CN113556926A - Semiconductor processing equipment and cooling assembly and cooling method thereof - Google Patents
Semiconductor processing equipment and cooling assembly and cooling method thereof Download PDFInfo
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- CN113556926A CN113556926A CN202110807513.3A CN202110807513A CN113556926A CN 113556926 A CN113556926 A CN 113556926A CN 202110807513 A CN202110807513 A CN 202110807513A CN 113556926 A CN113556926 A CN 113556926A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/248—Components associated with high voltage supply
Abstract
The invention provides a cooling assembly, which comprises a temperature sensing device, a cooling device and a control device, wherein the control device acquires a temperature detection value of an electric control device in semiconductor process equipment through the temperature sensing device, and a processor of the control device is used for controlling the cooling device to cool the electric control device when the temperature detection value meets a preset high-temperature condition or the electric control device runs. In the aspect, the processor of the control device can control the cooling device to start cooling the electric control device when the electric control device operates or when the temperature detection value of the electric control device meets the preset high-temperature condition, so that the electric control device is cooled only when the electric control device has a cooling requirement, the potential safety hazard that liquid drops are generated due to the fact that the electric control device is continuously cooled unnecessarily when the temperature of the electric control device is lower and condensation inside the electric control device is caused is eliminated, and the safety of semiconductor process equipment is improved. The invention also provides semiconductor processing equipment and a cooling method.
Description
Technical Field
The embodiment of the invention relates to the field of semiconductor process equipment, in particular to a cooling assembly, semiconductor process equipment comprising the cooling assembly and a cooling method realized by the cooling assembly.
Background
In a semiconductor process, the performance of a radio frequency power supply has a crucial influence on the process effect, the power of the radio frequency power supply used by semiconductor process equipment is generally hundreds of watts to thousands of watts, and as the output power of the radio frequency power supply is large, extra work except the energy of a radio frequency signal is output in the form of heat, the temperature of the radio frequency power supply is very high, and some temperature sensitive devices are burnt, so that cooling measures need to be taken for the radio frequency power supply.
In the prior art, a water cooling mode is generally adopted for cooling the radio frequency power supply, however, although the radio frequency power supply can be cooled by water for a long time, due to the temperature, the humidity and other reasons of the use environment of the radio frequency power supply, the inside of the radio frequency power supply can be subjected to dewing, the generated water drops drop on a circuit board to cause short circuit, the power supply is further burnt, huge economic loss is caused, and other devices and workers around the radio frequency power supply are threatened.
Therefore, how to provide a temperature control scheme capable of cooling the rf power in real time according to the temperature control requirement of the rf power becomes a technical problem to be solved in the art.
Disclosure of Invention
The invention aims to provide a cooling assembly, semiconductor process equipment and a cooling method, wherein the cooling assembly can cool an electric control device only when the electric control device has a cooling requirement, so that the safety of the semiconductor process equipment is improved.
In order to achieve the above object, according to an aspect of the present invention, there is provided a cooling module for cooling an electric control device in a semiconductor processing apparatus, the cooling module includes a temperature sensing device, a cooling device, and a control device, the control device obtains a temperature detection value of the electric control device through the temperature sensing device, and the control device includes a processor, and the processor is configured to control the cooling device to cool the electric control device when the temperature detection value satisfies a preset high temperature condition or the electric control device is operated.
Optionally, the control device includes at least one temperature comparison module, the temperature comparison module obtains temperature detection values of components in the electronic control device through the temperature sensing device, compares each temperature detection value with a preset temperature value corresponding to the temperature detection value, and the processor determines whether the preset high temperature condition is met according to the comparison result, where the preset high temperature condition includes: at least one temperature detection value is higher than a corresponding preset temperature value.
Optionally, the temperature sensing device includes a plurality of temperature sensors, the temperature comparison module and the temperature sensors are arranged in a one-to-one correspondence, and the plurality of temperature sensors are respectively configured to detect temperatures of different components in the electronic control device.
Optionally, the control device includes an or gate circuit, and the temperature comparison module is configured to send a temperature flag signal to the or gate circuit when the temperature detection value is higher than a corresponding preset temperature value;
the OR gate circuit sends an over-temperature mark signal to the processor based on the temperature mark signal and the starting mark signal of the electric control device, and the processor is used for controlling the cooling device to cool the electric control device when receiving the over-temperature mark signal.
