CN113508502A - 双腔dfb激光器芯片、光发射组件、光模块及光网络装置 - Google Patents
双腔dfb激光器芯片、光发射组件、光模块及光网络装置 Download PDFInfo
- Publication number
- CN113508502A CN113508502A CN201980093475.0A CN201980093475A CN113508502A CN 113508502 A CN113508502 A CN 113508502A CN 201980093475 A CN201980093475 A CN 201980093475A CN 113508502 A CN113508502 A CN 113508502A
- Authority
- CN
- China
- Prior art keywords
- grating
- dfb laser
- laser chip
- dual cavity
- extending direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
本申请提供一种双腔DFB激光器芯片、光发射组件、光模块及光网络装置,在芯片基底组件上方沿光栅延伸方向间隔设置第一光栅和第二光栅。第一光栅的任意一个第一刻蚀区的沿光栅延伸方向的正投影与第二光栅的任意一个第二刻蚀区的沿光栅延伸方向的正投影之间具有相对位移,以使得第一光栅与第二光栅之间具有相位差,且第一光栅和第二光栅经过解理所形成的解理端面相位不同,因此,第一光栅对应的DFB激光器与第二光栅对应的DFB激光器的边模抑制比和斜率效率都会产生明显差异,总有一个DFB激光器的边模抑制比和斜率效率等性能指标满足性能要求,以便在封装时选择性能更优越的DFB激光器进行封装,提高了双腔DFB激光器芯片的成品率。
Description
PCT国内申请,说明书已公开。
Claims (14)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/077864 WO2020181497A1 (zh) | 2019-03-12 | 2019-03-12 | 双腔dfb激光器芯片、光发射组件、光模块及光网络装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113508502A true CN113508502A (zh) | 2021-10-15 |
CN113508502B CN113508502B (zh) | 2022-12-30 |
Family
ID=72427716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980093475.0A Active CN113508502B (zh) | 2019-03-12 | 2019-03-12 | 双腔dfb激光器芯片、光发射组件、光模块及光网络装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113508502B (zh) |
WO (1) | WO2020181497A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019228426A1 (en) * | 2018-05-30 | 2019-12-05 | Huawei Technologies Co., Ltd. | Laser chip design |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040131099A1 (en) * | 2002-10-28 | 2004-07-08 | Finisar Corporation | Process for improving yield of DFB lasers |
CN101803133A (zh) * | 2007-09-11 | 2010-08-11 | 宾奥普迪克斯股份有限公司 | 多腔刻蚀端面dfb激光器 |
CN103715607A (zh) * | 2013-12-19 | 2014-04-09 | 中国科学院半导体研究所 | 一种可调谐衬底发射量子级联激光器阵列器件 |
CN105140779A (zh) * | 2015-09-07 | 2015-12-09 | 南京大学 | 基于重构-等效啁啾技术的备份型半导体激光器 |
CN107275925A (zh) * | 2017-07-31 | 2017-10-20 | 青岛海信宽带多媒体技术有限公司 | 激光芯片及其制备方法、光模块 |
-
2019
- 2019-03-12 WO PCT/CN2019/077864 patent/WO2020181497A1/zh active Application Filing
- 2019-03-12 CN CN201980093475.0A patent/CN113508502B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040131099A1 (en) * | 2002-10-28 | 2004-07-08 | Finisar Corporation | Process for improving yield of DFB lasers |
CN101803133A (zh) * | 2007-09-11 | 2010-08-11 | 宾奥普迪克斯股份有限公司 | 多腔刻蚀端面dfb激光器 |
CN103715607A (zh) * | 2013-12-19 | 2014-04-09 | 中国科学院半导体研究所 | 一种可调谐衬底发射量子级联激光器阵列器件 |
CN105140779A (zh) * | 2015-09-07 | 2015-12-09 | 南京大学 | 基于重构-等效啁啾技术的备份型半导体激光器 |
CN107275925A (zh) * | 2017-07-31 | 2017-10-20 | 青岛海信宽带多媒体技术有限公司 | 激光芯片及其制备方法、光模块 |
Non-Patent Citations (1)
Title |
---|
JUNSHOU ZHENG ET AL.: "an equivalent-stepped-index-coupled DFB semiconductor laser and laser array realized by stepping the duty cycle of the sampled bragg grating", 《 OPTICS & LASER TECHNOLOGY》 * |
Also Published As
Publication number | Publication date |
---|---|
CN113508502B (zh) | 2022-12-30 |
WO2020181497A1 (zh) | 2020-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2017107958A (ja) | 半導体レーザ | |
US20090267195A1 (en) | Semiconductor element and method for manufacturing semiconductor element | |
KR100582114B1 (ko) | 반도체 디바이스 제작 방법 및 반도체 광 디바이스 | |
JP2008166371A (ja) | 光半導体素子及びその製造方法 | |
JP2002353559A (ja) | 半導体レーザ及びその製造方法 | |
CN113508502B (zh) | 双腔dfb激光器芯片、光发射组件、光模块及光网络装置 | |
EP1227556A2 (en) | Complex-coupled distributed feedback semiconductor laser device | |
CN111129945B (zh) | 整片制作省隔离器边发射激光器芯片的方法 | |
CN115579735B (zh) | 一种单片集成二维dfb阵列芯片的制备方法 | |
US20050185689A1 (en) | Optoelectronic device having a Discrete Bragg Reflector and an electro-absorption modulator | |
US10581223B2 (en) | Structure and fabricating method of distributed feedback laser | |
JPH01164077A (ja) | 発光ダイオードおよびその製造方法 | |
US6432735B1 (en) | High power single mode laser and method of fabrication | |
KR20030069879A (ko) | 반도체레이저 및 이를 포함하는 광집적반도체소자의제조방법 | |
JP2950302B2 (ja) | 半導体レーザ | |
JP4984514B2 (ja) | 半導体発光素子および該半導体発光素子の製造方法 | |
JPH0724324B2 (ja) | 半導体レーザ・チップおよびその製造方法 | |
CN112821197A (zh) | 一种光发射芯片的制作方法和光发射芯片 | |
JP2000244059A (ja) | 半導体レーザ装置 | |
CN114930657A (zh) | 单模dfb激光器 | |
JPWO2005060058A1 (ja) | 半導体レーザーおよびその製造方法 | |
JP2002057405A (ja) | 半導体レーザ装置及びその製造方法 | |
CN113812049A (zh) | 一种用于光子集成电路的分布式反馈激光器装置及其改进和制造方法 | |
CN104078842A (zh) | 光学器件以及光学模块 | |
CN112636166B (zh) | 一种可调谐单纵模激光器及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |