CN113464871B - Lamp film, preparation method thereof and electronic equipment - Google Patents
Lamp film, preparation method thereof and electronic equipment Download PDFInfo
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- CN113464871B CN113464871B CN202110745167.0A CN202110745167A CN113464871B CN 113464871 B CN113464871 B CN 113464871B CN 202110745167 A CN202110745167 A CN 202110745167A CN 113464871 B CN113464871 B CN 113464871B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a lamp film, a preparation method thereof and electronic equipment, wherein the lamp film comprises a first cover plate, a second cover plate and a plurality of light sources, and the lamp film comprises the following components: the first cover plate comprises a first insulating layer and a copper layer fixed on the first insulating layer, the copper layer comprises a plurality of copper blocks, and at least two copper blocks are fixedly arranged and electrically connected with a light source; the second cover plate comprises a copper plate and a second insulating layer arranged on the copper plate, the second insulating layer comprises a plurality of capillary modules, a groove is formed between every two adjacent capillary modules, each capillary module is provided with a capillary structure and liquid filled in the capillary structure, the second insulating layer is fixedly connected with the first insulating layer, a liquid channel is formed at the capillary modules, and an air channel is formed at the groove; heat is conducted into the air passage through the copper block, then is conducted to the liquid passage through the copper plate, so that liquid absorbs heat to evaporate into the air passage, flows in the air passage, is condensed into liquid through heat exchange with copper plates with lower temperatures at other positions, and the capillary structure absorbs the liquid into the liquid, so that the heat dissipation effect is good.
Description
Technical Field
The invention relates to the technical field of illumination, in particular to a lamp film, a preparation method thereof and electronic equipment.
Background
With the progress of technological development, LEDs (light-emitting diodes) are widely used in the technical field of illumination, especially in flat panel displays, wearable devices and medical devices, due to their advantages of energy saving, environmental protection, and fast response speed.
The LED lamp film is used for realizing illumination in the existing electronic equipment, the LED lamp is formed by welding the LED lamp on PET (Polyethylene terephthalate, polyester film) on a lens through solder paste, the power requirement of the LED is higher and higher along with the daily and monthly requirements of LED light emission, the heating value of the LED is higher and higher, the temperature of the LED can be increased to more than 60 degrees when the LED emits light, but the heat dissipation of the LED lamp film is difficult due to poor PET heat conductivity, and the product performance and the service life of the LED lamp film are influenced when the LED lamp film is used for a long time.
Disclosure of Invention
Accordingly, it is necessary to provide a lamp film, a manufacturing method thereof and an electronic device for solving the problem that the heat dissipation of the LED lamp film is difficult.
A lamp film comprises a first cover plate, a second cover plate and a plurality of light sources, wherein:
the first cover plate comprises a first insulating layer and a copper layer fixed on one side surface of the first insulating layer, the copper layer comprises a plurality of copper blocks, and at least two copper blocks are fixedly arranged with one light source and electrically connected with the light source;
the second cover plate is arranged on one side surface of the first insulating layer, far away from the copper layer, and comprises a copper plate and a second insulating layer arranged on one side surface of the copper plate, wherein the second insulating layer is connected with the first insulating layer, the second insulating layer comprises a plurality of capillary modules, grooves are formed between every two adjacent capillary modules, each capillary module is provided with a capillary structure and liquid filled in the capillary structure, the second insulating layer is fixedly connected with the first insulating layer, a liquid channel is formed at the position of each capillary module, and an air channel is formed at the position of each groove.
In the lamp film, the heat emitted by the light source is conducted to the copper block of the first cover plate and is conducted to the air passage of the second cover plate through the copper block, and then is conducted to the liquid passage of the second cover plate through the copper plate of the second cover plate, so that the liquid filled in the capillary structure absorbs the heat to evaporate into the air passage and flows in the air passage, the liquid is condensed into the liquid through heat exchange with the copper plate with lower temperature at other positions, the capillary structure absorbs the liquid to the inside of the liquid, and the heat is prevented from accumulating at the same position through the diffusion of part of the lamp film near the light source and even the whole lamp film in the circulation process, and the heat dissipation effect is good.
