocks, the output shaft of the linear motor is connected with the air-bearing shaft beam 5, specifically, the bottom air-bearing block, the side air-bearing blocks and the turntable mounting base form a closed square air-bearing block, and the air-bearing blocks are sleeved on the air-bearing shaft beam, so that the bottom air-bearing block can support the air-bearing shaft beam, compressed air is blown from the air holes at the lower part of the bottom air-bearing block, an air cushion is formed with the aid of the equalizing groove, and as the acting force is equal to the reacting force, a buoyancy force is generated to lift the air-bearing assembly.
According to one embodiment of the invention, as shown in fig. 1, a plurality of air holes are arranged on the side wall of the side air floating block 7, and the upper end and the lower end of the side air floating block 7 are respectively connected with the turntable mounting table and the DD turntable 11.
According to an embodiment of the present invention, as shown in fig. 1, a mounting seat adapted to a DD turntable 11 is disposed on the turntable mounting plate, the DD turntable 11 is connected in the mounting seat, and a DD motor is disposed in the DD turntable 11, and specifically, the DD motor rotates to correct an angle between a moving platform and a scribe line during a wafer processing process.
The use method of the invention comprises the following steps:
a series of regular cutting channels which are arranged longitudinally and transversely are reserved in a wafer after the wafer is subjected to photoetching, the whole large wafer is divided into a series of crystal grains along the cutting channels in the wafer cutting process, the wafer needs to be positioned before processing, the wafer needs to be fixed to a calibration state through three degrees of freedom XYR, and therefore the processing platform needs to meet the requirements of the three degrees of freedom. The air floatation platform for the cutting machine consists of a double-drive shaft, an air floatation shaft and a rotating shaft. The double driving shafts are supported by linear guide rails and driven by linear motors; the air floating shaft is supported by an air floating guide rail and driven by a linear motor; the rotating shaft directly adopts a DD motor, the double-drive shaft and the air floating shaft do linear reciprocating motion, and the DD motor does rotating motion.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. The utility model provides a crystal element is air supporting platform for cutting machine which characterized in that: including base (1), be provided with two drive axis nature guide rails (2) of symmetry on the upper portion base plane of base (1), one side of two drive axis linear guide rails (2) is provided with two drive axle stators (3), be connected with two drive axle active cells (4) on two drive axle stators (3), air supporting shaft crossbeam (5) have been erect to two drive axis linear guide rails (2), be provided with the air supporting piece on air supporting shaft crossbeam (5), the air supporting piece is including setting up bottom air supporting piece (6) in air supporting shaft crossbeam (5) lower part and setting up on bottom air supporting piece (6) and side air supporting piece (7) in air supporting shaft crossbeam (5) both sides, the top of air supporting shaft crossbeam (5) and be provided with the revolving stage mount table on the upper portion of side air supporting piece (7), be provided with revolving stage (11) on the revolving stage mount table, the lower part of revolving stage mount table and be provided with air supporting shaft active cell (8) and air supporting shaft active cell (7) in the side air supporting piece (7) of both sides, be provided with air supporting shaft active cell (8) and revolving stage (11) on the lower part of revolving stage mount table (9).
2. The air bearing platform for a wafer saw as claimed in claim 1, wherein: the base (1) is made of marble, and the double-drive-shaft linear guide rail (2) is fixedly connected to the upper base surface of the base (1).
3. The air bearing platform for a wafer saw as claimed in claim 1, wherein: two groups of double-drive-shaft linear guide rails (2) are symmetrically arranged on the base (1), linear motors are arranged inside the double-drive-shaft linear guide rails (2), and two groups of double-drive-shaft linear guide rails (2) and the linear motors in the double-drive-shaft linear guide rails form gantry double drive.
4. The air bearing platform for a wafer saw as claimed in claim 1, wherein: the air flotation device is characterized in that an air flotation shaft beam (5) is fixed on a double-drive-shaft linear guide rail (2), a double-drive-shaft rotor (4) is fixed on the air flotation shaft beam (5), a linear motor in the double-drive-shaft linear guide rail (2) drives the air flotation shaft beam (5) to reciprocate, a plurality of air holes used for blowing are formed in the lower portion of a bottom air flotation block (6), and the bottom air flotation block (6) is provided with a pressure equalizing groove matched with the bottom air flotation block on a base (1).
5. The air bearing platform for a wafer saw as claimed in claim 4, wherein: the bottom air floating blocks (6), the side air floating blocks (7) and the rotary table mounting seat (10) form a closed quadrilateral structure, the closed quadrilateral structure is sleeved in an air floating shaft cross beam (5) and keeps a certain gap with the cross beam, the air floating shaft cross beam (5) is supported by a plurality of groups of air floating blocks, and an output shaft of a linear motor is connected with the air floating shaft cross beam (5).
6. The air bearing platform for a wafer saw as claimed in claim 1, wherein: the side wall of the side air floating block (7) is provided with a plurality of air holes, and the upper end and the lower end of the side air floating block (7) are respectively connected with the turntable mounting table and the DD turntable (11).
7. The air bearing platform for a wafer saw as claimed in claim 1, wherein: the rotary table mounting plate is provided with a mounting seat matched with the DD rotary table (11), the DD rotary table (11) is arranged and connected in the mounting seat, and a DD motor is arranged in the DD rotary table (11).
8. The air bearing platform for a wafer saw as claimed in claim 1, wherein: the turntable mounting plate is connected with the air floatation block and is driven by an air floatation shaft stator (8) arranged in the air floatation block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111028407.1A CN113572337A (en) | 2021-09-02 | 2021-09-02 | Air floatation platform for wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111028407.1A CN113572337A (en) | 2021-09-02 | 2021-09-02 | Air floatation platform for wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113572337A true CN113572337A (en) | 2021-10-29 |
Family
ID=78173484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111028407.1A Withdrawn CN113572337A (en) | 2021-09-02 | 2021-09-02 | Air floatation platform for wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113572337A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114512430A (en) * | 2022-01-28 | 2022-05-17 | 河南通用智能装备有限公司 | Air floatation carrying platform |
| CN114833597A (en) * | 2022-05-12 | 2022-08-02 | 横川机器人（深圳）有限公司 | Gantry double-drive multi-axis motion platform |
| CN115001235A (en) * | 2022-08-02 | 2022-09-02 | 上海隐冠半导体技术有限公司 | Two-dimensional movement device |
| CN116995001A (en) * | 2023-09-26 | 2023-11-03 | 迈为技术(珠海)有限公司 | Substrate transfer device |
-
2021
- 2021-09-02 CN CN202111028407.1A patent/CN113572337A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114512430A (en) * | 2022-01-28 | 2022-05-17 | 河南通用智能装备有限公司 | Air floatation carrying platform |
| CN114833597A (en) * | 2022-05-12 | 2022-08-02 | 横川机器人（深圳）有限公司 | Gantry double-drive multi-axis motion platform |
| CN115001235A (en) * | 2022-08-02 | 2022-09-02 | 上海隐冠半导体技术有限公司 | Two-dimensional movement device |
| CN116995001A (en) * | 2023-09-26 | 2023-11-03 | 迈为技术(珠海)有限公司 | Substrate transfer device |
| CN116995001B (en) * | 2023-09-26 | 2023-12-19 | 迈为技术(珠海)有限公司 | Substrate transfer device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20211029 |