CN112259472A - Semiconductor cleaning equipment and cleaning medium temperature control method - Google Patents
Semiconductor cleaning equipment and cleaning medium temperature control method Download PDFInfo
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- CN112259472A CN112259472A CN202011089379.XA CN202011089379A CN112259472A CN 112259472 A CN112259472 A CN 112259472A CN 202011089379 A CN202011089379 A CN 202011089379A CN 112259472 A CN112259472 A CN 112259472A
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- 238000000034 method Methods 0.000 title claims abstract description 159
- 238000004140 cleaning Methods 0.000 title claims abstract description 144
- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- 238000005057 refrigeration Methods 0.000 claims abstract description 92
- 238000010438 heat treatment Methods 0.000 claims abstract description 72
- 239000000110 cooling liquid Substances 0.000 claims description 50
- 238000001816 cooling Methods 0.000 claims description 24
- 239000002826 coolant Substances 0.000 claims description 20
- 238000004364 calculation method Methods 0.000 claims description 3
- 230000001186 cumulative effect Effects 0.000 claims description 2
- 239000012530 fluid Substances 0.000 abstract description 10
- 230000001276 controlling effect Effects 0.000 description 13
- 239000007788 liquid Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000003814 drug Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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Abstract
The invention provides semiconductor cleaning equipment which comprises a process tank, a heating assembly, a refrigerating assembly, a temperature measuring piece and a controller, wherein the temperature measuring piece is used for measuring the actual temperature of a cleaning medium in the process tank; the controller is used for starting the refrigeration assembly when the actual temperature is greater than or equal to the preset refrigeration starting temperature; when the actual temperature is lower than the preset refrigeration closing temperature, closing the refrigeration assembly, and opening the heating assembly; when the actual temperature of the cleaning medium is greater than or equal to the preset target process temperature, closing the heating assembly; wherein the refrigeration start temperature is greater than the target process temperature, which is greater than the refrigeration shut-off temperature. According to the invention, the controller can start the refrigeration assembly when the temperature of the fluid in the process chamber is too high, and the fluid in the process chamber is rapidly cooled through the refrigeration assembly, so that the precision and reliability of the semiconductor cleaning equipment for controlling the temperature of the fluid in the process chamber are improved. The invention also provides a cleaning medium temperature control method.
Description
Technical Field
The invention relates to the field of semiconductor technology, in particular to semiconductor cleaning equipment and a cleaning medium temperature control method applied to the semiconductor cleaning equipment.
Background
In a semiconductor cleaning process, a temperature field of a fluid near a wafer has a crucial influence on an actual process effect, and a corresponding heating module is often arranged in a semiconductor cleaning device and used for controlling the temperature of the fluid in a process chamber so as to ensure that a semiconductor process is performed within a proper temperature interval. The existing semiconductor cleaning equipment often has the problem of overhigh temperature of fluid in a process chamber, and an ideal process effect is difficult to achieve.
Disclosure of Invention
The present invention is directed to providing a semiconductor cleaning apparatus capable of precisely controlling an actual temperature of a fluid in a process chamber and a cleaning medium temperature control method applied to the semiconductor cleaning apparatus.
To achieve the above objects, as one aspect of the present invention, there is provided a semiconductor cleaning apparatus including a process tank, a heating assembly, a cooling assembly, a temperature measuring member, and a controller, wherein,
the process tank is used for bearing a cleaning medium;
the heating assembly is used for heating the cleaning medium;
the refrigerating assembly is used for cooling the cleaning medium;
the temperature measuring part is used for measuring the actual temperature of the cleaning medium;
the controller is used for starting the refrigeration assembly when the actual temperature is greater than or equal to a preset refrigeration starting temperature; when the actual temperature is lower than a preset refrigeration closing temperature, closing the refrigeration assembly and opening the heating assembly; when the actual temperature of the cleaning medium is greater than or equal to a preset target process temperature, closing the heating assembly;
wherein the refrigeration turn-on temperature is greater than the target process temperature, which is greater than the refrigeration turn-off temperature.
Preferably, the controller is further configured to maintain a current working state of the refrigeration component when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the refrigeration opening temperature; and when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the target process temperature, maintaining the current working state of the heating assembly.
