CN113498277B - Processing method of circuit board containing thermistor material - Google Patents
Processing method of circuit board containing thermistor material Download PDFInfo
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- CN113498277B CN113498277B CN202110809977.8A CN202110809977A CN113498277B CN 113498277 B CN113498277 B CN 113498277B CN 202110809977 A CN202110809977 A CN 202110809977A CN 113498277 B CN113498277 B CN 113498277B
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- layer plate
- pressing
- circuit board
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- plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Abstract
The invention discloses a processing method of a circuit board containing thermistor materials, which comprises the following steps: A. manufacturing an inner layer plate and an outer layer plate with preset sizes; B. etching the inner-layer plate; C. sequentially pressing the etched inner-layer plates; D. drilling holes on the outer layer plate according to preset parameters; E. plating copper on the outer layer plate; F. and etching and soldering the outer plate. The invention can solve the defects of the prior art and improve the yield and the stability of the circuit board containing the thermistor material.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) manufacturing, in particular to a processing method of a circuit board containing thermistor materials.
Background
In fabricating a multi-layer PCB, a number of process steps involve high temperature processing. The PCB containing the thermistor material is easy to generate thermistor material modification and irregular deformation in high-temperature processing, and the processing quality of subsequent processing procedures is influenced.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for processing a circuit board containing a thermistor material, which can overcome the defects of the prior art and improve the yield and stability of the circuit board containing the thermistor material.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows.
A method for processing a circuit board containing thermistor materials comprises the following steps:
A. manufacturing an inner layer plate and an outer layer plate with preset sizes;
B. etching the inner-layer plate;
C. sequentially pressing the etched inner-layer plates;
D. drilling holes in the outer layer plate according to preset parameters;
E. plating copper on the outer layer plate;
F. and etching and solder-resisting the outer plate.
Preferably, in the step A, the preset size of the inner layer plate and the outer layer plate is 1-2% larger than that of a finished product; and D, performing secondary processing on the inner plate and the outer plate according to the size of the finished product before performing the step D.
Preferably, in step C, the inner layer plates are laminated one at a time, and the thickness of the insulating sheet used for each lamination is gradually reduced.
Preferably, in the step C, the thickness of the insulating sheet used each time is 80 to 85 percent of the thickness of the insulating sheet used last time, and the thickness of the insulating sheet used for the first time is more than 0.2 mm.
Preferably, in the step C, the temperature rise speed of the pressing is 0.6-1.0 ℃/min, the pressing temperature is controlled to be 135-150 ℃, and the room temperature cooling is carried out after the pressing is finished.
Preferably, in the step D, the outer plate is heated to 45 ℃ to be drilled, and the top surface and the bottom surface are drilled in a bidirectional drilling mode.
Preferably, in step F, the curing temperature of the solder resist green oil is 120 ℃, and the curing time is 4 h.
Adopt the beneficial effect that above-mentioned technical scheme brought to lie in: the invention optimizes the process route of the circuit board, adopts a mode of repeated low-temperature pressing for the pressing process, and effectively solves the quality problem caused by high temperature.
Detailed Description
Example 1
A method for processing a circuit board containing thermistor materials comprises the following steps:
A. manufacturing an inner layer plate and an outer layer plate with preset sizes;
B. etching the inner-layer plate;
C. sequentially pressing the etched inner-layer plates;
D. drilling holes on the outer layer plate according to preset parameters;
E. plating copper on the outer layer plate;
F. and etching and soldering the outer plate.
In the step A, the preset sizes of the inner layer plate and the outer layer plate are 1% larger than the size of a finished product; and D, performing secondary processing on the inner laminate and the outer laminate according to the size of the finished product before performing the step D.
And step C, pressing one inner-layer plate each time, wherein the thickness of the insulation sheet used in pressing each time is gradually reduced.
In the step C, the thickness of the insulating sheet used each time is 80% -85% of that of the insulating sheet used last time, and the thickness of the insulating sheet used first time is larger than 0.2 mm.
In the step C, the temperature rising speed of the pressing is 0.7 ℃/min, the pressing temperature is controlled at 140 ℃, and the room temperature is cooled after the pressing is finished.
And D, heating the outer plate to 45 ℃ for drilling, and drilling in a mode of bidirectional drilling on the top surface and the bottom surface.
And in the step F, the curing temperature of the solder resist green oil is 120 ℃, and the curing time is 4 h.