Optionally, the control device includes a delay module, and the delay module is configured to delay the operation of the cooling device for a preset time period when the cooling device is in operation and the over-temperature flag signal is not received.
Optionally, the cooling device includes a cooling liquid pipeline and a valve disposed on the cooling liquid pipeline, the cooling liquid pipeline is used for cooling the electric control device, and the processor is used for controlling the valve to open or close so as to control the cooling device to start or stop operating.
As a second aspect of the present invention, there is provided a semiconductor processing apparatus, comprising an electric control device, wherein a cooling module is disposed in the electric control device, and the cooling module is the cooling module described above.
Optionally, the electric control device is a radio frequency power supply, the radio frequency power supply can send a radio frequency identification signal to the control device when the electric control device operates, and the processor of the control device is further configured to determine that the electric control device is in an operating state when receiving the radio frequency identification signal sent by the radio frequency power supply.
As a third aspect of the present invention, there is provided a cooling method for an electronic control device in a semiconductor process apparatus, comprising:
acquiring a temperature detection value of the electric control device through the temperature sensing device;
and when the temperature detection value meets a preset high-temperature condition or the electric control device runs, controlling a cooling device to cool the electric control device.
Optionally, the cooling method further comprises:
and in the operation of the cooling device, when the preset high-temperature condition and the operation condition of the electric control device are not met, prolonging the operation of the cooling device for a preset delay time.
In the semiconductor process equipment and the cooling assembly and the cooling method thereof, the processor of the control device can control the cooling device to start cooling the electric control device when the electric control device operates or when the temperature detection value of the electric control device meets the preset high-temperature condition, so that the electric control device is cooled only when the electric control device has the cooling requirement, the potential safety hazard that liquid drops are generated due to the fact that the electric control device is continuously cooled unnecessarily when the temperature of the electric control device is lower and the interior of the electric control device is condensed is eliminated, and the safety of the semiconductor process equipment is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a cooling module provided in an embodiment of the present invention;
FIG. 2 is a schematic flow diagram of a cooling method provided by an embodiment of the present invention;
fig. 3 is a schematic flow chart of a cooling method according to another embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In order to solve the above technical problems, according to an aspect of the present invention, there is provided a cooling assembly for cooling an electric control device in a semiconductor processing apparatus, the cooling assembly including a temperature sensing device, a cooling device, and a control device, the control device obtaining a temperature detection value of the electric control device through the temperature sensing device, the control device including a processor for controlling the cooling device to cool the electric control device when the temperature detection value of the electric control device satisfies a preset high temperature condition or the electric control device is operated.
The structure and function of the electric control device are not particularly limited in the embodiments of the present invention, for example, the electric control device may be a radio frequency power supply, or may also be a device that generates excessive heat when a motor or other devices work. It should be noted that, in the research of the inventor of the present invention, some electronic control devices, such as the rf power supply, may generate heat even if they do not output power (i.e., they do not release heat of extra work themselves), and the heat conducted to the electronic control devices may also cause over-temperature. Therefore, the judgment standard for judging whether the cooling requirement exists in the electric control device also comprises a preset high-temperature condition, and even if the electric control device is not in a running state, the processor of the control device can automatically start the cooling device when the whole or local temperature of the electric control device is overhigh (namely the temperature detection value meets the preset high-temperature condition), so that the phenomenon that the temperature of the electric control device is overhigh and the overtemperature alarm of the electric control device is triggered is further avoided, and the safety and the production efficiency of semiconductor process equipment are improved.
In the invention, the cooling device is in a normally closed state in the non-working time period of the semiconductor processing equipment, the processor of the control device can control the cooling device to start cooling the electric control device when the electric control device runs, or the temperature detection value of the electric control device meets a preset high temperature condition (for example, the temperature of the whole electric control device is overhigh, or the temperature of some specific positions (the positions of components which are easily affected by the temperature and generate faults) of the electric control device is overhigh, or the temperature of a plurality of specific positions of the electric control device is overhigh at the same time), therefore, the electric control device is cooled only when the electric control device has the cooling requirement, the potential safety hazard that liquid drops are generated due to the fact that the electric control device is continuously cooled unnecessarily when the temperature of the electric control device is low and the interior of the electric control device is condensed is eliminated, and the safety of semiconductor process equipment is improved.
