CN113549964B - 一种无氰镀铜锌合金晶粒细化剂及其应用 - Google Patents
一种无氰镀铜锌合金晶粒细化剂及其应用 Download PDFInfo
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- CN113549964B CN113549964B CN202110854055.9A CN202110854055A CN113549964B CN 113549964 B CN113549964 B CN 113549964B CN 202110854055 A CN202110854055 A CN 202110854055A CN 113549964 B CN113549964 B CN 113549964B
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- free copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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US5656148A (en) * | 1995-03-02 | 1997-08-12 | Atotech Usa, Inc. | High current density zinc chloride electrogalvanizing process and composition |
JP2004339364A (ja) * | 2003-05-15 | 2004-12-02 | Nippon Paint Co Ltd | 消泡剤を含有するカチオン電着塗料組成物 |
KR100776180B1 (ko) * | 2006-08-07 | 2007-11-16 | 주식회사 잉크테크 | 금속적층판의 제조방법 |
JP5948663B2 (ja) * | 2012-02-22 | 2016-07-06 | 国立大学法人信州大学 | 電析材料組成物、それを用いた電析塗膜および電析塗膜の製造方法 |
US20160145745A1 (en) * | 2014-11-24 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Formaldehyde-free electroless metal plating compositions and methods |
CN109487101B (zh) * | 2018-12-20 | 2021-01-29 | 昆明理工大学 | 一种铝合金晶粒细化剂的制备方法 |
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Effective date of registration: 20220314 Address after: 402260 No.557 Lanxi Road, Degan Industrial Park, Jiangjin District, Chongqing Applicant after: CHONGQING LIDAO NEW MATERIAL TECHNOLOGY Co.,Ltd. Applicant after: SICHUAN NANSHAN POWDER ACTUATED FASTENING SYSTEM Co.,Ltd. Address before: 402260 Chongqing Jiangjin district de sense Industrial Park Applicant before: CHONGQING LIDAO NEW MATERIAL TECHNOLOGY Co.,Ltd. |
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Inventor after: Hu Guohui Inventor after: Huang Bin Inventor after: Chen Xingkuan Inventor after: Liu Jun Inventor after: Liu Yang Inventor after: Duan Xiao Inventor after: Xiao Ling Inventor after: Li Minggang Inventor after: Xiao Chunyan Inventor after: Liu Bo Inventor before: Hu Guohui Inventor before: Duan Xiao Inventor before: Li Minggang Inventor before: Xiao Ling Inventor before: Xiao Chunyan Inventor before: Liu Yang Inventor before: Liu Jun Inventor before: Huang Bin |
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