CN113492263B

CN113492263B - Laser polishing device

Info

Publication number: CN113492263B
Application number: CN202110667959.0A
Authority: CN
Inventors: 肖永山; 赵振宇; 李佳霓; 帅词俊; 蔡学奋; 李凯; 尹杰; 周浩
Original assignee: Shenzhen Institute of Information Technology
Current assignee: Shenzhen Institute of Information Technology
Priority date: 2021-06-16
Filing date: 2021-06-16
Publication date: 2024-02-02
Anticipated expiration: 2041-06-16
Also published as: CN113492263A

Abstract

The invention discloses a laser polishing device, which comprises a frame, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms, wherein the moving mechanism is arranged on the frame; the moving mechanism and the laser mechanism are arranged on the frame, and the workpiece placing mechanism is arranged on the moving mechanism; the moving mechanism drives the workpiece placement mechanisms to reciprocate, so that one workpiece placement mechanism is located in the laser polishing area, and at least one other workpiece placement mechanism is used for feeding. The laser polishing device can realize the processes of continuous feeding, polishing, taking and re-feeding, does not need to stop, has high efficiency, is convenient and fast to operate, and is convenient for automatic continuous production. And moreover, the continuous feeding, polishing, workpiece taking and re-feeding processes can be realized by only at least two workpiece placement mechanisms, so that the cost of the workpiece placement mechanisms is saved, and the workpiece placement mechanisms are fully utilized.

Description

Laser polishing device

Technical Field

The invention relates to the technical field of laser polishing, in particular to a laser polishing device.

Background

The laser polishing technology is a new laser processing application technology, and is characterized in that a focused laser beam spot acts on the surface of a rough metal workpiece to cause melting and evaporation of a convex thin layer on the surface of the material. The melted material flows under the action of self surface tension and gravity, fills the concave part of the surface of the titanium alloy and solidifies, and finally the ideal polishing material surface is obtained.

Currently, many scholars and research institutions are favored. The laser polishing application on metal surfaces has potential advantages, not only has selectable polishing speed, no chemical contamination, and detectability of the polishing process, but also is a non-contact processing method. The detection result can be obtained, and the surface roughness of the workpiece after laser polishing is obviously reduced.

Most of laser polishing equipment in the current market is operated in one piece, and the workpiece to be polished before polishing is fed and the workpiece to be polished is taken after polishing is completed, so that the machine is low in efficiency, troublesome in operation, inconvenient in automatic continuous production and high in cost.

Disclosure of Invention

The invention aims to provide a laser polishing device which can continuously carry out the processes of feeding, polishing, taking and re-feeding, does not need to stop, has high efficiency, is convenient and fast to operate, is convenient for automatic continuous production and has low cost.

The invention discloses a laser polishing device, which comprises a frame, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms, wherein the moving mechanism is arranged on the frame; the moving mechanism and the laser mechanism are arranged on the frame, and the workpiece placing mechanism is arranged on the moving mechanism; the moving mechanism drives the workpiece placement mechanisms to reciprocate, so that one workpiece placement mechanism is located in the laser polishing area, and at least one other workpiece placement mechanism is used for feeding.

Optionally, the workpiece placement mechanism includes a tilt assembly and a polishing table assembly; the polishing table assembly is arranged on the tilting rotation assembly and is used for placing a workpiece to be polished, and the tilting assembly is used for tilting the polishing table assembly in a rotating manner so as to tilt the polishing reference surface in a rotating manner.

Optionally, the tilting assembly includes a mounting base, a rotating member, and a first driving member; the rotating piece can be rotatably arranged on the mounting seat and is connected with the first driving piece; the first driving member drives the rotating member to rotate and incline so as to enable the polishing reference surface to rotate and incline.

Optionally, the tilting assembly includes a polishing table assembly including a base, a second drive member, and a polishing table; the base is arranged on the inclined assembly, the second driving piece is arranged on the base, and the polishing table is connected with the second driving piece; the second driving piece is used for driving the polishing table to rotate.