Preferably, the controller is further configured to cyclically obtain a temperature difference between the target process temperature and the actual temperature through the temperature measuring part after the heating assembly is started, and adjust the power of the heating assembly according to the temperature difference to reduce the temperature difference.
Preferably, the controller is configured to obtain a power adjustment value of the heating assembly according to the following calculation formula, and adjust the power of the heating assembly according to the power adjustment value:
wherein P is a power adjustment value of the heating assembly, kpTo adjust the proportionality coefficient, kiIs an integral coefficient, kdFor the derivative coefficient, error is the temperature difference for the current cycle, Δ error is the temperature difference for the previous cycle, and Σ error is the cumulative value of the temperature differences over multiple cycles.
Preferably, a circulation passage is arranged on the process tank, and the inlet end and the outlet end of the circulation passage are both communicated with the process tank; the circulating pump is arranged on the circulating passage and is used for enabling the cleaning medium in the process tank to flow into the circulating passage from the inlet end and flow back to the process tank from the outlet end; the heating assembly is disposed on the circulation path.
Preferably, the heating assembly includes a heater and a solid-state relay for controlling heating power of the heater, and the controller controls the heating power of the heater by outputting a control signal to the solid-state relay.
Preferably, the refrigeration assembly comprises a heat exchanger and a cooling liquid pipe, the heat exchanger is arranged on the circulation path, the cooling liquid pipe is arranged in the heat exchanger, a cooling liquid valve is arranged on the cooling liquid pipe, when the cooling liquid valve is opened, cooling liquid is introduced into the cooling liquid pipe, and the cooling liquid absorbs heat of the cleaning medium in the heat exchanger;
the controller is also used for sending a refrigeration opening instruction to the cooling liquid valve to open the cooling liquid valve; and sending a refrigeration closing instruction to the cooling liquid valve to close the cooling liquid valve.
Preferably, the refrigeration assembly comprises a cooling disc and a cooling liquid pipe, the cooling disc is arranged in the process tank, the cooling liquid pipe is arranged in the cooling disc, a cooling liquid valve is arranged on the cooling liquid pipe, when the cooling liquid valve is opened, cooling liquid is introduced into the cooling liquid pipe, and the cooling disc absorbs heat of the cleaning medium in the process tank;
the controller is also used for sending a refrigeration opening instruction to the cooling liquid valve to open the cooling liquid valve; and sending a refrigeration closing instruction to the cooling liquid valve to close the cooling liquid valve.
As a second aspect of the present invention, there is provided a cleaning medium temperature control method applied to the aforementioned semiconductor cleaning apparatus, the method comprising:
cyclically detecting the actual temperature of the cleaning medium;
when the actual temperature is greater than or equal to a preset refrigeration starting temperature, starting a refrigeration assembly to cool the cleaning medium;
when the actual temperature is lower than a preset refrigeration closing temperature, closing the refrigeration assembly, and opening the heating assembly to heat the cleaning medium;
when the actual temperature is greater than or equal to a preset target process temperature, closing the heating assembly;
wherein the refrigeration turn-on temperature is greater than the target process temperature, which is greater than the refrigeration turn-off temperature.
Preferably, the method further comprises:
when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the refrigeration opening temperature, the current working state of the refrigeration assembly is kept;
and when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the target process temperature, maintaining the current working state of the heating assembly.
In the semiconductor cleaning equipment and the cleaning medium temperature control method provided by the invention, the controller can quickly respond when the actual temperature of the cleaning medium in the process tank is too high, the refrigeration assembly is started, and the cleaning medium in the process tank is quickly cooled through the refrigeration assembly, so that the cleaning medium in the process tank is prevented from being in a high-temperature state for a long time to influence the reaction in the process tank or cause decomposition of partial components in the cleaning medium due to high temperature, the precision and the reliability of the semiconductor cleaning equipment in controlling the temperature of the cleaning medium in the process tank are improved, and the process effect of a semiconductor process is further improved.
In addition, the semiconductor cleaning equipment and the temperature control method provided by the invention can effectively save the waiting time for automatically cooling the cleaning medium in the process tank, thereby improving the efficiency of the semiconductor process.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a magnitude relationship between temperature information related to the temperature control of the cleaning medium by the controller in the semiconductor cleaning apparatus according to the embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a connection relationship between a controller and other components in the semiconductor cleaning apparatus according to an embodiment of the present invention;
fig. 4 is a schematic flow chart of a cleaning medium temperature control method according to an embodiment of the present invention.