The embodiment of the present invention does not specifically limit how the processor of the control device determines whether the electronic control device is operating, for example, the electronic control device may continuously or periodically send a corresponding feedback signal to the control device during operation, and the control device determines whether the electronic control device is operating according to whether the control signal is received.
As an optional implementation manner of the present invention, in a case that the electric control device is a radio frequency power supply, the radio frequency power supply can send a radio frequency identification signal to the control device when running, and the processor of the control device is further configured to determine that the electric control device is in a running state when receiving the radio frequency identification signal sent by the radio frequency power supply; and when the radio frequency identification signal sent by the radio frequency power supply is not received, judging that the electric control device is in a non-running state.
For example, as an optional implementation manner of the present invention, as shown in fig. 1, the control device may include at least one temperature comparison module, where the temperature comparison module obtains a temperature detection value of (at least one) component in the electronic control device through a temperature sensing device, compares each temperature detection value with a preset temperature value corresponding to each temperature detection value, and determines, according to a comparison result, whether the preset high temperature condition is met, where the preset high temperature condition includes: at least one temperature detection value is higher than the corresponding preset temperature value.
In order to improve the protection effect on the electric control device, preferably, as shown in fig. 1, the temperature sensing device includes a plurality of temperature sensors (temperature sensor 1, temperature sensor 2, … … temperature sensor n), and the temperature comparison modules (temperature comparison module 1, temperature comparison module 2, … … temperature comparison module n) and the temperature sensors are arranged in a one-to-one correspondence manner, and the plurality of temperature sensors are respectively used for detecting the temperatures of a plurality of different components in the electric control device.
In the embodiment of the invention, the temperature sensing device comprises a plurality of temperature sensors for detecting a plurality of different components, the plurality of temperature sensors (temperature sensor 1, temperature sensor 2, … … temperature sensor n) are respectively arranged corresponding to the plurality of different components of the electric control device, the control device comprises a plurality of temperature comparison modules, the plurality of temperature comparison modules (temperature comparison module 1, temperature comparison module 2, … … temperature comparison module n) correspondingly acquire temperature detection values (temperature detection value 1, temperature detection value 2, … … temperature detection value n) of different components in the electric control device through the plurality of temperature sensors one by one, and respectively compare the temperature detection values of the plurality of different components with preset temperature values corresponding to the components, so that each temperature sensitive area and each temperature sensitive component in the electric control device can be comprehensively protected, when the temperature of each temperature sensitive component exceeds the preset temperature value which can be borne by the temperature sensitive component, the fact that the electric control device needs to be cooled is judged in time, and therefore the safety of the electric control device is improved.
For example, as a preferred embodiment of the present invention, when the temperature detection value is higher than a corresponding preset temperature value, the temperature comparison module may send a corresponding signal to the control device, so that the control device directly determines whether the temperature reduction requirement exists in the electric control device according to the signal, specifically:
the control device comprises an OR gate circuit, and the temperature comparison module is used for sending temperature sign signals (temperature sign signal 1, temperature sign signal 2 and … … temperature sign signal n) to the OR gate circuit of the control device when the temperature detection value is higher than the corresponding preset temperature value;
the or gate circuit sends an over-temperature flag signal to the processor based on the temperature flag signal and a start flag signal of the electric control device (i.e., a feedback signal sent by the electric control device (e.g., a radio frequency flag signal sent by a radio frequency power supply) when the electric control device operates), and the processor is used for controlling the cooling device to cool the electric control device when receiving the over-temperature flag signal.
In an embodiment of the present invention, the control device further includes an or gate circuit, and the processor determines whether cooling is required according to an over-temperature flag signal obtained by integrating a start flag signal and a temperature flag signal of the electronic control device by the or gate circuit, specifically, the or gate circuit can send the over-temperature flag signal to the processor when receiving the temperature flag signal sent by the at least one temperature comparison module and/or receiving the start flag signal (such as a radio frequency flag signal), and at this time, the state of the cooling component must satisfy at least one condition that the electronic control device is running and the electronic control device has over-temperature components, so that the processor can control the cooling device to cool the electronic control device in time to ensure the safety of the electronic control device.
In the invention, the cooling device is kept in a normally closed state in the non-working time period of the semiconductor process equipment, namely the cooling device needs to be closed in time after the cooling device cools the electric control device to avoid continuously cooling the electric control device, and the embodiment of the invention does not specifically limit how the control device controls the cooling device to be closed, for example, the control device can immediately close the cooling device after the temperature detection value of the electric control device does not meet the preset high-temperature condition or the electric control device stops running.
Or, in order to prevent the waste heat generated by the operation of the electric control device from being conducted to the temperature sensitive component after the cooling device is turned off to cause damage or cause frequent start of the cooling device, preferably, the control device turns off the cooling device at intervals after the electric control device stops operating and the temperature detection values all decrease to a value not meeting the preset high temperature condition, specifically:
the control device also comprises a delay module, wherein the delay module is used for delaying the preset time length and stopping the operation of the cooling device when the cooling device is in operation and the over-temperature mark signal is not received.
In the embodiment of the invention, the control device further comprises a delay module, so that the cooling device can be stopped after the time when the over-temperature mark signal is not received (namely the electric control device stops running and the temperature detection values are all reduced to be below the preset high-temperature condition) exceeds the preset time, the temperature of each component in the electric control device can be reduced to a certain temperature difference with the corresponding preset temperature value through the cooling device, and therefore, when the temperature of each component in the electric control device is kept near the preset temperature value, the temperature detection values are prevented from floating up and down near the preset temperature value due to residual heat generated by the running of the electric control device or slight change of the external environment, the cooling device is started frequently, and the stability and the service life of the cooling assembly are improved.
Specifically, when the control device judges whether the electric control device has a cooling requirement according to the temperature flag signal and the start flag signal of the electric control device, the control device controls the cooling device to stop operating when the processor does not receive the time length of the over-temperature flag signal generated by the OR gate circuit based on the temperature flag signal or the start flag signal of the electric control device (for example, the radio frequency flag signal sent by the radio frequency power supply) is longer than the preset time length.
For example, optionally, the cooling device may include a cooling liquid pipeline and a valve disposed on the cooling liquid pipeline, the cooling liquid pipeline is used for cooling the electronic control device (the cooling liquid pipeline is attached to the electronic control device, and low-temperature cooling liquid in the cooling liquid pipeline can absorb heat of the electronic control device and flow to take away the heat, so as to cool the electronic control device), and the processor is used for controlling the valve to open or close to control the cooling device to start or stop operating.
As a second aspect of the present invention, a semiconductor processing apparatus is provided, which includes an electric control device, a cooling module is disposed in the electric control device, and the cooling module is the cooling module provided in the embodiment of the present invention.
In the semiconductor process equipment provided by the invention, the cooling device of the cooling assembly is in a normally closed state in the non-working time period of the semiconductor process equipment, the processor of the control device can control the cooling device to start cooling the electric control device when the electric control device runs, or the temperature detection value of the electric control device meets the preset high temperature condition (for example, the temperature of the whole electric control device is overhigh, or the temperature of certain specific positions (the positions of components which are easily affected by temperature and generate faults) of the electric control device is overhigh, or the phenomenon of overhigh temperature simultaneously occurs in a plurality of specific positions of the electric control device), so that the electric control device is cooled only when the electric control device has the requirement of cooling, the potential safety hazard that the liquid drops are generated by condensation in the electric control device because the electric control device is continuously cooled unnecessarily when the temperature of the electric control device is lower is eliminated, the safety of the semiconductor process equipment is improved.
As an optional implementation manner of the present invention, the electric control device is a radio frequency power supply, the radio frequency power supply can send a radio frequency identification signal to the control device when the electric control device operates, and the processor of the control device is further configured to determine that the electric control device is in an operating state when the radio frequency identification signal sent by the radio frequency power supply is received.
As a third aspect of the present invention, there is provided a cooling method implemented by a control device in a cooling assembly provided by an embodiment of the present invention, as shown in fig. 2, the method including:
step S1, acquiring a temperature detection value of the electric control device through the temperature sensing device;
and step S2, when the temperature detection value meets the preset high-temperature condition or the electric control device runs, controlling the cooling device to cool the electric control device.
In the cooling method provided by the invention, the control device can control the cooling device to start cooling the electric control device when the electric control device runs or the temperature detection value of the electric control device meets the preset high-temperature condition, so that the electric control device is cooled only when the electric control device has a cooling requirement, the potential safety hazard that liquid drops are generated due to condensation in the electric control device because the electric control device is continuously cooled unnecessarily when the temperature of the electric control device is lower is eliminated, and the safety of semiconductor process equipment is improved.