In one embodiment, the copper block is disposed on a surface of the first insulating layer, which is far away from the second cover plate, and a region, opposite to the copper block, on the first insulating layer is provided with a through hole penetrating through the thickness of the first insulating layer.
In the lamp film, the arrangement positions of the copper blocks and the structure of the first insulating layer are limited, so that the air passage comprising the through holes of the first insulating layer and the grooves of the second insulating layer is formed, the air passage is large in size, and heat transfer of the copper blocks is facilitated.
In one embodiment, the copper block is disposed directly above the via, and an edge of the copper block is bonded with the first insulating layer at the edge of the via.
In the lamp film, the arrangement mode of the copper block is limited, so that the first cover plate is simple in structure and good in stability.
In one embodiment, the copper block is embedded in the first insulating layer, one end of the copper block, which is close to the groove, at least protrudes from the first insulating layer, and the height of the copper block protruding from the first insulating layer is smaller than the depth of the groove.
In the lamp film, the arrangement positions of the copper blocks are limited, so that the structural sizes of the first cover plate and the second cover plate are smaller, and the lamp film is convenient to miniaturize.
In one embodiment, the copper plate has a first direction and a second direction perpendicular to each other, the capillary module is a strip-shaped structure extending along the first direction, and the plurality of capillary modules are arranged on the copper plate along the second direction.
In the lamp film, the heat conduction is conveniently realized and the heat dissipation effect is improved through the structural form and the arrangement mode of the capillary module.
In one embodiment, the copper layer further comprises copper lines electrically connected to the copper block, the copper lines being disposed on a surface of the first insulating layer facing away from the second insulating layer.
In the lamp film described above, the copper wiring is provided in the copper layer, and the position where the copper wiring is provided is defined so as to achieve electrical connection between copper blocks and heat transfer.
In addition, the invention also provides electronic equipment, which comprises the lamp film according to any one of the technical schemes.
In the electronic device, the heat emitted by the light source in the lamp film is conducted to the copper block of the first cover plate and is conducted to the air passage of the second cover plate through the copper block, and then is conducted to the liquid passage of the second cover plate through the copper plate of the second cover plate, so that the liquid filled in the capillary structure absorbs the heat to evaporate into the air passage and flows in the air passage, the liquid is condensed into the liquid through heat exchange with the copper plate with lower temperature at other positions, the capillary structure absorbs the liquid to the inside, and the heat is diffused through part of the lamp film near the light source and even the whole lamp film in the circulation process, so that the heat is prevented from accumulating at the same position, and the heat dissipation effect is better.
In addition, the invention also provides a preparation method of the lamp film according to any one of the technical schemes, which comprises the following steps:
providing a first film layer, patterning to form a first insulating layer, and forming a copper block on the first insulating layer;
depositing a second film layer on the copper plate, and patterning the second film layer to form a second insulating layer;
filling liquid in the capillary structure of the second insulating layer;
and covering the second insulating layer and the first insulating layer, and electrically connecting the light source on the copper block.
In the preparation method of the lamp film, a first film layer is provided firstly, patterning treatment is carried out on the first film layer to form a first insulating layer, and a copper block is arranged on the first insulating layer to prepare a first cover plate; providing a copper plate, depositing a second film layer on the copper plate, and carrying out patterning treatment on the second film layer to form a second insulating layer; then filling liquid in the capillary structure of the second insulating layer to prepare a second cover plate; and finally, covering the first insulating layer and the second insulating layer together, fixing a light source on the copper block, and electrically connecting the copper block and the light source to prepare the lamp film. The preparation method of the lamp film is simple, has fewer processes and is convenient for preparing the lamp film.
