CN113492263A

CN113492263A - Laser polishing device

Info

Publication number: CN113492263A
Application number: CN202110667959.0A
Authority: CN
Inventors: 肖永山; 赵振宇; 李佳霓; 帅词俊; 蔡学奋; 李凯; 尹杰; 周浩
Original assignee: Shenzhen Institute of Information Technology
Current assignee: Shenzhen Institute of Information Technology
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2021-10-12
Anticipated expiration: 2041-06-16
Also published as: CN113492263B

Abstract

The invention discloses a laser polishing device, which comprises a rack, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms, wherein the rack is provided with a plurality of positioning holes; the moving mechanism and the laser mechanism are arranged on the rack, and the workpiece placing mechanism is arranged on the moving mechanism; the moving mechanism drives the workpiece placing mechanisms to move in a reciprocating mode, so that one workpiece placing mechanism is located in a laser polishing area, and at least one other workpiece placing mechanism is used for feeding materials. The laser polishing device can realize the processes of continuous feeding, polishing, taking and re-feeding, does not need to be stopped, and has high efficiency, convenient operation and convenient automatic continuous production. Moreover, the processes of continuous feeding, polishing, taking and re-feeding can be realized by only needing two workpiece placing mechanisms at least, the cost of the workpiece placing mechanism is saved, and the workpiece placing mechanism is fully utilized.

Description

Laser polishing device

Technical Field

The invention relates to the technical field of laser polishing, in particular to a laser polishing device.

Background

The laser polishing technique is a new laser processing application technique, and is characterized by that a focused laser beam spot is used to act on the surface of rough metal workpiece to make the convex thin layer of material surface melt and evaporate. The melted material flows under the action of surface tension and gravity, fills the concave part on the surface of the titanium alloy and solidifies to finally obtain the ideal polished material surface.

Is currently favored by many researchers and research institutions. Laser applications for metal surface polishing have potential advantages that not only are selectable polishing rates, no chemical contamination, and polishing process detectability, but also are a non-contact process. The detection result can be obtained, and the surface roughness of the workpiece after laser polishing is obviously reduced.

Most singleness operations of laser polishing equipment on the existing market, the material loading of treating polishing work piece before the polishing and the piece of getting after the polishing is accomplished all need to shut down, and efficiency is not high, troublesome poeration, inconvenient automatic continuous production, with high costs.

Disclosure of Invention

The invention aims to provide a laser polishing device which can continuously carry out the processes of feeding, polishing, taking and re-feeding, does not need to be stopped, has high efficiency, is convenient to operate, is convenient for automatic continuous production and has low cost.

The invention discloses a laser polishing device, which comprises a rack, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms, wherein the rack is provided with a plurality of positioning holes; the moving mechanism and the laser mechanism are arranged on the rack, and the workpiece placing mechanism is arranged on the moving mechanism; the moving mechanism drives the workpiece placing mechanisms to move in a reciprocating mode, so that one workpiece placing mechanism is located in a laser polishing area, and at least one other workpiece placing mechanism is used for feeding materials.

Optionally, the workpiece placing mechanism comprises a tilting assembly and a polishing table assembly; the polishing table assembly is arranged on the inclined rotating assembly and used for placing a workpiece to be polished, and the inclined assembly is used for rotating and inclining the polishing table assembly so as to enable the polishing datum plane to rotate and incline.

Optionally, the tilting assembly comprises a mounting seat, a rotating member and a first driving member; the rotating piece can be rotatably arranged on the mounting seat and is connected with the first driving piece; the first driving piece drives the rotating piece to rotate and incline so as to enable the polishing reference surface to rotate and incline.

Optionally, the tilting assembly comprises a polishing table assembly comprising a base, a second driving member and a polishing table; the base is arranged on the inclined assembly, the second driving piece is arranged on the base, and the polishing table is connected with the second driving piece; the second driving piece is used for driving the polishing table to rotate.

Optionally, a partition plate is arranged on the polishing table, and the partition plate partitions the polishing table into at least two processing areas.

Optionally, the partition plate includes a first sub-plate and a second sub-plate; the first sub-plate and the second sub-plate are connected in a staggered mode to form a cross shape, and the polishing table is divided into four processing areas.

Optionally, the moving mechanism includes a moving driving assembly and a sliding rail; the workpiece placing mechanism is arranged on the sliding rail in a sliding mode, and the moving driving assembly is connected with the workpiece placing mechanism and drives the workpiece placing mechanism to move.

Optionally, the moving driving assembly includes a third driving element and a screw rod; the two ends of the screw rod are respectively installed on the sliding rail through bearings, the third driving piece is connected with the screw rod, and the screw rod is connected with the workpiece placing mechanism.

Optionally, the screw rod is located in the middle of the slide rail.

Optionally, a lifting mechanism is arranged on the rack, the laser mechanism is arranged on the lifting mechanism, and the lifting mechanism can drive the laser mechanism to lift.

The laser polishing device can realize the processes of continuous feeding, polishing, taking and re-feeding, does not need to be stopped, and has high efficiency, convenient operation and convenient automatic continuous production. Moreover, the processes of continuous feeding, polishing, taking and re-feeding can be realized by only needing two workpiece placing mechanisms at least, the cost of the workpiece placing mechanism is saved, and the workpiece placing mechanism is fully utilized.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

FIG. 1 is a schematic view of a laser polishing apparatus according to an embodiment of the present invention;

FIG. 2 is another schematic view of a laser polishing apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic view of a tilt assembly and polishing table assembly according to an embodiment of the present invention.

100, a frame; 200. a moving mechanism; 210. a movement drive assembly; 211. a third driving member; 212. a screw rod; 213. a bearing; 220. a slide rail; 221. a channel; 300. a laser mechanism; 400. a workpiece placement mechanism; 410. a tilt assembly; 411. a mounting seat; 412. a rotating member; 413. a first driving member; 420. a polishing table assembly; 421. a base; 422. a second driving member; 423. a polishing table; 423a, a partition plate; 423a1, a first daughter board; 423a2, a second daughter board; 430. sealing the cabin body; 431. a base plate; 500. a lifting mechanism.

Detailed Description

It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

The invention is described in detail below with reference to the figures and alternative embodiments.

As shown in fig. 1 and 2, as an embodiment of the present invention, a laser polishing apparatus is disclosed, which includes a frame 100, a moving mechanism 200, a laser mechanism 300, and at least two workpiece placing mechanisms 400; the moving mechanism 200 and the laser mechanism 300 are arranged on the rack 100, and the workpiece placing mechanism 400 is arranged on the moving mechanism 200; the moving mechanism 200 drives the workpiece placing mechanisms 400 to reciprocate, so that the laser mechanism 300 polishes the workpiece in one of the workpiece placing mechanisms 400, and at least one other workpiece placing mechanism 400 is loaded.

In the laser polishing apparatus of the present invention, the workpiece placing mechanism 400 is used to place a workpiece to be polished. The laser mechanism 300 is used for emitting laser to perform laser polishing on a workpiece to be polished. The moving mechanism 200 is configured to drive the workpiece placement mechanisms 400 to reciprocate, so that the positions of the workpiece placement mechanisms 400 are changed, one of the workpiece placement mechanisms 400 is located in the laser polishing area, the laser mechanism 300 polishes the workpiece to be polished in the workpiece placement mechanism 400, and the remaining at least one workpiece placement mechanism 400 can be loaded at the same time, that is, the workpiece to be polished is placed in the workpiece placement mechanism 400. After the polishing of the workpiece currently being polished is completed, the moving mechanism 200 drives the workpiece placing mechanism 400 to move, and the next loaded workpiece placing mechanism 400 is brought into the laser polishing area to continue laser polishing. At this time, the workpiece which has just been polished is taken out and a new workpiece is loaded, and then the workpiece is driven by the moving mechanism 200 to the laser polishing area for polishing, and the workpiece which has been polished is taken out and a new workpiece is loaded at the same time. The moving mechanism 200 reciprocates in this way, and the processes of feeding, polishing, picking and reloading of each workpiece placing mechanism 400 are realized.

