CN113539913B - Die bonding equipment and die bonding method - Google Patents
Die bonding equipment and die bonding method Download PDFInfo
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- CN113539913B CN113539913B CN202110680675.5A CN202110680675A CN113539913B CN 113539913 B CN113539913 B CN 113539913B CN 202110680675 A CN202110680675 A CN 202110680675A CN 113539913 B CN113539913 B CN 113539913B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The application relates to die bonding equipment and a die bonding method. The die bonding equipment comprises a carrying platform, a die disc and a swing arm; the carrying platform is used for carrying a target substrate, and a first driving mechanism is arranged on the carrying platform and used for driving the target substrate placed on the carrying platform to move; the number of the wafer disks is multiple, each wafer disk is used for placing wafers, and the wafers placed on at least one wafer disk are different from those placed on other wafer disks; the number of the swing arms is multiple, each swing arm corresponds to one wafer disc, and the swing arms respectively correspond to a plurality of wafer positions in one wafer position unit group of the target substrate; each swing arm is provided with a second driving mechanism, and each second driving mechanism is used for driving the corresponding swing arm to move; the swing arms are used for taking the chips at the corresponding wafer disks respectively and transferring the chips to the corresponding chip positions of the chip position unit group positioned at the chip bonding station on the target substrate in sequence at the chip bonding station.
Description
Technical Field
The application relates to the field of semiconductor technology and equipment, in particular to die bonding equipment and a die bonding method.
Background
The die bonder is a key device in an LED packaging production line, and is used for transferring and mounting LED chips on a wafer to LED chip mounting positions on an LED board (e.g., a Mini LED display panel or a Micro LED display panel). Generally, the LED chips requiring transfer mounting to the LED board include red LED chips, green LED chips, and blue LED chips.
The existing die bonder for transferring and mounting a red LED chip, a green LED chip and a blue LED chip on an LED board comprises a carrying platform, a wafer disc and a swing arm. The carrying platform is used for placing a substrate on which the LED chip is to be mounted. The substrate is provided with a plurality of wafer positions, the wafer positions are usually arranged in an array, and each wafer position is used for placing an LED chip; the plurality of wafer positions can be divided into three types which are respectively used for placing a red LED chip, a green LED chip and a blue LED chip, and the adjacent three wafer positions used for placing the red LED chip, the green LED chip and the blue LED chip form a wafer position unit group. The three wafer disks are respectively used for placing wafers with red LED chips, green LED chips and blue LED chips. The swing arm is provided with a driving mechanism, and the driving mechanism can drive the swing arm to swing among the crystal disc with the red LED chip, the crystal disc with the green LED chip, the crystal disc with the blue LED chip and the carrying platform. The swing arm can take the red LED chip when being positioned at the wafer disc position with the red LED chip, can take the green LED chip when being positioned at the wafer disc position with the green LED chip, and can take the blue LED chip when being positioned at the wafer disc position with the blue LED chip; the swing arm can transfer the red LED chip, the green LED chip or the blue LED chip to a wafer position on a substrate of the die bonding station when the swing arm is at the die bonding station. The carrier is also provided with a driving mechanism which is used for driving the substrate to move, after one wafer position on the substrate is transferred and mounted with the LED chip, the substrate is driven to move, so that the next wafer position on the substrate is moved to the die bonding station, and the LED chip is waited to be transferred and mounted on the wafer position.
In order to achieve the optimal die bonding efficiency, the conventional die bonding machine performs the die bonding process in the following general processes: the driving mechanism firstly drives the swing arm to swing between the wafer with the red LED chips and the carrying platform, and all the red LED chips are transferred and mounted on a wafer position for placing the red LED chips on a substrate on the carrying platform at one time; assuming that the number of wafer sites on the substrate where the red LED chips are required to be placed is n, in the process, the substrate needs to be moved n times by the driving mechanism (assuming that none of the wafer sites on which the red LED chips are required to be placed is at the die bonding station in the initial state of the substrate). After that, the driving mechanism drives the swing arm to swing between the wafer with the green LED chips and the carrier, and all the green LED chips are transferred and mounted on the wafer position for placing the green LED chips on the substrate on the carrier at one time; in this process, the substrate needs to be moved n times by the driving mechanism. After that, the driving mechanism drives the swing arm to swing between the wafer with the blue LED chips and the carrier, and all the blue LED chips are transferred and mounted on a wafer position for placing the blue LED chips on a substrate on the carrier at one time; in this process, the substrate needs to be moved n times by the driving mechanism.