Description of reference numerals:
10: a process tank 20: heating assembly
21: heater 22: solid state relay
31: cooling liquid pipe 32: heat exchanger
33: coolant valve 40: temperature measuring piece
50: circulating pump
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The inventor of the invention finds out in experimental research that the existing semiconductor cleaning equipment often has the problem of overhigh temperature of the fluid in the process chamber, and the ideal process effect is difficult to achieve. Taking a cleaning device as an example, the cleaning device in the silicon wafer manufacturing process is generally divided into a single wafer type and a tank type (multi-wafer type), wherein a tank type cleaning machine is used for soaking a silicon wafer in a process tank by using a manipulator, and the surface of the silicon wafer and a cleaning liquid medicine are subjected to chemical reaction under a specific environment to clean impurities such as chemical agents, particles, metals and the like remained on the surface of the silicon wafer.
In the chemical reaction of liquid preparation of some process tanks, the chemical reaction of liquid supplement of some process tanks and the cleaning process of some process tanks, certain heat is released in the chemical reaction process of silicon wafer impurities and cleaning liquid medicine (for example, the cleaning liquid medicine in an SPM process tank is usually prepared by mixing concentrated sulfuric acid and hydrogen peroxide according to a certain proportion, and a large amount of heat is released in the liquid preparation process, so that the temperature of the liquid medicine of a cleaning tank is easily over-high, but the cooling speed is slow only depending on room temperature, the normal process temperature cannot be recovered for a long time, and the decomposition of the hydrogen peroxide can be accelerated at an excessively high temperature). The above-described problems also exist in some other kinds of semiconductor devices (e.g., semiconductor devices that perform reactions in a gaseous environment).
Therefore, the control of the fluid temperature in the process chamber is a key point influencing the semiconductor process, and how to provide a control scheme beneficial to improving the control precision of the fluid temperature in the process chamber becomes a technical problem to be solved in the field.
In order to solve the above technical problems, as one aspect of the present invention, there is provided a semiconductor cleaning apparatus, as shown in fig. 1, comprising a process tank 10, a heating assembly 20, a cooling assembly, a temperature measuring member 40, and a controller (not shown in the figure), wherein:
the process tank 10 is used for bearing cleaning media;
the heating assembly 20 is used for heating the cleaning medium in the process tank 10;
the refrigeration assembly is used for cooling the cleaning medium in the process tank 10:
the temperature measuring part 40 is used for measuring the actual temperature of the cleaning medium;
the controller is used for starting the refrigeration assembly when the actual temperature aT of the cleaning medium is greater than or equal to a preset refrigeration starting temperature cwOpet; when the actual temperature aT of the cleaning medium is less than the preset refrigeration closing temperature cwclosed t, the refrigeration component is closed and the heating component 20 is turned on; when the actual temperature aT of the cleaning medium is greater than or equal to the preset target process temperature setT, the heating assembly 20 is turned off.
Wherein the refrigeration opening temperature cwOpenT is greater than the target process temperature setT, which is greater than the refrigeration closing temperature cwCloseT.
The type of the Controller is not specifically limited in the embodiments of the present invention, and for example, the Controller may be a Programmable Logic Controller (PLC).
In the invention, the semiconductor cleaning equipment comprises a heating component 20 and a refrigerating component, and the controller can quickly respond when the actual temperature aT of the cleaning medium in the process tank 10 is too high (higher than the refrigerating opening temperature cwOpt), and the refrigerating component is started to quickly cool the cleaning medium in the process tank 10 through the refrigerating component, so that the influence of the cleaning medium in the process tank 10 on the reaction performed in the process tank 10 when the cleaning medium is in a high-temperature state for a long time or the decomposition of partial components in the cleaning medium due to high temperature is prevented, the precision and the reliability of the semiconductor cleaning equipment on the temperature control of the cleaning medium in the process tank 10 are improved, and the process effect of the semiconductor process is further improved.
In addition, the semiconductor cleaning equipment provided by the invention can effectively save the waiting time for automatically cooling the cleaning medium in the process tank 10, thereby improving the efficiency of the semiconductor process.
