CN113543919A - Electric diffusion bonding device - Google Patents
Electric diffusion bonding device Download PDFInfo
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- CN113543919A CN113543919A CN202080018581.5A CN202080018581A CN113543919A CN 113543919 A CN113543919 A CN 113543919A CN 202080018581 A CN202080018581 A CN 202080018581A CN 113543919 A CN113543919 A CN 113543919A
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- temperature information
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 38
- 238000003825 pressing Methods 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 6
- 230000000630 rising effect Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 16
- 238000005304 joining Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- 238000012544 monitoring process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
Abstract
The invention aims to provide an electric diffusion bonding device which can precisely control the output of a power supply and can realize precise temperature management of a bonded component. An energization diffusion bonding apparatus (10) that energizes a plurality of members to be bonded (1) with which a bonding surface (S) is abutted and bonds the plurality of members to be bonded (1), comprising: a plurality of electrodes (2) for energizing the plurality of members (1) to be joined; a power supply (3) capable of continuously changing the output applied to the plurality of electrodes (2); a temperature information providing unit (4) that provides temperature information of the member (1) to be joined or the electrode (2); and an output control unit (5) that performs rising slope control of the output of the power supply (3) on the basis of the temperature information from the temperature information providing unit (4).
Description
Technical Field
The present invention relates to an electrically energized diffusion bonding apparatus for bonding members to be bonded to each other.
Background
Conventionally, there is known an electric diffusion bonding in which metal members are heated in a solid phase temperature range and bonded by utilizing a diffusion phenomenon of atoms (for example, see patent document 1). The electrical diffusion bonding is suitable for bonding of the same material or different materials formed by using a metal material difficult to be welded.
In the electric diffusion bonding, an electric current (direct current or pulse) is passed between the electrodes to heat the bonded member in a state where the bonded member is sandwiched between the electrodes and pressure is applied to the bonding surface by a pressurizing mechanism via the electrodes. Then, the joining is performed by utilizing the adhesion of the joining surfaces and the solid phase diffusion phenomenon caused by softening and deformation of the materials in the solid phase temperature range of the melting temperature or lower of the members to be joined.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2012 and 6068
Disclosure of Invention
Here, in the electric diffusion bonding, it is necessary to uniformize the current density flowing through the bonding surface of the bonded member and to make the temperature of the bonding surface uniform. However, even if the current value is concentrated to a certain small extent in the conventional impulse step response, the current concentrated portion is not generated specifically. Since the temperature of the portion where the current is concentrated rapidly rises, the bonding state of the portion rapidly becomes liquid phase bonding, and the bonding state of the bonding interface becomes a non-uniform state, resulting in variation in bonding strength. In the electric diffusion bonding, it is necessary to maintain an optimum bonding temperature condition for a certain time from the viewpoint of being suitable for atomic movement in a solid phase region. Therefore, temperature management of the joined components is very important in the energization diffusion bonding, and management of electric energy converted into heat in the joined components becomes important.
However, in general resistance welding or the like, temperature is a secondary factor depending on the amount of power supplied (current × time), and there is almost no case where temperature is primarily controlled. In the conventional method, even when the current is made to flow for a constant time or the current is controlled, the method is not precise control such as ON/OFF (ON/OFF) control, and thus has a problem that variation in the bonding strength increases.
In the electric diffusion bonding, a load applied to the bonding surface also becomes an important element of the bonding strength, and it is necessary to take measures against thermal expansion of the members to be bonded during heat generation in order to keep the load constant. In this regard, a countermeasure against thermal expansion of the members to be joined is also set forth in patent document 1. However, in the ON/OFF (ON/OFF) temperature control, since stress is repeatedly applied to the engaged member, only the above-described countermeasure is insufficient.
Therefore, an object of the present invention is to provide an electric diffusion bonding apparatus capable of controlling the output of a power supply more precisely and performing precise temperature management of a bonded member.