The existing die bonder has the following technical problems:
in the above process, transfer mounting of the LED chip of the next color can be performed only after all the LED chips of one color are transferred to the wafer site on the substrate. And, completing the mounting of all the wafer-level LED chips on the substrate requires moving the substrate 3n times. With the increasing demand of the display field for the LED particle density, the value of n is already a large value and is also larger, so that the number of times the substrate needs to be moved in the process is high, which affects the process and efficiency.
Disclosure of Invention
The application provides a die bonder and a die bonding method, which aim to solve the technical problem that the conventional die bonder cannot efficiently and sequentially and respectively mount corresponding wafers to a plurality of wafer positions in a wafer position unit group on a substrate.
The invention provides a die bonder, which is used for mounting a wafer on a target substrate and comprises a carrying platform, a wafer disc and a swing arm; the carrying platform is used for carrying a target substrate, and a first driving mechanism is arranged on the carrying platform and used for driving the target substrate placed on the carrying platform to move so as to enable each wafer contained in one wafer position unit group on the target substrate to move to a wafer fixing station; the number of the wafer disks is multiple, each wafer disk is used for placing wafers, and the wafers placed on at least one wafer disk are different from those placed on other wafer disks; the number of the swing arms is multiple, each swing arm corresponds to one wafer disc, and the swing arms respectively correspond to a plurality of wafer positions in one wafer position unit group of the target substrate; each swing arm is provided with a second driving mechanism, and each second driving mechanism is used for driving the corresponding swing arm to sequentially move from the wafer disc corresponding to the swing arm to the die bonding station and from the die bonding station to the wafer disc corresponding to the swing arm; the swing arms are used for taking wafers at the corresponding wafer disks respectively and transferring the wafers to corresponding wafer positions of a wafer position unit group located at a wafer fixing station on a target substrate in sequence at the wafer fixing station.
The number of the wafer disks is three, and the three wafer disks are respectively used for placing a wafer with red LED chips, a wafer with green LED chips and a wafer with blue LED chips.
The die bonding station is provided with an image acquisition device, and the image acquisition device is used for acquiring an image of a target substrate.
The die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms, and the control mechanism controls the swing arms to sequentially reach corresponding wafer positions in the wafer position unit groups of the die bonding stations on the target substrate under the driving of the corresponding second driving mechanisms.
The number of the swing arms is three, and the wafers of the three wafer disks are correspondingly picked up.
The invention provides a die bonding method, which comprises the following steps:
determining the corresponding relation of the wafer position in the wafer disc, the swing arm and the target substrate unit group;
the control system controls the carrying platform to move until the die bonding camera confirms that the wafer bit position unit group on the ocular plate substrate is matched with the image preset by the system;
controlling the selected swing arm to take the chip from the corresponding wafer disc, and sequentially transferring and installing the taken chip to the corresponding chip position in a chip position unit group on the target substrate at the die bonding position;
and the control system controls the carrying platform to move, so that each wafer position included in the next wafer position unit group on the target substrate reaches the wafer fixing station, and the previous step is repeated until all wafer positions in the set wafer position unit group on the target substrate are transferred and provided with wafers.
Each wafer bit unit group comprises three wafer bits; and the three wafer positions respectively require to be transferred and installed with a red LED chip, a green LED chip and a blue LED chip.
The die bonding method further comprises the following steps:
and after the target substrate is moved, detecting whether each wafer in the wafer position unit group on the target substrate reaches the die bonding station.