In order to improve the stability of the controller in controlling the temperature of the cleaning medium, preferably, the controller is further configured to maintain the current working state of the refrigeration component when the actual temperature aT of the cleaning medium in the process tank 10 is greater than or equal to the refrigeration closing temperature cwclosed t and less than the refrigeration opening temperature cwOpenT; when the actual temperature aT of the cleaning medium is greater than or equal to the refrigeration shut-off temperature cwCloseT and less than the target process temperature setT, the current operating state of the heating assembly 20 is maintained. In the process of controlling the temperature of the cleaning medium by the controller, the heating assembly 20 and the refrigerating assembly can be simultaneously started to ensure that the temperature of the cleaning medium is stably changed.
To ensure that the semiconductor process is performed within a suitable temperature range, as shown in fig. 2, the refrigeration open temperature cwOpenT is preferably less than the upper limit of the process temperature for performing the semiconductor process, and the refrigeration close temperature cwclosett is preferably greater than the lower limit of the process temperature for performing the semiconductor process (i.e., the upper limit of the process temperature H _ T > the refrigeration open temperature cwOpenT > the target process temperature setT > the refrigeration close temperature cwclosett > the lower limit of the process temperature L _ T), so that the heating element 20 or the refrigeration element is activated in time before the temperature is increased to be able to decompose or reduce the critical components in the cleaning medium to stop the reaction.
It should be noted that the target process temperature setT is an ideal ambient temperature of the semiconductor process, and the target process temperature setT may have different values for different types of semiconductor processes.
In order to facilitate the setting of the target process temperature setT by the operator according to the type of semiconductor process, the target process temperature setT may preferably be manually input to the controller by the operator.
To further increase the stability of controlling the temperature of the cleaning medium in the process tank 10, the controller is preferably further configured to: after the heating assembly 20 is turned on, the temperature measuring part 40 cyclically obtains the temperature difference between the target process temperature setT and the actual temperature aT of the cleaning medium in the process tank 10, and adjusts the power of the heating assembly 20 according to the temperature difference to reduce the temperature difference, generally, the power of the heating assembly 20 is positively correlated with the temperature difference.
In the embodiment of the present invention, the controller cyclically adjusts the power of the heating element 20 according to the temperature difference between the target process temperature setT and the actual temperature aT of the cleaning medium in the process tank 10, so that the power of the heating element 20 is feedback-controlled by the temperature difference, the actual temperature aT of the cleaning medium in the process tank 10 approaches the target process temperature setT, and the efficiency and stability of controlling the temperature of the cleaning medium in the process tank 10 are improved.
The feedback control algorithm is not specifically limited in the embodiment of the present invention, for example, the feedback control algorithm may be a pid (probability Integral differential) algorithm, and specifically, the controller may obtain a power adjustment value of the heating element 20 according to the following calculation formula, and adjust the power of the heating element 20 according to the power adjustment value:
wherein P is the power adjustment value of the heating assembly, kpTo adjust the proportionality coefficient, kiIs an integral coefficient, kdAnd the error is a differential coefficient, the error is the temperature difference value of the current cycle, the delta error is the temperature difference value of the previous cycle, and the sigma error is the accumulated value of the temperature difference values in a plurality of cycle periods.
The embodiment of the present invention does not specifically limit how the heating element 20 and the cooling element are contacted with the cleaning medium in the process tank 10, for example, as an alternative embodiment of the present invention, as shown in fig. 1, a circulation passage is provided on the process tank 10, an inlet end and an outlet end of the circulation passage are both communicated with the process tank 10, a circulation pump 50 is provided on the circulation passage for making the cleaning medium in the process tank 10 flow into the circulation passage from the inlet end and flow back to the process tank 10 from the outlet end, and the heating element 20 is provided on the circulation passage for heating the cleaning medium flowing through the circulation passage.
The structure of the heating assembly 20 is not particularly limited in the embodiment of the present invention, for example, as an alternative embodiment of the present invention, as shown in fig. 3, the heating assembly 20 includes a heater 21 and a solid-state relay 22, the solid-state relay 22 is used for controlling the heating power of the heater 21, and the controller controls the heating power of the heater 21 by outputting a control signal to the solid-state relay 22.