In one embodiment, the step of providing a first film layer and patterning to form a first insulating layer, disposing a copper block on the first insulating layer, specifically includes:
depositing a third film layer on the copper sheet, and patterning the third film layer;
etching the copper sheet, and removing the third film layer to form a plurality of copper blocks;
and pressing the copper block on the first film layer, and patterning the first film layer to form the first insulating layer.
In the method for preparing the lamp film, the first cover plate is prepared by limiting the first cover plate to be prepared by adopting an etching method, so that the first cover plate is prepared simply and conveniently.
In one embodiment, the step of providing a first film layer and patterning to form a first insulating layer, disposing a copper block on the first insulating layer, specifically includes:
pressing a transition dry film on the bearing film, and patterning the transition dry film;
depositing a first film layer on the transition dry film, and patterning to form a first insulating layer and a through groove, wherein the through groove penetrates through the first film layer and the transition dry film and extends to the surface of the bearing film, which is close to the transition dry film;
and forming the copper block in the through groove, and removing the bearing film and the transition dry film.
In the preparation method of the lamp film, the first cover plate is prepared by limiting the first cover plate and adopting an addition method, so that the first cover plate is prepared more simply and conveniently.
Drawings
FIG. 1 is a schematic view of a lamp film according to an embodiment of the present invention;
FIG. 2 is a schematic view of a lamp film according to another embodiment of the present invention;
FIG. 3 is a top view of a first cover plate according to an embodiment of the invention;
FIG. 4 is a top view of a second cover plate according to an embodiment of the invention;
FIG. 5 is a flowchart of a method for manufacturing a lamp film according to an embodiment of the invention;
FIGS. 6 (a) -6 (f) are schematic views illustrating a process for preparing a lamp film according to an embodiment of the present invention;
FIGS. 7 (a) -7 (f) are schematic views illustrating a process for preparing a lamp film according to another embodiment of the present invention;
FIGS. 8 (a) -8 (e) are schematic views illustrating a process for manufacturing a first cover plate according to an embodiment of the invention;
fig. 9 (a) -9 (e) are schematic views illustrating a process for manufacturing a first cover plate according to an embodiment of the invention.
Reference numerals:
10. a lamp film;
100. a first cover plate; 110. a first insulating layer; 111. a through hole; 120. a copper layer; 121. copper blocks; 122. a copper bonding pad;
200. a second cover plate; 210. copper plate; x, a first direction; y, second direction; 220. a second insulating layer; 221. a capillary module; 2211. a capillary structure; 2212. a liquid; 222. a groove; 230. a liquid channel; 240. an airway;
300. a light source;
400. a solder paste pad;
500. an insulating layer;
610. a first film layer; 620. a second film layer; 630. a third film layer; 640. a carrier film; 650. a transitional dry film; 660. a through groove;
700. copper sheet.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
The following describes the technical scheme provided by the embodiment of the invention with reference to the accompanying drawings.
As shown in fig. 1 and 2, the present invention provides a lamp film 10, wherein the lamp film 10 can be applied to a flat panel display such as an outdoor advertisement display screen, and the lamp film 10 comprises a first cover plate 100, a second cover plate 200 and a plurality of light sources 300. The light source 300 may be an LED lamp, and the light source 300 may be other light emitting elements that can meet the requirements.
The first cover plate 100 includes a first insulating layer 110 and a copper layer 120, the copper layer 120 is fixed on one side surface of the first insulating layer 110 by evaporation, etching or pressing, the copper layer 120 includes a plurality of copper blocks 121, and at least two copper blocks 121 are fixedly arranged and electrically connected with a light source 300; when specifically arranged, each light source 300 may correspond to two copper blocks 121, three copper blocks 121 or more than three copper blocks 121, and the light source 300 may be fixedly arranged and electrically connected to the copper blocks 121 through solder paste pads 400. A layer of solder paste is arranged on the copper block 121 in a screen printing and spraying mode, the light source 300 is pressed on the solder paste, and the solder paste forms a solder paste bonding pad 400 which is fused with the copper block 121 after solidification so as to fix and electrically connect the light source 300 and the copper block 121. The thickness of the first insulating layer 110 may be 50 μm to 200 μm, the first insulating layer 110 may be a PAS layer, or may be made of other materials, and the thickness of the copper block 121 may be 50 μm to 200 μm.
The second cover plate 200 is disposed on a side surface of the first insulating layer 110 away from the copper layer 120, the second cover plate 200 includes a copper plate 210 and a second insulating layer 220, the second insulating layer 220 may be formed over the copper plate 210 by a yellow light process, the second insulating layer 220 includes a plurality of capillary modules 221, a groove 222 is formed between two adjacent capillary modules 221, the capillary modules 221 have a capillary structure 2211 and a liquid 2212, the liquid 2212 is filled inside the capillary structure 2211, the second insulating layer 220 is bonded with the first insulating layer 110, and the second insulating layer 220 is fixedly connected with the first insulating layer 110, and the second insulating layer 220 and the first insulating layer 110 form a liquid channel 230 at the capillary module 221, and the second insulating layer 220 and the first insulating layer 110 form an air passage 240 at the groove 222. In a specific arrangement, the number of the capillary modules 221 may be two, three, four or more, the thicknesses of the capillary modules 221 and the second insulating layer 220 may be 50 μm-200 μm, the second insulating layer 220 may be a PAS layer, or may be made of other materials, the thickness of the copper plate 210 may be 50 μm-200 μm, and in order to facilitate heat conduction, the method is not limited to the copper block 121 and the copper plate 210, and may be other materials with good heat conduction effects. The liquid 2212 may be water, and may be other liquids such as ethanol, acetone, etc. which can meet the requirements.
In the lamp film 10, the heat emitted by the light source 300 is conducted to the copper block 121 of the first cover plate 100, and is conducted to the air channel 240 of the second cover plate 200 through the copper block 121, and then is conducted to the liquid channel 230 of the second cover plate 200 through the copper plate 210 of the second cover plate 200, so that the liquid 2212 filled in the capillary structure 2211 absorbs the heat to evaporate into the air channel 240 and flows in the air channel 240, and is condensed into the liquid 2212 by heat exchange with the copper plate 210 with lower temperature at other positions, the capillary structure 2211 absorbs the liquid 2212 into the interior, and the heat is diffused by the part of the lamp film 10 near the light source 300 even the whole lamp film 10 through the circulation process, so that the heat is prevented from accumulating at the same position, and the heat dissipation effect is better.
The copper block 121 is disposed in various ways, and in a preferred embodiment, as shown in fig. 1 and 3, the copper block 121 is disposed on a surface of the first insulating layer 110, which is far away from the second cover plate 200, the first insulating layer 110 has a through hole 111, the through hole 111 is located in a region of the first insulating layer 110 opposite to the copper block 121, and the through hole 111 penetrates through the thickness of the first insulating layer 110.
In the lamp film 10, the heat emitted by the light source 300 is conducted to the copper block 121 of the first cover plate 100, and then the heat is diffused in the through hole 111 and is diffused in the groove 222 of the second cover plate 200 and on the copper plate 210, so that the air in the whole air passage 240 is heated, and is uniformly conducted to the liquid passage 230 of the second cover plate 200 through the copper plate 210 of the second cover plate 200. Therefore, by defining the arrangement position of the copper block 121 and the structure of the first insulating layer 110, the air passage 240 including the through hole 111 of the first insulating layer 110 and the trench 222 of the second insulating layer 220 is formed, so that the volume of the air passage 240 is large, and the heat transfer of the copper block 121 is facilitated. In a specific arrangement, the through hole 111 may be located directly under the copper block 121, and the copper block 121 may also be offset directly under the copper block 121.