And whether each wafer in the wafer position unit group on the detection target substrate reaches the die bonding station or not is determined according to the image of the target substrate acquired by the image acquisition device arranged at the die bonding station.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the die bonding equipment provided by the embodiment of the application comprises a carrying platform, wherein a first driving mechanism is arranged on the carrying platform, and a target substrate placed on the carrying platform can be moved through the first driving mechanism, so that different wafer bit unit groups on the target substrate are moved to die bonding stations. The number of the swing arms is multiple, each swing arm corresponds to one wafer disc and corresponds to one wafer position in one wafer position unit group on the target substrate, each swing arm can be driven by the corresponding second driving mechanism to move to the wafer disc corresponding to the swing arm, a wafer is taken from the wafer disc, and driven by the second driving mechanism to move to the wafer fixing station on the carrying platform, and the wafer is transferred and mounted to the wafer position, corresponding to the swing arm, in the wafer position unit group on the target substrate and located at the wafer fixing station. In the case of a plurality of wafer disks, at least one wafer disk may be placed on a different wafer than the other wafer disks, that is, the plurality of wafer disks may be placed on a wafer having at least two different chips. The number of the types of the wafers placed on the wafer disks and the types of the wafers placed on each wafer disk can be set according to needs, so that each swing arm can take the wafers from the wafer disk corresponding to the swing arm, and the taken wafers are consistent with the types of the wafers to be placed on the wafer disk corresponding to the swing arm. In this case, when each chip site included in one chip site unit group on the target substrate is located at the die bonding station, the swing arms may respectively take one chip at the corresponding wafer tray, and correspondingly transfer and mount the taken one chip to the corresponding chip site in the chip site unit group at the die bonding station, during which the target substrate does not need to be moved by the first driving mechanism. After the transfer installation of the wafers in each wafer position included in one wafer position unit group on the target substrate is completed, the target substrate needs to be moved through the first driving mechanism to a position where each wafer position in the next wafer position unit group on the target substrate is located at the wafer fixing station, and then the corresponding wafer is transferred and installed to each wafer position in the wafer position unit group through the plurality of swing arms. And repeating the process to finish the transfer installation of the wafers of all wafer positions on the target substrate. Therefore, on one hand, after one wafer is transferred and mounted to the corresponding wafer position on the target substrate at one time, the operation of transferring and mounting the next wafer to the corresponding wafer position on the target substrate is not needed; in addition, in the above process, the number of times and the total displacement of the target substrate are moved by the first driving mechanism are greatly reduced, and higher efficiency can be achieved compared with the prior art.
In the die bonding method provided by the embodiment of the invention, one wafer position unit group on the target substrate is taken as a unit, and a corresponding wafer is transferred and installed to each wafer position in the wafer position unit group every time, so that the target substrate does not need to be moved in the process; after each wafer position in one wafer position unit group is transferred and installed with a wafer, the target substrate needs to be moved, so that each wafer position included in the next wafer position unit group on the target substrate is located at the wafer fixing station, and then the corresponding wafer is transferred and installed on each wafer position in the next wafer position unit group, and the steps are repeated until all wafer positions on the target substrate are transferred and installed with wafers. Compared with the prior art, the die bonding method provided by the embodiment of the invention does not need to transfer and mount a next wafer to the corresponding wafer position on the target substrate after all wafers are transferred and mounted to the corresponding wafer positions on the target substrate at one time; on the other hand, the number of times of movement of the target substrate can be greatly reduced, and higher efficiency can be achieved compared with the prior art.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a die bonding apparatus provided in embodiment 1 of the present application;
FIG. 2 is a schematic structural diagram of a swing arm and a wafer tray in the die bonding apparatus shown in FIG. 1;
FIG. 3 is a schematic top view of the die attach apparatus shown in FIG. 1;
fig. 4 is a schematic flow chart of the die bonding method provided in embodiment 1 of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
(1) Example 1 of die bonder
In this embodiment, the die bonding apparatus is used to mount a wafer onto a target substrate. As shown in fig. 1 to 3, the die bonding apparatus includes a stage (not shown), a wafer plate 20, and a swing arm 30.
The carrier is used for carrying a target substrate (not shown in the figure), and the carrier is provided with a first driving mechanism (not shown in the figure), wherein the first driving mechanism is used for driving the target substrate placed on the carrier to move, so that each wafer contained in one wafer position unit group on the target substrate moves to the wafer fixing station. Specifically, the first driving mechanism can drive the target substrate to move, so that different wafer bit unit groups on the target substrate are located at the die bonding station.
Specifically, the first driving mechanism includes two sub-driving mechanisms for driving the target substrate to move in two mutually perpendicular directions within a horizontal plane, respectively; through the two sub-driving mechanisms, the first driving mechanism can drive the target substrate to move at any position in the horizontal plane, so that each wafer position contained in any wafer position unit group on the target substrate is positioned at a die bonding station.
The number of wafer disks 20 is multiple, each wafer disk 20 is used for placing a wafer, and at least one wafer disk 20 is used for placing a different wafer from other wafer disks 20. Specifically, each wafer tray 20 is provided with an ejector pin mechanism for ejecting a chip in a wafer placed on the wafer tray 20, so that the lifted chip can be taken out when the swing arm 30 moves to the wafer tray 20.