For example, as shown in fig. 1, when there are two workpiece placing mechanisms 400, the workpiece placing mechanism 400 on the left side can be loaded when the laser polishing area is polished by the workpiece placing mechanism 400 on the right side. After the left workpiece placing mechanism 400 finishes polishing, the moving mechanism 200 drives the two workpiece placing mechanisms 400 to move left, the left workpiece placing mechanism 400 leaves the laser polishing area, and the right workpiece placing mechanism 400 enters the laser polishing area. At this time, the laser mechanism 300 may continue to polish the workpiece in the workpiece placement mechanism 400 on the right. Meanwhile, the left workpiece placing mechanism 400 may be taken out, and then a new workpiece to be polished is placed on the left workpiece placing mechanism 400, completing the loading. After the right workpiece placing mechanism 400 finishes polishing, the moving mechanism 200 drives the two workpiece placing mechanisms 400 to move rightwards, the right workpiece placing mechanism 400 leaves the laser polishing area, and the left workpiece placing mechanism 400 enters the laser polishing area again. At this point, the laser mechanism 300 may continue to polish the workpiece in the workpiece placement mechanism 400 on the left. Meanwhile, the workpiece placing mechanism 400 on the right side can be taken out, and then a new workpiece to be polished is placed on the workpiece placing mechanism 400 on the right side, so that the feeding is completed. The moving mechanism 200 thus cyclically drives the workpiece placing mechanism 400 to reciprocate, and the processes of continuous feeding, polishing, workpiece taking and re-feeding are completed without stopping.

Specifically, the number of workpiece placement mechanisms 400 may be two, three, four, or even more. When the number of the workpiece placing mechanisms 400 is more than two, for example, three or four, the processes of loading, polishing, taking, and reloading are similar to those of the two cases. That is, the laser mechanism 300 sequentially polishes the workpieces in the workpiece placing mechanism 400, and after all the workpieces are sequentially polished, the moving mechanism 200 moves in the reverse direction, and the polishing is continued from the last workpiece. Or the moving mechanism 200 is directly moved in reverse and reset to continue polishing from the first one. Preferably, the workpiece placement mechanisms 400 of the present invention are two in number. The two workpiece placing mechanisms 400 can meet the requirements of feeding and taking without stopping, one workpiece can be polished while the other workpiece is taken or fed, the operation is simple and tedious, and the workpiece placing mechanisms 400 are fully utilized. In addition, only two workpiece placing mechanisms 400 are used, so that the requirements of feeding and taking without stopping are met, and the cost is low.

The laser polishing device can realize the processes of continuous feeding, polishing, taking and re-feeding, does not need to be stopped, and has high efficiency, convenient operation and convenient automatic continuous production. Moreover, at least two workpiece placing mechanisms 400 are needed to realize the processes of continuous feeding, polishing, workpiece taking and re-feeding, so that the cost of the workpiece placing mechanism 400 is saved, and the workpiece placing mechanism 400 is fully utilized.

Specifically, the workpiece placement mechanism 400 includes a tilt assembly 410 and a polishing table assembly 420; the polishing table assembly 420 is disposed on the tilt rotating assembly, the polishing table assembly 420 is used for placing a workpiece to be polished, and the tilting assembly 410 is used for rotating and tilting the polishing table assembly 420 so as to rotatably tilt the polishing reference surface. The tilting assembly 410 tilts the polishing table assembly 420 by rotation, which means that the tilting assembly 410 rotates the polishing table assembly 420 by a certain angle. For example, the polishing reference surface of the polishing table assembly 420 is horizontal in a normal state, and after the polishing table assembly 420 is driven by the tilting assembly 410 to rotate and tilt, the polishing reference surface is tilted to form a certain angle with respect to the horizontal plane. The scheme realizes the overturning and inclining of the polishing table component 420 at a certain angle through the arrangement of the inclining component 410, and can realize the polishing of the curved surface by matching with the 3D galvanometer of the laser mechanism 300.