In order to improve structural stability of the first cap plate 100, specifically, as shown in fig. 1 and 3, a copper block 121 is disposed right above the through hole 111, and an edge of the copper block 121 is pressed together with the first insulating layer 110 at the edge of the through hole 111.
In the lamp film 10, the sectional area of the copper block 121 is larger than the sectional area of the through hole 111, the copper block 121 is erected right above the through hole 111, the first insulating layer 110 at the edge of the through hole 111 supports the copper block 121, and the copper block 121 and the first insulating layer 110 at the edge of the through hole 111 are pressed together to fix the copper block 121 and the first insulating layer 110 together, so as to form the first cover plate 100. Therefore, the arrangement mode of the copper block 121 is limited, so that the first cover plate 100 has simple structure and better stability. When specifically arranged, the copper block 121 and the first insulating layer 110 at the edge of the through hole 111 may be pressed together, or may be fixed together by other means.
In order to facilitate miniaturization of the lamp film 10, as shown in fig. 2 and 4, in a preferred embodiment, the copper block 121 is embedded in the first insulating layer 110, one end of the copper block 121 near the trench 222 protrudes at least from the first insulating layer 110, and the height of the copper block 121 protruding from the first insulating layer 110 near the trench 222 is smaller than the depth of the trench 222.
In the lamp film 10, the copper block 121 is embedded in the first insulating layer 110 to fix the copper block 121 and the first insulating layer 110 together to form the first cover plate 100, one end of the copper block 121 close to the groove 222 protrudes out of the first insulating layer 110 at least, so that the copper block 121 protrudes into the groove 222, the volume of the air channel 240 is smaller, the overall thickness of the first cover plate 100 and the second cover plate 200 is smaller, and the height of the copper block 121 protruding out of the first insulating layer 110 close to the groove 222 is smaller than the depth of the groove 222, so that the first cover plate 100 and the second cover plate 200 can be fixed together. Therefore, by defining the arrangement position of the copper block 121 so that the structural dimensions of the first cover plate 100 and the second cover plate 200 are small, it is convenient to achieve miniaturization of the lamp film 10. In a specific arrangement, one end of the copper block 121 near the trench 222 may be located within the first insulating layer 110, and a position of the first insulating layer 110 opposite to the copper block 121 may have an opening communicating the copper block 121 with the outside. The end of the copper block 121 near the groove 222 may be flush with the end surface of the first insulating layer 110 near the second insulating layer 220, the end of the copper block 121 near the groove 222 may protrude from the first insulating layer 110, the height of the copper block 121 near the end of the groove 222 protruding from the first insulating layer 110 may be one fourth, one third, one half, two thirds, three quarters of the depth of the groove 222, of course, the height of the copper block 121 near the end of the groove 222 protruding from the first insulating layer 110 may be the depth of the groove 222, not limited to the above values, but may be other values capable of meeting the requirements. The end of the copper block 121 away from the groove 222 may be flush with the end surface of the first insulating layer 110 away from the second insulating layer 220, and the end of the copper block 121 away from the groove 222 may also be located on the side of the end surface of the first insulating layer 110 away from the second insulating layer 220 close to the second insulating layer 220, so that the structural dimensions of the first cover plate 100 and the second cover plate 200 are smaller, and the end of the copper block 121 away from the groove 222 may also be located on the side of the end surface of the first insulating layer 110 away from the second insulating layer 220, so as to facilitate the fixed connection between the light source 300 and the copper block 121.
In order to improve the heat dissipation effect, as shown in fig. 4, a surface of the copper plate 210 carrying the second insulating layer 220 has a first direction X and a second direction Y, the first direction X and the second direction Y are perpendicular to each other, the capillary modules 221 are in a strip structure, the capillary modules 221 extend along the first direction X, and the plurality of capillary modules 221 are arranged on the copper plate 210 along the second direction Y.