The number of the swing arms 30 is plural, each swing arm 30 corresponds to one wafer disk 20, and the plural swing arms 30 respectively correspond to plural wafer bits in one wafer bit unit group of the target substrate. Each swing arm 30 is provided with a second driving mechanism 31, and each second driving mechanism 31 is used for driving the corresponding swing arm 30 to move from the wafer tray 20 corresponding to the swing arm 30 to the die bonding station in sequence and to move from the die bonding station to the wafer tray 20 corresponding to the swing arm 30. The swing arms 30 are used for taking the chips from the corresponding wafer trays 20, and transferring the chips to the corresponding chip sites of a chip site unit group on the target substrate in sequence at the die bonding station. Specifically, each swing arm 30 has, in addition to the second drive mechanism 31, another drive mechanism for driving the swing arm 30 to move in the vertical direction; when the swing arm 30 reaches the wafer disk 20 to pick up the wafer, the swing arm 30 is driven by the driving mechanism to move in the vertical direction, and the wafer lifted by the ejector pin mechanism is transferred to the swing arm 30, so that the wafer is picked up.
The die bonding equipment in this embodiment includes a carrier, where the carrier is provided with a first driving mechanism, and the first driving mechanism can move a target substrate placed on the carrier, so that different wafer bit cell groups on the target substrate move to die bonding stations. The number of the swing arms 30 is multiple, and for each swing arm 30, it corresponds to one wafer disk 20 and corresponds to one wafer position in one wafer position unit group on the target substrate, and each swing arm 30 can be driven by its corresponding second driving mechanism to move to the wafer disk 20 corresponding to the swing arm 30, take a wafer at the wafer disk 20, and move to a die bonding station on the carrier under the driving of the second driving mechanism, so as to transfer and mount the wafer to the wafer position corresponding to the swing arm 30 in the wafer position unit group on the target substrate located at the die bonding station. In the plurality of wafer disks 20, at least one wafer disk 20 is different from the other wafer disks 20 in wafer placement, that is, the plurality of wafer disks 20 are different in wafer placement with at least two different chips. The number of the types of wafers placed on the plurality of wafer disks 20 and the type of the wafer placed on each wafer disk 20 may be set as required, so that each swing arm 30 may pick up the wafer at the wafer disk 20 corresponding thereto, and the picked-up wafer is the same as the type of the wafer to be placed at the wafer position corresponding to the swing arm 30. In this case, when each chip site included in one chip site unit group on the target substrate is located at the die bonding station, the swing arms 30 may take one chip at the corresponding wafer tray 20, and transfer and mount the taken one chip to each chip site in the chip site unit group at the die bonding station, respectively, without moving the target substrate by the first driving mechanism. After the transfer installation of the wafers in each wafer position included in one wafer position unit group on the target substrate is completed, the target substrate needs to be moved by the first driving mechanism to a position where each wafer position in the next wafer position unit group on the target substrate is located at the die bonding station, and then the swing arms 30 respectively transfer and install the corresponding wafer to each wafer position in the wafer position unit group. And repeating the process to finish the transfer installation of the wafers of all wafer positions on the target substrate. Therefore, on one hand, after one wafer is transferred and mounted to the corresponding wafer position on the target substrate at one time, the operation of transferring and mounting the next wafer to the corresponding wafer position on the target substrate is not needed; in addition, in the above process, the number of times the target substrate is moved by the first driving mechanism is greatly reduced, and higher efficiency can be achieved compared with the prior art.
Specifically, in the present embodiment, the number of the wafer disks 20 is three, and the three wafer disks are respectively used for placing three different wafers, namely, a wafer with red LED chips, a wafer with green LED chips, and a wafer with blue LED chips.
One wafer bit cell group on the target substrate has three wafer bits, which respectively require the transfer of mounted wafers as red LED chips, green LED chips, and blue LED chips.
The number of the swing arms 30 is three, and the three swing arms correspond to the three wafer disks 20 respectively, and correspond to three wafer positions included in one wafer position unit group on the target substrate respectively. When each chip position included in one chip position unit group on the target substrate is located at a die bonding station, the first swing arm 30 is used for taking a red LED chip at the wafer tray 20 where a wafer with the red LED chip is placed, and transferring and mounting the taken red LED chip to the chip position where the red LED chip is required to be placed in the die bonding station group on the target substrate at the die bonding station; the second swing arm 30 is used for taking the green LED chip from the wafer tray 20 on which the wafer with the green LED chip is placed, and transferring and mounting the taken green LED chip to a wafer position on the target substrate, where the green LED chip is required to be placed, in the die bonding position unit group at the die bonding station; the third swing arm 30 is used for taking the blue LED chips from the wafer tray 20 on which the wafer with the blue LED chips is placed, and transferring and mounting the taken blue LED chips to the wafer positions on the target substrate in the die bonding position unit group where the blue LED chips are required to be placed at the die bonding position.
