KR200457049Y1 - monitoring apparatus for semiconductor manufacturing equipment - Google Patents

monitoring apparatus for semiconductor manufacturing equipment Download PDF

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Publication number
KR200457049Y1
KR200457049Y1 KR2020110008797U KR20110008797U KR200457049Y1 KR 200457049 Y1 KR200457049 Y1 KR 200457049Y1 KR 2020110008797 U KR2020110008797 U KR 2020110008797U KR 20110008797 U KR20110008797 U KR 20110008797U KR 200457049 Y1 KR200457049 Y1 KR 200457049Y1
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KR
South Korea
Prior art keywords
high voltage
voltage zone
cooling fan
semiconductor manufacturing
zone
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KR2020110008797U
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Korean (ko)
Inventor
한정훈
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(주)엠에프에스
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Priority to KR2020110008797U priority Critical patent/KR200457049Y1/en
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Publication of KR200457049Y1 publication Critical patent/KR200457049Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The present invention provides a real-time monitoring of the operating state of the cooling fan provided in the high voltage zone and the temperature change of the high voltage zone in a semiconductor manufacturing facility having a high voltage zone which is electrically disconnected from the outside and operated using a unique power source. The present invention relates to a monitoring device for a new semiconductor manufacturing facility.
The monitoring device of the semiconductor manufacturing equipment according to the present invention is installed in the high voltage zone 30, the detection sensor (41, 42) for detecting the RPM of the cooling fan 34 and the temperature inside the high voltage zone 30, and the high voltage zone ( 30 is installed outside the display module 60 is connected to the sensing sensors (41, 42) and the data communication through the optical cable 50, the cooling fan (while maintaining the electrical cutoff of the high-voltage zone (30) ( There is an advantage to monitor the operating state of the 34 or the temperature inside the high-voltage zone (30).

Description

Monitoring apparatus for semiconductor manufacturing equipment

The present invention can be monitored in real time the operating state of the cooling fan provided in the high voltage zone and the temperature change inside the high voltage zone in a semiconductor manufacturing facility having a high voltage zone that is electrically isolated from the outside and operated using a unique power source. The present invention relates to a monitoring device for a new semiconductor manufacturing facility.

In general, a semiconductor manufacturing process includes an implant process for forming a pattern on the surface of a wafer with an ion beam by using a medium or high cleat facility.

As shown in FIG. 1, the medium or high cleat facility is operated by a load port 10 for loading a wafer, a general voltage zone 20 operated by a general commercial power source, and a high voltage power source. It consists of a high voltage zone 30 and the like.

The high voltage zone 30 is provided with a gas box 31 in which gas is stored to convert the gas stored in the gas box 31 into an ion gas used in an implant process using high pressure electricity.

In this case, since the high voltage region 30 uses very high voltage electricity, an arc may be generated when it is electrically connected to the outside. Accordingly, the high voltage zone 30 has a generator 32 and a controller 33 for generating high voltage electricity, and is output from the internal generator 32 in a state in which the high voltage zone 30 is completely electrically disconnected from the outside. It is configured to operate only with electricity.

In addition, a plurality of cooling fans 34 operated by electricity output from the generator 32 are installed in each portion of the high voltage zone 30 so as to cool the high voltage zone 30.

However, since the high voltage zone 30 is electrically disconnected from the outside, even if an abnormality occurs in the operation of the cooling fan 34 or the internal temperature of the high voltage zone 30 is abnormally raised, it can be monitored in real time. There was no way.

Therefore, when an operation abnormality occurs in the cooling fan 34 or when the temperature rises inside the high voltage region 30, it is not detected in real time, and a follow-up action is required only when an operation abnormality or a fire occurs in the high voltage region 30. This occurred.

This problem is not limited to the above-described medium or high-clan facilities, and the same has occurred in semiconductor manufacturing facilities having high voltage zones that operate independently with completely disconnected electrical connections to the outside.

Therefore, there is a need for a new method for monitoring the operating state of the cooling fan 34 or the internal temperature of the high voltage zone 30 while keeping the high voltage zone 30 completely electrically disconnected from the outside.

On the other hand, in the semiconductor manufacturing equipment, when the load port 10 is switched to the idling state, the general voltage zone 20 and the high voltage zone 30 are automatically switched to the idling state according to a predetermined sequence without additional external manipulation. It is configured to be.

The present invention is to solve the above problems, in a semiconductor manufacturing facility having a high voltage zone that is electrically disconnected from the outside and operated using a unique power source, while maintaining the state in which the high voltage zone is completely electrically disconnected from the outside It is an object of the present invention to provide a monitoring device of a new semiconductor manufacturing facility that can monitor in real time the operating state of the cooling fan provided in the high voltage zone and the temperature change inside the high voltage zone.