Specifically, the power adjustment value may be a percentage of the actual power of the heater 21 to the rated power of the heating element, and the controller sends the power adjustment value to the solid-state relay 22, so that the solid-state relay 22 adjusts the actual power of the heater 21 according to the power adjustment value.
The structure of the refrigeration assembly is not specifically limited in the embodiment of the present invention, for example, as an alternative embodiment of the present invention, as shown in fig. 1, the refrigeration assembly includes a heat exchanger 32 and a coolant pipe 31, the heat exchanger 32 is disposed on the circulation path, the coolant pipe 31 is disposed in the heat exchanger 32, a coolant valve 33 is disposed on the coolant pipe 31, when the coolant valve 33 is opened, the coolant is introduced into the coolant pipe 31, so that the coolant absorbs the heat of the cleaning medium in the heat exchanger 32;
the controller is also used for sending a refrigeration opening instruction to the cooling liquid valve 33 to open the cooling liquid valve 33; and, a cooling closing command is sent to the coolant valve 33 to close the coolant valve 33.
As another alternative embodiment of the present invention, the refrigeration assembly may include a cooling tray disposed in the process tank 10 and a cooling liquid pipe disposed in the cooling tray, the cooling liquid pipe being provided with a cooling liquid valve, and when the cooling liquid valve is opened, the cooling liquid pipe is introduced with cooling liquid, so that the cooling tray absorbs heat of the cleaning medium in the process tank 10;
the controller is also used for sending a refrigeration opening instruction to the cooling liquid valve to open the cooling liquid valve; and sending a cooling closing instruction to the cooling liquid valve to close the cooling liquid valve.
The structural type of the temperature measuring member 40 is not particularly limited in the embodiment of the present invention, for example, optionally, the temperature measuring member 40 may include a temperature measuring thermocouple.
Optionally, the controller may include:
the CPU module is used for storing a cleaning medium temperature control program and controlling other modules in the PLC controller to realize the temperature control steps provided by the invention when the cleaning medium temperature control program is executed;
a DO module, configured to start or close the refrigeration component according to an instruction of the CPU module (specifically, a refrigeration opening instruction or a refrigeration closing instruction may be sent to the coolant valve 33);
an RTD module for receiving the temperature detection value of the temperature measurement component 40 (temperature measurement thermocouple) and transmitting the detection value to the CPU module;
and the AO module is used for outputting 4-20ma signals to control the solid-state relay 22 in the heating component 20, so that the solid-state relay 22 adjusts the on-off frequency of the heater 21, and further the heater 21 is controlled.
The embodiment of the invention adjusts the temperature of the cleaning medium in the process tank 10 by the multi-interval temperature control method based on the controller, has high real-time performance, high reliability and strong controllability, and can effectively improve the process effect of the semiconductor process performed in the process tank 10.
The type of the semiconductor cleaning apparatus is not particularly limited in the embodiments of the present invention, for example, optionally, the semiconductor cleaning apparatus may be a tank type cleaning machine, the process tank 10 may be a cleaning tank, and the cleaning medium in the process tank 10 may be cleaning solution. In the embodiment, the semiconductor cleaning equipment provided by the invention can solve the problem that the temperature range of the process tank liquid medicine cannot be recovered to the normal process temperature range for a long time due to liquid preparation, liquid supplement and heat release of the process tank cleaning liquid medicine, shorten the time for recovering the temperature to the normal state, improve the precision and the reliability of the temperature of the cleaning liquid medicine, and improve the process effect and the productivity of the equipment.
In some other embodiments of the present invention, the semiconductor cleaning apparatus may also be a semiconductor cleaning apparatus for performing a semiconductor process in a gaseous environment, and the cleaning medium in the process tank 10 may be a process gas.
As a second aspect of the present invention, there is provided a cleaning medium temperature control method applied to a semiconductor cleaning apparatus provided by an embodiment of the present invention, the method including:
cyclically detecting the actual temperature aT of the cleaning medium;
when the actual temperature aT is greater than or equal to the preset refrigeration starting temperature cwOpenT, starting the refrigeration assembly to cool the cleaning medium;
when the actual temperature aT is less than the preset refrigeration closing temperature cwCloseT, closing the refrigeration assembly, and starting the heating assembly 20 to heat the cleaning medium;
when the actual temperature aT is greater than or equal to the preset target process temperature setT, the heating assembly 20 is turned off;
wherein the refrigeration opening temperature cwOpenT is greater than the target process temperature setT, which is greater than the refrigeration closing temperature cwCloseT.