In this embodiment, an image capturing device 40 is disposed at the die bonding station, and the image capturing device 40 is used for capturing an image of the target substrate. The image of the target substrate acquired by the image acquisition device 40 may be used to determine whether the moved target substrate satisfies that each wafer position included in the next wafer position unit group is located in the die bonding station after the first driving mechanism drives the target substrate to move. If the position of the target substrate is not satisfied, the position of the target substrate needs to be further adjusted, for example, the target substrate is driven to move continuously by the first driving mechanism. If the wafer position is satisfied, the swing arms 30 can respectively transfer and mount the corresponding wafer to each wafer position in the wafer position unit group located at the die bonding station.
It should be noted that the image captured by the image capturing device 40 may include not only a photo, but also a dynamic video, and may also be continuous real-time video monitoring information.
The principle and process of the die bonding process performed by the die bonding equipment in the embodiment are exemplarily described below with reference to the drawings.
In the first step, the first swing arm 30 is driven by the corresponding second driving mechanism to move to the first wafer disc 20 corresponding to the first swing arm 30, and the wafer disc 20 is placed with the red LED chips. The first swing arm 30 picks up the red LED chips at the first wafer disk 20.
Secondly, a second driving mechanism drives the first swing arm 30 to move to a die bonding station; at this time, the target substrate placed on the carrier is driven by the first driving mechanism to move to the position where each wafer position in one wafer position unit group on the target substrate is located at the die bonding station.
Thirdly, at the die bonding station, the first swing arm 30 mounts the red LED chip to the chip site of the target substrate located in the die bonding station, where the red LED chip is required to be placed.
Fourthly, the second driving mechanism drives the first swing arm 30 to move from the die bonder to the first wafer disk 20, and then the red LED chip is taken out for standby.
And fifthly, the second swing arm 30 is driven by the corresponding second driving mechanism to move to the second wafer disc 20 corresponding to the second swing arm 30, and the wafer disc 20 is provided with the wafer with the green LED chips. The second swing arm 30 picks up green LED chips at the second wafer disk 20.
And sixthly, the second driving mechanism drives the second swing arm 30 to move to the die bonding station on the carrying platform.
And seventhly, at the die bonding station, the second swing arm 30 transfers and mounts the green LED chip to a chip position on the target substrate, where the green LED chip is required to be placed, in the chip position unit group located at the die bonding station.
And eighthly, driving the second swing arm 30 to move from the die bonder to the second wafer disk 20 by the second driving mechanism to take the green LED chip for standby.
In the ninth step, the third swing arm 30 is driven by the corresponding second driving mechanism to move to the third wafer disc 20 corresponding to the third swing arm 30, and the wafer disc 20 is placed with the blue LED chips. The third swing arm 30 picks up blue LED chips at the third wafer disk 20.
Tenth, the second driving mechanism drives the third swing arm 30 to move to the die bonding station on the carrier.
And a tenth step, at the die bonding station, the third swing arm 30 transfers and mounts the blue LED chip to a chip site on the target substrate, where the blue LED chip is required to be placed, in the chip site unit group located at the die bonding station.
And step ten, the second driving mechanism drives the third swing arm 30 to move from the die bonder to the third wafer disk 20, and then the blue LED chip is taken out for standby.
And a tenth step, driving the target substrate to move by the first driving mechanism, so that each wafer position included in the next wafer position unit group on the target substrate is positioned at the die bonding station.
And fourteenth, acquiring an image of the target substrate by an image acquisition device positioned at the die bonding station, and judging whether each wafer position included in the next wafer position unit group on the target substrate is positioned at the die bonding station according to the image acquired by the image acquisition device. If the target substrate is in the die bonding station, the target substrate is moved in place, and if the target substrate is not in the die bonding station, the target substrate is not moved in place, and the position of the target substrate needs to be further adjusted. Further adjustment of the position of the target substrate may be continued by the first drive mechanism.
And a fifteenth step, which is repeated from the first step, for respectively and sequentially transferring and mounting the corresponding red LED chip, green LED chip and blue LED chip in each wafer site in the next wafer site unit group on the target substrate. And continuously repeating the steps until all the wafer positions in all the wafer position unit groups on the target substrate are transferred and mounted with the corresponding LED chips.