For example, as an optional implementation manner of the present invention, as shown in fig. 1, the control device may include at least one temperature comparison module, where the temperature comparison module obtains a temperature detection value of (at least one) component in the electronic control device through a temperature sensing device, compares each temperature detection value with a preset temperature value corresponding to each temperature detection value, and determines, according to a comparison result, whether the preset high temperature condition is met, where the preset high temperature condition includes: at least one temperature detection value is higher than the corresponding preset temperature value.
In order to prevent the waste heat generated by the operation of the electric control device from being conducted to the temperature sensitive component after the cooling device is turned off to cause damage or cause frequent starting of the cooling device, the cooling method preferably further comprises turning off the cooling device after a period of time after the electric control device stops running, specifically:
the control device further comprises a time delay module, as shown in fig. 3, and the cooling method further comprises: and step S3, in the operation of the cooling device, when the preset high-temperature condition and the operation condition of the electric control device are not met (namely the temperature detection value does not meet the preset high-temperature condition and the electric control device stops operating), delaying the preset time and then stopping the operation of the cooling device.
Specifically, when the control device judges whether the electric control device has a cooling requirement according to the temperature flag signal and the start flag signal of the electric control device, the control device controls the cooling device to stop running (close the valve) when the processor does not receive the time length of the over-temperature flag signal generated by the OR gate circuit based on the temperature flag signal or the start flag signal of the electric control device (for example, the radio frequency flag signal sent by the radio frequency power supply) is longer than the preset time delay time length.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A cooling assembly is used for cooling an electric control device in semiconductor process equipment and is characterized in that the cooling assembly comprises a temperature sensing device, a cooling device and a control device, the control device obtains a temperature detection value of the electric control device through the temperature sensing device, the control device comprises a processor, and the processor is used for controlling the cooling device to cool the electric control device when the temperature detection value meets a preset high-temperature condition or the electric control device runs.
2. The cooling assembly according to claim 1, wherein the control device includes at least one temperature comparison module, the temperature comparison module obtains temperature detection values of components in the electronic control device through the temperature sensing device, and compares each temperature detection value with a preset temperature value corresponding to the temperature detection value, and the processor determines whether the preset high temperature condition is met according to the comparison result, wherein the preset high temperature condition includes: at least one temperature detection value is higher than a corresponding preset temperature value.
3. The cooling assembly of claim 2, wherein the temperature sensing device comprises a plurality of temperature sensors, the temperature comparison module and the temperature sensors are arranged in a one-to-one correspondence, and the plurality of temperature sensors are respectively used for detecting the temperatures of different components in the electric control device.
4. The cooling assembly of claim 2, wherein the control device comprises an or gate circuit, and the temperature comparison module is configured to send a temperature flag signal to the or gate circuit when the detected temperature value is higher than a corresponding preset temperature value;
the OR gate circuit sends an over-temperature mark signal to the processor based on the temperature mark signal and the starting mark signal of the electric control device, and the processor is used for controlling the cooling device to cool the electric control device when receiving the over-temperature mark signal.
5. The cooling assembly of claim 4 wherein the control means includes a delay module for delaying the operation of the cooling means for a predetermined period of time when the cooling means is in operation and the over-temperature flag signal is not received.
6. The cooling assembly of any one of claims 1-5, wherein the cooling device includes a cooling fluid line and a valve disposed on the cooling fluid line, the cooling fluid line is configured to cool the electronic control device, and the processor is configured to control the valve to open or close to control the cooling device to start or stop operating.
7. Semiconductor processing equipment comprising an electrical control device, in which a cooling module is provided, characterized in that the cooling module is a cooling module according to any one of claims 1 to 6.
8. The semiconductor processing apparatus of claim 7, wherein the electrical control device is a radio frequency power source capable of sending a radio frequency identification signal to the control device during operation, and the processor of the control device is further configured to determine that the electrical control device is in an operational state upon receiving the radio frequency identification signal sent by the radio frequency power source.
9. A method of cooling an electrically controlled device used in a semiconductor processing apparatus, comprising:
acquiring a temperature detection value of the electric control device through the temperature sensing device;
and when the temperature detection value meets a preset high-temperature condition or the electric control device runs, controlling a cooling device to cool the electric control device.
10. The cooling method of claim 9, further comprising:
and in the operation of the cooling device, when the preset high-temperature condition and the operation condition of the electric control device are not met, prolonging the operation of the cooling device for a preset delay time.
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