In order to achieve the above object, the present invention provides an electric diffusion bonding apparatus for bonding a plurality of members to be bonded by supplying electricity to the plurality of members to be bonded with which bonding surfaces are brought into contact, the apparatus comprising: a plurality of electrodes for energizing the plurality of engaged members; a power supply capable of continuously changing an output applied to the plurality of electrodes; a temperature information providing section that provides temperature information of the engaged member or the electrode; and an output control unit that performs rising slope control of the output of the power supply based on the temperature information from the temperature information providing unit.
In this case, a voltage drop detection unit may be provided that supplies a constant current to the device to be joined and is capable of detecting a voltage drop at the bonding surface. Further, the output control unit may control the output of the power supply based on the voltage drop detected by the voltage drop detection unit.
The temperature information providing unit may be a temperature sensor that detects temperature information of the engaged member or the electrode, or may be a temperature information storage unit that stores temperature information of the engaged member or the electrode.
Further, the electrical diffusion bonding apparatus of the present invention includes a pressing portion for applying pressure to the bonding surface of the bonded member.
Effects of the invention
The invention provides an electric diffusion bonding apparatus capable of controlling power supply more precisely, realizing precise temperature management and pressure management of a bonded member, and performing bonding with strong bonding strength and small deviation.
Drawings
Fig. 1 is a partial sectional view showing an electrical diffusion bonding apparatus of the present invention.
Fig. 2 is a block diagram for explaining an output control unit according to the present invention.
Fig. 3 is a block diagram for explaining the pressure control unit according to the present invention.
Description of the reference numerals
1: engaged member
2: electrode for electrochemical cell
3: power supply
4: temperature information providing unit
5: output control unit
6: base member
7: pressure control unit
8: pressurization part
9: base station
10: electric diffusion bonding device
51: operation part
52: display unit
53: voltage drop detection unit
71: operation part
72: display unit
73: pressure sensor
74: encoder for encoding a video signal
81: pressing member
82: driving source
83: ball screw mechanism
84: elastic force applying unit
84 a: spring
84 b: block body
S: joint surface
Detailed Description
The electrical diffusion bonding apparatus 10 of the present invention will be described with reference to fig. 1 to 3. An energization diffusion bonding apparatus 10 according to the present invention is an apparatus that energizes a plurality of members to be bonded 1 with which a bonding surface S is brought into contact, and bonds the plurality of members to be bonded 1, and the energization diffusion bonding apparatus 10 mainly includes an electrode 2, a power source 3, a temperature information providing unit 4, and an output control unit 5.
Here, the member to be joined 1 means a member to be joined on the joining surface S, and as long as electric current can be passed, the material, shape, and the like thereof may be arbitrary. Examples of the material include a steel material such as stainless steel, a nonferrous metal such as copper, aluminum, and zinc, and a metal material such as various alloys containing aluminum, nickel, chromium, titanium, and copper, and a nonmetallic material such as a ceramic, a semiconductor, and a single crystal material having high-temperature conductivity. The members to be joined 1 may be made of the same material or different materials. The shape may be, for example, a tubular shape, a block shape, a thick plate shape, or a thin plate shape, and may be subjected to any processing such as groove processing or hole forming. The joining surface S is preferably flat, but may be a curved surface, for example, a curved surface having the same curvature, as long as no gap is formed. The bonding surface S is preferably a mirror surface, but may be a rough surface.
The electrodes 2 are used to conduct electricity output from the power source 3 to the plurality of members to be joined 1. In the energization diffusion bonding apparatus 10, in order to energize the bonded member 1, at least 2 electrodes 2 may be provided, and the electrodes 2 may be provided, for example, at portions facing each other with the bonding surface S of the bonded member 1 interposed therebetween. Of course, the device 1 may have 3 or more electrodes 2 depending on the material, shape, and the like of the bonded member. The electrode 2 may be made of any material as long as the member to be bonded 1 can be energized, and for example, copper, molybdenum, tungsten, or the like can be used. The electrode 2 is connected to a power supply 3 via a cable 31.
The power supply 3 is for outputting electric power to the plurality of electrodes 2. The power supply 3 may be any power supply as long as it can continuously change the output applied to the plurality of electrodes 2, and for example, a known inverter power supply can be used.