The principle and process of the die bonding process performed by the die bonding apparatus in this embodiment are described above by taking the red LED chip, the green LED chip, and the blue LED chip from the three die disks 20 respectively by the three swing arms 30 and mounting the red LED chip, the green LED chip, and the blue LED chip on three die sites in the die site unit group of the target substrate respectively, and the above description is only exemplary, and various adaptive changes and adjustments can be made for other different embodiments. Specifically, to increase the speed, the above steps may be performed simultaneously, for example, the first swing arm may be moving to the wafer fixing station, the second swing arm may be moving to the wafer fixing station, and the third swing arm may be moving from the wafer fixing station to the wafer fixing station. This is done synchronously to increase speed.
In order to improve the process efficiency, the die bonding equipment further comprises a control mechanism for controlling the plurality of second driving mechanisms 31, and the control mechanism controls the two swing arms 30 which continuously reach the die bonding station under the driving of the corresponding second driving mechanisms 31 to reach the die bonding station.
In summary, the die bonding apparatus provided by the present invention includes a carrier, wherein the carrier is provided with a first driving mechanism, and the first driving mechanism can move a target substrate placed on the carrier, so that different wafer position unit groups on the target substrate are moved to die bonding stations. The number of the swing arms 30 is multiple, and for each swing arm 30, it corresponds to one wafer disk 20 and corresponds to one wafer position in one wafer position unit group on the target substrate, and each swing arm 30 can be driven by its corresponding second driving mechanism to move to the wafer disk 20 corresponding to the swing arm 30, take a wafer at the wafer disk 20, and move to a die bonding station on the carrier under the driving of the second driving mechanism, so as to transfer and mount the wafer to the wafer position corresponding to the swing arm 30 in the wafer position unit group on the target substrate located at the die bonding station. In the plurality of wafer disks 20, at least one wafer disk 20 is different from the other wafer disks 20 in wafer placement, that is, the plurality of wafer disks 20 are different in wafer placement with at least two different chips. The number of the types of wafers placed on the plurality of wafer disks 20 and the type of the wafer placed on each wafer disk 20 may be set as required, so that each swing arm 30 may pick up the wafer at the wafer disk 20 corresponding thereto, and the picked-up wafer is the same as the type of the wafer to be placed at the wafer position corresponding to the swing arm 30. In this case, when each chip site included in one chip site unit group on the target substrate is located at the die bonding station, the swing arms 30 may take one chip at the corresponding wafer tray 20, and transfer and mount the taken one chip to each chip site in the chip site unit group at the die bonding station, respectively, without moving the target substrate by the first driving mechanism. After the transfer installation of the wafers in each wafer position included in one wafer position unit group on the target substrate is completed, the target substrate needs to be moved by the first driving mechanism to a position where each wafer position in the next wafer position unit group on the target substrate is located at the die bonding station, and then the swing arms 30 respectively transfer and install the corresponding wafer to each wafer position in the wafer position unit group. And repeating the process to finish the transfer installation of the wafers of all wafer positions on the target substrate. Therefore, on one hand, after one wafer is transferred and mounted to the corresponding wafer position on the target substrate at one time, the operation of transferring and mounting the next wafer to the corresponding wafer position on the target substrate is not needed; in addition, in the above process, the number of times the target substrate is moved by the first driving mechanism is greatly reduced, and higher efficiency can be achieved compared with the prior art.
(2) Examples of die bonding methods
In this embodiment, as shown in fig. 4, the die bonding method includes:
and S1, acquiring the type information of the wafer required to be placed by the plurality of wafer sites in the wafer site unit group on the target substrate.
The target substrate usually includes a plurality of wafer bit unit sets, each wafer bit unit set includes a plurality of wafer bits, and each wafer bit has a preset requirement for a type of wafer to be placed, and is generally determined according to a type and parameters of the target substrate. Also, typically, multiple wafer sites per group of wafer site cells require different wafers to be placed. In step S1, each wafer bit cell group includes three wafer bits; the three wafer positions respectively require transfer mounting of a red LED chip, a green LED chip and a blue LED chip.
And S2, selecting the wafer disc 20 with the corresponding chip and the swing arm 30 corresponding to the wafer disc 20 from the wafer discs 20 and the swing arms 30.
It will be appreciated that for different types of target substrates, the number of wafer bits included in each wafer bit cell group is different, with some wafer bits being two, some wafer bits being three, and some being four or more.