Optionally, a spacer plate is disposed on the polishing table, and the spacer plate separates the polishing table into at least two processing areas.

Optionally, the partition plate includes a first sub-plate and a second sub-plate; the first sub-board and the second sub-board are connected in a staggered mode, and the polishing tables are separated into four processing areas.

Optionally, the moving mechanism comprises a moving driving assembly and a sliding rail; the workpiece placement mechanism is arranged on the sliding rail in a sliding mode, and the moving driving assembly is connected with the workpiece placement mechanism and drives the workpiece placement mechanism to move.

Optionally, the moving driving assembly comprises a third driving piece and a screw rod; the two ends of the screw rod are respectively arranged on the sliding rail through bearings, the third driving piece is connected with the screw rod, and the screw rod is connected with the workpiece placing mechanism.

Optionally, the screw rod is located at the middle position of the sliding rail.

Optionally, a lifting mechanism is arranged on the frame, the laser mechanism is arranged on the lifting mechanism, and the lifting mechanism can drive the laser mechanism to lift.

The laser polishing device can realize the processes of continuous feeding, polishing, taking and re-feeding, does not need to stop, has high efficiency, is convenient to operate, and is convenient for automatic continuous production. And moreover, the continuous feeding, polishing, workpiece taking and re-feeding processes can be realized by only at least two workpiece placement mechanisms, so that the cost of the workpiece placement mechanisms is saved, and the workpiece placement mechanisms are fully utilized.

Drawings

The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is evident that the figures in the following description are only some embodiments of the invention, from which other figures can be obtained without inventive effort for a person skilled in the art. In the drawings:

FIG. 1 is a schematic view of a laser polishing apparatus according to an embodiment of the present invention;

FIG. 2 is another schematic view of a laser polishing apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic view of a tilt assembly and polishing table assembly according to an embodiment of the present invention.

Wherein, 100, the frame; 200. a moving mechanism; 210. a movement drive assembly; 211. a third driving member; 212. a screw rod; 213. a bearing; 220. a slide rail; 221. a channel; 300. a laser mechanism; 400. a workpiece placement mechanism; 410. a tilting assembly; 411. a mounting base; 412. a rotating member; 413. a first driving member; 420. a polishing table assembly; 421. a base; 422. a second driving member; 423. a polishing table; 423a, a spacer plate; 423a1, a first daughter board; 423a2, a second daughter board; 430. sealing the cabin; 431. a bottom plate; 500. and a lifting mechanism.

Detailed Description

It is to be understood that the terminology used herein, the specific structural and functional details disclosed are merely representative for the purpose of describing particular embodiments, but that the invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

The invention is described in detail below with reference to the attached drawings and alternative embodiments.

As shown in fig. 1 and 2, as an embodiment of the present invention, a laser polishing apparatus is disclosed, comprising a frame 100, a moving mechanism 200, a laser mechanism 300, and at least two work placement mechanisms 400; the moving mechanism 200 and the laser mechanism 300 are arranged on the frame 100, and the workpiece placing mechanism 400 is arranged on the moving mechanism 200; the moving mechanism 200 drives the workpiece placement mechanisms 400 to reciprocate, so that the laser mechanism 300 polishes a workpiece in one workpiece placement mechanism 400, and at least one other workpiece placement mechanism 400 is fed.