The temperature information providing section 4 is for providing the output control section 5 with temperature information of the joined member 1 or the electrode 2. The temperature information is information related to the temperature of the bonded device 1 or the electrode 2, and may be information of the temperature itself, or may be information converted by calculation based on the temperature, such as a voltage value that determines the voltage of the power supply 3. As the temperature information providing unit 4, for example, a temperature sensor that detects the temperature of the joined member 1 or the electrode 2 can be used. The temperature sensor may be any as long as it can detect the temperature of the joining member or the electrode 2, and for example, a non-contact sensor that detects the temperature in a non-contact manner like an infrared radiation thermometer or the like, or a contact sensor such as a thermocouple that detects the temperature by contacting with the joining member 1 or the electrode 2 may be used. In addition, a non-contact sensor and a contact sensor can be used in combination.
The output control unit 5 performs slope control of the output of the power supply 3 based on the temperature information from the temperature information providing unit 4. Conventionally, a constant current is conducted for a constant time or by ON/OFF (ON/OFF) control, and therefore the temperature of a portion where the current is concentrated may suddenly rise. In this case, the bonding state of the portion becomes liquid phase bonding or the like, and the bonding state of the bonding surface S becomes uneven, and the bonding state varies. In contrast, in the rising slope control, the current is gradually increased, so that rapid current concentration is suppressed, and the temperature of the bonding surface can be made uniform. Therefore, a uniform diffusion layer can be formed on the bonding surface S, and the strength can be made uniform. The output control unit 5 can continuously control the rising slope of the output of the power supply 3 in real time based on the temperature information detected by the temperature sensor, thereby achieving precise temperature management of the device under engagement 1. Therefore, the joint strength of the joint surfaces S of the joint members can be high and the joint can be joined with small variation. Further, since such continuous control can maintain the thermal expansion constant as compared with ON/OFF (ON/OFF) control, the influence of pressure fluctuation due to thermal expansion can be reduced.
The output control unit 5 may be any unit as long as it can control the rising gradient of the output of the power supply 3 based on the temperature information from the temperature information providing unit 4, and for example, a device including a CPU, a ROM, a RAM, an I/O, and the like, and electrically connected to the operation unit 51 and the display unit 52, may be used. Specifically, a known PID temperature control device such as a high-speed sampling temperature controller can be used. Here, the operation unit 51 includes various operation switches such as a start switch and a start switch, an input panel such as a touch panel, and the like. The information input from the operation unit 51 is sent to the output control unit 5. The display unit 52 receives information generated based on an input to the output control unit 5 or a calculation result of the output control unit 5 from the output control unit 5, and displays the information. Here, the display portion 52 includes a digital display panel, a lamp, and the like.
In addition, the case where the temperature information providing unit 4 described above acquires the temperature of the joined component 1 or the electrode 2 in real time using a temperature sensor and provides the output control unit 5 with the temperature information of the joined component 1 or the electrode 2 has been described. However, in the case where the members to be joined 1 of the same material are joined in the same environment using the electrical diffusion joining apparatus 10 of the present invention, the same result is obtained as to the relationship between the elapsed time and the temperature of the members to be joined 1 or the electrodes 2. Therefore, as long as temperature information indicating the relationship between the elapsed time and the temperature of the engaged member 1 or the electrode 2 is acquired in advance, the temperature information can be provided even without using a temperature sensor. Therefore, the temperature information providing unit 4 may be a temperature information storage unit that stores temperature information indicating a relationship between the elapsed time of the engaged member 1 or electrode 2 and the temperature of the engaged member 1 or electrode 2. Thereby, the output control unit 5 can control the output of the power supply 3 based on the temperature information stored in the temperature information storage unit. The temperature information storage unit may be any as long as it can store temperature information for determining the relationship between the elapsed time and the output of the power supply 3, and for example, a known memory or the like may be used.
In the electric diffusion bonding, it is important to align the axes of the members to be bonded 1 in the pressing direction and to control the load. As a result of intensive studies by the present inventors, it was found that the management state is reflected in the value of the contact resistance at the joining interface. Therefore, it is possible to determine whether or not the initial state can be maintained by monitoring the contact resistance value. In addition, the maintenance time for placing the joined member 1 in the jig of the energization diffusion bonding apparatus 10 can be clarified from the degree of the change in the contact resistance value. Therefore, the current diffusion bonding device 10 of the present invention may include the voltage drop detection unit 53 that supplies a constant current to the bonded member 1 and can detect a voltage drop at the bonding surface S. The output control unit 5 may control the output of the power supply 3 based on the voltage drop detected by the voltage drop detection means 53. This enables further precise temperature control of the joined member 1. Therefore, the joint strength of the joint surfaces S of the joint members can be high and the joint can be joined with small variation.
Next, another structure of the electrical diffusion bonding apparatus 10 will be described. The energization diffusion bonding device 10 includes a pressing portion 8 for applying pressure to the bonding surface S of the bonded member 1. The pressurizing unit 8 may have any configuration as long as it can apply pressure to the bonding surface S of the bonded member 1, and for example, the pressurizing unit 8 may include: a pressing member 81 to which the electrode 2 is fixed; a driving source 82 for driving the pressing member 81; and a ball screw mechanism 83 for transmitting the driving force of the driving source 82 and moving the pressing member 81 up and down.
Here, the pressing member 81 is formed in a substantially cylindrical shape for versatility, but may be formed in accordance with the shape of the member to be engaged 1, or may sandwich an intermediate member conforming to the shape of the member to be engaged 1 therebetween. The material of the pressing member 81 may be any material as long as it has rigidity against the pressing force, and for example, a metal such as stainless steel, copper, molybdenum, or tungsten may be used.
Although not shown, the pressing member 81 may have a cooling unit for cooling the member to be joined 1. The cooling means may be any cooling means as long as it can cool the member to be welded 1, and for example, a structure in which a cooling fluid such as tap water is circulated through the flow path can be adopted. The flow path may be provided in the pressure member 81 itself, or a cooling block having a flow path formed therein may be disposed in close contact with the pressure member 81.
The drive source 82 can be, for example, a servomotor with a reduction gear. The servo motor is provided with an encoder 74 and is disposed on a not-shown stand.
The ball screw mechanism 83 includes: a screw shaft extending in the vertical direction and having a thread groove formed on an outer circumferential surface thereof; a nut having a thread groove formed on an inner peripheral surface thereof; and a plurality of balls accommodated between the screw grooves. The nut is fixed to the upper portion of the pressing member 81 via an insulator such as bakelite and the pressure sensor 73. The screw shaft is connected to a rotation shaft of the servo motor via a reducer. The screw shaft is rotated by the rotational driving of the servo motor, and the nut and the pressing member 81 move up and down relative to the screw shaft. In addition, if the driving of the servo motor is stopped, the position of the pressing member 81 is maintained. At this time, the pressing portion 8 restricts the displacement of the engaged member 1 and applies pressure to the engagement surface S.
The pressurizing unit 8 may have a pressure sensor 73 for detecting the pressure on the bonding surface S. The pressure sensor 73 is, for example, a single-axis load cell that measures a pressure in the vertical direction, but a multi-axis pressure sensor may be used. The pressure sensor 73 can indirectly detect the pressure applied to the bonding surfaces S of the members to be bonded 1.
The pressing portion 8 may further include an elastic force applying unit 84 that applies an elastic force to the joining surfaces S of the members to be joined 1. For example, the elastic force applying unit 84 is disposed between the base member 6 on which the pressing member 81 is disposed and the base 9 of the electrical diffusion bonding apparatus 10. As the elastic force applying unit 84, for example, there are included: a spring 84 a; and a block 84b for limiting the spring 84a to a preset length shorter than a free length between the block 84b and the base member 6. The pressing force applied to the member to be joined 1 by the base member 6 pushed up by the elastic force applying unit 84 differs depending on the material or shape of the member to be joined 1, and is, for example, 5 to 100N. And, the pressure can be changed by replacing the spring 84 a. With such a configuration, even if the member to be joined 1 undergoes thermal expansion or thermal contraction, a rapid change in pressure acting on the joining surface S can be alleviated.