Specifically, as shown in fig. 3, the tilting assembly 410 includes a mounting seat 411, a rotating member 412 and a first driving member 413; the rotating member 412 is rotatably mounted on the mounting seat 411 and connected to the first driving member 413; the first driving member 413 drives the rotating member 412 to rotate and tilt so that the polishing reference surface rotates and tilts.

Specifically, as shown in fig. 3, the tilting assembly 410 includes a polishing table assembly 420 including a base 421, a second driving member 422, and a polishing table 423; the base 421 is mounted on the tilting assembly 410, the second driving member 422 is mounted on the base 421, and the polishing table 423 is connected with the second driving member 422; the second driving member 422 is used to drive the polishing table 423 to rotate. The polishing table 423 is driven to rotate through the second driving piece 422, the angle of laser polishing can be changed, the polishing operation is more convenient, and the effect is better. The second drive 422 may be a motor.

Specifically, a partition plate 423a is provided on the polishing table 423, and the partition plate 423a partitions the polishing table 423 into at least two processing zones. The two processing areas separated by the spacing plate 423a can be used for placing workpieces to be polished, so that the feeding and polishing efficiency is improved, and the polishing continuity is improved. Meanwhile, the machining areas are separated by the partition plates 423a, so that the influence of the laser of the current machining area on workpieces of other machining areas can be prevented, and the polishing effect is ensured. The switching of the different processing zones is effected by the rotation of the second drive 422.

Specifically, the partition plate 423a includes a first sub-plate 423a1 and a second sub-plate 423a 2; the first sub-plate 423a1 and the second sub-plate 423a2 are connected in a staggered manner to form a cross shape, and the polishing table 423 is partitioned into four processing areas. In this case, the polishing table 423 is partitioned into four processing regions by the first sub-plate 423a1 and the second sub-plate 423a2, thereby improving the processing efficiency.

Specifically, the workpiece placement mechanism 400 includes a sealed enclosure 430, and the tilt assembly 410 and the polishing table assembly 420 are disposed in the sealed enclosure 430.

On the other hand, the moving mechanism 200 includes a moving driving assembly 210 and a slide rail 220; the workpiece placing mechanism 400 is slidably disposed on the slide rail 220, and the moving driving assembly 210 is connected to the workpiece placing mechanism 400 and drives the workpiece placing mechanism 400 to move. In the continuous polishing process, the moving driving assembly 210 drives the workpiece placing mechanism 400 to reciprocate on the slide rail 220, so as to complete the continuous feeding, polishing, taking and re-feeding processes. Specifically, the sealing cabin 430 is disposed at the bottom of the sealing cabin 430, and the bottom plate is slidably disposed on the slide rail 220.

Specifically, as shown in fig. 1, two ends of the slide rail 220 extend out of the machine frame 100, and when one workpiece placement mechanism 400 is located in the laser polishing area, the rest workpiece placement mechanisms 400 are located on the slide rail 220 extending out of the machine frame 100. The workpiece placement mechanism 400 located on the slide rail 220 extending outside the frame 100 facilitates the picking and feeding operations. More specifically, there are two workpiece placing mechanisms 400, wherein when one workpiece placing mechanism 400 is located in the laser polishing area, the other workpiece placing mechanism 400 is located on the slide rail 220 extending out of the machine frame 100, so as to facilitate the workpiece taking and loading operations.

