CN113468852B - Analysis method for graphic and text printing data manufactured in auxiliary manner by industrial graphic computer - Google Patents
Analysis method for graphic and text printing data manufactured in auxiliary manner by industrial graphic computer Download PDFInfo
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- CN113468852B CN113468852B CN202110790561.6A CN202110790561A CN113468852B CN 113468852 B CN113468852 B CN 113468852B CN 202110790561 A CN202110790561 A CN 202110790561A CN 113468852 B CN113468852 B CN 113468852B
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- 238000007639 printing Methods 0.000 title claims abstract description 41
- 238000004458 analytical method Methods 0.000 title claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- 238000011161 development Methods 0.000 abstract description 8
- 239000012141 concentrate Substances 0.000 abstract description 4
- 230000003252 repetitive effect Effects 0.000 abstract description 4
- 238000012827 research and development Methods 0.000 abstract description 4
- 230000009897 systematic effect Effects 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The invention discloses an analysis method of graphic printing data manufactured by industrial graphic computer assistance, which comprises the following steps: s1, a computer firstly confirms that layer data related to PCB graphic printing yield are imported; the anti-welding window layer, the signal circuit layer, the hole layer, the forming layer and the graphic printing layer are respectively arranged; s2, analyzing the relation between the image-text printing layer and the anti-welding window opening layer, wherein A is listed in the table; after the data is analyzed by the method, the data are integrated into systematic data with reference value. The management layer can avoid errors caused by manual judgment, scientific management is realized, and cost is further saved; engineers can avoid tedious and error-prone repetitive work, concentrate on research and development, and further improve the yield; meanwhile, the manufacturing end is guided to actively feed back to a software development end and an equipment provider, development opinions of related industrial software are sequentially improved, and automatic development of the manufacturing industry generates a closed loop.
Description
Technical Field
The invention relates to the technical field of image-text printing process yield improvement methods in PCB manufacturing industry, in particular to an analysis method for image-text printing data in industrial graphic computer-aided manufacturing.
Background
The circuit density of the Printed Circuit Board (PCB) is increased, the appearance is also complicated, characters or patterns are printed on the solder mask layer by ink, and the ink is baked and solidified in order to facilitate the effective identification of the positions of parts in the follow-up Surface Mount Technology (SMT) and the like.
The main printing method at present is as follows: 1. screen printing (SILK SCREEN PRINTER) 2. Spray Coating (Spray Coating) has advantages and disadvantages, but the yield is limited by the physical properties of liquid ink which is heated and solidified again, for example, when the ink with lower viscosity is used for Coating 8 characters, the paste characters are easily caused by the flowing of the ink and cannot be distinguished.
Computer Aided Manufacturing (CAM) software simply identifies the graphic printing layer on the screen and does not systematically analyze the data, so that engineers still rely on a lot of experience to manually judge the process flow on the production line, and the efficiency is not in the best.
It is therefore necessary to devise a method for analyzing graphic printing data for industrial graphic computer aided manufacturing.
Disclosure of Invention
The invention aims to provide an analysis method of graphic printing data manufactured by an industrial graphic computer in an auxiliary way, and the data is integrated into systematic data with reference value after being analyzed by the method. The management layer can avoid errors caused by manual judgment, scientific management is realized, and cost is further saved; engineers can avoid tedious and error-prone repetitive work, concentrate on research and development, and further improve the yield; meanwhile, the manufacturing end is guided to actively feed back to a software development end and an equipment provider, development opinions of related industrial software are sequentially improved, and automatic development of the manufacturing industry generates a closed loop.
The aim of the invention can be achieved by the following technical scheme:
an analysis method of graphic printing data manufactured by industrial graphic computer assistance comprises the following steps:
S1, a computer firstly confirms that layer data related to PCB graphic printing yield are imported; the anti-welding window layer, the signal circuit layer, the hole layer, the forming layer and the graphic printing layer are respectively arranged;
s2, analyzing the relation between the image-text printing layer and the anti-welding window opening layer, wherein A is listed in the table;
s3, analyzing the relation between the image-text printing layer and the signal circuit layer, and listing B, C in a table;
S4, analyzing the relation between the image-text printing layer and the hole layer, and listing D in a table;
s5, analyzing the relation between the image-text printing layer and the forming layer, and listing E in a table;
s6, analyzing the data of the graphic printing layer, and listing F in the table.