Further, although the above-described configuration has been described as the pressing portion 8, the pressing portion 8 may have another configuration as long as it is a configuration for pressing the members to be joined 1 against each other by the joining surface S. For example, the following structure can be used: a weight is placed only on the engaged members 1 to press the engaged members 1 against each other.
The electric heating bonding apparatus 10 of the present invention may further include a pressure control unit 7 for controlling the pressure applied to the bonding surface S. The pressure control unit 7 includes, for example, a CPU, ROM, RAM, I/O, and the like, and is electrically connected to an operation unit 71 and a display unit 72. Here, the operation unit 71 includes various operation switches such as a start switch and a start switch, an input panel including a touch panel, and the like. The information input from the operation unit 71 is sent to the pressure control unit 7. The display unit 72 receives information generated based on an input to the pressure control unit 7 or a calculation result of the pressure control unit 7 from the pressure control unit 7, and displays the information. Here, the display portion 72 includes a digital display panel, a lamp, and the like. Note that the pressure control unit 7 may be a device common to the output control unit 5 described above.
Detection signals are input to the pressure control unit 7 from the encoder 74, the pressure sensor 73, and the temperature sensor. The pressure control unit 7 outputs control signals to the power supply 3 and the servo motor based on these detection signals, information input from the operation unit 71, and control information such as the set pressure Ps, the lower limit set pressure Ps1, the set temperature Ts, and the set holding time Hs stored in the storage unit.
Claims (6)
1. An electrical diffusion bonding apparatus that bonds a plurality of members to be bonded by applying current to the members to be bonded that have bonding surfaces in contact with each other, the apparatus comprising:
a plurality of electrodes for energizing the plurality of engaged members;
a power supply capable of continuously changing an output applied to the plurality of electrodes;
a temperature information providing section that provides temperature information of the engaged member or the electrode; and
and an output control unit that performs slope-up control of the output of the power supply based on the temperature information from the temperature information providing unit.
2. The energized diffusion bonding apparatus of claim 1, wherein:
the bonding surface bonding apparatus includes a voltage drop detection unit that supplies a constant current to the bonded device and is capable of detecting a voltage drop on the bonding surface.
3. The energized diffusion bonding apparatus of claim 2, wherein:
the output control unit controls the output of the power supply based on the voltage drop detected by the voltage drop detection unit.
4. The energized diffusion bonding device according to any one of claims 1 to 3, characterized in that:
the temperature information providing unit is a temperature sensor that detects temperature information of the engaged member or the electrode.
5. The energized diffusion bonding device according to any one of claims 1 to 3, characterized in that:
the temperature information providing unit is a temperature information storage unit that stores temperature information of the engaged member or the electrode.
6. The energized diffusion bonding device according to any one of claims 1 to 5, characterized in that:
a pressing portion for applying pressure to the engaging face of the engaged member is included.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-040058 | 2019-03-05 | ||
| JP2019040058 | 2019-03-05 | ||
| PCT/JP2020/009289 WO2020179855A1 (en) | 2019-03-05 | 2020-03-05 | Conduction diffusion bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113543919A true CN113543919A (en) | 2021-10-22 |
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| CN202080018581.5A Pending CN113543919A (en) | 2019-03-05 | 2020-03-05 | Electric diffusion bonding device |
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| JP (1) | JPWO2020179855A1 (en) |
| CN (1) | CN113543919A (en) |
| WO (1) | WO2020179855A1 (en) |
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| KR102370405B1 (en) * | 2020-02-07 | 2022-03-04 | 서울대학교산학협력단 | Methods of joining high entropy alloy, apparatus of joining the same and join structure of high entropy alloy |
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- 2020-03-05 WO PCT/JP2020/009289 patent/WO2020179855A1/en active Application Filing
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- 2020-03-05 JP JP2021503640A patent/JPWO2020179855A1/ja active Pending
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| WO2020179855A1 (en) | 2020-09-10 |
| JPWO2020179855A1 (en) | 2020-09-10 |
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Application publication date: 20211022 |