The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention by those skilled in the art.

According to the present invention for achieving the above object, the generator 32, the cooling fan 34 and the controller 33 is provided and has a high voltage zone 30 that operates independently in a completely electrically isolated state In the semiconductor manufacturing facility, installed in the high voltage zone 30 is operated by the power output from the generator 32 to detect the operating state of the cooling fan 34 or the internal temperature of the high voltage zone 30. The display is installed on the outside of the high voltage region 30 and the detection sensor (41, 42) is operated by a common commercial power source and is connected to the detection sensor (41, 42) and data communication through the optical cable 50 Provided is a monitoring device for a semiconductor manufacturing facility, comprising a module 60.

According to another feature of the present invention, the detection sensor (41, 42) is provided in front of the cooling fan 34, RPM sensor 41 for measuring the rotational speed of the cooling fan 34, and the high voltage zone A monitoring apparatus for a semiconductor manufacturing facility is provided which includes a temperature sensor 42 installed inside the 30 to measure the temperature of each part inside the high voltage region 30.

According to another feature of the present invention, the RPM sensor 41, the infrared irradiation unit 41a for irradiating infrared rays to the front surface of the blade 34a of the cooling fan 34, and from the front surface of the blade 34a Provided is a monitoring apparatus for a semiconductor manufacturing facility, comprising an infrared receiver 41b for receiving reflected infrared light.

According to another feature of the present invention, by monitoring the signals of the detection sensors (41, 42) received by the display module 60, the RPM of the cooling fan 34 is lowered below the set reference value or of the high voltage region 30 There is provided a monitoring device of a semiconductor manufacturing facility, characterized in that it further comprises an alarm means (61) for outputting an alarm when the internal temperature rises above a set reference value.

According to another feature of the present invention, the semiconductor manufacturing equipment includes a load port 10 for loading a wafer, connected to the load port 10 and the detection sensor 41, received in the display module 60 The control unit 70 further monitors the signal of 42, wherein the control unit 70 is lowered below the set reference value RPM of the cooling fan 34 or the internal temperature of the high-voltage zone 30 is above the set reference value When raised to provide a monitoring device of a semiconductor manufacturing facility, characterized in that for outputting a control signal for switching the load port 10 to the idling state.

The monitoring device of the semiconductor manufacturing equipment according to the present invention is installed in the high voltage zone 30, the detection sensor (41, 42) for detecting the RPM of the cooling fan 34 and the temperature inside the high voltage zone 30, and the high voltage zone ( 30 is installed outside the display module 60 is connected to the sensing sensors (41, 42) and the data communication through the optical cable 50, the cooling fan (while maintaining the electrical cutoff of the high-voltage zone (30) ( There is an advantage to monitor the operating state of the 34 or the temperature inside the high-voltage zone (30).

1 is a block diagram showing a conventional semiconductor manufacturing equipment,
Figure 2 is a block diagram showing a monitoring device of a semiconductor manufacturing facility according to the present invention,
3 is a reference diagram showing an RPM sensor of a monitoring device of a semiconductor manufacturing facility according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 and 3 illustrate a monitoring apparatus of a semiconductor manufacturing apparatus according to the present invention, which illustrates that the semiconductor manufacturing apparatus is applied to a medium or a high cleat apparatus that forms a pattern on a surface of a wafer with an ion beam. .

In this case, the medium or high-clincher facility includes a load port 10 for loading a wafer, a general voltage zone 20 operated by a general commercial power supply, and a high voltage zone 30 operated by a high voltage power source. The high voltage zone 30 is provided with a gas box 31, a generator 32, a cooling fan 34 and a controller 33 to operate independently from the outside in a completely electrically disconnected state. Same as before.

And, according to the present invention, the monitoring device of the semiconductor manufacturing equipment is installed in the high voltage zone 30, as shown in Figure 2 operating state of the cooling fan 34 and the internal temperature of the high voltage zone 30 Detection sensors (41, 42) for detecting the display module 60 is installed on the outside of the high voltage region 30 and connected to the detection sensors (41, 42) for data communication, and the load port (10) It consists of a control unit 70 connected to.

In detail, the detection sensors 41 and 42 operate by using the electricity output from the generator 32 as power, and are provided in front of the cooling fan 34 to rotate the speed of the cooling fan 34. RPM sensor 41 to measure the, and is installed in the high voltage zone 30 is composed of a temperature sensor 42 for measuring the temperature of each part inside the high voltage zone (30).