As a further scheme of the invention: the A is expressed as SM CLEARANCE and the risk of too close to the welding-resistant windowing; the B is expressed as the risk of too close to the SMD of the patch pad; the C is expressed as PADS CLEARANCE and the risk of too close to the non-mount Pad; the D is expressed as Hole Clearance and pore too close risk; the E is expressed as routclearance and shaping too-near risk; and F represents the design risk of the Text with printed image and Text layer.
As a further scheme of the invention: the PADS CLEARANCE and non-die Pad too close risk includes: PTH PADS CLEARANCE are too close to the plated through hole pad; NPTH PADS CLEARANCE is too close to the non-via pad; VIA PADS CLEARANCE are too close to the via pad; non-DRILL PADS CLEARANCE is too close to the Non-porous pad.
As a further scheme of the invention: the Hole Clearance and pore too close risk includes: PTH CLEARANCE are too close to the plated through holes; NPTH CLEARANCE are too close to the non-plated through holes; VIA CLEARANCE are too close to the via.
As a further scheme of the invention: the Text Width printing image-Text layer design risk comprises: LINE WIDTH linear article dimensions; arc Width Arc article size; pad Width Pad object size; surface Width copper article size; SS to SS SPACING graph-to-graph edge spacing; SHAVED LINE the linear dimension covered by negative data; SHAVED ARC arc line size covered by negative data; SHAVED PAD the size of the pallet object covered by negative data; shaved Surface copper object size covered by negative data.
The invention has the beneficial effects that: after the data is analyzed by the method, the data are integrated into systematic data with reference value. The management layer can avoid errors caused by manual judgment, scientific management is realized, and cost is further saved; engineers can avoid tedious and error-prone repetitive work, concentrate on research and development, and further improve the yield; meanwhile, the manufacturing end is guided to actively feed back to a software development end and an equipment provider, development opinions of related industrial software are sequentially improved, and automatic development of the manufacturing industry generates a closed loop.
Detailed Description
The technical solutions of the present invention will be clearly and completely described in connection with the embodiments, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
An analysis method of graphic printing data manufactured by industrial graphic computer assistance comprises the following steps:
S1, a computer firstly confirms that layer data related to PCB graphic printing yield are imported; the anti-welding window layer, the signal circuit layer, the hole layer, the forming layer and the graphic printing layer are respectively arranged;
s2, analyzing the relation between the image-text printing layer and the anti-welding window opening layer, wherein A is listed in the table;
s3, analyzing the relation between the image-text printing layer and the signal circuit layer, and listing B, C in a table;
S4, analyzing the relation between the image-text printing layer and the hole layer, and listing D in a table;
s5, analyzing the relation between the image-text printing layer and the forming layer, and listing E in a table;
s6, analyzing the data of the image-text printing layer, and listing F in a table;
A is SM CLEARANCE and the risk of too close to the welding-proof window; b is denoted as risk of too close to the die pad SMD; c is denoted PADS CLEARANCE as risk of too close to the non-die Pad; d is expressed as Hole Clearance and pore too close risk; e is denoted as routclearance and shaping too-near risk; f represents the design risk of the Text Width printing image-Text layer; PADS CLEARANCE risk of too close to non-die Pad includes: PTH PADS CLEARANCE are too close to the plated through hole pad; NPTH PADS CLEARANCE is too close to the non-via pad; VIA PADS CLEARANCE are too close to the via pad; non-DRILL PADS CLEARANCE is too close to the Non-porous pad; hole Clearance and Hole too close risk include: PTH CLEARANCE are too close to the plated through holes; NPTH CLEARANCE are too close to the non-plated through holes; VIA CLEARANCE is too close to the via hole; the design risk of the Text Width printing image-Text layer per se comprises: LINE WIDTH linear article dimensions; arc Width Arc article size; pad Width Pad object size; surface Width copper article size; SS to SS SPACING graph-to-graph edge spacing; SHAVED LINE the linear dimension covered by negative data; SHAVED ARC arc line size covered by negative data; SHAVED PAD the size of the pallet object covered by negative data; shaved Surface copper object size covered by negative data.