The moving driving assembly 210 comprises a third driving member 211 and a screw rod 212; two ends of the screw rod 212 are respectively mounted on the slide rail 220 through bearings 213, the third driving member 211 is connected with the screw rod 212, and the screw rod 212 is connected with the workpiece placing mechanism 400. The screw rod 212 is accurate in driving position and good in positioning effect.

Specifically, the lead screw 212 is located at the middle position of the slide rail 220. In this embodiment, the screw 212 is located at the middle position of the slide rail 220, and the acting force of the screw 212 is also applied to the middle position of the workpiece placing mechanism 400. The workpiece placing mechanism 400 is more evenly stressed, the workpiece placing mechanism 400 is more easily driven to move, and the movement of the workpiece placing mechanism 400 is more stable. More specifically, the slide rail 220 is provided with a channel 221 in the middle, and the screw 212 is disposed in the channel 221.

On the other hand, the frame 100 is provided with a lifting mechanism 500, the laser mechanism 300 is arranged on the lifting mechanism 500, and the lifting mechanism 500 can drive the laser mechanism 300 to lift. The lifting mechanism 500 can adjust the height of the laser mechanism 300, and the laser focus can be conveniently adjusted.

The foregoing is a more detailed description of the invention in connection with specific alternative embodiments, and the practice of the invention should not be construed as limited to those descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims

1. A laser polishing device is characterized by comprising a rack, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms; the moving mechanism and the laser mechanism are arranged on the rack, and the workpiece placing mechanism is arranged on the moving mechanism; the moving mechanism drives the workpiece placing mechanisms to move in a reciprocating mode, so that one workpiece placing mechanism is located in a laser polishing area, and at least one other workpiece placing mechanism is used for feeding materials.

2. The laser polishing apparatus according to claim 1, wherein the workpiece placing mechanism includes a tilting assembly and a polishing table assembly; the polishing table assembly is arranged on the inclined rotating assembly and used for placing a workpiece to be polished, and the inclined assembly is used for rotating and inclining the polishing table assembly so as to enable the polishing datum plane to rotate and incline.

3. The laser polishing apparatus as claimed in claim 2, wherein the tilting assembly includes a mount, a rotating member, and a first driving member; the rotating piece can be rotatably arranged on the mounting seat and is connected with the first driving piece; the first driving piece drives the rotating piece to rotate and incline so as to enable the polishing reference surface to rotate and incline.

4. The laser polishing apparatus of claim 2, wherein the tilt assembly comprises a polishing table assembly comprising a base, a second drive, and a polishing table; the base is arranged on the inclined assembly, the second driving piece is arranged on the base, and the polishing table is connected with the second driving piece; the second driving piece is used for driving the polishing table to rotate.

5. The laser polishing apparatus according to claim 4, wherein a partition plate is provided on the polishing table, the partition plate partitioning the polishing table into at least two processing zones.

6. The laser polishing apparatus as claimed in claim 5, wherein the partition plate includes a first sub-plate and a second sub-plate; the first sub-plate and the second sub-plate are connected in a staggered mode to form a cross shape, and the polishing table is divided into four processing areas.

7. The laser polishing apparatus according to any one of claims 1 to 6, wherein the moving mechanism includes a moving drive assembly and a slide rail; the workpiece placing mechanism is arranged on the sliding rail in a sliding mode, and the moving driving assembly is connected with the workpiece placing mechanism and drives the workpiece placing mechanism to move.

8. The laser polishing apparatus as claimed in claim 7, wherein the movement driving assembly includes a third driving member and a lead screw; the two ends of the screw rod are respectively installed on the sliding rail through bearings, the third driving piece is connected with the screw rod, and the screw rod is connected with the workpiece placing mechanism.

9. The laser polishing apparatus according to claim 8, wherein the lead screw is located at a middle position of the slide rail.

10. The laser polishing device according to any one of claims 1 to 6, wherein a lifting mechanism is arranged on the machine frame, the laser mechanism is arranged on the lifting mechanism, and the lifting mechanism can drive the laser mechanism to lift.