To improve the smoothness of the controller in controlling the temperature of the cleaning medium, preferably, the method further comprises:
when the actual temperature aT is greater than or equal to the refrigeration closing temperature cwCloseT and less than the refrigeration opening temperature cwOpenT, keeping the current working state of the refrigeration assembly; and when the actual temperature aT is greater than or equal to the refrigeration closing temperature cwCloseT and less than the target process temperature setT, maintaining the current working state of the heating assembly. In the process of controlling the temperature of the cleaning medium by the controller, the heating assembly 20 and the refrigerating assembly can be simultaneously started to ensure that the temperature of the cleaning medium is stably changed.
In the cleaning medium temperature control method provided by the invention, based on the heating component 20 and the refrigerating component in the semiconductor cleaning equipment, the controller can quickly respond when the actual temperature aT of the cleaning medium in the process tank 10 is too high, the refrigerating component is started, and the cleaning medium in the process tank 10 is quickly cooled through the refrigerating component, so that the cleaning medium in the process tank 10 is prevented from being in a high-temperature state for a long time to influence the reaction in the process tank 10 or cause decomposition of partial components in the cleaning medium due to high temperature, the precision and the reliability of the semiconductor cleaning equipment in controlling the temperature of the cleaning medium in the process tank 10 are improved, and the process effect of a semiconductor process is further improved.
In addition, the cleaning medium temperature control method provided by the invention can effectively save the waiting time for automatically cooling the cleaning medium in the process tank 10, thereby improving the efficiency of the semiconductor process.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. The semiconductor cleaning equipment is characterized by comprising a process tank, a heating component, a refrigerating component, a temperature measuring component and a controller, wherein,
the process tank is used for bearing a cleaning medium;
the heating assembly is used for heating the cleaning medium;
the refrigerating assembly is used for cooling the cleaning medium;
the temperature measuring part is used for measuring the actual temperature of the cleaning medium;
the controller is used for starting the refrigeration assembly when the actual temperature is greater than or equal to a preset refrigeration starting temperature; when the actual temperature is lower than a preset refrigeration closing temperature, closing the refrigeration assembly and opening the heating assembly; when the actual temperature of the cleaning medium is greater than or equal to a preset target process temperature, closing the heating assembly;
wherein the refrigeration turn-on temperature is greater than the target process temperature, which is greater than the refrigeration turn-off temperature.
2. The semiconductor cleaning device according to claim 1, wherein the controller is further configured to maintain a current operating state of the cooling component when the actual temperature is greater than or equal to the cooling-off temperature and less than the cooling-on temperature; and when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the target process temperature, maintaining the current working state of the heating assembly.
3. The semiconductor cleaning apparatus according to claim 1, wherein the controller is further configured to cyclically obtain a temperature difference between the target process temperature and the actual temperature through the temperature measuring member after the heating assembly is turned on, and adjust the power of the heating assembly according to the temperature difference to reduce the temperature difference.
4. The semiconductor cleaning apparatus according to claim 3, wherein the controller is configured to obtain a power adjustment value of the heating assembly according to the following calculation formula, and adjust the power of the heating assembly according to the power adjustment value:
P＝kp×error+ki×Σerror+kd×Δerror
wherein P is a power adjustment value of the heating assembly, kpTo adjust the proportionality coefficient, kiIs an integral coefficient, kdFor the derivative coefficient, error is the temperature difference for the current cycle, Δ error is the temperature difference for the previous cycle, and Σ error is the cumulative value of the temperature differences over multiple cycles.
5. The semiconductor cleaning equipment according to any one of claims 1 to 4, wherein a circulation passage is provided in the process tank, and an inlet end and an outlet end of the circulation passage are both communicated with the process tank; the circulating pump is arranged on the circulating passage and is used for enabling the cleaning medium in the process tank to flow into the circulating passage from the inlet end and flow back to the process tank from the outlet end; the heating assembly is disposed on the circulation path.
6. The semiconductor cleaning apparatus according to claim 5, wherein the heating assembly includes a heater and a solid-state relay for controlling heating power of the heater, and the controller controls the heating power of the heater by outputting a control signal to the solid-state relay.