In the lamp film 10 described above, the plurality of capillary modules 221 are uniformly arranged on the copper plate 210 along the second direction Y, and the capillary modules 221 extend along the first direction X to form uniformly distributed capillary structures 2211 on the copper plate 210, forming the liquid channels 230 and the gas channels 240 having uniform thickness and distribution, so that heat can be uniformly conducted. Therefore, the heat conduction is facilitated and the heat dissipation effect is improved by the structural form and the arrangement mode of the capillary module 221. When specifically arranged, the capillary modules 221 may extend along the first direction X, and the plurality of capillary modules 221 may be uniformly arranged on the copper plate 210 along the second direction Y, which is not limited to the above, and may be other ways that can meet the requirements, for example, the capillary modules 221 extend in a ring shape, and the plurality of capillary modules 221 are sequentially arranged from inside to outside.
To facilitate electrical connection and heat transfer between the copper blocks 121, as shown in fig. 1 and 2, the copper layer 120 further includes copper traces that are electrically connected to the copper blocks 121 and disposed on a surface of the first insulating layer 110 facing away from the second insulating layer 220.
In the lamp film 10, when the copper block 121 is disposed above the first insulating layer 110, the copper circuit is disposed on the surface of the first insulating layer 110 facing away from the second insulating layer 220, and when the copper block 121 is embedded on the first insulating layer 110, the copper circuit is disposed on the surface of the first insulating layer 110 facing away from the second insulating layer 220, or the copper circuit is disposed on the same layer as the first insulating layer 110, and the copper circuit is electrically connected with the copper block 121, so that the plurality of copper blocks 121 are electrically connected. Thus, by providing copper lines in the copper layer 120 and defining the location of the copper lines, electrical connection and heat transfer between the copper blocks 121 is facilitated. In a specific arrangement, copper pad 122 is disposed in copper layer 120 in addition to copper line and copper block 121 corresponding to light source 300, and thicknesses of copper block 121 and copper pad 122 may be the same, and at this time, thicknesses of copper line about 2 μm may be different for adapting to different connection functions. In order to achieve electrical insulation, the copper pad 122 is provided with an insulating layer 500, such as a PAS layer, which may have a thickness of 1 μm to 10 μm.
In addition, the invention also provides an electronic device, comprising the lamp film 10 according to any one of the above technical schemes. The electronic equipment can be an outdoor display screen and can also realize the structure of illumination display.
In the above electronic device, since the heat emitted by the light source 300 in the lamp film 10 is conducted to the copper block 121 of the first cover plate 100 and is conducted to the air channel 240 of the second cover plate 200 through the copper block 121, and then is conducted to the liquid channel 230 of the second cover plate 200 through the copper plate 210 of the second cover plate 200, so that the liquid 2212 filled in the capillary structure 2211 absorbs the heat to evaporate into the air channel 240 and flows in the air channel 240, and is condensed into the liquid 2212 by heat exchange with the copper plate 210 with a lower temperature at other positions, the capillary structure 2211 absorbs the liquid 2212 into the interior, and the heat is diffused by the above circulation process at a part of the lamp film 10 near the light source 300, even the whole lamp film 10, so that the heat accumulation at the same position is avoided, and the heat dissipation effect is better, and therefore, the heat dissipation effect of the electronic device with the lamp film 10 is better.
In addition, as shown in fig. 5, the present invention also provides a method for preparing a lamp film 10 according to any one of the above technical solutions, which includes the following steps:
step S501, providing a first film 610 and patterning to form a first insulating layer 110, forming a copper block 121 on the first insulating layer 110 to prepare a first cover plate 100 as shown in fig. 6 (a) and fig. 7 (a);
step S502, as shown in fig. 6 (b) and fig. 7 (b), depositing a second film 620 on the copper plate 210 by evaporation, spraying, etc., and patterning the second film 620 by exposure, development, etc. to form a second insulating layer 220 as shown in fig. 6 (c) and fig. 7 (c);
step S503, as shown in fig. 6 (d) and fig. 7 (d), filling the capillary structure 2211 of the second insulating layer 220 with a liquid 2212 to prepare a second cover plate 200;
in step S504, as shown in fig. 6 (e) and fig. 7 (e), the first cover plate 100 and the second cover plate 200 are pressed to cover the second insulating layer 220 and the first insulating layer 110, so that the second insulating layer 220 and the first insulating layer 110 are fixed together, and the light source 300 is electrically connected to the copper block 121, so as to prepare the lamp film 10 as shown in fig. 6 (f) and fig. 7 (f).