The laser polishing apparatus of the present invention, the work placement mechanism 400 is used for placing a work to be polished. The laser mechanism 300 is used for emitting laser and performing laser polishing on a workpiece to be polished. The moving mechanism 200 is used for driving the workpiece placement mechanisms 400 to reciprocate, so that the positions of the workpiece placement mechanisms 400 are changed, one of the workpiece placement mechanisms 400 is located in a laser polishing area, the laser mechanism 300 polishes a workpiece to be polished in the workpiece placement mechanism 400, and at least one of the rest workpiece placement mechanisms 400 can be simultaneously fed, namely, the workpiece to be polished is placed in the workpiece placement mechanism 400. When the polishing of the workpiece being polished is completed, the moving mechanism 200 drives the workpiece placement mechanism 400 to move, and the next workpiece placement mechanism 400 which is already loaded is brought to the laser polishing area to continue the laser polishing. At this time, the workpiece just finished being polished is finished to be fetched and a new workpiece is fed, and then is driven by the moving mechanism 200 to be polished in the laser polishing area, and the workpiece just finished being polished is simultaneously fetched and a new workpiece is fed. The moving mechanism 200 moves reciprocally in this way, and processes of loading, polishing, picking and reloading of each workpiece placement mechanism 400 are realized.

For example, as shown in fig. 1, when there are two workpiece placement mechanisms 400, the left workpiece placement mechanism 400 may be charged while the laser polishing area is polished by the right workpiece placement mechanism 400. When the left workpiece placement mechanism 400 finishes polishing, the moving mechanism 200 drives the two workpiece placement mechanisms 400 to move leftwards, the left workpiece placement mechanism 400 leaves the laser polishing area, and the right workpiece placement mechanism 400 enters the laser polishing area. At this time, the laser mechanism 300 may continue polishing the workpiece in the workpiece placement mechanism 400 on the right. At the same time, the left workpiece placement mechanism 400 may be removed, and then a new workpiece to be polished may be placed on the left workpiece placement mechanism 400, completing the loading. After the polishing of the right workpiece placement mechanism 400 is completed, the moving mechanism 200 drives the two workpiece placement mechanisms 400 to move rightward, the right workpiece placement mechanism 400 leaves the laser polishing area, and the left workpiece placement mechanism 400 reenters the laser polishing area. At this time, the laser mechanism 300 may continue polishing the workpiece in the workpiece placement mechanism 400 on the left side. At the same time, the right work piece placement mechanism 400 may be removed, and then a new work piece to be polished may be placed on the right work piece placement mechanism 400, completing the loading. The moving mechanism 200 drives the workpiece placement mechanism 400 to reciprocate circularly in this way, and the processes of continuously feeding, polishing, taking out and re-feeding without stopping the machine are completed.

Specifically, the number of workpiece placement mechanisms 400 may be two, three, four, or even more. When the number of the workpiece placement mechanisms 400 is more than two, for example, three or four, the processes of loading, polishing, picking up, and reloading are similar to those of the two. That is, the laser mechanism 300 sequentially polishes the workpieces in the workpiece placement mechanism 400, and after all the workpieces are sequentially polished, the moving mechanism 200 moves reversely and continues to polish from the last one. Or the moving mechanism 200 is directly moved reversely and reset, and polishing is continued from the original first one. Preferably, the number of workpiece placement mechanisms 400 of the present invention is two. The two workpiece placement mechanisms 400 can meet the requirements of non-stop feeding and workpiece taking, one workpiece placement mechanism can be used for taking or feeding while polishing, the other workpiece placement mechanism is simple and not complex in operation, and the workpiece placement mechanism 400 is fully utilized. In addition, only two workpiece placement mechanisms 400 are used, so that the cost is low while the feeding and the workpiece taking are not stopped.

The laser polishing device can realize the processes of continuous feeding, polishing, taking and re-feeding, does not need to stop, has high efficiency, is convenient and fast to operate, and is convenient for automatic continuous production. And, at least only need two work piece placement machine 400 just can realize continuous material loading, polishing, get the piece, the process of unloading again, save work piece placement machine 400's cost, work piece placement machine 400 also utilizes fully.

Specifically, the workpiece placement mechanism 400 includes a tilt assembly 410 and a polishing table assembly 420; the polishing table assembly 420 is disposed on the tilting rotation assembly, the polishing table assembly 420 is used for placing a workpiece to be polished, and the tilting assembly 410 is used for tilting the polishing table assembly 420 in a rotation manner so as to tilt the polishing reference surface in a rotation manner. Tilting the polishing table assembly 420 by the tilting assembly 410 means that the tilting assembly 410 drives the polishing table assembly 420 to turn over at a certain angle. For example, in a normal state, the polishing reference surface of the polishing table assembly 420 is in a horizontal state, and after the tilting assembly 410 drives the polishing table assembly 420 to tilt, the polishing reference surface tilts to form a certain angle with respect to the horizontal plane. According to the scheme, the tilting component 410 is arranged to realize the tilting of the polishing table component 420 at a certain angle, and the polishing of the curved surface can be realized by matching with the 3D vibrating mirror of the laser mechanism 300.

Specifically, as shown in fig. 3, the tilting assembly 410 includes a mounting seat 411, a rotating member 412, and a first driving member 413; the rotating member 412 is rotatably mounted on the mounting seat 411 and connected to the first driving member 413; the first driving member 413 drives the rotation member 412 to be rotated and tilted so as to rotationally tilt the polishing reference surface.

Specifically, as shown in fig. 3, the tilting assembly 410 includes a polishing table assembly 420 including a base 421, a second driving member 422, and a polishing table 423; the base 421 is mounted on the tilting assembly 410, the second driving member 422 is mounted on the base 421, and the polishing table 423 is connected to the second driving member 422; the second driving member 422 is configured to drive the polishing table 423 to rotate. The second driving piece 422 drives the polishing table 423 to rotate, so that the laser polishing angle can be changed, the polishing operation is more convenient, and the effect is better. The second driver 422 may be a motor.

Specifically, a partition plate 423a is disposed on the polishing table 423, and the partition plate 423a partitions the polishing table 423 into at least two processing areas. The two processing areas separated by the partition plate 423a can be used for placing workpieces to be polished, so that the feeding and polishing efficiency is improved, and the polishing continuity is improved. Meanwhile, the processing areas are separated by the partition plates 423a, so that the influence of the laser of the current processing area on the workpieces of other processing areas can be prevented, and the polishing effect is ensured. By rotation of the second driving member 422, switching of different processing zones is achieved.

Specifically, the partition plate 423a includes a first sub-plate 423a1 and a second sub-plate 423a2; the first sub-board 423a1 and the second sub-board 423a2 are connected in a cross-shape, so that the polishing table 423 is divided into four processing areas. In this scheme, the polishing table 423 is divided into four processing areas by the first and second sub-boards 423a1 and 423a2, so as to improve the processing efficiency.

Specifically, the workpiece placement mechanism 400 includes a sealed enclosure 430, and the tilt assembly 410 and the polishing table assembly 420 are both disposed within the sealed enclosure 430.

On the other hand, the moving mechanism 200 includes a moving driving assembly 210 and a slide rail 220; the workpiece placement mechanism 400 is slidably disposed on the slide rail 220, and the movement driving assembly 210 is connected to the workpiece placement mechanism 400 and drives the workpiece placement mechanism 400 to move. In the continuous polishing process, the moving driving assembly 210 drives the workpiece placement mechanism 400 to reciprocate on the sliding rail 220, so that continuous feeding, polishing, workpiece taking and re-feeding processes are completed. Specifically, the bottom of the sealed cabin 430 is provided with a sealed cabin 430, and the bottom plate is slidably disposed on the sliding rail 220.

Specifically, as shown in fig. 1, two ends of the sliding rail 220 extend out of the frame 100, and when one workpiece placement mechanism 400 is located in the laser polishing area, the remaining workpiece placement mechanisms 400 are located on the sliding rail 220 extending out of the frame 100. The workpiece placement mechanism 400 on the slide rail 220 extending out of the frame 100 facilitates the picking and loading operations. More specifically, there are two workpiece placement mechanisms 400, where when one workpiece placement mechanism 400 is located in the laser polishing area, the other workpiece placement mechanism 400 is located on the sliding rail 220 extending out of the frame 100, so as to facilitate the workpiece taking and feeding operations.