Comparative example 1
The comparison example is modified on the basis of the example 1, specifically, the step C of the example 1 is replaced by one-time pressing at 180 ℃, and the temperature rise speed of the pressing is increased to 2 ℃/min.
Comparative example 2
The comparison example is modified on the basis of the comparison example 1, and specifically, the one-time lamination of the comparison example 1 is changed into the sequential lamination of the inner layer plates in the example 1.
A24-layer PCB product containing thermistor material was processed using the process steps of example 1 and the two comparative examples, and the product yields are shown in the following table.
| Group of | Yield of |
| Example 1 | 93% |
| Comparative example 1 | 85% |
| Comparative example 2 | 88% |
Therefore, by improving the pressing process, the invention can obviously improve the product yield of the multilayer board containing the thermistor material.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A processing method of a circuit board containing thermistor materials is characterized by comprising the following steps:
A. manufacturing an inner layer plate and an outer layer plate with preset sizes;
B. etching the inner-layer plate;
C. sequentially pressing the etched inner-layer plates; pressing one inner layer plate each time, wherein the thickness of the insulation sheet used in pressing each time is gradually reduced; the thickness of the insulating sheet used each time is 80-85% of that of the insulating sheet used last time, and the thickness of the insulating sheet used first time is larger than 0.2 mm; the temperature rise speed of the pressing is 0.6-1.0 ℃/min, the pressing temperature is controlled to be 135-150 ℃, and the room temperature cooling is carried out after the pressing is finished;
D. drilling holes on the outer layer plate according to preset parameters;
E. plating copper on the outer layer plate;
F. and etching and soldering the outer plate.
2. The method of manufacturing a thermistor material-containing circuit board according to claim 1, characterized in that: in the step A, the preset sizes of the inner layer plate and the outer layer plate are 1-2% larger than the size of a finished product; and D, performing secondary processing on the inner laminate and the outer laminate according to the size of the finished product before performing the step D.
3. The method of manufacturing a thermistor material-containing circuit board according to claim 1, characterized in that: and D, heating the outer plate to 45 ℃ for drilling, and drilling in a mode of bidirectional drilling on the top surface and the bottom surface.
4. The method of manufacturing a thermistor material-containing circuit board according to claim 1, characterized in that: in the step F, the curing temperature of the solder resist green oil is 120 ℃, and the curing time is 4 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110809977.8A CN113498277B (en) | 2021-07-17 | 2021-07-17 | Processing method of circuit board containing thermistor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110809977.8A CN113498277B (en) | 2021-07-17 | 2021-07-17 | Processing method of circuit board containing thermistor material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113498277A CN113498277A (en) | 2021-10-12 |
| CN113498277B true CN113498277B (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110809977.8A Active CN113498277B (en) | 2021-07-17 | 2021-07-17 | Processing method of circuit board containing thermistor material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115415622B (en) * | 2022-07-29 | 2024-02-02 | 广州广合科技股份有限公司 | Preparation method of PCB (printed circuit board) direct display board for mini LED (light-emitting diode) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465222A (en) * | 2020-04-21 | 2020-07-28 | 大连崇达电子有限公司 | Method for improving out-of-tolerance control of outer-layer impedance and multilayer circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW583080B (en) * | 2001-03-07 | 2004-04-11 | Protectronics Technology Corp | Composite material for thermistor having positive temperature coefficient and manufacturing method thereof |
| CN106888549A (en) * | 2017-04-12 | 2017-06-23 | 广东冠锋科技股份有限公司 | A kind of High Frequency Of Recombination circuit board and its production method |
| CN107041067A (en) * | 2017-05-10 | 2017-08-11 | 深圳市深联电路有限公司 | A kind of preparation method of thermistor printed circuit board |
| CN107946010A (en) * | 2017-11-15 | 2018-04-20 | 江苏苏杭电子有限公司 | Processing technology based on circuit board production technology processing thermistor semiconductor |
| CN109803502A (en) * | 2019-01-29 | 2019-05-24 | 广德宝达精密电路有限公司 | A kind of thermistor material PCB manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111465222A (en) * | 2020-04-21 | 2020-07-28 | 大连崇达电子有限公司 | Method for improving out-of-tolerance control of outer-layer impedance and multilayer circuit board |
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| CN113498277A (en) | 2021-10-12 |
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