As shown in FIG. 3, the RPM sensor 41 is reflected by an infrared irradiation part 41a for irradiating infrared rays to the front surface of the blade 34a of the cooling fan 34 and the front surface of the blade 34a. It consists of an infrared receiver 41b for receiving infrared rays, and measures the number of times the blade 34a passes one point during the reference time to measure the RPM of the cooling fan 34.

The temperature sensor 42 is fixed to a portion of the high voltage zone 30 to measure the temperature, preferably on the outer circumferential surface of the gas box 31 or on each part of the generator 32 and the controller 33. Measure the temperature of the part.

The RPM sensor 41 and the temperature sensor 42 configured as described above are generally used widely, and thus detailed description thereof will be omitted.

The display module 60 is configured as an LCD monitor and is operated by a general commercial power supplied from the outside. The display module 60 is connected to the sensing sensors 41 and 42 so as to enable data communication through an optical cable 50. The RPM of the cooling fan 34 and the temperature of each part inside the high voltage region 30 measured by 41 and 42 are displayed in real time.

To this end, an optical transmitter connected to one end of the optical cable 50 in the high voltage region 30 and converting a signal output from the sensing sensors 41 and 42 into an optical signal and outputting the optical signal to the optical cable 50 ( 51 is provided, and the display module 60 is provided with an optical receiver 52 connected to the other end of the optical cable 50 and receiving the optical signal transmitted through the optical cable 50. At this time, the optical transmitter 51 is operated by the power output from the generator 32 in the high voltage region 30, the optical receiver 52 is supplied to the general commercial power applied to the display module 60. Is operated by

In this way, since the configuration of the optical transmitter 51 and the optical receiver 52 for transmitting and receiving signals or data through the optical cable 50 is widely used in optical communication equipment, detailed description thereof will be omitted.

In addition, the display module 60 is connected to the alarm means 61 for outputting an alarm. The alarm means 61 is provided with a speaker and an alarm lamp, not shown, when the RPM of the cooling fan 34 is lowered below the set reference value or the internal temperature of the high-voltage zone 30 rises above the set reference value, Alarms are output using sound and light, allowing administrators to quickly recognize that an emergency has occurred.

The control unit 70 monitors the signals of the detection sensors 41 and 42 received by the display module 60, so that the RPM of the cooling fan 34 is lowered below a set reference value or inside the high voltage region 30. When the temperature rises above the set reference value, a control signal for switching the load port 10 to an idling state is output.

At this time, when the control signal is output from the control unit 70, the load port 10 is stopped after the operation according to a predetermined sequence is switched to the idling state, when the load port 10 is switched to the idling state The high voltage zone 30 is automatically switched to an idling state according to a predetermined sequence. Therefore, the load inside the high voltage region 30 is minimized to minimize the amount of heat generated.

Further, the reference value for outputting a control signal for the control unit 70 to switch the load port 10 to the idling state is set equal to the reference value at which the alarm means 61 is operated, so that in the alarm means 61 At the same time as the alarm is output, the control unit 70 outputs a control signal to switch the load port 10 to the idling state.

In this way, the monitoring device of the semiconductor manufacturing equipment according to the present invention is installed in the high-voltage zone (30) and the detection sensors (41, 42) for detecting the RPM of the cooling fan 34 and the temperature inside the high-voltage zone (30) and In addition, the display module 60 is installed outside the high voltage region 30 and connected to the sensing sensors 41 and 42 via the optical cable 50 to enable data communication.

Therefore, since the detection sensors 41 and 42 and the display module 60 are connected to each other only through the non-conducting optical cable 50, the cooling fan 34 is operated while maintaining the electrical cutoff of the high voltage region 30. There is an advantage to monitor the status or temperature inside the high-voltage zone 30

In addition, when the RPM of the cooling fan 34 is lowered below the set reference value or the internal temperature of the high voltage region 30 rises above the set reference value using the control unit 70, the load port 10 is switched to the idling state. By doing so, the high voltage zone 30 is automatically switched to an idling state, thereby minimizing the amount of internal heat generated in the high voltage zone 30, thereby preventing an abnormal operation or a fire of the high voltage zone 30.

In particular, the control unit 70, by stopping the operation of the high-voltage zone 30, instead of switching the load port 10 to the idling state, the load as the high-voltage zone 30 is switched to the idling state There is an advantage that can prevent the malfunction or error of the port 10 or the general voltage zone 20 occurs.

In the present embodiment, as an example of a semiconductor manufacturing facility, a medium or high cleat facility is illustrated, but various types of semiconductor manufacturing facilities having a high voltage region that operates independently with a completely disconnected electrical connection to the outside. Of course, the present invention can be applied to.

In addition, the detection sensors (41, 42) is an RPM sensor (41) for measuring the rotational speed of the blade (34a) of the cooling fan 34, and a temperature sensor for measuring the temperature of each part inside the high-voltage zone (30) Although 42 is illustrated, an exhaust temperature measuring sensor for measuring the temperature of the air exhausted from the high voltage region 30 may be added.

In addition, the control unit 70 outputs a control signal for switching the load port 10 to the idling state, the reference value of the RPM of the cooling fan 34 and the internal temperature of the high-voltage zone 30, and the alarm means ( Although the reference value for operating 61 is set to be the same, the control unit 70 differs from the reference value for outputting the control signal and the setting of the reference value for operating the alarm means 61, so that the alarm means 61 After the alarm is output and no further action is taken, when the RPM of the cooling fan 34 becomes slower or the internal temperature of the high voltage zone 30 is further raised, the control unit 70 outputs a control signal to load port. It may be configured to transition the 10 to an idling state.

It is to be understood that the foregoing is merely illustrative of one preferred embodiment of the present invention and that modifications and variations may be made thereto without departing from the spirit of the invention.

10. Load port 20. Normal voltage area
30. High voltage zone 41,42. Sensor
50. Optical cable 60. Display module
70. Control Unit

Claims (5)

In a semiconductor manufacturing facility having a generator 32, a cooling fan 34 and a controller 33, and having a high voltage zone 30 that operates independently in a state of being completely disconnected from the outside,
Installed in the high voltage zone 30 is operated by the power output from the generator 32 as a power source and a sensing sensor for sensing the operating state of the cooling fan 34 or the internal temperature of the high voltage zone 30, 41, 42),
Installed on the outside of the high voltage region 30 is operated by a common commercial power source and includes a display module 60 is connected to the sensing sensors (41, 42) and data communication through the optical cable 50,
The detection sensors (41, 42),
RPM sensor 41 is provided in front of the cooling fan 34 to measure the rotational speed of the cooling fan 34,
Is installed inside the high voltage zone 30 includes a temperature sensor 42 for measuring the temperature of each part inside the high voltage zone 30,
The semiconductor manufacturing facility includes a load port 10 for loading a wafer,
The control unit 70 is connected to the load port 10 and monitors the signals of the detection sensors 41 and 42 received by the display module 60.
The control unit 70 is a control signal for switching the load port 10 to an idling state when the RPM of the cooling fan 34 is lowered below the set reference value or the internal temperature of the high voltage region 30 is higher than the set reference value. Monitoring device for semiconductor manufacturing equipment characterized in that it outputs.
delete The method of claim 1,
The RPM sensor 41,
An infrared irradiation unit 41a for irradiating infrared rays to the front surface of the blade 34a of the cooling fan 34;
And an infrared receiver (41b) for receiving infrared rays reflected from the front surface of the blade (34a).
The method of claim 1,
When the RPM of the cooling fan 34 is lowered below the set reference value or the internal temperature of the high voltage zone 30 is raised above the set reference value by monitoring the signals of the sensing sensors 41 and 42 received by the display module 60. And monitoring means (61) for outputting an alarm.
delete
KR2020110008797U 2011-09-30 2011-09-30 monitoring apparatus for semiconductor manufacturing equipment KR200457049Y1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101232834B1 (en) * 2012-07-24 2013-02-13 손규태 Apparatus and method for monitoring the cooling fan of a semiconductor manufacturing equipment
KR20200042785A (en) * 2018-10-16 2020-04-24 박근배 A Diagnostic System for Cooling Fan Using Wind Power

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002116218A (en) * 2000-10-11 2002-04-19 Iwatsu Electric Co Ltd Monitoring apparatus for operating environment of air- cooled fan
JP2006284129A (en) * 2005-04-04 2006-10-19 Nec Engineering Ltd Cooling system for sealed device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002116218A (en) * 2000-10-11 2002-04-19 Iwatsu Electric Co Ltd Monitoring apparatus for operating environment of air- cooled fan
JP2006284129A (en) * 2005-04-04 2006-10-19 Nec Engineering Ltd Cooling system for sealed device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101232834B1 (en) * 2012-07-24 2013-02-13 손규태 Apparatus and method for monitoring the cooling fan of a semiconductor manufacturing equipment
KR20200042785A (en) * 2018-10-16 2020-04-24 박근배 A Diagnostic System for Cooling Fan Using Wind Power
KR102124782B1 (en) 2018-10-16 2020-06-19 박근배 A Diagnostic System for Cooling Fan Using Wind Power

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