7. The semiconductor cleaning device according to claim 5, wherein the refrigeration assembly comprises a heat exchanger and a coolant pipe, the heat exchanger is arranged on the circulation path, the coolant pipe is arranged in the heat exchanger, a coolant valve is arranged on the coolant pipe, when the coolant valve is opened, a coolant is introduced into the coolant pipe, and the coolant absorbs heat of the cleaning medium in the heat exchanger;
the controller is also used for sending a refrigeration opening instruction to the cooling liquid valve to open the cooling liquid valve; and sending a refrigeration closing instruction to the cooling liquid valve to close the cooling liquid valve.
8. The semiconductor cleaning apparatus according to claim 5, wherein the cooling assembly comprises a cooling tray disposed in the process tank and a cooling liquid pipe disposed in the cooling tray, the cooling liquid pipe is provided with a cooling liquid valve, when the cooling liquid valve is opened, the cooling liquid pipe is filled with cooling liquid, and the cooling tray absorbs heat of the cleaning medium in the process tank;
the controller is also used for sending a refrigeration opening instruction to the cooling liquid valve to open the cooling liquid valve; and sending a refrigeration closing instruction to the cooling liquid valve to close the cooling liquid valve.
9. A cleaning medium temperature control method applied to the semiconductor cleaning apparatus according to any one of claims 1 to 8, characterized by comprising:
cyclically detecting the actual temperature of the cleaning medium;
when the actual temperature is greater than or equal to a preset refrigeration starting temperature, starting a refrigeration assembly to cool the cleaning medium;
when the actual temperature is lower than a preset refrigeration closing temperature, closing the refrigeration assembly, and opening the heating assembly to heat the cleaning medium;
when the actual temperature is greater than or equal to a preset target process temperature, closing the heating assembly;
wherein the refrigeration turn-on temperature is greater than the target process temperature, which is greater than the refrigeration turn-off temperature.
10. The method of claim 9, further comprising:
when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the refrigeration opening temperature, the current working state of the refrigeration assembly is kept;
and when the actual temperature is greater than or equal to the refrigeration closing temperature and less than the target process temperature, maintaining the current working state of the heating assembly.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556926A (en) * | 2021-07-16 | 2021-10-26 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and cooling assembly and cooling method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960025312U (en) * | 1994-12-01 | 1996-07-22 | 엘지반도체주식회사 | Automatic temperature and flow control device for semiconductor manufacturing cleaning tank |
| CN101359578A (en) * | 2007-08-05 | 2009-02-04 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning method and apparatus |
| KR20140026949A (en) * | 2012-08-24 | 2014-03-06 | 주식회사 글로벌스탠다드테크놀로지 | Temperature control of semiconductor manufacturing equipment and its control method |
| JP2014099086A (en) * | 2012-11-15 | 2014-05-29 | Mitsubishi Electric Corp | Temperature control system and method for controlling the same |
| CN107086188A (en) * | 2016-09-09 | 2017-08-22 | 深圳市新纶科技股份有限公司 | A kind of wafer cleaning device |
| CN108172533A (en) * | 2017-12-25 | 2018-06-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | control system, method and wafer cleaning device |
-
2020
- 2020-10-13 CN CN202011089379.XA patent/CN112259472B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960025312U (en) * | 1994-12-01 | 1996-07-22 | 엘지반도체주식회사 | Automatic temperature and flow control device for semiconductor manufacturing cleaning tank |
| CN101359578A (en) * | 2007-08-05 | 2009-02-04 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning method and apparatus |
| KR20140026949A (en) * | 2012-08-24 | 2014-03-06 | 주식회사 글로벌스탠다드테크놀로지 | Temperature control of semiconductor manufacturing equipment and its control method |
| JP2014099086A (en) * | 2012-11-15 | 2014-05-29 | Mitsubishi Electric Corp | Temperature control system and method for controlling the same |
| CN107086188A (en) * | 2016-09-09 | 2017-08-22 | 深圳市新纶科技股份有限公司 | A kind of wafer cleaning device |
| CN108172533A (en) * | 2017-12-25 | 2018-06-15 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | control system, method and wafer cleaning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556926A (en) * | 2021-07-16 | 2021-10-26 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment and cooling assembly and cooling method thereof |
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