The working principle of the invention is as follows: after the data is analyzed by the method, the data are integrated into systematic data with reference value. The management layer can avoid errors caused by manual judgment, scientific management is realized, and cost is further saved; engineers can avoid tedious and error-prone repetitive work, concentrate on research and development, and further improve the yield; meanwhile, the manufacturing end is guided to actively feed back to a software development end and an equipment provider, development opinions of related industrial software are sequentially improved, and automatic development of the manufacturing industry generates a closed loop.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (1)
1. An analysis method of graphic printing data manufactured by industrial graphic computer assistance is characterized by comprising the following steps:
s1, a computer firstly confirms that layer data related to PCB graphic printing yield are imported; the anti-welding window layer, the signal circuit layer, the hole layer, the forming layer and the graphic printing layer are respectively arranged;
S2, analyzing the relation between the image-text printing layer and the anti-welding window opening layer, wherein A is listed in the table;
S3, analyzing the relation between the image-text printing layer and the signal circuit layer, and listing B, C in a table;
s4, analyzing the relation between the image-text printing layer and the hole layer, and listing D in a table;
s5, analyzing the relation between the image-text printing layer and the forming layer, and listing E in a table;
S6, analyzing the data of the image-text printing layer, and listing F in a table;
A is SM CLEARANCE and the risk of too close to the welding-proof window; b is denoted as risk of too close to the die pad SMD; c is denoted PADS CLEARANCE as risk of too close to the non-die Pad; d is expressed as Hole Clearance and pore too close risk; e is denoted as routclearance and shaping too-near risk; f represents the design risk of the Text Width printing image-Text layer; PADS CLEARANCE risk of too close to non-die Pad includes: PTH PADS CLEARANCE are too close to the plated through hole pad; NPTH PADS CLEARANCE is too close to the non-via pad; VIA PADS CLEARANCE are too close to the via pad; non-DRILL PADS CLEARANCE is too close to the Non-porous pad; hole Clearance and Hole too close risk include: PTH CLEARANCE are too close to the plated through holes; NPTH CLEARANCE are too close to the non-plated through holes; VIA CLEARANCE is too close to the via hole; the design risk of the Text Width printing image-Text layer per se comprises: LINE WIDTH linear article dimensions; arc Width Arc article size; pad Width Pad object size; surface Width copper article size; SS to SS SPACING graph-to-graph edge spacing; SHAVED LINE the linear dimension covered by negative data; SHAVED ARC arc line size covered by negative data; SHAVED PAD the size of the pallet object covered by negative data; shaved Surface copper object size covered by negative data.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110790561.6A CN113468852B (en) | 2021-07-13 | 2021-07-13 | Analysis method for graphic and text printing data manufactured in auxiliary manner by industrial graphic computer |
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| CN202110790561.6A CN113468852B (en) | 2021-07-13 | 2021-07-13 | Analysis method for graphic and text printing data manufactured in auxiliary manner by industrial graphic computer |
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| CN113468852A CN113468852A (en) | 2021-10-01 |
| CN113468852B true CN113468852B (en) | 2024-05-14 |
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| KR20110058107A (en) * | 2009-11-25 | 2011-06-01 | 삼성전기주식회사 | Metallic laminate, method of manufacturing thereof and method of manufacturing pcb |
| WO2015101842A1 (en) * | 2014-01-06 | 2015-07-09 | Nokia Technologies Oy | A body of a portable electronic device that includes a near field coil |
| CN111179336A (en) * | 2019-12-31 | 2020-05-19 | 苏州悦谱半导体有限公司 | PCB blind hole alignment optimization method based on CCD vision |
| CN112387604A (en) * | 2021-01-04 | 2021-02-23 | 深圳和美精艺半导体科技股份有限公司 | Method for detecting packaging substrate through AVI (automatic voltage indicator) detector and automatic point finder in networking mode |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102606964B1 (en) * | 2019-07-03 | 2023-11-29 | 삼성에스디에스 주식회사 | Method of circular frame generation for path routing in multilayer structure, and computing device |
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2021
- 2021-07-13 CN CN202110790561.6A patent/CN113468852B/en active Active
Patent Citations (4)
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|---|---|---|---|---|
| KR20110058107A (en) * | 2009-11-25 | 2011-06-01 | 삼성전기주식회사 | Metallic laminate, method of manufacturing thereof and method of manufacturing pcb |
| WO2015101842A1 (en) * | 2014-01-06 | 2015-07-09 | Nokia Technologies Oy | A body of a portable electronic device that includes a near field coil |
| CN111179336A (en) * | 2019-12-31 | 2020-05-19 | 苏州悦谱半导体有限公司 | PCB blind hole alignment optimization method based on CCD vision |
| CN112387604A (en) * | 2021-01-04 | 2021-02-23 | 深圳和美精艺半导体科技股份有限公司 | Method for detecting packaging substrate through AVI (automatic voltage indicator) detector and automatic point finder in networking mode |
Non-Patent Citations (3)
| Title |
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| Optimized design of through-hole via in high-speed printed circuit board;Kun-Lin Sie 等;《2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)》;401-404 * |
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| CN113468852A (en) | 2021-10-01 |
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