The moving driving assembly 210 includes a third driving member 211 and a screw 212; the two ends of the screw rod 212 are respectively installed on the sliding rail 220 through bearings 213, the third driving piece 211 is connected with the screw rod 212, and the screw rod 212 is connected with the workpiece placement mechanism 400. The screw rod 212 is accurate in driving position and good in positioning effect.

Specifically, the screw 212 is located at a middle position of the sliding rail 220. In this embodiment, the screw 212 is located at a middle position of the sliding rail 220, and the force of the screw 212 is also applied to a middle position of the workpiece placement mechanism 400. The stress of the workpiece placement mechanism 400 is more balanced, the workpiece placement mechanism 400 is easier to drive to move, and the movement of the workpiece placement mechanism 400 is also more stable. More specifically, a channel 221 is disposed in the middle of the sliding rail 220, and the screw 212 is disposed in the channel 221.

On the other hand, a lifting mechanism 500 is disposed on the frame 100, the laser mechanism 300 is disposed on the lifting mechanism 500, and the lifting mechanism 500 can drive the laser mechanism 300 to lift. The lifting mechanism 500 can adjust the height of the laser mechanism 300, which facilitates adjusting the laser focus.

The above description of the invention in connection with specific alternative embodiments is further detailed and it is not intended that the invention be limited to the specific embodiments disclosed. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.

Claims

1. The laser polishing device is characterized by comprising a frame, a moving mechanism, a laser mechanism and at least two workpiece placing mechanisms; the moving mechanism and the laser mechanism are arranged on the frame, and the workpiece placing mechanism is arranged on the moving mechanism; the moving mechanism drives the workpiece placement mechanisms to reciprocate, so that one workpiece placement mechanism is positioned in a laser polishing area, and at least one other workpiece placement mechanism is fed; after the polishing of the workpiece being polished is finished, the moving mechanism drives the workpiece placing mechanism to move, and the other workpiece placing mechanism which is already loaded is brought into a laser polishing area to continue polishing;

the workpiece placement mechanism comprises an inclination assembly and a polishing table assembly; the polishing table assembly is arranged on the tilting assembly and is used for placing a workpiece to be polished, and the tilting assembly is used for rotationally tilting the polishing table assembly so as to rotationally tilt a polishing reference surface; the tilting assembly comprises a mounting seat, a rotating piece and a first driving piece; the rotating piece can be rotatably arranged on the mounting seat and is connected with the first driving piece; the first driving piece drives the rotating piece to rotate and incline so as to enable the polishing reference surface to rotate and incline; the polishing table assembly comprises a base, a second driving member and a polishing table; the base is arranged on the inclined assembly, the second driving piece is arranged on the base, and the polishing table is connected with the second driving piece; the second driving piece is used for driving the polishing table to rotate; the polishing device comprises a polishing table, a frame, a laser mechanism and a spacing plate, wherein the polishing table is provided with the spacing plate, the spacing plate is used for spacing the polishing table into at least two processing areas, the frame is provided with the lifting mechanism, the laser mechanism is arranged on the lifting mechanism, and the lifting mechanism can drive the laser mechanism to lift.

2. The laser polishing apparatus of claim 1 wherein the spacer plate comprises a first sub-plate and a second sub-plate; the first sub-board and the second sub-board are connected in a staggered mode, and the polishing tables are separated into four processing areas.

3. The laser polishing apparatus according to claim 1 or 2, wherein the moving mechanism comprises a moving drive assembly and a slide rail; the workpiece placement mechanism is arranged on the sliding rail in a sliding mode, and the moving driving assembly is connected with the workpiece placement mechanism and drives the workpiece placement mechanism to move.

4. The laser polishing apparatus of claim 3, wherein the moving drive assembly comprises a third drive member and a lead screw; the two ends of the screw rod are respectively arranged on the sliding rail through bearings, the third driving piece is connected with the screw rod, and the screw rod is connected with the workpiece placing mechanism.

5. The laser polishing apparatus of claim 4, wherein the lead screw is located at a middle position of the slide rail.