In the present embodiment, as described above, the wafer bit unit group includes three wafer bits, and the three wafer bits respectively require placement of a red LED chip, a green LED chip, and a blue LED chip. In this case, three wafer disks 20 and swing arms 30 are selected, and wafers having red LED chips, wafers having green LED chips, and wafers having blue LED chips are placed in the selected wafer disks 20, respectively. Meanwhile, the selected swing arm 30 is the swing arm 30 corresponding to the three wafer disks 20, and the swing arm 30 corresponding to the wafer disk 20 takes the corresponding type of LED chips from the wafer disk 20.
And S3, controlling the selected swing arm 30 to take the chips from the corresponding wafer tray 20, sequentially moving the chips to the die bonding station, and sequentially transferring and mounting the taken chips to the corresponding chip position in a chip position unit group on the target substrate reaching the die bonding station.
Specifically, the first swing arm 30 takes the red LED chip from the corresponding wafer tray 20, moves to the die bonding station, and transfers and mounts the red LED chip to a chip site, where the red LED chip is required to be placed, in a chip site unit group on the target substrate located at the die bonding station. Later than the first swing arm 30, the second swing arm 30 picks up the green LED chip from the corresponding wafer tray 20, moves the green LED chip to the die bonding station, and transfers and mounts the green LED chip to a chip site where the green LED chip is required to be placed in a chip site unit group on the target substrate located at the die bonding station. Later than the second swing arm 30, the third swing arm 30 picks up the blue LED chip from the corresponding wafer tray 20, moves the blue LED chip to the die bonding station, and transfers and mounts the blue LED chip to a chip site where the blue LED chip is required to be placed in a chip site unit group on the target substrate located at the die bonding station.
S4, moving the target substrate to make each wafer bit included in the next wafer bit unit group on the target substrate reach the die bonding station, and repeating the previous step S3 until all wafer bits in the wafer bit unit group on the target substrate are transferred and mounted with wafers.
In the above-described step S3, the transfer mounting of the wafers of all the wafer levels in the group of one wafer level cells on the target substrate is completed. In step S4, the target substrate is moved, each wafer level in the wafer level unit group on the target substrate to which the wafer has been transferred is moved out of the die bonding station, and each wafer level in the next wafer level unit group on the target substrate is moved to the die bonding station; then, by repeating step S3, transfer mounting of the wafer for each wafer level in the group of wafer level cells on the target substrate can be completed. Thus, by moving the target substrate and continuously repeating step S3, all the wafers on the target substrate can be bit-transferred with the corresponding wafers mounted thereon.
In the die bonding method provided by this embodiment, one wafer bit unit group on the target substrate is used as a unit, and a corresponding wafer is transferred and mounted to each wafer bit in the one wafer bit unit group each time, so that the target substrate does not need to be moved in the process; after each wafer position in one wafer position unit group is transferred and installed with a wafer, the target substrate needs to be moved, so that each wafer position included in the next wafer position unit group on the target substrate is located at the wafer fixing station, and then the corresponding wafer is transferred and installed on each wafer position in the next wafer position unit group, and the steps are repeated until all wafer positions on the target substrate are transferred and installed with wafers. Compared with the prior art, the die bonding method provided by the embodiment does not need to transfer and mount a next wafer to a corresponding wafer position on the target substrate after all wafers are transferred and mounted to the corresponding wafer position on the target substrate at one time; on the other hand, the number of times of movement of the target substrate can be greatly reduced, and higher efficiency can be achieved compared with the prior art.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A die bonder is used for mounting a wafer on a target substrate and is characterized by comprising a carrying platform, a wafer disc and a swing arm;
the carrying platform is used for carrying a target substrate, and a first driving mechanism is arranged on the carrying platform and used for driving the target substrate placed on the carrying platform to move so as to enable each wafer contained in one wafer position unit group on the target substrate to move to a wafer fixing station; the target substrate is provided with a plurality of wafer bit unit groups;
the number of the wafer disks is multiple, each wafer disk is used for placing wafers, and the wafers placed on at least one wafer disk are different from those placed on other wafer disks;
the number of the swing arms is multiple, each swing arm corresponds to one wafer disc, and one swing arm corresponds to one wafer position in one wafer position unit group of the target substrate;
each swing arm is provided with a second driving mechanism, and each second driving mechanism is used for driving the corresponding swing arm to sequentially move from the wafer disc corresponding to the swing arm to the die bonding station and from the die bonding station to the wafer disc corresponding to the swing arm;
the plurality of swing arms are used for taking wafers at the corresponding wafer disks respectively and transferring the wafers to corresponding wafer positions of a wafer position unit group positioned at a wafer fixing station on a target substrate in sequence at the wafer fixing station;
each wafer bit unit group on the target substrate is provided with three wafer bits, and the three wafer bits are respectively used for placing a red LED chip, a green LED chip and a blue LED chip;
during die bonding, the chip mounting step comprises: the first swing arm mounts the red LED chip to a chip site corresponding to the red LED chip in a first chip site unit group of the target substrate,
then, the second swing arm mounts the green LED chip on the chip position corresponding to the green LED chip in the first chip position unit group of the target substrate,
finally, the third swing arm installs the blue LED chip on the chip position corresponding to the blue LED chip in the first chip position unit group of the target substrate;
and then moving the target substrate to enable each wafer position contained in the next wafer position unit group on the target substrate to reach a die bonding station, and repeating the chip mounting step until all wafer positions in the predetermined wafer position unit group on the target substrate are transferred and mounted with wafers.