In the above-mentioned method for manufacturing the lamp film 10, first, through step S501, a first film 610 is provided, and patterning treatment is performed on the first film 610 to form a first insulating layer 110, and a copper block 121 is formed on the first insulating layer 110 to manufacture a first cover plate 100; next, through step S502, a copper plate 210 is provided, and a second film 620 is deposited on the copper plate 210, and patterning is performed on the second film 620 to form a second insulating layer 220; then, through step S503, the capillary structure 2211 of the second insulating layer 220 is filled with a liquid 2212 to prepare a second cover plate 200; finally, through step S504, the first insulating layer 110 and the second insulating layer 220 are covered together, and the light source 300 is fixed on the copper block 121, and the copper block 121 and the light source 300 are electrically connected to prepare the lamp film 10. The preparation method of the lamp film 10 is simple, has fewer processes, and is convenient for preparing the lamp film 10.
In order to easily and conveniently manufacture the first cover plate 100, in a preferred embodiment, the step of providing the first film 610 and patterning the first insulating layer 110, disposing the copper block 121 "on the first insulating layer 110 specifically includes:
as shown in fig. 8 (a), a third film 630 is deposited on the copper sheet 700 by evaporation, spraying, etc., and as shown in fig. 8 (b), the third film 630 is patterned by exposure, development, etc.;
as shown in fig. 8 (c), the copper sheet 700 is etched by filling the etching liquid in the third film 630, and the third film 630 is removed after etching to form a plurality of copper blocks 121;
as shown in fig. 8 (d), the copper block 121 is cleaned and the copper block 121 is pressed onto the first film 610, and as shown in fig. 8 (e), the first film 610 is patterned by exposure, development, or the like to form the first insulating layer 110.
In the method for manufacturing the lamp film 10, a copper sheet 700 is provided, a third film 630 is formed on the copper sheet 700, patterning is performed on the third film 630, then the copper sheet 700 is etched to form a plurality of copper blocks 121, the copper blocks 121 are pressed on the first film 610, patterning is performed on the first film 610 to form a first insulating layer 110, so that the copper blocks 121 are arranged above the first insulating layer 110, and the region, opposite to the copper blocks 121, on the first insulating layer 110 has a structure form of through holes 111 penetrating through the thickness of the first insulating layer 110. Therefore, the first cover plate 100 is manufactured by defining the first cover plate 100 to be manufactured by an etching method, so that the first cover plate 100 is manufactured more simply and conveniently.
In order to easily and conveniently manufacture the first cover plate 100, in a preferred embodiment, the step of providing the first film 610 and patterning the first insulating layer 110, disposing the copper block 121 "on the first insulating layer 110 specifically includes:
as shown in fig. 9 (a) and 9 (b), a transitional dry film 650 is pressed on a carrier film 640, and the transitional dry film 650 is patterned by exposing, developing, etc.;
as shown in fig. 9 (c), a first film layer 610 is deposited on the transitional dry film 650 by evaporation, spraying, etc., and patterned by exposure, development, etc. to form a first insulating layer 110 and a through groove 660, the through groove 660 penetrates through the first film layer 610 and the transitional dry film 650, and the through groove 660 extends to the surface of the carrier film 640 near the transitional dry film 650;
as shown in fig. 9 (d), copper block 121 is formed in through groove 660 by plating, spraying, or the like, as shown in fig. 9 (e), and carrier film 640 and transitional dry film 650 are removed.
In the method for manufacturing the lamp film 10, a carrier film 640 is provided, a transitional dry film 650 is pressed on the carrier film 640, the transitional dry film 650 is patterned, then a first film layer 610 is deposited on the transitional dry film 650, the first film layer 610 is patterned to form a first insulating layer 110 and a through groove 660, a copper block 121 is formed in the through groove 660, the carrier film 640 and the transitional dry film 650 are removed to form a structure in which the copper block 121 is embedded in the first insulating layer 110, and one end of the copper block 121 close to the groove 222 protrudes out of the first insulating layer 110. Therefore, the first cover plate 100 is manufactured by limiting the first cover plate 100 to be manufactured by an additive process, so that the first cover plate 100 is manufactured more simply and conveniently.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (7)
1. The utility model provides a lamp membrane which characterized in that includes first apron, second apron and a plurality of light source, wherein:
the first cover plate comprises a first insulating layer and a copper layer fixed on one side surface of the first insulating layer, the copper layer comprises a plurality of copper blocks, and at least two copper blocks are fixedly arranged with one light source and electrically connected with the light source;
the second cover plate is arranged on one side surface of the first insulating layer, far away from the copper layer, and comprises a copper plate and a second insulating layer arranged on one side surface of the copper plate, the second insulating layer is connected with the first insulating layer, the second insulating layer comprises a plurality of capillary modules, grooves are formed between two adjacent capillary modules, each capillary module is provided with a capillary structure and liquid filled in the capillary structure, the second insulating layer is fixedly connected with the first insulating layer, a liquid channel is formed at the capillary module, and an air channel is formed at the groove;
the copper block is embedded in the first insulating layer, one end of the copper block, which is close to the groove, protrudes out of the first insulating layer at least, the height of the copper block protruding out of the first insulating layer is smaller than the depth of the groove, and one end, which is far away from the groove, of the copper block is flush with the end face, which is far away from the second insulating layer, of the first insulating layer or protrudes out of the end face.
2. The lamp film according to claim 1, wherein the copper plate has a first direction and a second direction perpendicular to each other, the capillary modules are in a strip-like structure extending along the first direction, and a plurality of the capillary modules are arranged on the copper plate along the second direction.
3. The lamp film of claim 1, wherein the copper layer further comprises a copper line electrically connected to the copper block, the copper line disposed on a surface of the first insulating layer facing away from the second insulating layer.
4. An electronic device comprising the lamp film of any one of claims 1-3.
5. A method of producing a lamp film according to any one of claims 1 to 3, comprising the steps of:
providing a first film layer, patterning to form a first insulating layer, and forming a copper block on the first insulating layer;
depositing a second film layer on the copper plate, and patterning the second film layer to form a second insulating layer;
filling liquid in the capillary structure of the second insulating layer;
and covering the second insulating layer and the first insulating layer, and electrically connecting the light source on the copper block.
6. The method of manufacturing a lamp film according to claim 5, wherein the step of providing a first film layer and patterning to form a first insulating layer, disposing a copper block on the first insulating layer, specifically comprises:
depositing a third film layer on the copper sheet, and patterning the third film layer;
etching the copper sheet, and removing the third film layer to form a plurality of copper blocks;
and pressing the copper block on the first film layer, and patterning the first film layer to form the first insulating layer.
7. The method of manufacturing a lamp film according to claim 5, wherein the step of providing a first film layer and patterning to form a first insulating layer, disposing a copper block on the first insulating layer, specifically comprises:
pressing a transition dry film on the bearing film, and patterning the transition dry film;
depositing a first film layer on the transition dry film, and patterning to form a first insulating layer and a through groove, wherein the through groove penetrates through the first film layer and the transition dry film and extends to the surface of the bearing film, which is close to the transition dry film;
and forming the copper block in the through groove, and removing the bearing film and the transition dry film.
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