2. The die bonding apparatus according to claim 1, wherein the number of the die disks is three, and the three die disks are used for placing a wafer with red LED chips, a wafer with green LED chips and a wafer with blue LED chips, respectively.
3. The die bonding equipment as claimed in claim 1 or 2, wherein an image acquisition device is arranged at the die bonding station and used for acquiring an image of the target substrate.
4. The die bonding apparatus according to claim 1, further comprising a control mechanism for controlling the plurality of second driving mechanisms, wherein the control mechanism controls each swing arm to sequentially reach a corresponding wafer position in the group of wafer position units at the die bonding station on the target substrate under the driving of the corresponding second driving mechanism.
5. A die bonding method is characterized by comprising the following steps:
acquiring the type information of a wafer required to be placed by a plurality of wafer bits in a wafer bit unit group on a target substrate;
selecting a wafer disc with a corresponding wafer and a swing arm corresponding to the wafer disc from a plurality of wafer discs and swing arms;
controlling the selected swing arm to take a chip from the corresponding wafer disc, moving the swing arm to a die bonding station, and transferring and mounting the taken chip to a corresponding chip position in a chip position unit group on a target substrate reaching the die bonding station, wherein the target substrate is provided with a plurality of chip position unit groups;
each wafer bit unit group on the target substrate is provided with three wafer bits, and the three wafer bits are respectively used for placing a red LED chip, a green LED chip and a blue LED chip;
wherein the chip mounting step includes: the first swing arm mounts the red LED chip to a chip site corresponding to the red LED chip in a first chip site unit group of the target substrate,
then, the second swing arm mounts the green LED chip on the chip position corresponding to the green LED chip in the first chip position unit group of the target substrate,
finally, the third swing arm installs the blue LED chip on the chip position corresponding to the blue LED chip in the first chip position unit group of the target substrate;
and moving the target substrate to enable each wafer position in the next wafer position unit group on the target substrate to reach the die bonding station, and repeating the chip mounting step until all wafer positions in the predetermined wafer position unit group on the target substrate are transferred and mounted with wafers.
6. The die bonding method according to claim 5, further comprising:
and after the target substrate is moved, detecting whether each wafer in the wafer position unit group on the target substrate reaches the die bonding station.
7. The die bonding method according to claim 6, wherein the detection of whether each wafer position in the group of wafer position units on the target substrate reaches the die bonding station is determined according to an image of the target substrate acquired by an image acquisition device arranged at the die bonding station.
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| CN202110680675.5A CN113539913B (en) | 2021-06-18 | 2021-06-18 | Die bonding equipment and die bonding method |
| PCT/CN2021/132303 WO2022262194A1 (en) | 2021-06-18 | 2021-11-23 | Die bonding device and die bonding method |
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| CN202110680675.5A CN113539913B (en) | 2021-06-18 | 2021-06-18 | Die bonding equipment and die bonding method |
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| CN113539913B true CN113539913B (en) | 2022-03-29 |
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| CN110379732A (en) * | 2019-05-28 | 2019-10-25 | 广东工业大学 | A kind of detection die bond integration bull chip mounter |
| CN111863685A (en) * | 2020-07-31 | 2020-10-30 | 深圳市踏路科技有限公司 | COB die bonder |
| CN111863669A (en) * | 2020-07-31 | 2020-10-30 | 深圳市踏路科技有限公司 | COB die bonding balance method and system and COB die bonding machine |
| CN113539913B (en) * | 2021-06-18 | 2022-03-29 | 深圳市卓兴半导体科技有限公司 | Die bonding equipment and die bonding method |
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